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TW200609381A - Composition for formining a chemical layer on surfaces of copper and copper alloys - Google Patents

Composition for formining a chemical layer on surfaces of copper and copper alloys

Info

Publication number
TW200609381A
TW200609381A TW093127099A TW93127099A TW200609381A TW 200609381 A TW200609381 A TW 200609381A TW 093127099 A TW093127099 A TW 093127099A TW 93127099 A TW93127099 A TW 93127099A TW 200609381 A TW200609381 A TW 200609381A
Authority
TW
Taiwan
Prior art keywords
copper
formining
composition
resistance
chemical layer
Prior art date
Application number
TW093127099A
Other languages
Chinese (zh)
Inventor
Chih-Chiang Chen
Te-Chun Chang
Hsiou-Fang Juo
Original Assignee
Formochem Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formochem Technology Co Ltd filed Critical Formochem Technology Co Ltd
Priority to TW093127099A priority Critical patent/TW200609381A/en
Publication of TW200609381A publication Critical patent/TW200609381A/en

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  • Chemical Treatment Of Metals (AREA)

Abstract

A surface treating agent for copper and copper alloy, comprising an aqueous solution containing an oxalinize compound, inorganic bases, and metal ions. The agent forms an organic film selectively on the surface of copper while forming no film on other metal. Organic film formed on copper surface shows excellent heat-resistance and moisture-resistance; therefore, the treated printed wiring board (PWB) preserves excellent soldability for a long time.
TW093127099A 2004-09-07 2004-09-07 Composition for formining a chemical layer on surfaces of copper and copper alloys TW200609381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093127099A TW200609381A (en) 2004-09-07 2004-09-07 Composition for formining a chemical layer on surfaces of copper and copper alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093127099A TW200609381A (en) 2004-09-07 2004-09-07 Composition for formining a chemical layer on surfaces of copper and copper alloys

Publications (1)

Publication Number Publication Date
TW200609381A true TW200609381A (en) 2006-03-16

Family

ID=57807491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093127099A TW200609381A (en) 2004-09-07 2004-09-07 Composition for formining a chemical layer on surfaces of copper and copper alloys

Country Status (1)

Country Link
TW (1) TW200609381A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105081614A (en) * 2015-09-07 2015-11-25 东莞市富默克化工有限公司 A kind of OSP prepreg
CN116444572A (en) * 2023-05-05 2023-07-18 广东哈福技术股份有限公司 Preparation and application methods of organic solderability preservative

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105081614A (en) * 2015-09-07 2015-11-25 东莞市富默克化工有限公司 A kind of OSP prepreg
CN116444572A (en) * 2023-05-05 2023-07-18 广东哈福技术股份有限公司 Preparation and application methods of organic solderability preservative
CN116444572B (en) * 2023-05-05 2024-04-16 广东哈福技术股份有限公司 Preparation and application methods of organic solderability preservative

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