TW200608472A - Electron-tunneling-type power and cool structure and method for producing the same - Google Patents
Electron-tunneling-type power and cool structure and method for producing the sameInfo
- Publication number
- TW200608472A TW200608472A TW093125948A TW93125948A TW200608472A TW 200608472 A TW200608472 A TW 200608472A TW 093125948 A TW093125948 A TW 093125948A TW 93125948 A TW93125948 A TW 93125948A TW 200608472 A TW200608472 A TW 200608472A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- tunneling
- electron
- type power
- insulation mats
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 238000009413 insulation Methods 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- 229920000642 polymer Polymers 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000005979 thermal decomposition reaction Methods 0.000 abstract 1
Landscapes
- Cold Cathode And The Manufacture (AREA)
Abstract
The present invention provides an electron-tunneling-type power and cool structure and a method for producing the same, in which a semiconductor production process is applied to produce an electron-tunneling-type power and cool structure with a stable vacuum clearance. The production method comprises: providing a substrate; sequentially forming a binding layer, a first metal layer and a plurality of support insulation mats on the surface of the substrate; coating a polymer layer on the surface of the thick metal layer and covering the support insulation mats and filling up the clearances; thinning the polymer layer until exposing the tip of the support insulation mats; forming a second metal layer on the polymer layer and the support insulation mats; using a thermal decomposition process to remove the polymer layer and separating the first metal layer and the second metal layer with the support insulation mats and using them to maintain a clearance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93125948A TWI233636B (en) | 2004-08-27 | 2004-08-27 | Electron-tunneling-type power and cool structure and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93125948A TWI233636B (en) | 2004-08-27 | 2004-08-27 | Electron-tunneling-type power and cool structure and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI233636B TWI233636B (en) | 2005-06-01 |
| TW200608472A true TW200608472A (en) | 2006-03-01 |
Family
ID=36501791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93125948A TWI233636B (en) | 2004-08-27 | 2004-08-27 | Electron-tunneling-type power and cool structure and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI233636B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401830B (en) * | 2008-12-31 | 2013-07-11 | Ind Tech Res Inst | Low heat leakage thermoelectric nanowire arrays and manufacture method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404152B (en) * | 2007-01-16 | 2013-08-01 | Univ Nat Cheng Kung | Immediate Damage Detection Method and Measurement of Porous Ultra - low Dielectric Materials |
-
2004
- 2004-08-27 TW TW93125948A patent/TWI233636B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401830B (en) * | 2008-12-31 | 2013-07-11 | Ind Tech Res Inst | Low heat leakage thermoelectric nanowire arrays and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI233636B (en) | 2005-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |