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TW200618213A - Method and system for packaging a MENS device - Google Patents

Method and system for packaging a MENS device

Info

Publication number
TW200618213A
TW200618213A TW094127033A TW94127033A TW200618213A TW 200618213 A TW200618213 A TW 200618213A TW 094127033 A TW094127033 A TW 094127033A TW 94127033 A TW94127033 A TW 94127033A TW 200618213 A TW200618213 A TW 200618213A
Authority
TW
Taiwan
Prior art keywords
backplate
packaging
array
transparent substrate
interferometric modulators
Prior art date
Application number
TW094127033A
Other languages
Chinese (zh)
Inventor
Mark W Miles
Jeffrey B Sampsell
Lauren Palmateer
Brian W Arbuckle
Philip D Floyd
Original Assignee
Idc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/045,800 external-priority patent/US7184202B2/en
Application filed by Idc Llc filed Critical Idc Llc
Publication of TW200618213A publication Critical patent/TW200618213A/en

Links

Landscapes

  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.
TW094127033A 2004-09-27 2005-08-09 Method and system for packaging a MENS device TW200618213A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US61327504P 2004-09-27 2004-09-27
US61347704P 2004-09-27 2004-09-27
US11/045,800 US7184202B2 (en) 2004-09-27 2005-01-28 Method and system for packaging a MEMS device

Publications (1)

Publication Number Publication Date
TW200618213A true TW200618213A (en) 2006-06-01

Family

ID=57808189

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127033A TW200618213A (en) 2004-09-27 2005-08-09 Method and system for packaging a MENS device

Country Status (1)

Country Link
TW (1) TW200618213A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475663B (en) * 2009-05-14 2015-03-01 Qualcomm Inc System-in packages
TWI488276B (en) * 2006-06-20 2015-06-11 Innovatier Inc Embedded electronic device and manufacturing method thereof
CN107906346A (en) * 2017-12-19 2018-04-13 惠科股份有限公司 Display device and hanging rack structure thereof
US10911020B2 (en) 2015-12-08 2021-02-02 Skyworks Solutions, Inc. Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488276B (en) * 2006-06-20 2015-06-11 Innovatier Inc Embedded electronic device and manufacturing method thereof
TWI475663B (en) * 2009-05-14 2015-03-01 Qualcomm Inc System-in packages
US10911020B2 (en) 2015-12-08 2021-02-02 Skyworks Solutions, Inc. Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer
CN107906346A (en) * 2017-12-19 2018-04-13 惠科股份有限公司 Display device and hanging rack structure thereof

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