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TW200623477A - Light-emitting device with inorganic housing - Google Patents

Light-emitting device with inorganic housing

Info

Publication number
TW200623477A
TW200623477A TW094140272A TW94140272A TW200623477A TW 200623477 A TW200623477 A TW 200623477A TW 094140272 A TW094140272 A TW 094140272A TW 94140272 A TW94140272 A TW 94140272A TW 200623477 A TW200623477 A TW 200623477A
Authority
TW
Taiwan
Prior art keywords
light
housing
emitting device
emitting diode
recess
Prior art date
Application number
TW094140272A
Other languages
English (en)
Inventor
Lucas Johannes Anna Maria Beckers
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200623477A publication Critical patent/TW200623477A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/856Arrangements for extracting light from the devices comprising reflective means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
TW094140272A 2004-11-19 2005-11-16 Light-emitting device with inorganic housing TW200623477A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04105918 2004-11-19

Publications (1)

Publication Number Publication Date
TW200623477A true TW200623477A (en) 2006-07-01

Family

ID=36407516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140272A TW200623477A (en) 2004-11-19 2005-11-16 Light-emitting device with inorganic housing

Country Status (7)

Country Link
US (1) US7714335B2 (zh)
EP (1) EP1815540B1 (zh)
JP (1) JP5280686B2 (zh)
KR (1) KR101170407B1 (zh)
CN (1) CN101438406B (zh)
TW (1) TW200623477A (zh)
WO (1) WO2006054233A2 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8441179B2 (en) * 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
CN100422107C (zh) * 2006-07-14 2008-10-01 山西新型炉业集团有限公司 利用废旧镁碳砖和镁铝碳砖制备镁阿隆陶瓷材料的方法
JP5148126B2 (ja) * 2007-02-09 2013-02-20 スタンレー電気株式会社 色変換発光素子とその製造方法
US7863635B2 (en) 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ledランプの製造方法
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
DE102010028776A1 (de) * 2010-05-07 2011-11-10 Osram Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement
CN102418853A (zh) * 2010-09-28 2012-04-18 展晶科技(深圳)有限公司 发光装置及其制造方法
US8754424B2 (en) * 2011-08-29 2014-06-17 Micron Technology, Inc. Discontinuous patterned bonds for semiconductor devices and associated systems and methods
DE102012210195A1 (de) 2012-06-18 2013-12-19 Osram Gmbh Vorrichtung zum Bereitstellen elektromagnetischer Strahlung
US10544619B2 (en) * 2017-02-13 2020-01-28 Hall Labs Llc Self-cleaning window blinds with photocatalytic material
CN109417065B (zh) 2017-06-12 2024-05-14 库力索法荷兰有限公司 分立组件向基板上的并行组装
CN108194844B (zh) * 2017-12-31 2022-02-25 上海极优威光电科技有限公司 一种电子束激发荧光粉的深紫外光源
US12144903B2 (en) 2020-04-27 2024-11-19 Mechoshade Systems, Llc Sanitizing window shade system
CN112089862A (zh) * 2020-10-20 2020-12-18 山西华微紫外半导体科技有限公司 一种紫外半导体并联的uvc led全无机或半无机封装结构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
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US4040078A (en) * 1976-05-11 1977-08-02 Bell Telephone Laboratories, Incorporated Opto-isolators and method of manufacture
US6353250B1 (en) * 1997-11-07 2002-03-05 Nippon Telegraph And Telephone Corporation Semiconductor photo-detector, semiconductor photo-detection device, and production methods thereof
US6683325B2 (en) * 1999-01-26 2004-01-27 Patent-Treuhand-Gesellschaft-für Elektrische Glühlampen mbH Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US6703780B2 (en) * 2001-01-16 2004-03-09 General Electric Company Organic electroluminescent device with a ceramic output coupler and method of making the same
US20050051859A1 (en) * 2001-10-25 2005-03-10 Amkor Technology, Inc. Look down image sensor package
US6870311B2 (en) * 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles
JP2003179270A (ja) 2002-11-07 2003-06-27 Sanken Electric Co Ltd 半導体発光装置
JP4450168B2 (ja) 2002-11-27 2010-04-14 セイコーエプソン株式会社 半導体装置の製造方法および半導体装置用カバー
US6982470B2 (en) * 2002-11-27 2006-01-03 Seiko Epson Corporation Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment
JP2004200531A (ja) * 2002-12-20 2004-07-15 Stanley Electric Co Ltd 面実装型led素子
JP4254276B2 (ja) * 2003-03-03 2009-04-15 豊田合成株式会社 発光装置およびその製造方法
EP1455398A3 (en) * 2003-03-03 2011-05-25 Toyoda Gosei Co., Ltd. Light emitting device comprising a phosphor layer and method of making same
US20040173808A1 (en) * 2003-03-07 2004-09-09 Bor-Jen Wu Flip-chip like light emitting device package
TWI246780B (en) * 2003-03-10 2006-01-01 Toyoda Gosei Kk Solid-state component device and manufacturing method thereof

Also Published As

Publication number Publication date
US20090166651A1 (en) 2009-07-02
KR20070086351A (ko) 2007-08-27
JP2008521238A (ja) 2008-06-19
CN101438406B (zh) 2011-04-20
WO2006054233A3 (en) 2009-04-30
EP1815540A2 (en) 2007-08-08
CN101438406A (zh) 2009-05-20
WO2006054233A2 (en) 2006-05-26
US7714335B2 (en) 2010-05-11
EP1815540B1 (en) 2019-07-31
KR101170407B1 (ko) 2012-08-02
JP5280686B2 (ja) 2013-09-04

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