TW200539981A - Laser processing device - Google Patents
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- TW200539981A TW200539981A TW093126144A TW93126144A TW200539981A TW 200539981 A TW200539981 A TW 200539981A TW 093126144 A TW093126144 A TW 093126144A TW 93126144 A TW93126144 A TW 93126144A TW 200539981 A TW200539981 A TW 200539981A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
200539981 九、發明說明: [發明所屬之技術領域] 本發明乃關於,以在印刷電路板等被加工物上進行開 孔加工為主要目的的雷射加工裝置,尤其是可提升其生產 力及加工品質的雷射加工裝置。 [先前技術] 以在印刷電路板等被加工物上進行開孔加工為主要目 的的習知雷射加工裝置當中,尤其是可同時於2處實施加 工的雷射加工裝置,例如具備於日本國際公開號碼 W003/041904號公報當中的第9圖所示般的構成。 於弟9圖^中,1為雷射振盪器,2為雷射光,3為, 使加工孔成為所希望的大小及形狀而從入射的雷射光當 中’切下所需部分的雷射光之光罩,4為反射雷射光2而 引‘光路徑的複數個反射鏡。24為將雷射光分光為兩條雷 射光的第一偏光分光鏡,6為於第一偏光分光鏡24當中所 二光的邊的田射光,6P為雷射光6的偏光方向,7為於 第-偏光分光鏡當中所分光的另一邊的雷射光,為雷射 光7的偏光方向,25為反射雷射光6,並讓雷射光7穿透 :引導至第—檢流掃描鏡12的第二偏光分光鏡。W為於 光分光鏡所反射的雷射光,11為於第二偏光分光鏡 :透的雷射光,14為用於引導雷射光6至第二偏光分光 =的反射鏡,17為用於使雷射光1Q、n聚光於被加工 =的透鏡’13為於2轴方向上掃描雷射光7,並 ¥至弟—偏光分光鏡25的第—檢流掃描鏡,12為於2 316248 5 200539981 轴方向上掃描雷射光10及雷射光u,並弓i導至被加工物 20的第二檢流掃描鏡。18為於χγ方向移動被加工物別 承載台,19為測定由透鏡17所射出的雷射光的 能量的能量感測器(p〇wersens〇r),15為阻擋雷射光6的第 1快門,16為阻擋雷射光7的第2快門。此外,能量感測 态19固定於χγ承載台丨8,於測定雷射光的能量之際, 為可移動至雷射光所照射於能量感測器19的感光部的位 置。 —、如第9圖所示般,於偏光分光鏡當中將一條雷射光分 光為兩條雷射光,並獨立掃描兩條雷射光,藉此可同時於 2處上貫施加工的開孔加工用雷射加工裝置當甲,藉由雷 射振盪裔1以直線偏光而產生振盪的雷射光2,經由光罩3 及反射鏡4而被引導至第一偏光分光鏡%。 然後’於第一偏光分光鏡24當中,雷射光2的p波 成分牙透第一偏光分光鏡24而成為雷射光6,S波成分於 第偏光分光鏡24被反射而被分光為雷射光7。 牙透第一偏光分光鏡24的雷射光6經由反射鏡14而 被引導至第二偏光分光鏡25。 另一方面’於第一偏光分光鏡24被反射的雷射光7, 由第一檢流掃描鏡13進行2軸方向掃描之後,被引導至第 二偏光分光鏡25。 雷射光6經常於相同位置上被引導至第二偏光分光鏡 25,而雷射光7可藉由控制第一檢流掃描鏡13的擺角,來 調整入射於第二偏光分光鏡25的位置及角度。 6 316248 200539981 ,後,雷射光1〇、u由第二檢流掃描鏡n 方向掃描之後’被引導至㈣鏡17,並各於: 加工物20的特定位置。 九、破 此時’藉由掃描第一檢流掃⑽13,可設定雷射光“ 三對雷射光1G的光軸於某設定範圍内,例如4職見方的 乾圍内擺動。藉由此,例如經介在可加工範圍為每邊%職 寺擺動的第二檢流掃描鏡12,而可同時照射雷射光於被加 工物20的任意不同2點上。 、第10圖係顯示,用於說明偏光分光鏡24的原理之模· 式圖,中央為正視圖,其左右為側視圖,上方為上視圖。 乂於第10圖當中,26為偏光分光鏡的窗孔(Window)部 刀於採用石反酸氣體雷射的情況下,乃採用Znse或是Ge。 27為用於使雷射光產生9〇。折回的反射鏡。 偏光分光鏡24為,使產生偏光分離而對入射光束呈布 魯司特角(Brewster Angle)的構造。 因此’一旦入射雷射光28於此偏光分光鏡24,則具_ 備偏光方向28p的成分(P波成分)會穿透,而偏光方向28s 的成分(S波成分)會反射的性質。 此外,若是為所有的偏光方向為均質存在的圓偏光, 以及對P波、S波呈45G的角度的偏光方向的話,則雷射 光會被等量分光,而具備雷射光29及雷射光30的能量相 同的性質。 因此,藉由使成為圓偏光,或是對P波、S波呈45° 的角度,可使往第一偏光分光鏡24的入射光束2,具備等 7 316248 200539981 量分離能量的構成。 此外,當然具備,若是入射於偏光分光鏡24的雷射光 的偏光方向僅有P波成分的話,則全部穿透,若是僅有s 波成分的話,則全部反射的性質。 ' 因此,藉由使雷射光7僅具備p波成分並使雷射光ό ,僅具備S波成分,可得到,不會產生能量損失而引導往第 二偏光分光鏡25的入射光束,至第二檢流掃描鏡12的構 • 成。 立於上述般的以往的雷射加工裝置當中,第一偏光分光 、兄4及第一偏光分光叙2 5均藉由,使往雷射光的窗孔部 二26的入射角王布魯司特角的方式來配置窗孔,而將雷射 光2为光為s波、Ρ波成分,例如,於採用ZnSe為窗孔的 材質而用於碳酸氣體雷射的分光情況下,若布魯司特角為 67.5的話,則往窗孔的入射角變大,若設引導至偏光分 光鏡的雷射光徑為p 35mm的話,則窗孔上的雷射光徑於 、長軸方向將成為94mm。因此,窗孔必須具備上述雷射光 私的一5七以上的有效徑,而產生難以維持製作精密度的 問題。 此外,做為P波成分而穿透第一偏光分光鏡24的雷 射光6,於第二偏光分光鏡25當中有必要做為s波成分來 反射,而做為s波成分而於第一偏光分光鏡24被反射的 雷射光7’於第二偏光分光鏡25當中有必要做為?波成分 而穿透,因此有必要於第一、第二偏光分光鏡當中,各設 置用於使雷射光以90。折回的反射鏡27,此外,由於窗孔 316248 200539981 部分26及反射鏡27的相對位置關係,對偏光分光鏡之後 的光路徑的精密度產生極大影響’因此必須注意窗孔部分 26及反射鏡27的相對位置關係來製作偏光分光鏡,因而 產生使偏光为光鏡成為昂貴的光學元件的問題。 此外’考慮ίθ透鏡17的特性’為了獲得更為安定的 加工品質,有必要極力縮短從第一偏光分光鏡以至透 鏡η之間的光路徑長,並擴大偏光分光鏡的有效徑。而由 於難以設計出足夠大的偏光分光鏡的有效徑,因此實際上 的偏光分光鏡的有效徑並不夠,當引導至Μ透鏡17_ 射光徑較所希望的光徑還小受限時,於⑺透鏡的焦距^ 定的情=下’則被加工物上的雷射光徑較所希望的光徑還 要大巾田叉限’而無法構成適用於較小的開孔加工的光路 徑’因而產生無法得到所要求的加工品質的問題。 :夕=用於光學系統中的各個光學元件,於製程上 =因而),愈是要求平面度的精密度,則良 率忍差,口而仏成尚成本,因此,一般乃以雷射光波長又 =至1/20左右的光學像差來製作。若是在未考纽 組合多數個如此程度的光學元件建構成光學李的 話,則各個光學元件的像差累積,將冓產成:像: 學元::匕:::言,由於製作各個表面形狀為平面的光 子兀件的表面及背面的製程相同,因此报有 及背面的表面形狀均為凹狀 表面 狀4疋凸狀的傾向,於穿透型光 316248 9 200539981 學元件當t,產生光學失真(像差)擴大的問題。 本發明乃為了解決上述問題而研發出者,第1目的 二:Γ用藉由偏光分離機構而分光後的雷射光來進行加 為偏:Γ工裝置當中,可採用較為便宜的光學元件來做 、=1機構’並獲得可縮小被加工物上的雷射光徑之 ,雷射加工裝置。 此外’弟2目的為,獲得可ρ备/ 狀所造成的像差,而提升加工 元件的表面形 [發明内容] ^ 1的雷射加工裝置。 中二達成上述目的’於第1發明的雷射加工裝置當 I二:Γ將由雷射振盡器所射出的雷射光引導至被加 、勺夕數的光學元件所組成的光學系統,並以第一偏光 二離^㈣—條雷射光分光為兩條雷射光,—條經由反射 ί雨“ 1条由第:檢流掃描鏡當中向2軸方向掃描,於引 户隹1木田于光至第二偏光分離機構之後,由第二檢流掃描 知進行掃描,而加工被加工 軸呈45。的方式來配置上述第’及:為二對雷射光的光 置上述弟一及第二偏光分離機構。 離機構Γ發明的雷射加工裝置當中’第一及第二偏光分 Α表面形成介電質多層膜塗膜的偏光分光鏡。 於第3發明的雷射加工裝置當中’上述第一 光分離機構的_、喜Μ & & — 邊勺面為凹狀,而該面的背面為凸狀。 於弟4發明的雷射加工裝置當中,上述第一偏光分離 機構以反射雷身十本/丨Α 夂射田射先側的面為凸狀,以該面的背面為凹狀, 亚引^亥第-偏光分離機構當中所反射的雷射光,至表面 316248 10 200539981 形狀為凹狀的上述第—檢流掃描鏡’而上述第二偏光分離 機構以反射雷射光側的面為凹狀,以該面的背面為凸狀。 於第5發明的雷射加工裝置當中,上述第—偏光分離 機構以反射雷射光側的面為凹狀,以該面的背面為凸狀, 亚引導該第一偏光分離機構當中所反射的雷射光,至表面 形狀為凸狀的上述第_檢流掃描鏡,而上述第:偏光分離 機構以二射雷射光側的面為凸狀’以該面的背面為凹狀。 於=6發明的雷射加工裝置#中’以上述雷射光的波 :.、’、λ時,上述第一及第二偏光分離機構的表面的凹狀 是凸狀’是以λ/20以下的精密度形成。 於第7發明的雷射加工裝置當中,於上述光 =配^面形狀略為相同的1組光學元件為,使-邊的 呈^ 束人射面對另—邊的光學元件的光束入射面 邊二光與I:广邊的光學元件的光束入射角與對另-k的先子70件的光束入射角相同。 於第8發明的雷射力 壯 器所射出的雷射光至上、十、/自,;從上述雷射振盡 路徑當中,m 弟—偏光分離機構為止的雷射光 ± 1 έ 光罩,於此光罩及上述被加工物之間g己置 上述1組光學元件。 u加罝 於第9發明的雷射加 1組光學元件的支架(hold 況下,乃配置代表此方向 面相同之方向。 工裝置當中,具備個別固定上述 er) ’於上述支架具備方向性的情 的轴為,與各個光學元件的入射 於第10發明的雷射加工裝置當中,以上述雷射光的波 316248 200539981 長為λ日”上述1組光學元件的表面形狀,是以λ/10至 λ /20的精密度而形成。 土八於弟U發明的雷射加工裝置當中,上述第-及第二偏 、:離機構具備’與雷射光的行進方向垂直,且可於互相 正交的2軸方向上調整角度的機構。200539981 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a laser processing device whose main purpose is to perform hole processing on a processed object such as a printed circuit board. In particular, it can improve its productivity and processing quality. Laser processing device. [Prior art] Among the conventional laser processing devices whose main purpose is to perform hole processing on a workpiece such as a printed circuit board, in particular, a laser processing device that can perform processing at two locations at the same time, for example, is provided in Japan International The structure shown in FIG. 9 in the publication No. W003 / 041904. In Figure 9 of Figure 1, 1 is the laser oscillator, 2 is the laser light, and 3 is the light that cuts the required part of the laser light from the incident laser light so that the processed hole has the desired size and shape. The cover 4 is a plurality of reflecting mirrors that reflect the laser light 2 and guide the light path. 24 is a first polarizing beam splitter that splits the laser light into two laser beams, 6 is a field beam on the side of the second light beam in the first polarizing beam splitter 24, 6P is a polarization direction of the laser light 6, and 7 is the first -The laser light on the other side of the beam splitter in the polarizing beam splitter is the polarization direction of the laser light 7, 25 is the reflected laser light 6, and allows the laser light 7 to pass through: the second polarized light is guided to the first galvanic scanning mirror 12. Beamsplitter. W is the laser light reflected by the light beam splitter, 11 is the second polarized light beam splitter: transparent laser light, 14 is the mirror for guiding the laser light 6 to the second polarized light beam splitter, 17 is used for the laser The light 1Q and n are condensed on the processed lens '13 to scan the laser light 7 in the 2 axis direction, and to the 1st—galvanic scanning mirror of the polarizing beam splitter 25, 12 on the 2 316248 5 200539981 axis The laser light 10 and the laser light u are scanned in the directions, and the bow i is guided to the second galvano-scanning mirror of the workpiece 20. 18 is a moving object stage in the χγ direction, 19 is an energy sensor (p〇wersens〇r) that measures the energy of the laser light emitted by the lens 17, and 15 is a first shutter that blocks the laser light 6, 16 is a second shutter that blocks the laser light 7. In addition, the energy sensing state 19 is fixed to the χγ stage 8 and can be moved to a position where the laser light irradiates the photosensitive portion of the energy sensor 19 when measuring the energy of the laser light. —As shown in Figure 9, split a laser beam into two laser beams in a polarizing beam splitter, and scan the two laser beams independently, so that the two holes can be applied at the same time. When the laser processing device is a nail, the laser light 2 that is oscillated by linearly polarizing the laser oscillating light 1 is guided to the first polarizing beam splitter% through the mask 3 and the mirror 4. Then, in the first polarizing beam splitter 24, the p-wave component of the laser light 2 penetrates the first polarizing beam splitter 24 to become the laser light 6, and the S-wave component is reflected by the second polarizing beam splitter 24 and is split into laser light 7 . The laser light 6 which has penetrated the first polarizing beam splitter 24 is guided to the second polarizing beam splitter 25 via the reflecting mirror 14. On the other hand, the laser light 7 reflected by the first polarizing beam splitter 24 is scanned by the first galvano-scanning mirror 13 in the two-axis direction, and then guided to the second polarizing beam splitter 25. The laser light 6 is often guided to the second polarizing beam splitter 25 at the same position, and the laser light 7 can adjust the position and incidence of the second polarizing beam splitter 25 by controlling the swing angle of the first galvano-scanning mirror 13. angle. 6 316248 200539981. After that, the laser light 10 and u are scanned by the second galvano-scanning mirror n and are guided to the mirror 17 and each at a specific position of the workpiece 20. Nine, break this time 'By scanning the first galvanic sweep 13, the laser light can be set.' The optical axes of the three pairs of laser light 1G are within a certain setting range, for example, within the dry range of a 4 position square. By this, for example, Through the second galvano-scanning mirror 12 that can be processed in the range of swinging on each side, laser light can be irradiated onto any two different points of the object 20 at the same time. Figure 10 shows the polarized light. Schematic diagram of the principle of the beam splitter 24. The center is the front view, the left and right sides are side views, and the top is the top view. 乂 In Figure 10, 26 is the window part of the polarizing beam splitter. In the case of inverse acid gas laser, Znse or Ge is used. 27 is a reflector for generating 90% of the laser light. The polarizing beam splitter 24 separates the polarized light and makes the incident light beam blue. The structure of the special angle (Brewster Angle). So 'once the incident laser light 28 enters the polarizing beam splitter 24, the component (P wave component) with the polarization direction 28p will pass through, and the component (S wave with the polarization direction 28s) will pass through. Composition) will reflect the nature. Also, if for all If the light direction is a homogeneous circularly polarized light and a polarization direction at an angle of 45G to the P wave and S wave, the laser light will be divided into equal amounts, and the laser light 29 and the laser light 30 have the same energy. By making it into circularly polarized light, or at an angle of 45 ° to the P wave and S wave, the incident light beam 2 to the first polarizing beam splitter 24 can be provided with a structure that separates the energy by 7 316248 200539981. In addition, of course It has the property that if the polarization direction of the laser light incident on the polarizing beam splitter 24 has only the P-wave component, it will penetrate all, and if it has only the s-wave component, it will have the property of total reflection. Therefore, by making the laser light 7 Only the p-wave component is provided and the laser light is provided, and only the S-wave component is provided, and the incident light beam guided to the second polarizing beam splitter 25 without generating energy loss can be obtained. In the conventional laser processing apparatus as described above, the first polarized light beam splitter, the brother 4 and the first polarized light beam splitter 25 are all used to make the incident angle of the window hole part 26 of the laser beam Wang Bruce. Special corner way to configure window holes The laser light 2 is light with s-wave and P-wave components. For example, in the case of using ZnSe as the material of the window hole for the splitting of carbon dioxide gas laser, if the Brewster angle is 67.5, go to the window. The incident angle of the hole becomes larger. If the laser light diameter guided to the polarizing beam splitter is p 35mm, the laser light diameter on the window hole will be 94mm in the long axis direction. Therefore, the window hole must have the above-mentioned laser light privacy. It is difficult to maintain the production precision when the effective diameter is more than 57. In addition, as the P wave component, the laser light 6 that penetrates the first polarizing beam splitter 24 is necessary in the second polarizing beam splitter 25. Is it necessary to reflect as the s-wave component and the laser light 7 'reflected as the s-wave component in the first polarizing beam splitter 24 in the second polarizing beam splitter 25? The wave component penetrates, so it is necessary to set each of the first and second polarizing beam splitters to make the laser light 90 °. The folded-back mirror 27, in addition, due to the relative position of the window hole 316248 200539981 part 26 and the mirror 27, has a great impact on the precision of the light path behind the polarizing beam splitter '. Therefore, it is necessary to pay attention to the window hole part 26 and the mirror 27 The relative positional relationship between the polarizing beam splitter and the polarizing beam splitter makes an expensive optical element. In addition, "taking into consideration the characteristics of the θ lens 17", in order to obtain more stable processing quality, it is necessary to minimize the length of the light path from the first polarizing beam splitter to the lens η, and to increase the effective diameter of the polarizing beam splitter. And because it is difficult to design a sufficiently large effective diameter of the polarizing beam splitter, the effective diameter of the actual polarizing beam splitter is not enough. When guided to the M lens 17_, the light path diameter is smaller than the desired optical path. The focal length of the lens ^ is set to == 'the laser light path on the object to be processed is larger than the desired light path', and it cannot form a light path suitable for small opening processing '. The problem that the required processing quality cannot be obtained. : Xi = used for each optical element in the optical system, in the process = =), the more the precision of flatness is required, the yield tolerance is poor, and the cost is too high. Therefore, it is generally based on the laser light wavelength. = To about 1/20 of optical aberration. If a large number of optical elements with such a degree are combined to construct an optical lens, the aberrations of each optical element will accumulate and be produced into: Image: Xueyuan :: Dagger ::: Yuan, due to the production of each surface shape The photonic element is a flat photonic element with the same manufacturing process on the surface and the back surface. Therefore, the surface shape of the photon element and the back surface are both concave and convex. It is a transmissive light. 316248 9 200539981 The problem of enlarged distortion (aberration). The present invention was developed to solve the above-mentioned problems. The first object is: Γ is used to add and polarize the laser light that has been split by a polarization separating mechanism. Γ can use relatively inexpensive optical elements in the Γ device. , = 1 mechanism 'and obtain a laser processing device that can reduce the laser light path on the workpiece. In addition, the purpose of "Brother 2" is to obtain a laser beam processing device with aberration caused by ρ / shape, and improve the surface shape of the processing element. S2 achieves the above-mentioned objective. The laser processing device of the 1st invention when I2: Γ guides the laser light emitted by the laser oscillator to an optical system composed of optical elements that are added and numbered. The first polarized light is separated from two light beams—the laser beam is split into two laser beams, and one is reflected by the rain. One is scanned from the first: galvanometer scanning mirror in the direction of 2 axes, and it is introduced at the entrance to the wooden gate 1 After the second polarized light separation mechanism, scanning is performed by the second galvanic scanning scan, and the processing axis is 45. The above-mentioned method is configured to separate the first and second polarized light for two pairs of laser light. In the laser processing device invented by the mechanism Γ, a polarizing beam splitter in which a dielectric multilayer film is formed on the surfaces of the first and second polarized light beams A. In the laser processing device of the third invention, the above-mentioned first light _ 、 喜 M & & — The side surface of the separation mechanism is concave, and the back of the surface is convex. In the laser processing device invented by Brother 4, the first polarization separation mechanism described above reflects the laser beam. The surface of the front side of this / 丨 Α 夂 射 田 射 is convex, Taking the back of the surface as a concave shape, the laser light reflected in the sub-inductor helium-polarized light separation mechanism, to the surface 316248 10 200539981, said first galvano-scanning mirror having a concave shape and said second polarized light separation mechanism The laser-reflecting surface is concave, and the back of the surface is convex. In the laser processing apparatus of the fifth invention, the first-polarized-light separating means has a concave laser-reflecting surface, and the The back surface of the surface is convex, and the laser light reflected in the first polarization separation mechanism is sub-guided to the above-mentioned _galvanic scanning mirror whose surface shape is convex, and the above-mentioned: the polarization separation mechanism uses the two-laser laser light side When the surface of the surface is convex, the back surface of the surface is concave. In the laser processing device # 6 of the invention, when the wave of the laser light:. ,, and λ, the first and second polarized light separation mechanisms are described. The concave shape of the surface is convex. It is formed with a precision of λ / 20 or less. In the laser processing device of the seventh invention, in the above-mentioned group of optical elements whose light = distribution surface shape is slightly the same, The side of the ^ beam shot at the other side of the optical element The incident angle of the two light beams on the incident surface of the beam and I: the optical element of the broad-side optical element is the same as the incident angle of the beam to the first 70 sons of -k. The laser light emitted by the laser device of the eighth invention is supreme , 十 、 / 自 ,; from the above laser exhaustion path, the laser beam up to m-polarization separation mechanism ± 1 bar, and the above-mentioned group of optics is placed between this mask and the workpiece Components. U Add a bracket for the laser plus a group of optical components of the ninth invention (in the case of hold, it is configured to represent the same direction in this direction. In the construction device, the above-mentioned er is individually fixed) 'In the direction of the above bracket The axis of temperament is that with the laser processing device of the tenth invention incident to each optical element, the wave length of the laser light 316248 200539981 is λ day. The surface shape of the above-mentioned group of optical elements is λ / It is formed with a precision of 10 to λ / 20. In the laser processing device invented by Tu Ba Yudi, the above-mentioned first and second deflection mechanisms are provided with a mechanism that is perpendicular to the traveling direction of the laser light and can adjust the angle in two mutually orthogonal directions.
Ab旦:第12 明的雷射加工裝置當中’具備用於吸收做為 =貝失而從上逑第二偏光分離機構漏出的雷射光的阻尼 為(damper)。 傲兔::本杳明’猎由採用入射角為45。❾偏光分光鏡來 =偏光分離機構,可藉由透鏡來人射較大光徑的雷 的’亚可縮小被加工物上的雷射光徑,而可實施更精密 、此外偏光分離機構變得較便宜而可降低成本。 [貫施方式] - 第1實施刑能 ^圖乃關於本發明的第丨實施型態,係顯示,採用 入十$45的偏光分光鏡來做為偏光分離機構,將一條 雷射1分光為=條雷射光’藉由獨立掃描兩條雷射光,而 ,同,=2處貫施加工的開孔用雷射加工裝置的構成圖。 略詳細說明。 Π構成者,賦予相同符號並省 於弟1圖當中,5為第一偏光分光鏡,6為穿透第一偏 光分光鏡5的雷射光’ 6p為雷射光6之對第—偏光分光鏡 5而5為P波成份的偏光方向,&為雷射光6之對第一偏 光分光鏡5而言為S波成份的偏光方向,7為反射第一偏 316248 12 200539981 光分光鏡5的雷射光,7s為f 而言為s波成份的偏光方向,々為-偏光分光鏡 分光鏡而言為P波成份的偏二田光7之對弟-偏光 災风切的偏先方向,8為帛二偏 9為用於吸收做為能量損失所 先、見, A ^ ^ ^ , 玍的田射先的阻尼器,10 為田射先“中的於第二偏光分光鏡8所反射的雷射光, 11為雷射光7當中的於第—傯本八上拉 田耵九 田Τ B7万、弟一偏先分光鏡8所穿透的雷射 光0 於習知的技術當中偏光分離雷射光的情況下,採用以 布魯司特角做為入射角的窗孔,藉由偏光分離包含相等p 波成分及S波成分的雷射光,來等量分配穿透的p波成分 及反射的S波成分,而等量分割雷射光的能量。 然而,於本實施型態當中,藉由採用例如於反射面施 加介電質多層膜塗膜的偏光分光鏡,來配置入射角為對雷 射光的光軸呈45。,而非布魯司特角,並以固定精密度而 使P波穿透以及以固定精密度而使S波反射,而等量分割 雷射光的能量。 在此說明,於採用使95%的P波及5%的S波穿透, 並使95%的S波及5 %的P波反射的塗膜的偏光分光鏡的 情況,來做為一例。若以入射於第一偏光分光鏡5的雷射 光的能量為100%,則穿透第一偏光分光鏡5的雷射光6, 包含47.5%的P波成分及2·5%的S波成分。之後,包含 47·5%的S波成分及2.5%的Ρ波成分的雷射光入射於弟·一 偏光分光鏡8,而於第二偏光分光鏡8反射的雷射光,包 含45.125%的S波成分及0.125%的Ρ波成分,引導至第 13 316248 200539981 ,二檢流掃描鏡12的雷射% 1〇的能量,最後為4525%。 :成為穿透第二偏光分光鏡8的能量損失的雷射光,包含 2.375%的S波成分及2.375%的P波成分。 另方面於第一偏光分光鏡5反射的雷射光7亦經 '過相同過程’ 45.25%的能量被引導至第二檢流掃描鏡i2, • 而4.75%的能量成為損失。 因此,合计有9.5%作為能量損失而未被引導至第二 籲檢流掃描鏡12,但於構成本實施型態的光路徑的情況下, 由於雷射光6的損失量穿透第二偏光分光鏡且雷射光7的 損失里產生反射,因此,成為能量損失的雷射光可全部集 中於阻尼器9之處,而可防止成為損失量的雷射光對光學 元件等造成損害。 上述偏光分光鏡乃設定為以入射角45。,穿透95%的 P波及5%的S波’並反射95%的S波及5%的P波,但 於入射角從45。偏移的情況下,穿透的p波及反射的s波 _的比例P牛低’而會增加能量損失,因此較為理想者為設定 入射角為45。。 於上逃當中,乃說明了,於使95%的p波及5%的s 波穿透’並使95%的S波及5%的P波反射的偏光分光鏡 的月b !損失為9.5%,於此當中可明白得知的是,若是提 同p波的穿透率及S波的反射率較95%還高的話,則可使 能量損失低於9.5%。 此外’本實施型態的偏光分光鏡是以雷射光的入射角 為45的方式來配置,因此若引導至偏光分光鏡的雷射光 14 316248 200539981 4工為φ 3 5mm的話,則使窗孔上的雷射光徑於長軸方向上 成為52mm,約為上述雷射光徑的15倍。相較於入射角 為布魯司特角的以往的偏光分光鏡的窗孔有效徑,必須為 入射雷射光徑的2.5倍以上,可製作為更小的形狀。以窗 孔面積來比較的話,因為於短軸方向上均可為35mm,因 此,相較於入射角為布魯司特角的以往的偏光分光鏡,入 射角為45的偏光分光鏡,可減少44.6%的面積。藉此可 達到加工裝置的小型化。 此外於相同徑的窗孔’例如53mm的情況下,於以 往的偏光分光鏡當中,由於布魯司特角為67y ,故可分 =的雷射光徑為p2〇mm左右,而於入射角為45。的偏光 分光鏡當中,可分光的雷射光徑為p35mm,可構成具備較 大的雷射光徑的光路徑。在此,使光徑〇的雷射光入射於 焦距為f的透鏡,若此時於被加工物上聚光的光束點獲 為d的話’則光束點徑u f0透鏡的焦距f,及入射光徑 D的關係可以下列第(1)式來表示。 d cc f / d ( τ ) 第⑴式係顯示’藉由焦距為f的f㈣鏡,於被加工 物上聚光的光束點徑d,與入射於“透鏡的雷射光的光徑 D呈反比。 、因此,於思考以相同徑的窗子L來構成偏光分光鏡的情 况下,如上述般之入射角為45。的偏光分光鏡,可更有效 的確保雷射光的有效#,於使用相_ Μ透鏡的情況下, 由方、、可提咼入射於透鏡的光束徑D,因而可實施更小 316248 15 200539981 的光束點徑d的加工。 此外由於不須具備使光路徑以90。折回的反射鏡’因 而可使偏,分光鏡變得較為便宜,而降低加工裝置的成本。 方、本戶'轭型恕當中,由於構成使雷射光以9〇。折回的 光路徑,因此可適用入射角為45。的偏光分光鏡。藉由採 =成’因為於XY承載台18上,2軸的檢流掃插鏡的 為正交’因此如第1圖所示般,藉由配合此正交 方向於ΧΥ方向,可將Χ方向及Υ方向,以!對】的方式 =餘各個檢流掃描鏡,並於加工之際容易明瞭檢流掃 心鏡的控制,而達到簡便的構成。 於。又疋偏光分光鏡的雷射光的折回角較9〇。為小的 銳角的情況下,可擴大偏光分光鏡的有效徑,而可實施更 :的光束點徑的加工。不過於此情況下,由於在χγ承載 台18上,2轴的檢流掃描鏡的掃描方向並未正&,因此即 使例如配合-邊的檢流掃描鏡的掃描方向於X方向,Υ方 ^只能於另-邊的檢流掃描鏡與乂方向的檢流掃描鏡的合 、、方向乂上進行掃描,因此相較於上述使雷射光以列。折回 结光路L方、加工之際檢流掃描鏡的控制變得較為複雜。 施帮能 分光後的兩條雷射光均經由第二偏光分光鏡之後,有 =要與第1圖的X方向的軸平行而引導至第二檢流掃描鏡 “的中心’因此必須對分光後的雷射光6、7實施獨立的 光軸調整。 為了更精密的引導雷射光]〇'u至第二檢流掃描鏡 316248 16 200539981 12,於設置於第一偏光分光鏡5前方的反 路徑當中’至少須分職置2枚以上之,對光路== 方向呈垂直,且可於互相正交的2軸方向上調整角度的反 射鏡,於本實施型態當中,雷射光1〇可藉由第一偏光分光 鏡5前方的反射鏡4z及第二偏光分光鏡8來調整光軸,另 一方面,雷射光11可藉由第一偏光分光鏡5及第一檢流掃·’ 描鏡13來調整光軸。在此,第一檢流掃描鏡13具備,可 於互為扭曲的方向上調整角度的2枚反射鏡,可視為與於 互相正父的2軸方向上調整角度的i枚反射鏡具備相同功_ 能。 第2圖乃關於本發明的第2實施型態,係顯示,使偏 光分光鏡對雷射光的行進方向呈垂直,且可於互相正交的 2軸方向上調整角度的機構。於第2圖當中,偏光分光鏡5 或是8由固定支架31來支撐,固定支架31介以第1旋轉 軸35a ’以可自由旋轉方式而支撐於支架支撐32。此外, 支架支撐32介以與第1旋轉軸35a正交的第2旋轉軸 35b,以可自由旋轉方式而支撐於用以支撐丰學系統的光學 基座36。藉此,偏光分光鏡可調整為對光路徑的行進方向 呈垂直’且可於互相正交的2軸方向上調整角度。此外, 於支架支私32與固定支架31的接合部具備,於固定支架 3 1的旋轉方向上設置較長的第1調整孔34a,第1固定螺 絲33a貫通而鎖入於固定支架η,於旋轉調整之後,藉由 鎖緊第1固定螺絲33a而可於支架支撐32上固定固定支架 31之構造。支架支撐32與光學基座36的接合部亦同樣 316248 200539981 為,由第2調整孔34b及第2固定螺絲33b進行旋轉調整 之後而可固定的構造。Ab Dan: The laser processing apparatus of the twelfth aspect includes a damper for absorbing laser light leaked from the second polarized light separation mechanism of the upper part as a beam loss. Aurora :: Ben Yuming ’s hunting angle is 45 °. ❾A polarizing beam splitter comes with a polarization splitting mechanism. The lens can be used to shoot a large optical path of light. The laser beam path on the workpiece can be reduced, and a more precise polarizing splitting mechanism can be implemented. Cheap and reduce costs. [Implementation method]-The first implementation of criminal energy ^ The figure is about the first implementation form of the present invention, which shows that a polarizing beam splitter with a price of $ 45 is used as the polarization separation mechanism, and a laser beam is divided into 1 light beam = The strip laser light scans two laser lights independently, and at the same time, the structure diagram of the laser processing device for openings that is continuously applied at two places. Slightly detailed. Π constituents, given the same symbol and saved in the figure of the first brother, 5 is the first polarizing beam splitter, 6 is the laser light penetrating the first polarizing beam splitter 5 '6p is the pair of the laser light 6-the first polarizing beam splitter 5 5 is the polarization direction of the P-wave component, & is the polarization direction of the S-wave component of the laser light 6 for the first polarizing beam splitter 5, and 7 is the laser light reflecting the first polarization 316248 12 200539981 , 7s is the polarization direction of the s-wave component in terms of f, 々 is-the polarization beam splitter, and the polarization direction of the P-wave component in the spectroscope is the opposite direction of the polarized light-cutting, and 8 is the second Polarization 9 is used to absorb as the energy loss the first, see, A ^ ^ ^, Tian Shexian's damper, 10 is the laser light reflected by the second polarizing beam splitter 8 in Tian Shexian, 11 is the laser light transmitted by the 7th—the eighth copy of the field, the Jiutian T B7 million, and the first-passing beam splitter 8. The laser light penetrated by the polarized light in the conventional technology. Using a window with Brewster's angle as the angle of incidence, laser light containing equal p-wave components and S-wave components is separated by polarized light, To equally distribute the transmitted p-wave component and the reflected S-wave component, and equally divide the energy of the laser light. However, in this embodiment mode, for example, by applying a dielectric multilayer film coating on the reflective surface The polarizing beam splitter is configured to have an incident angle of 45 ° to the optical axis of the laser light, instead of the Brewster angle, and penetrates the P wave with a fixed precision and reflects the S wave with a fixed precision. The energy of the laser light is equally divided. Here, it is explained that a polarizing beam splitter of a coating film that penetrates 95% of P waves and 5% of S waves and reflects 95% of S waves and 5% of P waves is used. As an example, if the energy of the laser light incident on the first polarizing beam splitter 5 is 100%, the laser light 6 penetrating the first polarizing beam splitter 5 contains 47.5% of the P-wave component and 2 · 5% S-wave component. After that, laser light including 47.5% S-wave component and 2.5% P-wave component is incident on the first polarizing beam splitter 8 and the laser light reflected by the second polarizing beam splitter 8 , Including 45.125% of the S-wave component and 0.125% of the P-wave component, are guided to the 13th 316248 200539981, the thunder of the second galvanometer scanning mirror 12 The energy of% 10 is 4525% at last.: The laser light that becomes the energy loss penetrating the second polarizing beam splitter 8 includes 2.375% of the S-wave component and 2.375% of the P-wave component. On the other hand, it is related to the first polarization beam splitting The laser light 7 reflected by the mirror 5 is also 'passed through the same process' 45.25% of the energy is directed to the second galvanic scanning mirror i2, and 4.75% of the energy is lost. Therefore, a total of 9.5% is not lost as energy. It is guided to the second galvano-scanning mirror 12, but in the case of constituting the light path of this embodiment, the loss amount of the laser light 6 penetrates the second polarizing beam splitter and the reflection of the loss of the laser light 7 occurs. All the laser light that is an energy loss can be concentrated at the damper 9, and the laser light that is an amount of loss can be prevented from causing damage to the optical element and the like. The polarizing beam splitter is set at an incident angle of 45. , Penetrates 95% of P waves and 5% of S waves' and reflects 95% of S waves and 5% of P waves, but the incident angle is from 45. In the case of an offset, the ratio of the transmitted p wave and the reflected s wave _ is low and the energy loss is increased. Therefore, it is desirable to set the incident angle to 45. . In the escape, it is explained that the monthly b! Loss of a polarizing beam splitter that penetrates 95% of p waves and 5% of s waves and reflects 95% of S waves and 5% of P waves is 9.5%, It can be clearly understood that if the transmittance of the p wave and the reflectance of the S wave are higher than 95%, the energy loss can be lowered to 9.5%. In addition, the polarizing beam splitter of this embodiment is arranged so that the incident angle of the laser beam is 45. Therefore, if the laser beam guided to the polarizing beam splitter 14 316248 200539981 is φ 3 5mm, the window hole The laser light diameter is 52 mm in the long axis direction, which is about 15 times the laser light diameter. Compared with a conventional polarizing beam splitter having an incident angle of Brewster angle, the effective diameter of the aperture of the window must be 2.5 times or more the incident laser light diameter, and it can be made smaller. Comparing the area of the window hole, it can be 35mm in the short axis direction. Compared with the conventional polarizing beamsplitter with an incident angle of Brewster angle, the polarizing beamsplitter with an incident angle of 45 can be reduced. 44.6% of the area. This allows miniaturization of the processing equipment. In addition, in the case of a window hole of the same diameter, for example, 53mm, in the conventional polarizing beam splitter, since the Brewster angle is 67y, the laser light diameter that can be divided into = is about p20mm, and the incident angle is 45. Among the polarizing beam splitters, the laser beam diameter that can be split is p35mm, which can form a light path with a larger laser beam diameter. Here, the laser light having a light path of 0 is incident on a lens having a focal length of f, and if the beam spot condensed on the workpiece at this time is obtained as d ', the beam spot diameter u f0 is the focal length of the lens f and the incident light The relationship of the diameter D can be expressed by the following formula (1). The d cc f / d (τ) formula shows that the beam spot diameter d condensed on the object to be processed by the f lens with focal length f is inversely proportional to the optical path D of the laser light incident on the lens. Therefore, in the case of thinking of forming a polarizing beam splitter with a window L of the same diameter, a polarizing beam splitter with an incident angle of 45 ° as described above can more effectively ensure the effectiveness of the laser light. In the case of the M lens, the beam diameter D incident on the lens can be increased by the square, so it is possible to perform a smaller beam spot diameter d of 316248 15 200539981. In addition, since it is not necessary to have a light path of 90. Reflector's can make the polarization and beamsplitters cheaper, and reduce the cost of processing equipment. Among the square and home's yoke type, because it constitutes a light path that allows the laser light to be folded back at 90%, it can be used for incidence. A polarizing beam splitter with an angle of 45 °. By adopting 'because on the XY stage 18, the two-axis galvanometer mirror is orthogonal', so as shown in Figure 1, by matching this positive The direction of intersection is in the X and Y directions. You can change the X and Y directions with! = Each galvanometer scanning mirror, and it is easy to understand the control of galvanometer scanning at the time of processing, to achieve a simple structure. Yu. Also, the reflex angle of the laser light of the polarizing beam splitter is smaller than 90. It is a small acute angle. In the case of the polarizing beam splitter, the effective diameter of the polarizing beam splitter can be enlarged, and further processing of the beam spot diameter can be performed. However, in this case, the scanning direction of the two-axis galvano-scanning mirror on the χγ stage 18 Uncorrected, so even if, for example, the scanning direction of the galvano-scanning mirror with the -side is in the X direction, the square ^ can only be combined with the galvano-scanning mirror of the other-side and the galvano-scanning mirror in the 乂 -direction. Scanning is performed on the beam, so compared to the above, the laser light is arranged in a row. The control of the galvanometer scanning mirror when turning back to the junction of the light path L side is more complicated. The two laser lights after applying the energy splitting pass through the second After the polarizing beam splitter, it is necessary to be guided to the “center” of the second galvanometer scanning mirror in parallel with the axis in the X direction in FIG. 1. Therefore, it is necessary to perform independent optical axis adjustments on the split laser light 6 and 7. In order to guide the laser light more precisely] 〇'u to the second galvano-scanning mirror 316248 16 200539981 12, in the reverse path provided in front of the first polarizing beam splitter 5, 'at least two or more must be placed separately for the optical path == A mirror whose direction is vertical and whose angle can be adjusted in two mutually orthogonal directions. In this embodiment, the laser light 10 can pass through the mirror 4z and the first part of the first polarizing beam splitter 5. The two polarizing beam splitters 8 are used to adjust the optical axis. On the other hand, the laser light 11 can be adjusted by using the first polarizing beam splitter 5 and the first galvano mirror 13. Here, the first galvano-scanning mirror 13 is provided with two mirrors that can adjust the angle in mutually twisted directions, and can be regarded as having the same function as the i mirrors that adjust the angle in the two-axis directions of each other's positive father. _ can. Fig. 2 is a diagram showing a second embodiment of the present invention, which shows a mechanism that makes the polarizing beam splitter perpendicular to the traveling direction of the laser light and can adjust the angles in two orthogonal directions that are orthogonal to each other. In FIG. 2, the polarizing beam splitter 5 or 8 is supported by a fixed bracket 31, and the fixed bracket 31 is rotatably supported by a bracket support 32 via a first rotation axis 35a '. In addition, the stand support 32 is rotatably supported on the optical base 36 for supporting the Fengxue system via a second rotation axis 35b orthogonal to the first rotation axis 35a. Thereby, the polarizing beam splitter can be adjusted to be perpendicular to the traveling direction of the light path ', and the angle can be adjusted in two mutually orthogonal directions. In addition, the joint portion of the bracket support 32 and the fixing bracket 31 is provided with a first adjusting hole 34a which is longer in the rotation direction of the fixing bracket 31, and the first fixing screw 33a penetrates and is locked to the fixing bracket η. After the rotation adjustment, the structure of the fixing bracket 31 can be fixed on the bracket support 32 by tightening the first fixing screw 33a. The joint portion of the bracket support 32 and the optical base 36 is also the same. 316248 200539981 is a structure that can be fixed by rotating the second adjustment hole 34b and the second fixing screw 33b.
另一方面,相較於反射的雷射光,由於依據偏光分光 鏡的角度調整而使穿透偏光分光鏡的雷射光的光軸變化量 極小而可加以忽視,故即使調整由第一偏光分光鏡5所反 射的雷射光7、11的光軸,亦幾乎不會影響到雷射光6、 10的光軸,且即使調整由第二偏光分光鏡8所反射的雷射 光6、1〇的光軸,亦幾乎不會影響到穿透的雷射光7。 的光軸,因此可各自獨立調整。 此外,於調整反射鏡4z及第一及第二偏光分光鏡5、 :广角度之情況下’亦有可能產生往偏光分光鏡的入射角 從45。偏移的情況,此時,雷射光的能量損失雖會增加, 而’-般而言角度調整極小’目此能量損失亦極小。此 外^也可依據雷射振盪器的輸出進行修正,因此較理想為, 以藉由光軸調整來提升加工精密度為優先。 鏡來 進行=:情:由具備上述調整機構的偏光分光 整/ 光鏡5前方的反射鏡42的角度調 ,射光1〇、u於第二檢流掃描鏡13上,於相同方 夕動。因此,做為光轴調整方向的順序,首先,對採 、T作用於兩條雷射光的反射鏡“之雷射 · 進仃完成調整之後,必須進行雷射 "、、由, 外’若完成一次光軸調整後 的:軸5周整。此 鏡5前方的反射鏡4z的角…::進仃弟一偏光分光 角“整’而於維持第二檢流掃描 316248 18 200539981 鏡12上的兩條雷射光的相 射光10、11的光軸p n 1關^的狀態下,可進行雷 尤釉。周鲨,因而容易以高精宓 進行引導兩條雷射光 门信-度的方式,來 調整。 H泉掃描鏡12的中心之光軸 多3實施细雜 第3圖乃關於本發明的第3實施型態,係顯 一條雷射光分光為兩條雷射、,一 、; 光,可同暗於9 ♦、二、,亚猎由獨立掃描兩條雷射 且備進n Μ处進仃加工的開孔用雷射加工裝置當中, 具備進灯先罩轉印的光學系 於光罩之後的表面形狀略為相丄、„,使具有配置 4a、M14a、14b,^ir 光學元件的反射鏡 AA C 4+ ^ 政的反射鏡的光束入射面對另 二=射:的光束入射面呈垂直,並且,對一邊的反射 =45與對另一邊的反射鏡的光束入射角相同 ’.,、、 的方式而配置(例如,於-邊的反射鏡上,從 =方向入射的雷射光反射至Z方向,之後於另一邊的反射 鏡上’反射至γ方向的配置)的構成之構成圖。 於第3圖當中,4a、4b為從光罩3引導雷射光2至第 -偏光分光鏡5的表面形狀略為相同的反射鏡,⑷、⑽ 為’用於從第一偏光分光鏡5引導至第二偏光分光鏡8的 表面形狀略為相同的反射鏡。 關於偏光分光鏡,本第3實施型態與第】實施型態相 同丄而由於反射鏡4、14的配置或表面形狀不同,因此採 用第4圖來說明本發明的特徵之光學元件的配置。 於第4圖當中,pru( α )、prv( α)為,以光束入射角j 316248 19 200539981 入射的入射光束由反射鏡所反射的反射光束之U方向、v 方向的折射力(power)。ptu( α)、ptv( α)為,以光束入射角 α入射的入射光束穿透反射鏡之穿透光束的u方向、V方 向的折射力。在此,u方向為垂直於各光束的行進方向, 且平行於光束入射面(由入射光束及反射光束所形成的面) 的方向,V方向為垂直於各光束的行進方向,且垂直於光 束入射面的方向。 在此,折射力(Power)為顯示光學元件的折射性能的參 數之一 ’ 73顯示折射面的狀態、,一般而言,與表面曲率^ 徑R成反比,與折射率n成正比。於第4圖當中,表面曲 率半徑R於同,的情況下為均―,且相對於光學系統且 有極大的值(於光學元件的表面形狀為略為平面之際),若 以折射率為η,則折射力^⑷、^⑷可以下列T式子來 表示。 ⑵ (3)On the other hand, compared with the reflected laser light, the change in the optical axis of the laser light passing through the polarizing beam splitter is extremely small and can be ignored because of the angle adjustment of the polarizing beam splitter, so even if the first polarizing beam splitter is adjusted, The optical axes of the laser light 7, 11 reflected by 5 hardly affect the optical axes of the laser light 6, 10, and even if the optical axes of the laser light 6, 10 reflected by the second polarizing beam splitter 8 are adjusted It also hardly affects the transmitted laser light 7. The optical axis can be adjusted independently. In addition, when the reflecting mirror 4z and the first and second polarizing beam splitters 5 are adjusted to a wide angle, it is also possible that the incident angle to the polarizing beam splitter is 45. In this case, although the energy loss of the laser light will increase, the energy loss will be very small because the angle adjustment is very small. In addition, it can also be corrected based on the output of the laser oscillator, so it is ideal to give priority to improving the processing precision by adjusting the optical axis. Mirroring == Love: The angle of the mirror 42 in front of the mirror 5 is adjusted by the polarized beam splitter / adjuster with the above-mentioned adjustment mechanism, and the light rays 10 and u are moved on the second galvano-scanning mirror 13 at the same time. Therefore, as the order of adjusting the direction of the optical axis, first of all, after the laser and laser mirrors that act on the two laser beams are adjusted, the laser must be lasered. After completing the adjustment of the optical axis: the axis is 5 rounds. The angle of the mirror 4z in front of this mirror 5 :: The polarized light beam splitting angle is "rectified" to maintain the second galvanic scan 316248 18 200539981 on the mirror 12 In the state where the optical axes pn 1 of the phase-exposed lights 10 and 11 of the two laser lights are turned off, a Rayou glaze can be performed. Zhou Sha, so it is easy to adjust with high precision to guide the two laser light gates. The optical axis of the center of the H-spring scanning mirror 12 is more than three. The third figure is about the third embodiment of the present invention, which shows that one laser beam is split into two laser beams. On 9th, 2nd, and sub-hunting, the laser processing device for openings that independently scans two lasers and prepares them for processing at nM, is equipped with an optical system that transfers the light into the cover first and then transfers the light behind the photomask. The shape of the surface is slightly different, so that the beam incident surface of the reflector AA C 4+ ^ with the configuration of 4a, M14a, 14b, and ^ ir optical elements is facing the other two = = the incident surface of the beam is perpendicular, In addition, the reflection on one side = 45 is the same as the incident angle of the light beam on the mirror on the other side. (,,,, and (for example, on a -side mirror, the laser light incident from the = direction is reflected to Z Direction, and then the configuration of 'reflection to the γ direction' on the mirror on the other side). In Figure 3, 4a and 4b are the guides for the laser light 2 to the-polarizing beam splitter 5 from the mask 3. The surface shape is slightly the same, and ⑷, ⑽ are used to lead from the first polarizing beam splitter 5 The shape of the surface of the second polarizing beam splitter 8 is slightly the same. Regarding the polarizing beam splitter, the third embodiment is the same as the first embodiment. However, the configuration and surface shape of the mirrors 4 and 14 are different. Fig. 4 is used to describe the arrangement of the optical elements that are characteristic of the present invention. In Fig. 4, pru (α), prv (α) are, and the incident light beam incident at the incident angle j 316248 19 200539981 is reflected by the mirror The refraction power (power) in the U and v directions of the reflected light beam. Ptu (α), ptv (α) are the u direction and V direction of the penetrating beam of the reflecting beam that is incident at the incident angle α of the beam. Here, the u direction is the direction perpendicular to the traveling direction of each beam and is parallel to the incident surface of the beam (the surface formed by the incident beam and the reflected beam), and the V direction is perpendicular to the traveling direction of each beam. And perpendicular to the direction of the incident surface of the light beam. Here, the refractive power (Power) is one of the parameters showing the refractive performance of the optical element. 73 shows the state of the refracting surface, and generally speaking, it is inversely proportional to the surface curvature ^ radius R, With fold The emissivity n is directly proportional. In Figure 4, the surface curvature radii R are the same, in the case of uniform, and have a maximum value relative to the optical system (when the surface shape of the optical element is slightly flat), If the refractive index is η, the refractive powers ^ ⑷ and ^ ⑷ can be expressed by the following T formula. ⑵ (3)
cosa Rcosa R
户rv(a) = 2cosa 丄 R :般而言’即使製作光學^件的表面形狀為平面,於 衣私田中仍會產生决差’ _般的加工精密度約為入no至 又/20,若以較Λ/20為高的精密度來形成表面形狀的話, 則將花費極大的成本及時間。因&,一般的光學元件,乃 具備約為讀至λ/20的表面曲率半徑r。例如於 (η:2.41)上形成介電質多層膜塗膜之光束人射角為 45的偏光分光鏡的情況下,可藉Μ⑺、⑺式來分別獲 316248 20 200539981 得下列式子。 户π'(45。) == 2·8χ 丄 (4) R w 户rv(45°) = ΐ·4χ 丄 (5)Household rv (a) = 2cosa 丄 R: Generally speaking, even if the surface shape of the optical parts is flat, there will still be a difference in the clothing field. _General processing precision is about no to / 20, If the surface shape is formed with a higher precision than Λ / 20, it will take a great deal of cost and time. Since &, a general optical element has a surface curvature radius r which is approximately λ / 20. For example, in the case of forming a polarized beam splitter with a beam angle of 45 on a dielectric multilayer film on (η: 2.41), 316248 20 200539981 can be obtained by using the M⑺ and ⑺ formulas, respectively. Household π '(45.) == 2 · 8χ 丄 (4) R w Household rv (45 °) = ΐ · 4χ 丄 (5)
R 從第W、(5)式當中可得知,於光束入射角為45。告 中,於反射之際,u方向的折射力較乂方向的折射力還大田c 右是此u方向與ν方向的折射力的差傳達至加工點的話, 則成為像散光,而有可能無法獲得安定的加工品質。 相對於此,於本發明當巾,於建構光學㈣之際 將夕數枚的光學元件當中之表面形狀略且 元^以使一邊的光學元件的光束入射面對另一邊的^ 兀件的光束入射面呈垂首,甘0 ^ 电 九予 Μ置亚且,對一邊的光學元件的本 束入射角與對另一邊的光學元件 午勺先 而配置。 力干兀件的先束入射角相同的方式 在此’採用反射鏡14a、14b炎1 Μ描rV、 φ目讲c , i4b ;^兄明構成。於第5圖當 /備’反射鏡14a將從x方向人射㈣射光 ==心將由反射鏡14a所反射的 =R :;;,卜,以反射鏡⑷的反射鏡表面:R can be known from the formulas W and (5) that the incident angle at the light beam is 45. In the report, during the reflection, the refractive power in the u direction is greater than the refractive power in the 乂 direction, which is Daejeon to the right. If the difference between the refractive power in the u direction and the ν direction is transmitted to the processing point, it becomes astigmatism, and it may not be possible. Obtain stable processing quality. On the other hand, in the present invention, when the optical fiber is constructed, the surface shape of several optical elements is slightly reduced so that the light beam of one optical element enters the light beam of the ^ element facing the other. The incident surface is vertical, and the beam angle of the optical element on one side and the optical element on the other side are arranged first. In the same way, the incident angles of the first beams are the same. Here, the mirrors 14a, 14b are used to describe 1V, r, φ, and c, i4b; In FIG. 5, when the / mirror ’reflector 14a will radiate light from the person in the x direction == the heart will be reflected by the mirror 14a = R: ;;, b, the mirror surface of the mirror:
”、、"反射叙14b的反射鏡表面曲率半和A R 以反射鏡14a的u方6ό丄丄乂 ^ Rb ° 曰〕以方向的折射力為ρ_(45 ν 射力為Parv(45。),以;^ w力立, 向的折 P⑷。、士 射1竟14b的U方向的折射力為"," The mirror surface curvature half of AR 14b and AR are defined by the u side of mirror 14a. Rb ° =] The refractive power in the direction is ρ_ (45 ν and the radiation is Parv (45.) , ^ W 力 立, fold P⑷ towards the direction., The refraction in the U direction of Shishe 1 and 14b is
Pbru(45 ),V方向的把64·丄4 ^ 巧』刀马 门的折射力為Pbrv(45。)的話,則由 !4b所反射的雷射光 則由反射鏡 反射鏡14a及反射鏡14b所人&、 的U方向的折射力Pru、 :所a成 1 π刀,可由下列式 316248 21 (6)200539981 子來表示。 ^ = ^(45°) + />m(45°)=:i.4x ^ = ^(45^ + ^(450) = 2.8 xPbru (45), the refraction of 64 · 丄 4 ^ Qiaomen in the V direction is Pbrv (45.), Then the laser light reflected by! 4b is reflected by the mirror 14a and the mirror 14b The refraction power Pru in the U direction of all persons &, so that a becomes a 1 π knife, which can be expressed by the following formula 316248 21 (6) 200539981. ^ = ^ (45 °) + / > m (45 °) =: i.4x ^ = ^ (45 ^ + ^ (450) = 2.8 x
⑺ . 在此,由於反射鏡及反射鏡14b為略為相同的形 狀口此H,上述Pru略等於Ρα,因此可消除u方向 /、方向的折射力的差,結果為,可降低加工點的像散光, •而可獲得安定的加工品f。由於反射鏡4&、仆亦具備相同 構成因此可獲得相同的效果。 上述乃根據α=45。來探討,若為—般角度的話,則可 由下列式子來表示。 ⑻ (9)⑺. Here, since the mirror and the mirror 14b are slightly the same shape, the above Pru is slightly equal to Pα, so the difference in the refractive power in the u direction / direction can be eliminated, and as a result, the image at the processing point can be reduced. Astigmatism, and stable processed product f can be obtained. Since the mirror 4 & also has the same structure, the same effect can be obtained. The above is based on α = 45. To discuss, if it is a general angle, it can be expressed by the following formula. ⑻ (9)
户”,- + ΡΛγμ (a) = 2cos α丄 + —-——LHousehold ",-+ ΡΛγμ (a) = 2cos α 丄 + —-—— L
Ra cos a Rb 户⑺=Ka) + 〇) = JLL + 2cos α 丄 cos a R Rl —於Ra%Rb的情況下’從第⑻、(9)式當中可得知,pRa cos a Rb ⑺ = Ka) + 〇) = JLL + 2cos α 丄 cos a R Rl —In the case of Ra% Rb ’, we can know from equations ⑻ and (9) that p
略等於Prv’因此可消除U方向與v方向的折射力的差,與U α=45之際相同,可降低加工點的像散光,而可獲得定 的加工品質。 心 ▲於固定光學元件的支架元件為具備方向性的構造,由 该支架所支撐的反射鏡的表面曲率半# R沿著該方向性 而產生變化,因而產生像散光的情況下,乃配置i組由上 述支架所支撐的反射鏡,而使支架的方向性對各人射面為 朝相同的方向,並使一邊的光學元件的光束入射面對另二 邊的光學元件的光束入射面呈垂直’且對一邊的光學元件 316248 22 200539981 的光束人射角與對另—邊的光學㈣的光 ^第6圖乃顯示-例。於第6圖當中,第—二相同。 與第二光學元件3 7b為星右$ 子元件37a 一*加德从 為,、有相同表面形狀的光學元件,黧 支^件38a與第二支架構件鳥為具有 一”…二丄各頒不支架構件所具有的方向軸, -衣-反射鏡等光學元件於此支架上的二 表面曲率半徑,於A 、】反射鏡的 ,〜 方向上為mu向上為rB。 如弟ό圖所示般,以使第一 勹Β H Μ 便弟7^子疋件37a的光束人射 對弟-先學几件37b的光束入射面呈垂直,且對第一 # =件37a的光束入射角與對第二光學元件別的光束入 射角相同(例如為45。έΛ 士 + 與第二光學元件37b,l二來:置第一光學元件37aIt is slightly equal to Prv ', so the difference in refractive power between the U direction and the v direction can be eliminated, which is the same as when U α = 45. Astigmatism at the processing point can be reduced, and a certain processing quality can be obtained. Heart ▲ The bracket element that fixes the optical element has a directional structure. The surface curvature half # R of the mirror supported by the bracket changes along the directionality. Therefore, in the case of astigmatism, placement i The reflectors supported by the brackets are set so that the directivity of the brackets faces the same direction for each person, and the light beams of the optical elements on one side are incident to the light incident surfaces of the optical elements on the other side. 'And the human angle of the beam of the optical element 316248 22 200539981 to one side and the light of the optical chirp to the other side ^ Figure 6 is an example. In Figure 6, the second and second are the same. Sub-element 37a and second optical element 37b are sub-elements 37a-Garden, an optical element with the same surface shape, the support piece 38a and the second support member have a "..." Without the direction axis of the bracket member, the radius of curvature of the two surfaces of the optical element such as the mirror-mirror on this bracket is in the direction of A and the mirror, and the direction of mu is rB. As shown in the figure In general, the beam incident surface of the first HHBH 7 弟 child piece 37a is perpendicular to the beam incident surface of the first-learning piece 37b, and the incident angle of the light beam of the first # = piece 37a and The angle of incidence of the other optical beams on the second optical element is the same (for example, 45. ΛΛ 士 + and the second optical element 37b, l): Set the first optical element 37a
為了配合支架構件的方向性而使A f 丁於入射面的情況下’第二光學元件37b的反射之 广方向與v方向的折射力Uv,可由下列式子來 表不 0 4-^(45^ + /^(45) = 1.4)^ + 2.8)^ (1〇) 8 Ra Α = 4(45Κλ(45。卜 2·8χ 丄 + i 4 x 丄(1 ^ Rn 從第(10)、(11)式當中可得知,Pru等於Prv,因此可消 除具備方向性的支架所造成的像散光。藉由此,可降低加 工點的像散光,而可獲得安定的加工品質。從上述當中可 知知,入射角為45。以外之際,亦可消除像散光。 此外’可採用具備方向性的較便宜的支架,而獲得加 工裝置的成本降低之效果。 23 3】6248 200539981 到目前為止乃說明了,於本實施型態中進行光罩轉印 的光學系統中,配置於光罩之後的多數枚的光學元件。這 主要是因為,於光罩轉印當中,光罩之後的光學元件的像 差會影響加工點的光束品質之故。此外,關於光罩之前的 多數枚的光學元件,亦可採用相同思考方式來配置 獲传效果。 田此外’不僅是進行光罩轉印的光學系統,亦可採用相 同思考方式來配置光學元件,更可獲得降低光學性像差之 效果。 差4實施刑能_ 第7圖乃關於本發明的第4實施型態,係顯示,採用 表為凸狀,月面為凹狀的偏光分光鏡來做為第一偏光分 = :採用表面為凹狀,背面為凸狀的偏光分光鏡來 為!偏光分離機構,將一條雷射光分光為兩條雷射 工66= f立~描兩條雷射光,而可同時於2處上實施加 、碭=用雷射加工裝置的構成圖。 八并铲二圖§中’22為表面為凸狀,背面為凹狀的偏光 刀光鏡(蒼恥第8圖,π主本& _ 23為表面為凹狀’背面為凸狀的 二 =(参照第8圖(5))。在此,由於各個表面形狀乃 之研磨機的形狀等來決定,因此可藉由控制製 =而::擇於所希望一密㈣ 形狀之構成不同化:;二丄:形恕其偏光分光鏡的表面 以下就本發明的特徵之偏光分光鏡的形 316248 24 200539981 狀加以說明。In order to match the directivity of the bracket member with A f on the incident surface, the refractive power Uv in the broad direction of the reflection of the second optical element 37 b and the v direction can be expressed by the following formula: 0 4-^ (45 ^ + / ^ (45) = 1.4) ^ + 2.8) ^ (1〇) 8 Ra Α = 4 (45Κλ (45. Bu 2.8χ 丄 + i 4 x 丄 (1 ^ Rn from the (10), ( 11) It can be known from the formula that Pru is equal to Prv, so astigmatism caused by a directional bracket can be eliminated. As a result, astigmatism at the processing point can be reduced, and stable processing quality can be obtained. From the above, we can know that It is known that the incident angle is 45. In addition, astigmatism can also be eliminated. In addition, a cheaper bracket with directivity can be used to reduce the cost of processing equipment. 23 3] 6248 200539981 So far it has been explained In the optical system for performing mask transfer in this embodiment, there are a plurality of optical elements arranged behind the mask. This is mainly because during the mask transfer, the image of the optical element after the mask is The difference affects the beam quality of the processing point. In addition, most of the You can also use the same way of thinking to configure the transmission effect of the optical element. Tian Tian '' is not only an optical system for mask transfer, but also can be used to configure the optical element, which can also reduce the optical aberration. The difference is 4. The seventh embodiment is about the fourth embodiment of the present invention, which shows that a polarizing beam splitter with a convex surface and a concave lunar surface is used as the first polarizing beam splitting =: The polarizing beam splitter with a concave shape on the surface and a convex shape on the back! The polarization splitting mechanism splits a laser beam into two laser beams. 66 = f vertical ~ depicts two laser beams, which can be implemented at two places at the same time. Plus, 砀 = Structure diagram of the laser processing device. In the second figure of the eight parallel shovel, '22 is a polarizing knife light mirror whose surface is convex and the back is concave (Figure 8 of the shame, π master & _ 23 is a concave surface and a convex surface on the back = (refer to Figure 8 (5)). Here, since the shape of each surface is determined by the shape of the grinder, etc., it can be controlled by the control system = and: : Choose the composition of a dense shape according to the desired :; two: shape polarization polarization The following will be described on a surface of the polarization beam splitter of the present invention wherein the shaped 31624824 200 539 981 shape.
於弟8圖當中,P Λ ,, ., U )、Ptv( α)為,以光束入射角“ 入射的入射光束穿透光學元 士人牙处先束,於U方向、ν 方向的折射力,表面曲率半…同心圓的情況 二=光學系統具有極大的值(於光學元件的表面形 :^ 際以折射率為"]折觀⑷、In Figure 8, P Λ ,,., U) and Ptv (α) are, with the incident angle of the beam "the incident incident light beam penetrates the optical element, and its refractive power is in the U and ν directions. , The curvature of the surface is half ... the case of concentric circles 2 = the optical system has a maximum value (for the surface shape of the optical element: ^ the refractive index is ")
Ptv(a)可以下列式子來表示。 k cos or A⑷= cos" sin2( R cosa]^* 〇2) 〇3) Ή 士於ZnSe(n-2.41)上形成介電 入射角為45。的偏光分光镑沾卜主 ^曰胰土版之先束 式來獲得下列式子。 了猎由4(12)、(13) == 3.2x— (14) ^ν(45°) = ΐ.6χ-1 (15) 從第(4)、(5)、(Η)、(15)式當中可得知,於 角為45。#中’於反射之際和穿透之際,u方向的折射力 都較v方向的折射力還大。若 、射力 力的差傳達至加工點的話,==與V方向的折射 獲得安定的加工品質。?'丨成為像散光’而有可能無法 在此乃著眼於偏光分光鏡於穿透之際的折射力 之際的折射力為於偏光分光鏡的表面上的折射力上,加: 316248 25 200539981 於背面上的折射力。亦即,穿透之際的U方向、v方向的 折射力Ptua(45。)、Ptva(45。)為,於第(14)、(15)式當中對 表面及背面各自添加1、2的下標來顯示,而可獲得下列式 子0 1(45。) =。+12=32: ^(45°) = ^i+^2=L6> (l6)Ptv (a) can be expressed by the following formula. k cos or A⑷ = cos " sin2 (R cosa] ^ * 〇2) 〇3) 形成 The dielectric angle of incidence is 45 on ZnSe (n-2.41). The polarized beam splitter is used to obtain the following formula. The hunting consists of 4 (12), (13) == 3.2x— (14) ^ ν (45 °) = ΐ.6χ-1 (15) from (4), (5), (Η), (15 ) Can be found in the formula, the angle is 45. # 中 ’At the time of reflection and at the time of penetration, the refractive power in the u direction is greater than the refractive power in the v direction. If the difference between the shooting force and the shooting force is transmitted to the processing point, == and the refraction in the V direction can obtain stable processing quality. ? '丨 Becomes astigmatism' and may not be able to focus on the refractive power of the polarizing beam splitter at the time of penetration. The refractive power on the surface of the polarizing beam splitter is added to: 316248 25 200539981 at Refraction on the back. That is, the refraction powers Ptua (45 °) and Ptva (45.) in the U direction and the v direction at the time of penetration are obtained by adding 1 and 2 to the front and back surfaces respectively in equations (14) and (15). Subscript to display, and you can get the following formula 0 1 (45.) =. + 12 = 32: ^ (45 °) = ^ i + ^ 2 = L6 > (l6)
--1-- J 07) 因此’若如第8圖⑷所示般之表面為凸狀⑻ , I:為=:(:2< 0)的話’則由於表面及背面的折射力互相 及方向的:透之際的折射力變小。結果為,由於u方向 \;卜:二射ί的差變小’而可獲得降低像散光之效果。 背面為凸狀斤门示般… 互相抵銷,而使穿ί之=同’由於表面及背面的折射力--1-- J 07) Therefore, 'If the surface is convex as shown in Fig. 8⑷, I: == (: 2 < 0)', then the refraction of the surface and the backside and the direction of each other : The refractive power becomes smaller during penetration. As a result, the effect of reducing astigmatism can be obtained because the difference in the u direction becomes smaller. The back is like a convex catwalk ... cancel each other out, so that wearing = the same ’due to the refractive power of the surface and the back
牙透之際的折射力變小。έ士罢盘,^ 方向及V方向的折射力的 :果為,由於U 效果。 可後彳于降低像散光之 由於本發明中的 及背面的曲率半徑的絕對值為::表:形狀’必須使表面 加工精密度還要精密,較相、寻,因此須達到較一般的 接下來說明,全雕Γ ‘ 4為λ/20以下0 第二偏光分光鏡的最:形:系統當中的第-偏光分光鏡及 與先前所述之折射:的内 中,加算各個光學元件 同,於全體光學系統當 牛的折射力,而决定像差是大是小。 316248 26 200539981 因此,關於在第7圖的光學系統當令所使用的第一偏光分 光鏡22至第二偏光分光鏡23之間的光學元件,乃分為穿 透第一偏光分光鏡的雷射光6的光路徑a ,及反射之雷射 光7的光路徑B來說明。 田 於光路徑A當中,穿透第一偏光分光鏡22的雷射光 6’由反射鏡14a & 14b被引導至第二偏光分光鏡23。由 於反射鏡14a及l4b相對的較容易製作,因而可與得完工 之平面度的精密度為約"1〇至又/2〇的反射鏡。:如以下 =不般’由於檢流掃描鏡的平面度相對的較為惡化,因此 較理想為完工到約又/15至λ/2〇之精度。 =於此,於光路徑Β當中,第:偏光分光鏡22所 置:二ί7:,第一檢流掃描鏡13…3b來決定位 …及13b ·古、鏡3。由於第一檢流掃描鏡 nw邮" 因此必須極為輕巧,此外,如第 大所吞兄明般,為了不使加工品質惡化而必須使面積加 平面衣作出厚度較薄而面積較大的形狀,完工的 ==述反射鏡為惡化’大约為""Μ。此外’ W取决於製作機械,例如變為較凹的凹狀。 於光路徑A及光跋僻β a + 則加算後的折射力有可r 各個平面度不同的話, 成為光路徑A及光二=距。此折则 〜k β上的焦點差。 於本發明各+ ^ 形狀為較凹的=的I第一檢流掃描鏡133及別的表面 形狀為凸狀,背月况下’使弟—偏光分光鏡22的表面 月面形狀為凹狀,使第二偏光分光鏡23的表 316248 27 200539981 面形狀為凹狀’背面形狀為凸狀。 ,藉由如此的構成,於光路徑八當中,於穿透第一偏光 分光鏡22之際幾乎不會產生折射力,於反射鏡…及⑽ 當中、,從表面形狀的略微凹狀而稍具收敛方向的折射力, 然後被引導至第二偏光分光鏡23,而於第二偏光分光鏡^ 反射之際從表面形狀的略微凹狀而加算稍許的收斂方向的 折射力。結果為,稍具收斂方向的折射力。 相對於此,於光路徑B當中,於第一偏光分光鏡Μ 反射之際’從表面的凸狀而稍具發散方向的折射力,並被 引導至第-檢流掃描鏡13a及m。由於第一檢流掃描鏡 13a及13b為較凹的凹狀,因而加算較強的收敛方向的折 射力’結果為,稍具收斂方向的折射力的雷射《7,以幾 乎相同的折射力穿透第二偏光分光鏡23。The refraction becomes smaller when the teeth are penetrated.士士 罢 盘, ^ direction and V direction of the refractive power: As a result, due to the U effect. The absolute value of the radius of curvature of the astigmatism and the back surface in the present invention can be reduced later: Table: Shape 'must make the surface processing precision more precise, comparable and accurate, so it must reach a more general connection It is explained below that the full engraving Γ '4 is λ / 20 or less. 0 The maximum of the second polarizing beam splitter: shape: the first polarizing beam splitter in the system and the refraction described previously: the addition of each optical element is the same, The refractive power of the whole optical system acts as a bull, and determines whether the aberrations are large or small. 316248 26 200539981 Therefore, the optical element between the first polarizing beam splitter 22 to the second polarizing beam splitter 23 used in the optical system of FIG. 7 is divided into laser light 6 that penetrates the first polarizing beam splitter 6 The light path a and the light path B of the reflected laser light 7 are described. In the light path A, the laser light 6 'passing through the first polarizing beam splitter 22 is guided to the second polarizing beam splitter 23 by the reflecting mirrors 14a & 14b. Since the mirrors 14a and 14b are relatively easy to fabricate, they can be used with mirrors with a precision of about 10 to about / 20. : As follows = not unusual 'Since the flatness of the galvanometer mirror is relatively deteriorated, it is more desirable to have a precision from completion to about / 15 to λ / 20. = Here, in the light path B, the first: the polarizing beam splitter 22 is placed: the second 7 :, the first galvanic scanning mirror 13 ... 3b is used to determine the position ... and 13b. Because the first galvano mirror nw, it must be extremely lightweight. In addition, as the first large swallowed brother, in order not to deteriorate the processing quality, it is necessary to make the thickness of the area plus the flat clothing into a thinner and larger shape. The finished == described mirror is deteriorated 'about " " M. In addition, 'W depends on the production machine, and becomes, for example, a concave shape. For the light path A and the light path β a +, the added refractive power may be r. If the flatness is different, it becomes the light path A and the light two = distance. This compromise is the difference in focus on ~ kβ. In the present invention, the shape of each of the first galvanometer scanning mirror 133 and other surfaces is convex, and the shape of the surface of the polarizing beam splitter 22 is concave in the case of the moon. , The surface shape of the table 316248 27 200539981 of the second polarizing beam splitter 23 is concave, and the shape of the back surface is convex. With such a structure, in the eighth light path, there is almost no refractive power when penetrating the first polarizing beam splitter 22, and among the mirrors ... and ⑽, the surface shape is slightly concave and slightly The refractive power in the convergence direction is then guided to the second polarizing beam splitter 23, and when the second polarizing beam splitter ^ reflects, the refractive power in the slightly converging direction is added from the slightly concave shape of the surface. As a result, the refractive power slightly converged. On the other hand, in the light path B, when the first polarizing beam splitter M reflects, the refractive power from the surface is slightly convex, and is guided to the first galvanic scanning mirrors 13a and m. Since the first galvano-scanning mirrors 13a and 13b are relatively concave, the refractive power of the stronger convergence direction is added. As a result, the laser with a slightly smaller refractive power of the convergence direction "7, with almost the same refractive power Penetrates the second polarizing beam splitter 23.
於上述當中,反射鏡14&及14㈣表面形狀為拉許的 凹狀’而即使於些許的凸狀的情況下,於第—檢流掃描鏡 13a及l3b的表面形狀為較凹的凹狀之際,可藉由使第一 偏光分光鏡22的表面形狀為凸狀’背面形狀為凹狀,並使 第二偏光分錢23的表面形狀為凹狀,背面形狀為凸狀, 來降低光路徑A及⑽徑3的折射力的差。然而,由於在 反射鏡14a、14b的表面形狀作為些許的凹狀的情況下可降 低的效果較高,因此較理想為凹狀。 …如上述般’根據本發明’於光學系統當中消除各個光 學兀件所具有的像差成分’結果為具備,獲得較少的像散 光及焦點差等光學性像差的光學系統之效果。 316248 28 200539981 此外’於本實施型態當中’乃以表面為凸狀,背面為 凹狀的偏光分光鏡來做為第—偏光分離機構,並以表面為 凹狀’背面為凸狀的偏光分光鏡來做為第二偏光分離機 ,,於第一檢流掃描鏡13a、13b為較凸的凸狀的情況下, :可配置以表面為凹狀’背面為凸狀的偏光分光鏡來做為 第偏光刀離枝構,並以表面為凸狀,背面為凹狀的偏光 分光鏡來做為第二偏光分離機構之與上述配置相反的話, 則可於光學系統當中消除各個光學元件所具有的像差成 一從上述次明當中可得知,形狀及平面度的最佳值,乃 因光學系統或是使用於光學系統的光學元件而有所不同。 此外,於本實施型態當中,乃著眼於第一、第二偏光 分離機構的形狀,而從上述說明當中亦可得知,於其他光 學兀件當中,亦會因相同的思考方法而會有最佳值。 此外,雖分為第丨、2、3實施型態來說明,但是亦可 組合這些實施型態。 (產業上之可利用性) 在將一條雷射光分光為兩條以上的雷射光,且同時於 2處以上進行雷射加工的情況下,本發明的雷射加工裝置 乃適用於,降低製作上的困難及成本並提升加工品質。 [圖式簡單說明] 第1圖係顯示本發明的第丨實施型態的雷射加工裝置 的構成圖。 乐2圖係固定本發明的第丨實施型態的偏光分光鏡之 316248 29 200539981 支架部份的概略圖。 , 第3圖係顯示本發明的第2〜〜 的構成圖。 戶、a孓恶的运射加工裝置 第4圖係用於說明本發々— ψ βκ - 勺弟2貫施型態的雷射加工 衣置之先學兀件表面形狀鱼 丄 • 皆^ y /、折射力之關係的模式圖。 肝罢目糸用於說明本發明的第2實施型熊的兩射力 裝置,光學元件的配置的模式圏。的田射加工 • 第6圖係用於說明本發明的第2,刑、+ •裝置之具備方向性的光學22只把型悲的雷射加工 的模式圖。 Μ件支架的配置與折射力之關係 弟7圖係顯示本發明的笛 的構成圖。 的弟3貧施型態的雷射加工裳置 第:圖⑷娜用於說明本發明的第3 射加工裝置之光學元件表面 生〜、的辑 圖。 φ狀與折射力之關係的模式 第9圖係顯示與本發明有關的習知技術 置的構成圖。 射加工裝 第圖係用於說明與本發明有關的習知 加工裝置的偏光分光鏡的模式圖。 Τ的雷射 [主要元件符號說明] 1 雷射振盪器 . 2 ' 6 ' 7 ' 10、11、28 雷射光 3 光罩 4、4a、4b、4z、14、14a、14b、27 反射鏡 316248 30 200539981 5 > 22 第一偏光分離機 構(第一偏光分光鏡) 6p " 6s 7p ' 7s ' 28p ' 28s 偏光方向 8、23 第二偏光分離機 構(第二偏光分光鏡) 9 阻尼器 12 弟一檢流掃描鏡 13、13a、13b第一檢流掃描鏡 15 第1快門 16 第2快門 17 透鏡 18 XY承載台 19 能量感測器 20 被加工物 24 第一偏光分光鏡 25 第二偏光分光鏡 26 窗孔部分 31 固定支架 32 支架支撐 33a 第1固定螺絲 33b 第2固定螺絲 34a 第1調整孔 34b 弟2調整孔 35a 第1旋轉車由 35b 第2旋轉軸 36 光學基座 37a 第一光學元件 37b 第二光學元件 38a 第一支架元件 38b 第二支架元件 D 入射光徑 d 光束點徑 f 焦距 n 折射率 R 表面曲率半徑In the above, the surface shapes of the mirrors 14 & and 14 ′ are slightly concave, and even in the case of a slight convexity, the surface shapes of the first galvanic scanning mirrors 13a and 13b are relatively concave and concave. In this case, the light path can be reduced by making the surface shape of the first polarizing beam splitter 22 convex and the shape of the back surface concave, and making the surface shape of the second polarizing beam splitter 23 concave and the shape of the back surface convex. The difference in refractive power between A and the diameter 3. However, since the effect of reducing the surface shape of the mirrors 14a and 14b is slightly concave, it is preferable to have a concave shape. ... As described above, according to the present invention, "the elimination of the aberration component of each optical element in the optical system" has the effect of having an optical system that obtains less optical aberrations such as astigmatism and focus aberration. 316248 28 200539981 In addition, in this embodiment, the polarizing beam splitter with the convex surface on the back and concave on the back is used as the first polarization separating mechanism, and the polarizing beam splitting on the surface is concave with the convex on the back. Mirror as the second polarization splitter. In the case where the first galvano-scanning mirrors 13a and 13b are convex and convex, a polarizing beam splitter with a concave surface and a convex surface on the back can be configured. It is the first polarizing knife branching structure, and uses a polarizing beam splitter with a convex shape on the surface and a concave shape on the back as the second polarization separation mechanism. Contrary to the above configuration, each optical element can be eliminated from the optical system. It can be seen from the above-mentioned sub-brightness that the optimal values of the shape and flatness vary depending on the optical system or the optical element used in the optical system. In addition, in this embodiment, the shape of the first and second polarized light separation mechanisms is focused on, and from the above description, it can be known that among other optical components, the same thinking method will be used. best value. In addition, although the description is divided into the first, second, and third embodiments, these embodiments may be combined. (Industrial Applicability) When a laser beam is split into two or more laser beams, and laser processing is performed at two or more locations at the same time, the laser processing device of the present invention is suitable for reducing production Difficulties and costs and improve processing quality. [Brief description of the drawings] Fig. 1 is a configuration diagram showing a laser processing apparatus according to a first embodiment of the present invention. Le 2 is a schematic view of a 316248 29 200539981 bracket part of a polarizing beam splitter according to the first embodiment of the present invention. Fig. 3 is a diagram showing the second through the second through the present invention. The figure 4 of the shooting processing device for household and a 孓 evil is used to explain the surface shape of the first learned piece of laser processing clothing placed in this type of hairpin — ψ βκ-Spooner. • All ^ y /, A model diagram of the relationship between refractive power. The liver is used to explain the arrangement mode of the optical element of the two-radiation device of the bear of the second embodiment of the present invention. Field processing • Figure 6 is a schematic diagram for explaining the laser processing of the 22-type optical fiber with directivity of the 2nd, +, and directional devices of the present invention. The relationship between the arrangement of the M-piece holder and the refractive power. Fig. 7 is a structural diagram showing the flute of the present invention. Brother's 3rd laser processing mode of the first model: Figure ⑷ is used to explain the third embodiment of the optical processing device of the present invention on the surface of the photo processing. Mode of Relation between φ-shape and Refractive Power FIG. 9 is a structural diagram showing a conventional technique related to the present invention. Fig. 1 is a schematic diagram for explaining a polarizing beam splitter of a conventional processing device related to the present invention. Laser of Τ [Description of Symbols of Main Components] 1 Laser Oscillator. 2 '6' 7 '10, 11, 28 Laser Light 3 Mask 4, 4a, 4b, 4z, 14, 14a, 14b, 27 Reflector 316248 30 200539981 5 > 22 First polarization splitting mechanism (first polarizing beam splitter) 6p " 6s 7p '7s' 28p' 28s Polarizing direction 8, 23 Second polarization splitting mechanism (second polarizing beam splitter) 9 Damper 12 First galvanic scanning mirror 13, 13a, 13b First galvanic scanning mirror 15 First shutter 16 Second shutter 17 Lens 18 XY stage 19 Energy sensor 20 Workpiece 24 First polarizing beam splitter 25 Second polarizing light Beamsplitter 26 Window hole portion 31 Fixing bracket 32 Bracket support 33a 1st fixing screw 33b 2nd fixing screw 34a 1st adjusting hole 34b 2nd adjusting hole 35a 1st rotating car by 35b 2nd rotating shaft 36 optical base 37a 1st Optical element 37b Second optical element 38a First support element 38b Second support element D Incident light path d Beam point diameter f Focal length n Refractive index R Surface curvature radius
316248316248
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JP4979277B2 (en) * | 2006-06-07 | 2012-07-18 | 三菱電機株式会社 | Laser oscillator |
JP4297952B2 (en) * | 2007-05-28 | 2009-07-15 | 三菱電機株式会社 | Laser processing equipment |
JP4401410B2 (en) * | 2007-11-21 | 2010-01-20 | 三菱電機株式会社 | Laser processing equipment |
JP5692969B2 (en) | 2008-09-01 | 2015-04-01 | 浜松ホトニクス株式会社 | Aberration correction method, laser processing method using this aberration correction method, laser irradiation method using this aberration correction method, aberration correction apparatus, and aberration correction program |
JP5178557B2 (en) * | 2009-02-02 | 2013-04-10 | 三菱電機株式会社 | Spectroscopic unit and laser processing apparatus using the same |
JP5349406B2 (en) * | 2010-06-01 | 2013-11-20 | 三菱電機株式会社 | Polarization azimuth adjusting device and laser processing device |
DE112011103110B4 (en) * | 2010-09-17 | 2016-12-01 | Mitsubishi Electric Corporation | Gas laser device |
TWI459039B (en) * | 2011-05-18 | 2014-11-01 | Uni Via Technology Inc | Apparatus and method for transforming a laser beam |
TWI606880B (en) * | 2012-09-13 | 2017-12-01 | Hamamatsu Photonics Kk | Optical modulation control method, control program, control device, and laser light irradiation device |
CN103894734A (en) * | 2012-12-31 | 2014-07-02 | 上海微电子装备有限公司 | Laser annealing device and operation method of laser annealing device |
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