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TW200623996A - Electronic device comprising a flexible printed circuit board - Google Patents

Electronic device comprising a flexible printed circuit board

Info

Publication number
TW200623996A
TW200623996A TW094131180A TW94131180A TW200623996A TW 200623996 A TW200623996 A TW 200623996A TW 094131180 A TW094131180 A TW 094131180A TW 94131180 A TW94131180 A TW 94131180A TW 200623996 A TW200623996 A TW 200623996A
Authority
TW
Taiwan
Prior art keywords
electronic device
printed circuit
circuit board
flexible printed
conductive layer
Prior art date
Application number
TW094131180A
Other languages
Chinese (zh)
Inventor
Wouter Maes
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200623996A publication Critical patent/TW200623996A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

An electronic device comprises a flexible printed circuit board having an electrically conductive layer (2) on one side of the flexible board, and a conductive metallic stiffener (8) which is attached to the flexible board. Said conductive layer (2) is conductively connected to the metallic stiffener (8) by means of solder. The flexible board is provided with a through-hole (10), the solder connecting the metallic stiffener (8) with the conductive layer (2) being present in said through-hole (10).
TW094131180A 2004-09-13 2005-09-09 Electronic device comprising a flexible printed circuit board TW200623996A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04104416 2004-09-13

Publications (1)

Publication Number Publication Date
TW200623996A true TW200623996A (en) 2006-07-01

Family

ID=36060404

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131180A TW200623996A (en) 2004-09-13 2005-09-09 Electronic device comprising a flexible printed circuit board

Country Status (2)

Country Link
TW (1) TW200623996A (en)
WO (1) WO2006030352A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401450B (en) * 2010-01-11 2013-07-11 Zhen Ding Technology Co Ltd Method for testing flexible printed circuit board
TWI507119B (en) * 2010-07-16 2015-11-01 Zhen Ding Technology Co Ltd Flexible printed circuit board and method for manufacturing the same
US9474154B2 (en) 2014-07-18 2016-10-18 Starkey Laboratories, Inc. Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416278A (en) * 1993-03-01 1995-05-16 Motorola, Inc. Feedthrough via connection
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
US6499214B2 (en) * 2000-05-26 2002-12-31 Visteon Global Tech, Inc. Method of making a circuit board
US6534848B1 (en) * 2000-09-07 2003-03-18 International Business Machines Corporation Electrical coupling of a stiffener to a chip carrier
US6740824B2 (en) * 2002-06-25 2004-05-25 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making same
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Also Published As

Publication number Publication date
WO2006030352A2 (en) 2006-03-23
WO2006030352A3 (en) 2006-07-27

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