TW200610174A - Semiconductor light-emitting device and production method thereof - Google Patents
Semiconductor light-emitting device and production method thereofInfo
- Publication number
- TW200610174A TW200610174A TW093126439A TW93126439A TW200610174A TW 200610174 A TW200610174 A TW 200610174A TW 093126439 A TW093126439 A TW 093126439A TW 93126439 A TW93126439 A TW 93126439A TW 200610174 A TW200610174 A TW 200610174A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor light
- production method
- stacked layer
- emitting device
- light
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 8
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
A semiconductor light-emitting device and production method thereof are disclosed. The semiconductor light-emitting device is composed of a light-impervious substrate, a bonding structure, and a semiconductor light-emitting stacked layer lifting off from a original growth substrate and bonding to the light-impervious substrate via the bonding structure, and a fluorescent material structure forming over the semiconductor light-emitting stacked layer. The production method includes lifting off a semiconductor light-emitting stacked layer from a original growth substrate, bonding the semiconductor light-emitting stacked layer to a light-impervious substrate, and forming a fluorescent material structure over the semiconductor light-emitting stacked layer.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093126439A TWI241728B (en) | 2004-09-01 | 2004-09-01 | Semiconductor light-emitting device and production method thereof |
US11/160,588 US7928455B2 (en) | 2002-07-15 | 2005-06-29 | Semiconductor light-emitting device and method for forming the same |
KR1020050069967A KR101068649B1 (en) | 2004-09-01 | 2005-07-30 | Semiconductor light emitting device and method of forming the same |
JP2005241441A JP2006074036A (en) | 2004-09-01 | 2005-08-23 | Semiconductor light emitting device and manufacturing method thereof |
DE102005040522.3A DE102005040522B4 (en) | 2004-09-01 | 2005-08-26 | Light-emitting semiconductor device and method for producing such |
US13/045,202 US8853722B2 (en) | 2002-07-15 | 2011-03-10 | Semiconductor light-emitting device and method for forming the same |
US14/507,445 US9627577B2 (en) | 2002-07-15 | 2014-10-06 | Semiconductor light-emitting device and method for forming the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093126439A TWI241728B (en) | 2004-09-01 | 2004-09-01 | Semiconductor light-emitting device and production method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI241728B TWI241728B (en) | 2005-10-11 |
TW200610174A true TW200610174A (en) | 2006-03-16 |
Family
ID=35745894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093126439A TWI241728B (en) | 2002-07-15 | 2004-09-01 | Semiconductor light-emitting device and production method thereof |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006074036A (en) |
KR (1) | KR101068649B1 (en) |
DE (1) | DE102005040522B4 (en) |
TW (1) | TWI241728B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI470838B (en) * | 2012-05-25 | 2015-01-21 | Phostek Inc | Method for forming semiconductor light-emitting device |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006026481A1 (en) * | 2006-06-07 | 2007-12-13 | Siemens Ag | Method for arranging a powder layer on a substrate and layer structure with at least one powder layer on a substrate |
KR100757800B1 (en) * | 2006-06-30 | 2007-09-11 | 서울옵토디바이스주식회사 | Light emitting diode for alternating current having an insulating protective film and a method of manufacturing the same |
DE102006051746A1 (en) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optoelectronic component with a luminescence conversion layer |
DE102006061175A1 (en) * | 2006-12-22 | 2008-06-26 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor component has semiconductor chip and luminescence conversion element with luminescent material, which emits electromagnetic radiations |
KR101420214B1 (en) * | 2008-01-21 | 2014-07-17 | 엘지이노텍 주식회사 | The nitride-based light- |
JP2010054695A (en) * | 2008-08-27 | 2010-03-11 | National Institute Of Advanced Industrial Science & Technology | Method of manufacturing optical device |
JP2010263050A (en) * | 2009-05-01 | 2010-11-18 | Showa Denko Kk | LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING DIODE LAMP |
WO2010143114A1 (en) * | 2009-06-11 | 2010-12-16 | Koninklijke Philips Electronics N.V. | Led illumination device |
DE102010046966B4 (en) | 2010-09-29 | 2018-05-24 | Infineon Technologies Ag | Building block and method for the production of a building block |
JP2012069977A (en) * | 2011-11-08 | 2012-04-05 | Citizen Electronics Co Ltd | Light emitting device and method for manufacturing the same |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677079B2 (en) * | 1984-09-18 | 1994-09-28 | コニカ株式会社 | Radiation image information reader |
US5376580A (en) * | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
JPH09260060A (en) * | 1996-03-25 | 1997-10-03 | Uchitsugu Minami | Electro-luminescence element and manufacture thereof |
JP3617587B2 (en) * | 1997-07-17 | 2005-02-09 | 日亜化学工業株式会社 | Light emitting diode and method for forming the same |
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
JPH1187778A (en) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof |
JP4770058B2 (en) | 2000-05-17 | 2011-09-07 | 日亜化学工業株式会社 | LIGHT EMITTING ELEMENT AND DEVICE |
JP2002016284A (en) * | 2000-06-29 | 2002-01-18 | Toshiba Corp | Method for manufacturing gallium nitride semiconductor light-emitting element |
US6650044B1 (en) | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
JP5110744B2 (en) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | Light emitting device and manufacturing method thereof |
US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
JP3775268B2 (en) * | 2001-09-03 | 2006-05-17 | 日亜化学工業株式会社 | Method for forming light emitting device |
JP2003243727A (en) * | 2001-12-14 | 2003-08-29 | Nichia Chem Ind Ltd | Light emitting apparatus |
CA2754097C (en) * | 2002-01-28 | 2013-12-10 | Nichia Corporation | Nitride semiconductor device having support substrate and its manufacturing method |
JP2004031669A (en) * | 2002-06-26 | 2004-01-29 | Seiko Epson Corp | Semiconductor element member, semiconductor device, manufacturing method thereof, electro-optical device, and electronic equipment |
TW544958B (en) * | 2002-07-15 | 2003-08-01 | Epistar Corp | Light emitting diode with an adhesive layer and its manufacturing method |
JP4334845B2 (en) * | 2002-10-15 | 2009-09-30 | 株式会社リコー | Surface emitting laser, surface emitting laser array, optical transmission module, optical transmission / reception module, optical communication system, laser printer, and optical pickup system |
JP2004207576A (en) * | 2002-12-26 | 2004-07-22 | Toshiba Lighting & Technology Corp | Light emitting diode lamp |
-
2004
- 2004-09-01 TW TW093126439A patent/TWI241728B/en not_active IP Right Cessation
-
2005
- 2005-07-30 KR KR1020050069967A patent/KR101068649B1/en active Active
- 2005-08-23 JP JP2005241441A patent/JP2006074036A/en active Pending
- 2005-08-26 DE DE102005040522.3A patent/DE102005040522B4/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI470838B (en) * | 2012-05-25 | 2015-01-21 | Phostek Inc | Method for forming semiconductor light-emitting device |
Also Published As
Publication number | Publication date |
---|---|
JP2006074036A (en) | 2006-03-16 |
TWI241728B (en) | 2005-10-11 |
DE102005040522B4 (en) | 2022-03-03 |
DE102005040522A1 (en) | 2006-03-02 |
KR20060048984A (en) | 2006-05-18 |
KR101068649B1 (en) | 2011-09-28 |
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Legal Events
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MK4A | Expiration of patent term of an invention patent |