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TW200627608A - Quad flat no-lead chip package structure - Google Patents

Quad flat no-lead chip package structure

Info

Publication number
TW200627608A
TW200627608A TW094102285A TW94102285A TW200627608A TW 200627608 A TW200627608 A TW 200627608A TW 094102285 A TW094102285 A TW 094102285A TW 94102285 A TW94102285 A TW 94102285A TW 200627608 A TW200627608 A TW 200627608A
Authority
TW
Taiwan
Prior art keywords
mold lock
package structure
metal plate
chip package
quad flat
Prior art date
Application number
TW094102285A
Other languages
Chinese (zh)
Other versions
TWI261901B (en
Inventor
Chien Liu
Meng-Jen Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094102285A priority Critical patent/TWI261901B/en
Publication of TW200627608A publication Critical patent/TW200627608A/en
Application granted granted Critical
Publication of TWI261901B publication Critical patent/TWI261901B/en

Links

Classifications

    • H10W72/20—
    • H10W74/00—
    • H10W90/726—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A QFN type chip package structure is provided. The structure includes a chip, a lead frame and a molding compound. The lead frame has a plurality of bump bonding leads and a metal plate surrounded by the bump bonding leads for electrically connection with bumps on the chip. In addition, the metal plate has a first surface, a second surface and a plurality of mold lock holes concaved from the first surface, especially, the inner size of each mold lock hole is increased gradually from the first surface to the second surface. The cross-section shape of the mold lock holes is trapezoid or arc, for example. Therefore, the delamination between compound and metal plate is reduced to get better mold lock.
TW094102285A 2005-01-26 2005-01-26 Quad flat no-lead chip package structure TWI261901B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094102285A TWI261901B (en) 2005-01-26 2005-01-26 Quad flat no-lead chip package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094102285A TWI261901B (en) 2005-01-26 2005-01-26 Quad flat no-lead chip package structure

Publications (2)

Publication Number Publication Date
TW200627608A true TW200627608A (en) 2006-08-01
TWI261901B TWI261901B (en) 2006-09-11

Family

ID=37987037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102285A TWI261901B (en) 2005-01-26 2005-01-26 Quad flat no-lead chip package structure

Country Status (1)

Country Link
TW (1) TWI261901B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556359B (en) * 2015-03-31 2016-11-01 南茂科技股份有限公司 Quad flat no-lead package structure and quad flat no-lead package leadframe structure

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409924B (en) * 2007-09-12 2013-09-21 日月光半導體製造股份有限公司 Semiconductor package and method of manufacturing same
US12170261B2 (en) 2022-05-31 2024-12-17 Deca Technologies Usa, Inc. Molded direct contact interconnect structure without capture pads and method for the same
US20240030174A1 (en) * 2022-07-21 2024-01-25 Deca Technologies Usa, Inc. Quad flat no-lead (qfn) package with backside conductive material and direct contact interconnect build-up structure and method for making the same
US12500197B2 (en) 2022-12-23 2025-12-16 Deca Technologies Usa, Inc. Encapsulant-defined land grid array (LGA) package and method for making the same
US12424450B2 (en) 2023-11-22 2025-09-23 Deca Technologies Usa, Inc. Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same
US12500198B2 (en) 2024-03-01 2025-12-16 Deca Technologies Usa, Inc. Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556359B (en) * 2015-03-31 2016-11-01 南茂科技股份有限公司 Quad flat no-lead package structure and quad flat no-lead package leadframe structure

Also Published As

Publication number Publication date
TWI261901B (en) 2006-09-11

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Legal Events

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MK4A Expiration of patent term of an invention patent