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TW200621100A - Flexible circuit board and package structure - Google Patents

Flexible circuit board and package structure

Info

Publication number
TW200621100A
TW200621100A TW093138341A TW93138341A TW200621100A TW 200621100 A TW200621100 A TW 200621100A TW 093138341 A TW093138341 A TW 093138341A TW 93138341 A TW93138341 A TW 93138341A TW 200621100 A TW200621100 A TW 200621100A
Authority
TW
Taiwan
Prior art keywords
pads
portions
circuit board
package structure
flexible circuit
Prior art date
Application number
TW093138341A
Other languages
Chinese (zh)
Other versions
TWI251452B (en
Inventor
Tong-Hong Wang
Chang-Chi Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93138341A priority Critical patent/TWI251452B/en
Application granted granted Critical
Publication of TWI251452B publication Critical patent/TWI251452B/en
Publication of TW200621100A publication Critical patent/TW200621100A/en

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A package structure including a flexible circuit board, a first electronic device, and a second electronic device is provided. The flexible circuit board includes a flexible substrate, a plurality of first pads, a plurality of second pads, and a plurality of first pattern circuits. The flexible substrate has a first connecting portion, a plurality of second connecting portions, and a plurality of first circuit portions. Each of the first circuit portions is positioned between the first connecting portion and one of the second connecting portions. The first pads are disposed in the first connecting portion. The second pads are disposed in the second connecting portions. Each of the first pattern circuits is respectively disposed in one of the circuit portions. The first electronic device is electrically connected to the first pads. The first circuit portions are bent such that the second connect portions are located above the first connecting portion. The second electronic device is electrically connected to the second pads.
TW93138341A 2004-12-10 2004-12-10 Flexible circuit board and package structure TWI251452B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93138341A TWI251452B (en) 2004-12-10 2004-12-10 Flexible circuit board and package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93138341A TWI251452B (en) 2004-12-10 2004-12-10 Flexible circuit board and package structure

Publications (2)

Publication Number Publication Date
TWI251452B TWI251452B (en) 2006-03-11
TW200621100A true TW200621100A (en) 2006-06-16

Family

ID=37433591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93138341A TWI251452B (en) 2004-12-10 2004-12-10 Flexible circuit board and package structure

Country Status (1)

Country Link
TW (1) TWI251452B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656819B (en) * 2017-03-07 2019-04-11 HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. Flexible circuit board manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656819B (en) * 2017-03-07 2019-04-11 HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. Flexible circuit board manufacturing method

Also Published As

Publication number Publication date
TWI251452B (en) 2006-03-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees