TW200619371A - An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials - Google Patents
An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materialsInfo
- Publication number
- TW200619371A TW200619371A TW094129628A TW94129628A TW200619371A TW 200619371 A TW200619371 A TW 200619371A TW 094129628 A TW094129628 A TW 094129628A TW 94129628 A TW94129628 A TW 94129628A TW 200619371 A TW200619371 A TW 200619371A
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting
- brittle materials
- same
- oil solution
- slurry containing
- Prior art date
Links
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Lubricants (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
To provide an aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials to be used in a blade-saw or wire-saw for cutting brittle materials having high hardness with free abrasive particle at high efficiency and high accuracy, containing: (A) at least one compound selected from the group consisting of polyhydric alcohol, condensation product of polyhydric alcohol, and derivative of polyhydric alcohol; (B) aromatic polycarboxylic acid salt; (C) alkylene oxide adduct of alkylene glycol, and water.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004287586A JP2006096951A (en) | 2004-09-30 | 2004-09-30 | Water-soluble machining oil, slurry, and machining method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200619371A true TW200619371A (en) | 2006-06-16 |
Family
ID=36237076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094129628A TW200619371A (en) | 2004-09-30 | 2005-08-30 | An aqueous cutting oil solution, a slurry containing the same and a method for cutting brittle materials |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006096951A (en) |
KR (1) | KR20060051695A (en) |
CN (1) | CN1754949A (en) |
TW (1) | TW200619371A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI403575B (en) * | 2008-12-20 | 2013-08-01 | Cabot Microelectronics Corp | Composition for improving dryness during wire sawing |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009062426A (en) * | 2007-09-05 | 2009-03-26 | Kyodo Yushi Co Ltd | Water-soluble working fluid for loose grain wire saw, slurry, and cutting work method |
JP2009079083A (en) * | 2007-09-25 | 2009-04-16 | Kyodo Yushi Co Ltd | Water-soluble machining oil for free abrasive grain wire saw |
JP5350839B2 (en) * | 2009-03-05 | 2013-11-27 | 出光興産株式会社 | Processing oil for brittle materials and processing oil composition |
JP5464055B2 (en) * | 2009-06-02 | 2014-04-09 | 日信化学工業株式会社 | Water-based cutting fluid and water-based cutting agent |
JP5679642B2 (en) * | 2009-07-15 | 2015-03-04 | ユシロ化学工業株式会社 | Water-soluble machining fluid for fixed abrasive wire saws |
KR20120061821A (en) * | 2009-08-31 | 2012-06-13 | 산요가세이고교 가부시키가이샤 | Water-soluble cutting fluid for slicing silicon ingots |
KR101191272B1 (en) | 2010-07-19 | 2012-10-16 | 주식회사 넥솔론 | A Slurry Composition for Wire Saw Cutting and a Method for Cutting the Material by Using the Same |
CN102206536B (en) * | 2011-03-29 | 2012-12-12 | 浙江德圣龙新材料科技有限公司 | Isopycnic cutting slurry for linear cutting of solar wafer and manufacturing method thereof |
JP5755479B2 (en) * | 2011-03-31 | 2015-07-29 | 三洋化成工業株式会社 | Hydrous cutting fluid composition and method for producing the same |
JP5832462B2 (en) * | 2013-02-21 | 2015-12-16 | Jx日鉱日石エネルギー株式会社 | Grinding or polishing oil composition, and grinding or polishing method using the oil composition |
CN103242944B (en) * | 2013-04-23 | 2014-12-17 | 上海晔宗光伏科技有限公司 | Multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid |
TWI640619B (en) * | 2015-02-10 | 2018-11-11 | 達興材料股份有限公司 | An additive for an aqueous cutting fluid for a cutting process and a manufacturign method thereof |
CN105690586A (en) * | 2016-03-31 | 2016-06-22 | 苏州晶樱光电科技有限公司 | Silicon rod slicing process |
CN106833855A (en) * | 2016-12-11 | 2017-06-13 | 安徽省东至县东鑫冲压件有限责任公司 | A kind of cutting off machine coolant |
KR102012841B1 (en) | 2017-08-11 | 2019-08-21 | 양희준 | Preflex girder and manufacturing method thereof |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3391930B2 (en) * | 1995-03-07 | 2003-03-31 | 新日本石油株式会社 | Water-soluble cutting oil stock solution composition and water-soluble cutting oil composition |
JP3296781B2 (en) * | 1998-04-21 | 2002-07-02 | 信越半導体株式会社 | Aqueous cutting fluid, method for producing the same, and cutting method using this aqueous cutting fluid |
JP2000160185A (en) * | 1998-12-02 | 2000-06-13 | Kyodo Yushi Co Ltd | Water soluble oil agent for cut processing |
JP2002080883A (en) * | 2000-06-20 | 2002-03-22 | Neos Co Ltd | Water soluble processing liquid for wire saw |
JP3468752B2 (en) * | 2001-01-22 | 2003-11-17 | 日華化学株式会社 | Water-soluble cutting oil composition |
JP4497768B2 (en) * | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | Water-soluble machining fluid composition for fixed abrasive wire saw |
JP4194783B2 (en) * | 2002-02-14 | 2008-12-10 | 協同油脂株式会社 | Water-soluble cutting oil |
-
2004
- 2004-09-30 JP JP2004287586A patent/JP2006096951A/en active Pending
-
2005
- 2005-08-30 TW TW094129628A patent/TW200619371A/en unknown
- 2005-09-22 CN CNA200510104968XA patent/CN1754949A/en active Pending
- 2005-09-27 KR KR1020050090049A patent/KR20060051695A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI403575B (en) * | 2008-12-20 | 2013-08-01 | Cabot Microelectronics Corp | Composition for improving dryness during wire sawing |
Also Published As
Publication number | Publication date |
---|---|
JP2006096951A (en) | 2006-04-13 |
KR20060051695A (en) | 2006-05-19 |
CN1754949A (en) | 2006-04-05 |
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