[go: up one dir, main page]

TW200619371A - An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials - Google Patents

An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials

Info

Publication number
TW200619371A
TW200619371A TW094129628A TW94129628A TW200619371A TW 200619371 A TW200619371 A TW 200619371A TW 094129628 A TW094129628 A TW 094129628A TW 94129628 A TW94129628 A TW 94129628A TW 200619371 A TW200619371 A TW 200619371A
Authority
TW
Taiwan
Prior art keywords
cutting
brittle materials
same
oil solution
slurry containing
Prior art date
Application number
TW094129628A
Other languages
Chinese (zh)
Inventor
Yasuo Yamanaka
Eiji Niwa
Tsutomu Oi
Dai Mukai
Fumio Hidaka
Yoshihiro Ogawa
Original Assignee
Kyodo Yushi
Noritake Co Ltd
Komatsu Denshi Kinzoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Yushi, Noritake Co Ltd, Komatsu Denshi Kinzoku Kk filed Critical Kyodo Yushi
Publication of TW200619371A publication Critical patent/TW200619371A/en

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Lubricants (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

To provide an aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials to be used in a blade-saw or wire-saw for cutting brittle materials having high hardness with free abrasive particle at high efficiency and high accuracy, containing: (A) at least one compound selected from the group consisting of polyhydric alcohol, condensation product of polyhydric alcohol, and derivative of polyhydric alcohol; (B) aromatic polycarboxylic acid salt; (C) alkylene oxide adduct of alkylene glycol, and water.
TW094129628A 2004-09-30 2005-08-30 An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials TW200619371A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004287586A JP2006096951A (en) 2004-09-30 2004-09-30 Water-soluble machining oil, slurry, and machining method

Publications (1)

Publication Number Publication Date
TW200619371A true TW200619371A (en) 2006-06-16

Family

ID=36237076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129628A TW200619371A (en) 2004-09-30 2005-08-30 An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials

Country Status (4)

Country Link
JP (1) JP2006096951A (en)
KR (1) KR20060051695A (en)
CN (1) CN1754949A (en)
TW (1) TW200619371A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403575B (en) * 2008-12-20 2013-08-01 Cabot Microelectronics Corp Composition for improving dryness during wire sawing

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009062426A (en) * 2007-09-05 2009-03-26 Kyodo Yushi Co Ltd Water-soluble working fluid for loose grain wire saw, slurry, and cutting work method
JP2009079083A (en) * 2007-09-25 2009-04-16 Kyodo Yushi Co Ltd Water-soluble machining oil for free abrasive grain wire saw
JP5350839B2 (en) * 2009-03-05 2013-11-27 出光興産株式会社 Processing oil for brittle materials and processing oil composition
JP5464055B2 (en) * 2009-06-02 2014-04-09 日信化学工業株式会社 Water-based cutting fluid and water-based cutting agent
JP5679642B2 (en) * 2009-07-15 2015-03-04 ユシロ化学工業株式会社 Water-soluble machining fluid for fixed abrasive wire saws
KR20120061821A (en) * 2009-08-31 2012-06-13 산요가세이고교 가부시키가이샤 Water-soluble cutting fluid for slicing silicon ingots
KR101191272B1 (en) 2010-07-19 2012-10-16 주식회사 넥솔론 A Slurry Composition for Wire Saw Cutting and a Method for Cutting the Material by Using the Same
CN102206536B (en) * 2011-03-29 2012-12-12 浙江德圣龙新材料科技有限公司 Isopycnic cutting slurry for linear cutting of solar wafer and manufacturing method thereof
JP5755479B2 (en) * 2011-03-31 2015-07-29 三洋化成工業株式会社 Hydrous cutting fluid composition and method for producing the same
JP5832462B2 (en) * 2013-02-21 2015-12-16 Jx日鉱日石エネルギー株式会社 Grinding or polishing oil composition, and grinding or polishing method using the oil composition
CN103242944B (en) * 2013-04-23 2014-12-17 上海晔宗光伏科技有限公司 Multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid
TWI640619B (en) * 2015-02-10 2018-11-11 達興材料股份有限公司 An additive for an aqueous cutting fluid for a cutting process and a manufacturign method thereof
CN105690586A (en) * 2016-03-31 2016-06-22 苏州晶樱光电科技有限公司 Silicon rod slicing process
CN106833855A (en) * 2016-12-11 2017-06-13 安徽省东至县东鑫冲压件有限责任公司 A kind of cutting off machine coolant
KR102012841B1 (en) 2017-08-11 2019-08-21 양희준 Preflex girder and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391930B2 (en) * 1995-03-07 2003-03-31 新日本石油株式会社 Water-soluble cutting oil stock solution composition and water-soluble cutting oil composition
JP3296781B2 (en) * 1998-04-21 2002-07-02 信越半導体株式会社 Aqueous cutting fluid, method for producing the same, and cutting method using this aqueous cutting fluid
JP2000160185A (en) * 1998-12-02 2000-06-13 Kyodo Yushi Co Ltd Water soluble oil agent for cut processing
JP2002080883A (en) * 2000-06-20 2002-03-22 Neos Co Ltd Water soluble processing liquid for wire saw
JP3468752B2 (en) * 2001-01-22 2003-11-17 日華化学株式会社 Water-soluble cutting oil composition
JP4497768B2 (en) * 2001-09-06 2010-07-07 ユシロ化学工業株式会社 Water-soluble machining fluid composition for fixed abrasive wire saw
JP4194783B2 (en) * 2002-02-14 2008-12-10 協同油脂株式会社 Water-soluble cutting oil

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403575B (en) * 2008-12-20 2013-08-01 Cabot Microelectronics Corp Composition for improving dryness during wire sawing

Also Published As

Publication number Publication date
JP2006096951A (en) 2006-04-13
KR20060051695A (en) 2006-05-19
CN1754949A (en) 2006-04-05

Similar Documents

Publication Publication Date Title
TW200619371A (en) An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials
ITBO20060225A1 (en) OPERATING GROUP FOR ENGRAVING AND / OR CUTTING ARTICLES IN PARTICULAR PANELS.
IL181106A0 (en) Cleaning compositions for microelectronics substrates
MX2010004587A (en) Apparatus and process for treating an aqueous solution containing biological contaminants.
EA200701656A1 (en) ANTI-AGING AND / OR ANTI-FOLLETING COMPOSITION AND METHOD TO REDUCE THE TEMPERATURE OF THE FROZENING OF COMPLEX ETHERS OF PLANT OILS
TW200643156A (en) Aqueous dispersant for chemical polishing, chemical polishing method, and kit used in preparation of aqueous dispersant for chemical polishing
RU2009114849A (en) SELF-CONSERVING WATER PHARMACEUTICAL COMPOSITIONS
GB2441727A (en) Corrosion inhibitor for acids
AR089211A1 (en) LOW VISCOSITY Aqueous FRACTURING FLUID
TW200700337A (en) Method of dividing glass into separate pieces with the aid of a cutting liquid and improved cutting liquid for said method
TW200516134A (en) Novel slurry for chemical mechanical polishing of metals
IL203301A (en) Method for cutting a substrate with a wire saw
ZA200701326B (en) Use of phosphated alcanols as dispersants, emulsifiers, hydrotropes, wetting agents and compatability agents in agricultural compositions
Garfì et al. Additional insights on the ecology of the relic tree Zelkova sicula di Pasquale, Garfì et Quézel (Ulmaceae) after the finding of a new population
MY146842A (en) Supply mechanism for the chuck of an integrated circuit dicing device
WO2010055160A3 (en) Acid aqueous thiodiglycol ethoxylate composition and the use thereof in a method for etching metallic surfaces
WO2009041443A1 (en) Water-soluble processing oil for free-abrasive-grain wire saw
ATE371709T1 (en) POLISHING COMPOSITION AND POLISHING METHOD
MY137247A (en) Polishing composition
PE20020887A1 (en) METHOD TO PRODUCE L-GLUTAMIC ACID
CN105599155A (en) Chip accumulation-preventing spiral diamond wire
MY148620A (en) Metal ion-containing cmp composition and method for using the same
WO2009028710A1 (en) Water-soluble working oil for fixed-abrasive wire saw
TWI349008B (en) Ionic liquids having fluoroalkyltrifluoroborate anions
TW200619875A (en) Compositions comprising tannic acid as corrosion inhibitor