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TW200631083A - Apparatus for treating substrates - Google Patents

Apparatus for treating substrates

Info

Publication number
TW200631083A
TW200631083A TW094136304A TW94136304A TW200631083A TW 200631083 A TW200631083 A TW 200631083A TW 094136304 A TW094136304 A TW 094136304A TW 94136304 A TW94136304 A TW 94136304A TW 200631083 A TW200631083 A TW 200631083A
Authority
TW
Taiwan
Prior art keywords
brush
spindles
pair
rotatably supporting
treatment apparatus
Prior art date
Application number
TW094136304A
Other languages
Chinese (zh)
Other versions
TWI421924B (en
Inventor
Hideki Sueyoshi
Akinori Iso
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200631083A publication Critical patent/TW200631083A/en
Application granted granted Critical
Publication of TWI421924B publication Critical patent/TWI421924B/en

Links

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Cleaning In General (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)

Abstract

To provide a treatment apparatus in which a pair of spindles rotatably supporting both ends of a brush can be provided along the width direction of a treating tank without axial displacement. This treatment apparatus treats substrates transported in the treating tank, with the brush unit 11 provided in the tank. The brush unit 11 is equipped with: a frame 12 having a first mounting part 17 and a second mounting part 18 separated from each other with a given space in the horizontal direction on the same vertical plane; a first upper brush 32 and a first lower brush 33 disposed in a vertical direction with axes in parallel; a first pair of spindles 27 mounted on the first and second mounting parts and rotatably supporting both axial ends of the first upper brush; and a second pair of spindles 28 mounted on the first and second mounting parts and rotatably supporting both axial ends of the second lower brush.
TW094136304A 2004-10-22 2005-10-18 Apparatus for treating substrates TWI421924B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004308377A JP4537826B2 (en) 2004-10-22 2004-10-22 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200631083A true TW200631083A (en) 2006-09-01
TWI421924B TWI421924B (en) 2014-01-01

Family

ID=36534848

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136304A TWI421924B (en) 2004-10-22 2005-10-18 Apparatus for treating substrates

Country Status (4)

Country Link
JP (1) JP4537826B2 (en)
KR (1) KR101116713B1 (en)
CN (1) CN1778478B (en)
TW (1) TWI421924B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4919733B2 (en) * 2006-08-24 2012-04-18 株式会社日立ハイテクノロジーズ Substrate cleaning apparatus, substrate cleaning method, and substrate manufacturing method
CN101722476B (en) * 2008-10-27 2012-05-23 中芯国际集成电路制造(上海)有限公司 Chemical mechanical polishing cleaning device
CN102479669B (en) * 2010-11-29 2013-09-11 中芯国际集成电路制造(上海)有限公司 Wafer brush cleaning device and wafer brush cleaning method
CN102274844B (en) * 2011-06-24 2013-01-16 张家港青尼罗河曼迪科机械有限公司 Arrangement structure for brush rolls of brushing device in metal plate production line
CN102962215A (en) * 2012-11-13 2013-03-13 江西稀有稀土金属钨业集团有限公司 Steel strip cleaning device
CN103785633B (en) * 2013-11-13 2016-07-13 东莞市佳的自动化设备科技有限公司 A battery pole piece powder brushing device
KR102156741B1 (en) * 2013-12-27 2020-09-16 세메스 주식회사 Apparatus for treating substrate
KR102250364B1 (en) * 2014-07-08 2021-05-13 세메스 주식회사 Apparatus and Method for treating substrate
KR102634033B1 (en) * 2019-04-05 2024-02-08 주식회사 디엠에스 Apparatus for adjusting gap of substrate processing unit and substrate processing apparatus using the same
KR102764432B1 (en) * 2023-02-22 2025-02-07 주식회사 비에이치에스티 Cleaning device for flexible printed circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5475889A (en) * 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers
JP2963963B2 (en) * 1996-01-12 1999-10-18 極東産機株式会社 Tatami cleaning equipment
US6230753B1 (en) * 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US5924154A (en) * 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
JP3533884B2 (en) * 1997-06-03 2004-05-31 日立電子エンジニアリング株式会社 Substrate cleaning device
JP3185753B2 (en) * 1998-05-22 2001-07-11 日本電気株式会社 Method for manufacturing semiconductor device
US6055694A (en) * 1998-11-30 2000-05-02 Tsk America, Inc. Wafer scrubbing machine
DE19910790C1 (en) * 1999-03-11 2000-07-13 Wesumat Gmbh Vehicle washing assembly has an additional spray jet for each side spray assembly mounted to the horizontal brush carrier to follow the contour of the vehicle roof with a spray angle to cover the roof and sides
US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
JP4602567B2 (en) * 2000-12-15 2010-12-22 芝浦メカトロニクス株式会社 Substrate cleaning device
JP2003145060A (en) * 2001-11-15 2003-05-20 Shibaura Mechatronics Corp Cleaning brush, cleaning equipment

Also Published As

Publication number Publication date
JP2006116465A (en) 2006-05-11
TWI421924B (en) 2014-01-01
KR101116713B1 (en) 2012-02-22
CN1778478B (en) 2010-11-03
JP4537826B2 (en) 2010-09-08
KR20060049096A (en) 2006-05-18
CN1778478A (en) 2006-05-31

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