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TW200609390A - Copper strike plating bath - Google Patents

Copper strike plating bath

Info

Publication number
TW200609390A
TW200609390A TW094125795A TW94125795A TW200609390A TW 200609390 A TW200609390 A TW 200609390A TW 094125795 A TW094125795 A TW 094125795A TW 94125795 A TW94125795 A TW 94125795A TW 200609390 A TW200609390 A TW 200609390A
Authority
TW
Taiwan
Prior art keywords
plating bath
strike plating
copper strike
copper
copper cyanide
Prior art date
Application number
TW094125795A
Other languages
Chinese (zh)
Inventor
Yoko Ogihara
Masao Nakazawa
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200609390A publication Critical patent/TW200609390A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids. The copper cyanide compound is preferably sodium copper cyanide, potassium copper cyanide or a mixture thereof.
TW094125795A 2004-08-05 2005-07-29 Copper strike plating bath TW200609390A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004229199A JP4480509B2 (en) 2004-08-05 2004-08-05 Copper strike plating bath

Publications (1)

Publication Number Publication Date
TW200609390A true TW200609390A (en) 2006-03-16

Family

ID=35756351

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125795A TW200609390A (en) 2004-08-05 2005-07-29 Copper strike plating bath

Country Status (4)

Country Link
US (1) US20060027462A1 (en)
JP (1) JP4480509B2 (en)
KR (1) KR20060049053A (en)
TW (1) TW200609390A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5653743B2 (en) * 2009-12-25 2015-01-14 株式会社荏原製作所 Metal film forming method and apparatus
CN107665870A (en) * 2017-11-15 2018-02-06 贵溪博远金属有限公司 A kind of copper palladium-silver bonding line
KR102336506B1 (en) * 2020-05-12 2021-12-07 주식회사 써켐 A Cyanide Copper Plating Solution And A Method for Cyanide Copper Plating Using The Same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2737485A (en) * 1952-09-22 1956-03-06 Gen Motors Corp Electrodeposition of copper
US2841542A (en) * 1955-12-19 1958-07-01 Udylite Res Corp Electrodeposition of copper
AU2003217197A1 (en) * 2002-01-10 2003-07-30 Semitool, Inc. Method for applying metal features onto barrier layers using electrochemical deposition

Also Published As

Publication number Publication date
JP2006045623A (en) 2006-02-16
US20060027462A1 (en) 2006-02-09
KR20060049053A (en) 2006-05-18
JP4480509B2 (en) 2010-06-16

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