[go: up one dir, main page]

TW200535453A - Exposing apparatus - Google Patents

Exposing apparatus Download PDF

Info

Publication number
TW200535453A
TW200535453A TW94113749A TW94113749A TW200535453A TW 200535453 A TW200535453 A TW 200535453A TW 94113749 A TW94113749 A TW 94113749A TW 94113749 A TW94113749 A TW 94113749A TW 200535453 A TW200535453 A TW 200535453A
Authority
TW
Taiwan
Prior art keywords
exposure
functional pattern
image
data
laser beam
Prior art date
Application number
TW94113749A
Other languages
Chinese (zh)
Other versions
TWI347450B (en
Inventor
Miyoshi Ito
Original Assignee
Integrated Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Solutions Co Ltd filed Critical Integrated Solutions Co Ltd
Publication of TW200535453A publication Critical patent/TW200535453A/en
Application granted granted Critical
Publication of TWI347450B publication Critical patent/TWI347450B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007Alignment other than original with workpiece
    • G03F9/7015Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

In this exposure device 1, a laser beam radiated from an exposure optical system 3 relatively scans a glass substrate 8 in the direction orthogonal to the movement direction (arrow A) thereof to draw the function patterns with a predetermined pitch directly on the glass substrate 8. The exposure device 1 comprises an imaging means 5 for imaging the pixels of a black matrix previously formed on the glass substrate 8; and an optical system control means 7 for carrying out a predetermined image process to the image data of the pixels acquired by the imaging means 5, for forming a defect-free pixel row image by removing defects in a pixel row image of one scan region according to the laser beam, for detecting the reference position of the exposure start or end in the defect-free pixel row image, and for controlling the irradiation start or stop of the laser beam with reference to the reference position.

Description

200535453 五、發明說明(1) 【發明所屬之技術領域】 本發明係一種在被曝光體上曝露機能性圖型的曝光裝 置,尤其是關於一種曝光裝置,係利用攝影機構取得在被 曝光體上預先形成的做為基準的機能性圖型上設定的基準 位置,並予檢出,再以該基準位置為基準進行光束的照射 開始或照射停止的控制,藉以提高機能性圖型重合的精 度,同時抑制曝光裝置的成本。 :【先前技術】 傳統的曝光裝置,係使用預先形成有相當於玻璃基板 _上機能性圖型的光罩圖形為光罩,而轉印該光罩圖型於被 曝光體上而曝光。例如設有分步器(S t e p p e r )或微對稱投 影(Micro Mirror Projection)或近接功能(Proximity)等 裝置者均是。然而這些傳統曝光裝置,於積層形成複數層 的機能性圖型時,各層間機能性圖型的重合精度頗成問 題。尤其對於大型LCD用TFT與彩色濾光器形成所用大型光 罩的場合,光罩圖型之排列被要求須具絕對精準的尺寸, 提高了光罩成本。又為了得到上述重合精度,必須對準底 層的機能性圖型與光罩圖型,特別對於大型光罩,這樣的 0準作業困難頗大。 另一方面,有一種曝光裝置,不使用光罩,而使用電 ~子光束或雷射光束在被曝光體上直接描繪CAD數據圖型。 此種曝光裝置,具有雷射光源,用以往復掃描該雷射光源 _所發射的雷射光束的曝光光學系,及以承載被曝光體的狀200535453 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an exposure device that exposes a functional pattern on an object to be exposed, and particularly relates to an exposure device obtained by using a photographing mechanism on the object to be exposed. A pre-formed reference position set on a functional pattern that is used as a reference is detected and detected. The reference position is used as a reference to control the start or stop of irradiation of the light beam in order to improve the accuracy of the functional pattern registration. At the same time, the cost of the exposure device is suppressed. : [Prior art] A conventional exposure device uses a mask pattern previously formed with a functional pattern corresponding to a glass substrate _ as a mask, and the mask pattern is transferred to the exposed body for exposure. For example, steppers (S t e p p e r), micro symmetric projection (Micro Mirror Projection) or proximity function (Proximity) are all available. However, when these conventional exposure devices are laminated to form a plurality of layers of functional patterns, the accuracy of the functional patterns of the layers is very problematic. Especially for the large masks used in the formation of large LCD TFTs and color filters, the pattern arrangement of the masks must be required to have an absolutely accurate size, which increases the cost of the masks. In order to obtain the above-mentioned coincidence accuracy, it is necessary to align the functional pattern of the bottom layer and the pattern of the photomask, especially for large photomasks, this kind of accurate operation is difficult. On the other hand, there is an exposure device that does not use a photomask and directly draws a CAD data pattern on an object to be exposed using an electric beam or a laser beam. This exposure device has a laser light source, an exposure optical system for reciprocating scanning of the laser light source _, and a state of carrying an exposed object.

第5頁 200535453 五、發明說明(2) 態搬運的搬運機構,依據CAD數據,一面控制雷射光源的 發射狀態,一面往復掃描雷射光束,同時搬運被曝光體於 與雷射光束掃瞄方向正交之方向,以二維方式形成相當於 機能性圖形的CAD數據圖形於被曝光體上(例如參照特開 2 0 0 1 - 1 4 4 4 1 5 公報)。 但是,於這樣的直接描繪型傳統曝光裝置,CAD數據 圖型的排列需要有絕對的尺寸精度,此點與使用光罩的曝 /光裝置是一樣的。又在使用複數曝光裝置形成機能性圖型 ,的製程中,如在曝光裝置間的精度有參差,機能性圖型的 重合精度有降低的問題。因此,為了應付此一問題,必須 %高精度的曝光裝置,於是提高了曝光裝置的成本。 此外,事先須對準底層的機能性圖型與CAD數據圖 型,此點與使用光罩的其他曝光裝置同樣。也有上述一樣 的問題。 【發明内容】 本發明的目的在提供一種曝光裝置,其可應付上述問 題以提高機能性圖型的重合精度,同時可抑制曝光裝置的 成本。 φ 為了達成上述目的,第一發明的曝光裝置,是一種曝 光裝置,將曝光光學系所照射的光束相對掃瞄於與被曝光 ,體移動方向成正交的方向,而在該被曝光體上以既定節距 曝露機能性圖型者,包含有用以攝取預先形成於該被曝光 ^體上做為基準曝光位置的基準機能性圖型之攝影機構;及Page 5 200535453 V. Description of the invention (2) According to the CAD data, the conveying mechanism controls the emission status of the laser light source, scans the laser beam back and forth, and simultaneously conveys the exposed object in the scanning direction of the laser beam. In the orthogonal direction, a CAD data pattern corresponding to a functional figure is formed in a two-dimensional manner on the object to be exposed (for example, refer to Japanese Patent Application Laid-Open No. 2000-1-1 4 4 4 1 5). However, in such a direct drawing type conventional exposure device, the arrangement of CAD data patterns must have absolute dimensional accuracy, which is the same as the exposure / light device using a photomask. In the process of forming a functional pattern using a plurality of exposure devices, if the accuracy of the exposure devices varies, the accuracy of the coincidence of the functional patterns may decrease. Therefore, in order to cope with this problem, a high-precision exposure device is required, and the cost of the exposure device is increased. In addition, it is necessary to align the functional pattern and CAD data pattern of the bottom layer in advance, which is the same as that of other exposure devices using a photomask. There are the same problems as above. SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure device which can cope with the above problems to improve the registration accuracy of a functional pattern, and at the same time, can suppress the cost of the exposure device. φ In order to achieve the above object, the exposure apparatus of the first invention is an exposure apparatus that relatively scans the light beam irradiated by the exposure optical system in a direction orthogonal to the direction of exposure and the movement of the body, and on the subject to be exposed Those who expose the functional pattern at a predetermined pitch include a photographing mechanism that can take a reference functional pattern formed in advance on the exposed body as a reference exposure position; and

第6頁 200535453 五、發明說明丫3) 光學控制機構,用以對兮 ^^Page 6 200535453 V. Description of the invention 3) Optical control mechanism for correcting ^^

型的畫像數據進行既定=j影機構所取得該基準機於 領域的基準機能性圖型二=處理,排除對應於該光=,圖 機能性圖型畫I,在該c缺陷’以製成無缺陷的:= 曝光開始或終了之基準饮班、陷基準機能性圖型畫像上二準 該光束之照射開始或照射二,以该基準位置為基準來控= 藉此構成,對攝影 τ止。 ’I 鉍诚LV氺爆么、枇备丨协7構所取得基準機能性圖型的全你 數據以““制機構進行既定畫像處理,排除;:f像 束掃描領域的基準機能性圖型晝像的缺陷,以製.:;光 的基準機能性圖型晝像,在該無缺陷基準機能性圖型、== 上檢出曝光開始或終了之基準位置,以該基準位置^二進 來控制該光’I之照射開始或照射停止。藉此,即使預&來 成於被曝光體上的基準機能性圖型有缺陷,也可以高精/ 在既定位置形成既定機能性圖型。因此,於形成數^ ^ $ 層機能性圖型的場合,也可提高各層機能性圖型的^合^ 度。再者,於使用複數曝光裝置形成積層圖型的場合I ^ 以排除起因方;曝光裝置間精度差引起的機能性圖型重合精 度低下的問題,並抑制曝光裝置成本。 口月 又,4光本糸控制機構,係利用該攝影機構所取得基 •機能性圖型中之兩個畫像數據,以擇取各畫像數據論理 丨和而製成該無缺陷基準機能性圖型畫像。由是,利用攝影 -機構所取得基準機能性圖髮中之兩個晝像數據,藉光學系 1控制機構取得各晝像數據的論理和而製成無缺陷基準機能 性圖型畫像。The type of portrait data is processed according to the standard functional pattern of the reference machine obtained by the shadow mechanism in the field. The second processing is to exclude the light that corresponds to the light. Non-defective: = reference drinking shift, trap reference function diagram image at the beginning or end of exposure. The light beam is started or irradiated on the portrait image, and the reference position is used as a reference to control. . 'I Bismuth LV 氺 氺 氺 氺 氺 枇 枇 丨 丨 All the data of the reference functional pattern obtained by Xie 7 structure are processed by the "" system for predetermined image processing and excluded ;: the reference functional pattern in the field of f image beam scanning Defects of daylight image, based on :; light reference functional pattern daylight image, the reference position where the start or end of exposure is detected on the non-defective reference functional pattern, ==, and the reference position ^ is entered in two The irradiation of the light 'I is controlled to start or stop. With this, even if the reference functional pattern pre-made on the object to be exposed is defective, it is possible to form a high-precision / predetermined functional pattern at a predetermined position. Therefore, in the case of forming a functional pattern of several layers, the combination of the functional patterns of each layer can also be improved. Furthermore, in the case of forming a multi-layer pattern using a plurality of exposure devices, I ^ is used to eliminate the cause of the problem; the problem of the low accuracy of the coincidence of the functional patterns caused by the accuracy difference between the exposure devices, and the cost of the exposure device is suppressed. Kou Yueyou, the 4-light local control mechanism, uses the two portrait data in the basic functional pattern obtained by the photographic mechanism to select the theoretical data of each portrait data to make the non-defective reference functional map. Type portrait. Therefore, the two daytime image data in the reference functional map obtained by the photography agency were used to obtain the theoretical sum of each daytime image data by the optical system 1 control mechanism to create a defect-free reference functional pattern portrait.

幽1You 1

200535453 五、發明說明(4) 再者,該光學系控制機構,利用該攝影機構所取得前 一個基準機能性圖型畫像數據與新取得的基準機能性圖型 畫像數據,取得位於該被曝光體移動方向前後而互相同位 置的各畫像數據論理和,以製成無缺陷基準機能性圖型畫 像。由是利用以攝影機構所取得前一個基準機能性圖型晝 像數據與新取得的基準機能性圖型畫像數據,藉光學系控 _制機構取得位於被曝光體移動方向前後互相同位置的各畫 _像數據之論理和,以製成無缺陷基準機能性圖型畫像。藉 卩此,亦可去除承載被曝光體站台上所附著的異物等缺陷。 由此得以防止因誤認該缺陷為基準位置而曝光,故可提高 ’既定機能性圖型之曝光精度。 此外,該光學系控制機構,係利用該攝影機構所取得 基準機能性圖型畫像數據中相鄰之基準機能性圖型畫像數 據,取得各晝像數據之論理和,因而製成無缺陷基準機能 性圖型畫像。藉此,利用攝影機構所取得基準機能性圖形 畫像中相鄰之基準機能性圖型晝像數據,而以光學系控制 機構取得各畫像數據的論理和而製成無缺陷基準機能性圖 型晝像。是以即使最後列的光束掃瞄領域内有缺陷時,可 以比較相鄰兩個機能性圖型而去除缺陷。 φ 又,依照本發明的曝光裝置第二實施例係,為一種將 曝光光學系所照射的光束相對掃描於與被曝光體移動方向 -成正交的方向,而在被曝光體上以既定節距曝露機能性圖 型者。包含有用以攝取預先形成於被曝光體上做為基準曝 ‘光位置的基準機能性圖形之攝影機構;及光學系控制機200535453 V. Description of the invention (4) Furthermore, the optical system control mechanism uses the previous reference functional pattern image data obtained by the photographing mechanism and the newly obtained reference functional pattern image data to obtain the object located in the exposed body. Theoretical sum of each image data in the same position in front and back of the moving direction to make a defect-free reference functional image portrait. Therefore, the previous reference functional pattern day image data obtained by the photographing agency and the newly obtained reference functional pattern portrait data are used to obtain each of the same positions in front and back of the exposed body by the optical system control mechanism. Painting_Theoretical sum of image data to make a defect-free reference functional portrait. By doing so, defects such as foreign matter adhering to the platform carrying the object to be exposed can also be removed. This prevents exposure due to the mistaken recognition of the defect as a reference position, so that the exposure accuracy of a predetermined functional pattern can be improved. In addition, the optical system control mechanism uses adjacent reference functional pattern image data among the reference functional pattern image data obtained by the photographing mechanism to obtain the theoretical sum of each day image data, and thus creates a defect-free reference function. Sexual pattern portrait. In this way, the day-to-day reference functional pattern day image data of the reference functional graphic image obtained by the photographing mechanism is used, and the theory and sum of each image data are obtained by the optical system control mechanism to create a defect-free reference functional pattern day image. image. Therefore, even if there is a defect in the beam scanning area of the last column, the two adjacent functional patterns can be compared to remove the defect. φ In accordance with the second embodiment of the exposure apparatus of the present invention, a beam scanned by the exposure optical system is relatively scanned in a direction orthogonal to the moving direction of the object to be exposed, and the object is exposed at a predetermined pitch on the object. From the functional pattern of exposure. Including a photographing mechanism for taking a reference functional pattern formed in advance on an object to be exposed as a reference light position; and an optical control device

第8頁 200535453 五、發明說明(5) ' --;-- -- : 圭々把以攝景> 機構所取得既定領域中該基準機能性圖 ^ ^ Γ像數據,複印於該既定領域的後續領域,而補全以 =ί Ϊ機構未能取得的基準機能性圖型畫像,在該補全之 二 > 二2 I生圖型畫像上檢出曝光開始或終了之基準位置, μ 。 1為基準來控制該光束的照射開始或照射停 定領2 Φ Α成,以光學系控制機構,把攝影機構所取得既 後續領域Ϊ準機能性圖型之晝像數據,複印於既定領域的 型晝像,才而補充以該攝影機構未能取得的基準機能性圖 .或終了之其忒補充之基準機能性圖型晝像上檢出曝光開始 照射開始^ ^位置’並以該基準位置為基準來控制光束的 束掃瞄方1知射停止。由是以攝影機構不能取得所有在光 高精度^ i、形成於被曝光體之基準機能性圖型時,亦可以 束掃瞄領。'、既疋機旎性圖型於既定位置。準此,例如對光 影機椹I!域攝影機構之攝影領域較為狹小時,亦可依該攝 領域内之佥侍旦像數據,以完全之形態製成光束之全掃瞄 裝置成本畫像數據。由是得以減少攝影機構之數目而抑減 •貫施方式】 1 p^i 、裝置1係=為本發明之曝光裝置實施形態之概念圖。曝光 射光源2、以在被曝光體上曝露機能性圖型,且具備有雷 •明機構的、北曝光光學系3、搬運機構4,攝影機構5、做為照 月面光照射機構6,及光學系控制機構7。又,所Page 8 200535453 V. Description of the invention (5) '-;--: Guiyu copied the reference functional map of the established field obtained by the photography > organization ^ ^ Γ image data and copied it to the established field Follow-up field, and complement the reference functional pattern image that was not obtained by the ί Ϊ mechanism, and detect the reference position at which the exposure starts or ends on the second image of the complement 2> 2 I, . 1 is used as a reference to control the start or stop of irradiation of the beam 2 Φ Α, using the optical control mechanism to copy the day-to-day image data obtained by the photography mechanism from the previous functional standard pattern to the predetermined field The daylight image is supplemented with a reference functional map that the photography agency has failed to obtain. Or it is supplemented with a reference functional map. The daylight image is detected and the exposure starts and the exposure starts. The beam scanning side 1 that controls the light beam as a reference until the emission stops. Therefore, the imaging mechanism can also be used to scan the collar when the photographic mechanism cannot obtain all the high-accuracy reference patterns formed on the exposed object. ', The nature of the machine is in a predetermined position. If this is the case, for example, the photographic field of a photo camera's I! Domain photography agency is relatively small, and the full scan device cost image data can be made in a complete form based on the image data of the image in the photographic field. It can be reduced by reducing the number of photographing agencies. • Implementation method] 1 p ^ i, device 1 is a conceptual diagram of the embodiment of the exposure device of the present invention. Exposure light source 2, for exposing the functional pattern on the object to be exposed, and equipped with a thunder and light mechanism, north exposure optical system 3, transport mechanism 4, photographing mechanism 5, as a lunar surface light irradiation mechanism 6, And optical system control mechanism 7. Again

200535453 五、發明說明(6) 謂機能性圖型,係指製品所具有之為本來目的而動作之必 要構成部分之圖型,例如,彩色濾光器之黑色矩陣畫素圖 型,及紅、藍、綠各色濾光器之圖型,在半導體部件時, 則為配線圖型及各種電極圖型等。以下的敘述中,就做為 被曝光體的彩色濾光器用玻璃基板為例來說明。 上述雷射光源2係用以發射光束,例如屬於一種產生 3 5 5nm紫外線,輸出4W以上之高輸出全固定模鎖雷射光 •源。 - 在上述雷射光源2之光束發射方向前方設有曝光光學 系3。此曝光光學系3係用以將做為光束的雷射光束在玻璃 _基板8上往復掃瞄,其在雷射光束發射方向前方起,依序 具有光開關9,光偏向機構1 0,第一鏡子1 1,多角鏡1 2, f0透鏡13,及第二鏡子14。 該光開關9,係用以切換雷射光束的照射及照射停止 狀態者。例如第2圖所示,將第一及第二偏光元件1 5A, 1 5 B分離配置成使各偏光元件1 5 A,1 5 B之偏光軸P互相正交 (在該圖中偏光元件1 5 A之偏光軸P設定於垂直方向,偏光 元件1 5 B之偏光軸P設定於水平方向)。兩偏光元件1 5 A與 1 5 B之間,配置電氣光學調變器1 6。該電氣光學調度器1 6 φ經加於電壓,則動作而使偏光(直線偏光)之偏波面以數 n e s c之高速回轉。例如印加電壓為零時,在同圖(a )中, •由第一偏光元件1 5 A選擇透過的例如垂直方向之具有偏波 面的直線偏光,原樣透過該電氣光學調變器1 6,而達於第 >二偏光元件1 5B。由於此第二偏光元件1 5B,係配製成能使200535453 V. Description of the invention (6) The functional pattern refers to the pattern of the necessary components of the product for its original purpose, such as the black matrix pixel pattern of color filters, and red, The patterns of the blue and green color filters are wiring patterns and various electrode patterns in the case of semiconductor components. In the following description, a glass substrate for a color filter as an exposed object will be described as an example. The above-mentioned laser light source 2 is used to emit a light beam, for example, it belongs to a fully fixed mode-locked laser light source that generates 3 5 5nm ultraviolet rays and outputs a high output of more than 4W. -An exposure optics 3 is provided in front of the beam emitting direction of the laser light source 2 described above. This exposure optical system 3 is used to scan the laser beam as a light beam on the glass substrate 8 reciprocatingly. It has a light switch 9 and a light deflection mechanism 10 in order from the front of the laser beam emission direction. A mirror 11, a polygon mirror 12, an f0 lens 13, and a second mirror 14. The optical switch 9 is used to switch the irradiation and stop states of the laser beam. For example, as shown in FIG. 2, the first and second polarizing elements 15A and 1 5B are separately arranged so that the polarization axes P of the respective polarizing elements 15 A and 1 5 B are orthogonal to each other (the polarizing element 1 in the figure). The polarizing axis P of 5 A is set in the vertical direction, and the polarizing axis P of polarizing element 1 5 B is set in the horizontal direction). Between the two polarizing elements 15 A and 1 5 B, an electro-optic modulator 16 is arranged. When the electro-optical scheduler 16 φ is applied with a voltage, it operates to rotate the polarization surface of polarized light (linear polarized light) at a high speed of a number n e s c. For example, when the applied voltage is zero, in the same figure (a), the linearly polarized light having a polarizing surface, such as a vertical direction, which is selectively transmitted by the first polarizing element 1 5 A, passes through the electro-optic modulator 16 as it is, and Up to the > second polarizing element 15B. Since this second polarizing element 15B is formulated to enable

第10頁 200535453 五、發明說明(7) 〜- 具有水平方向偏波面的直線偏光選擇性的透過,故具有垂 直方向偏波面的該直線偏光不能透過,遇此場合,带 束成照射停止狀態。 田、 另一方面,如同圖(b)所示,加電壓於電氣光學調變 器1 6,當入射於該電氣光學調變器丨6的直線偏光偏波面回 轉9 0度時,該具有垂直方向偏波面的直線偏光,於發 •氣光學調度器1 6時,變成具有水平方向之偏波面,^直線 -·偏光可以透過第二偏光元件1 5β。於是雷射光束成為照射 •狀態。 “、 偏移於與 上與第1 ’例如屬 該偏光機構1 〇,係用以將雷射光束掃描位置 I掃描方向正交之方向(在玻璃基板8的移動方向 圖之箭頭Α方向一致),而調整成在正確位置掃描 於音響光學元件(A0元件)。 又 第 係用以將通過偏光機構1 0的雷射光 束進行方向.彎折於後述的多角型鏡12的設置方向,= 平面鏡。再者,多角形鏡12可往復掃描雷 ,例 正八角形之柱狀”體側面形成8具鏡子 ' 一所反射的雷射光束,隨著多备 、見子之 、、往”方向被掃描,俟雷射光束‘:之回轉’在-維之 •間返回復方向,再度隨著多:;射:置移至下-鏡面 ,、往"方向之掃描。 夕角开7鏡12之回轉,開始-維 入 板8上成為等速,而配置成其隹二☆ ^束掃描速度在玻璃基 面位置略為一致。第二鏡子丨4 f 與多角形鏡1 2的鏡 ’知用以反射通過f 0透鏡1 3Page 10 200535453 V. Description of the invention (7) ~-The linearly polarized light with the horizontally polarized surface is selectively transmitted. Therefore, the linearly polarized light with the vertically polarized surface cannot be transmitted. In this case, the belt is in the irradiation stop state. Tian, on the other hand, as shown in Figure (b), a voltage is applied to the electro-optic modulator 16 and when the linearly polarized polarization plane incident on the electro-optical modulator 6 is rotated 90 degrees, it has a vertical The linearly polarized light of the directional polarization plane becomes a horizontally polarized light plane when the air optical scheduler 16 is issued, and the linear-polarized light can pass through the second polarizing element 15β. As a result, the laser beam is irradiated. ", Shifted from the top and the 1st, for example, the polarizing mechanism 10, is used to orthogonalize the scanning direction of the laser beam scanning position I (the direction of the arrow A in the movement pattern of the glass substrate 8 is the same) , And adjusted to scan the acoustic optical element (A0 element) at the correct position. It is also used to direct the laser beam passing through the polarizing mechanism 10. Bend to the installation direction of the polygon mirror 12 described later, = plane mirror In addition, the polygon mirror 12 can scan the laser back and forth. For example, the regular octagonal columnar body has 8 mirrors. A reflected laser beam is scanned along with the direction of multiple preparation, seeing, and going. , 俟 Laser beam ': rotation' returns to the complex direction between -dimensional, and again with more :; shot: move to the lower-mirror surface, and scan in the direction of "quot 角 开 7 镜 12 之" Rotate and start-the dimensional input plate 8 becomes constant velocity, and is configured so that its beam scanning speed is slightly the same at the base of the glass. The second mirror 4f and the polygon mirror 12 are known Reflection through f 0 lens 1 3

$ 11頁 200535453 五、發明說明(8) ~~ 1 * 的雷射光束,而使其對玻璃基板8面略成垂直方向入 屬於一種平面鏡。又,在透鏡13之發射側面近傍往产 描之晷射光束掃描開始側之部份,設有與掃描方 %^ 之行傳感測器1 7,藉以檢出雷射光束設定掃描位置與游二 掃描位置之偏差量,同時檢出雷射光束掃描開始時刻:、: 外,傳感器17除在透鏡側之外,只要能夠檢出雷 光束知目田開始點,則可設在任何位置,例如可設田、 玻璃基板搬送用站台丨8側。 後处之 在該第二鏡子丨4下方,設有搬運機構4,此搬 •Ϊΐί 板8於站台18上,以既定速度在雷射光 束知描=向成正父之方向搬送,其具備有用以移動站台工 的例如搬運滾輪i 9,驅動該搬運滾輪i 9 ; 運驅動部2 0。 1 J戈馬違寻搬 搬運機構4之上方,如箭頭1〇所示搬運方向之 射光束知瞄位置前方側設有攝影機構5。此攝影 用以攝取預先形成於破璃基板8上做為曝光基準的基準機'、 能性圖型之黑色矩陣畫素者,如受光元件排成一行*之 CCD。在此如第3圖所示,該攝影機構5之攝影位置e盥册 光束掃描位置F間之距離D,設定成在黑色矩陣21蚩 #方向排列節距P的整數倍(n倍)。藉此,當破璃=板8被 搬運至畫素2 2的中心與雷射光束掃描位置一致時,怜可入 雷射光束開始掃描。又該距離D越小越好。ώ Β w疋可減小玻 璃基板8的移動誤差’而正確決定雷射光束掃描 素22的位置。又,第i圖中係例示設置三台攝:機構5广但$ 11 pages 200535453 V. Description of the invention (8) ~~ 1 * The laser beam makes it slightly perpendicular to the 8 sides of the glass substrate and belongs to a flat mirror. In addition, on the part near the emission side of the lens 13 toward the scanning beam scanning start side, a line sensor 17 is provided to scan the% ^ to detect the laser beam and set the scanning position and travel. The deviation of the two scanning positions, and the laser beam scanning start time is detected at the same time: In addition to the sensor side, the sensor 17 can be set at any position as long as it can detect the laser beam knowing the starting point of the laser beam, such as: Field and glass substrate transfer platforms can be set at 8 sides. Behind this second mirror 丨 4, there is a transport mechanism 4. This moving plate 8 is placed on the platform 18, and the laser beam is drawn at a predetermined speed in the direction of being a positive father. It has useful functions. The mobile platform worker, for example, transports the transport roller i 9 and drives the transport roller i 9; the transport drive unit 20. 1 J Goma is moved above the conveying mechanism 4, and a photographing mechanism 5 is provided on the front side of the beam position in the conveying direction as shown by the arrow 10. This photography is used to capture the black matrix pixels of the reference machine 'and the functional pattern previously formed on the broken glass substrate 8 as the exposure reference, such as CCDs with light receiving elements arranged in a row *. Here, as shown in FIG. 3, the distance D between the photographing position e of the photographing mechanism 5 and the beam scanning position F is set to an integer multiple (n times) of the pitch P arranged in the direction of the black matrix 21 蚩 #. By this, when the broken glass = plate 8 is carried to the center of the pixel 22 and the scanning position of the laser beam coincides, the laser beam starts scanning. The smaller the distance D, the better. The position of the laser beam scanning element 22 can be accurately determined by reducing the movement error of the glass substrate 8 '. In addition, in Figure i, three cameras are provided as an example:

200535453 五、發明說明(9) ' --~ 如果雷射光束掃描範圍狹於攝影機構5之畫像處理領域 時,使用一台攝影機構5就可,如果掃描範圍廣於^影機 構5 —台之晝像處理領域時,就應設置多台攝影機購5。 、>在該搬運機構4之下側設有背面光照射機構6。此背面 光照射機構6係用以照明晝素2 2,俾使攝影機構5得以攝 影,例如一種面光源。 所設光學系控制機構7係連接於雷射光源2、光開關 9、光偏向機構1 〇、多角形鏡丨2、行傳感器丨7、搬運機構4 及$影機構5 °此光學系控制機構7係用於檢出預先設定於 f〜機構5攝得的畫素2 2上圖型畫像之的基準位置,並以 °亥基準位置為基準來控制雷射光源2的雷射光束之照射開 始或照射停止’同時依據行傳感器1 7的輸出來控制印加於 光偏向機構1 〇之電壓而偏移雷射光束射出方向,並控制多 $ ^纟兄1 2的轉速以維持雷射光束掃描速度於既定速度,又 ^制搬運機構4之搬運玻璃基板8之速度於既定速度者,其 一備有用以點燃雷射光源2的光源驅動部2 3,用以控制雷 $光束照射開始及照射停止之光開關控制器24,用以控制 2 5 f向機構1 0的雷射光束偏向量之光偏向機構驅動部 ’用以控制多角形鏡1 2的驅動之多角形驅動部2 5 B,用 f ^制搬運手段4的搬運速度之搬運控制器2 6,用以控制 轉光f射機構6的點亮與熄滅之背面光控制器27,用以 ^/1)1攝^機構5所攝得畫像之A/D變換部28 ’用以依據經 、止i換畫像數據來判定雷射光束照射開始位置及照射停 立置之晝像處理部2 9,用以記憶經畫像處理部2 9處理所200535453 V. Description of the invention (9) '-~ If the laser beam scanning range is narrower than the image processing field of the photography mechanism 5, using one photography mechanism 5 is fine. If the scanning range is wider than the imaging mechanism 5-Taiwan's In the field of day image processing, multiple cameras should be set up5. ≫ A back light irradiation mechanism 6 is provided below the conveying mechanism 4. The back light illuminating mechanism 6 is used to illuminate the daylight element 22 to enable the photographing mechanism 5 to take a picture, such as a surface light source. The optical system control mechanism 7 is connected to the laser light source 2, the optical switch 9, the light deflection mechanism 10, the polygon mirror 丨 2, the line sensor 丨 7, the transport mechanism 4 and the shadow mechanism 5 ° This optical system control mechanism The 7 series is used to detect the reference position of the pixel 2 2 taken in advance in f ~ mechanism 5 and to control the laser light source 2 laser beam irradiation start based on the ° reference position. Or “irradiation stop” at the same time according to the output of the line sensor 17 to control the voltage applied to the light deflection mechanism 10 to shift the laser beam emission direction, and to control the speed of the laser beam to maintain the laser beam scanning speed If the glass substrate 8 is transported at a predetermined speed by the transport mechanism 4 at a predetermined speed, one of them is provided with a light source driving section 23 for igniting the laser light source 2 to control the start and stop of the irradiation of the laser beam. The light switch controller 24 is used to control the light deflection mechanism driving portion of the laser beam deflection vector of the 2 5 f direction mechanism 10, and the polygon driving portion 2 5 B is used to control the driving of the polygon mirror 12. f ^ Handling speed of the handling means 4 The controller 26 is used for controlling the back light controller 27 for turning on and off the light-transmitting mechanism 6 and is used for the A / D conversion section 28 ′ of the image taken by the camera 5. The image processing unit 2 9 is used to determine the laser beam irradiation start position and the irradiation stop position according to the image data based on the warp and stop, to memorize the image processing unit 29

第13頁 200535453 五、發明說明(10) 得雷射光束照射開始位置(以下稱曝光開始位置)及照射停 止位置(以下稱曝光終了位置)的數據,同時記憶後述曝光 開始位置及曝光終了位置的觀察台等記憶部30,用以依據 該記憶部3 0讀出的曝光開始位置及曝光終了位置數據來製 成做ON/OFF光開關9用的調變數據之調變數據製成處理部 3 1,及用以適切控制整個裝置以既定目的動作之控制部 32 ° 第4圖及第5圖為表示畫像處理部2 9之構成一例之方塊 •圖。如第4圖所示,畫像處理部2 9具備有例如三個並聯的 環狀緩衝記憶體3 3 A、3 3 B、3 3 C ;各併聯於該環狀緩衝記 ’隐體33A ' 33B、3 3C的例如三個行緩衝記憶體34A、34B、 3 4C ;連接於該行緩衝記憶體34A、34B、34C,而與既定之 臨角值相比較以輸出經2值化的灰階數據之比較回路3 5 ; 用以比較以上九個行緩衝記憶體34 A、34B及34C的輸出數 據與從第1圖所示記憶部3 0得來的相當於決定曝光開始位 置第一基準位置畫像數據的觀察台(曝光開始位置用 LUT ),兩數據一致時就輸出曝光開始位置判定結果之曝光 開始位置判定回路36 ;及用以比較以上九個行緩衝記&雕 34A、34B、3 4C的輸出數據與從第}圖所示記憶部3〇得^二 •當於決定曝光終了位置第二基準位置畫像數據的^二 (曝光終了位置用L UT)’兩數據一致時就輸出曝光 'τ、α •置判定結果的曝光終了位置判定回路3 7。 、 又,如第5圖所示,畫像處理部2 9具備有用以翰 光開始位置判定結果而計算相當於第一基準位置全曝 w ι像數Page 13 200535453 V. Description of the invention (10) The data of the laser beam irradiation start position (hereinafter referred to as the exposure start position) and the irradiation stop position (hereinafter referred to as the end of exposure position) are obtained. A memory unit 30 such as an observation table is used to prepare modulation data for the ON / OFF light switch 9 based on the exposure start position and end exposure position data read out by the memory unit 30. The modulation data creation processing unit 3 1, and a control section 32 ° for appropriately controlling the entire device to operate for a predetermined purpose. Figures 4 and 5 are block diagrams showing an example of the configuration of the image processing section 29. As shown in FIG. 4, the image processing unit 29 is provided with, for example, three ring buffer memories 3 3 A, 3 3 B, and 3 3 C in parallel; , 3 3C, for example, three line buffer memories 34A, 34B, and 3 4C; connected to the line buffer memories 34A, 34B, and 34C, and compared with a predetermined angle value to output binary grayscale data Comparison circuit 3 5; It is used to compare the output data of the above nine line buffer memories 34 A, 34B, and 34C with the first reference position portrait equivalent to the exposure start position determined from the memory section 30 shown in FIG. 1 Observation table for data (LUT for exposure start position), when the two data are consistent, the exposure start position determination circuit 36 that outputs the determination result of the exposure start position; and used to compare the above nine line buffers & 34A, 34B, 3 4C The output data of 与 is obtained from the memory section 30 shown in the figure. 二 • When determining the end position of the second reference position, the image data of the second reference position (LUT for the end of exposure position) is used to output exposure when the two data match. τ, α • Position determination circuit 37 determines the exposure end of the determination result. As shown in FIG. 5, the image processing unit 29 is provided with a number of images corresponding to the first reference position and a full exposure image, which is used to determine the starting position of the light.

第14頁 200535453 五、發明說明(11) 據一致次數之計數回路3 8A ;用以比較計數回路38 A的輸出 與得自第1圖所示記憶部3 0的曝光開始晝素號碼,兩數據 一致時就輸出曝光開始化號於弟1圖所示調變數據製成處 理部3 1之比較回路3 9 A ;用以輸入曝光終了位置判定結果 而計算相當於第二基準位置的畫像數據一致次數之計數回 路38B ;用以比較該計數回路38B的輸出與得自第1圖所示 記憶部3 0的曝光終了畫素號碼’兩數值一致時把曝光終了 /信號輸出於第1圖所示調變數據製成處理部3 1之比較回路 / 39B ;用以依據計數回路38A的輸出計算先前畫素數之先前 Λ畫素計數回路4 0 ;及用以比較先前畫素計數回路4 0的輸出 得自第1圖所示記憶部3 0的曝光畫素列號碼,兩數值一 致時,輸出曝光畫素列指定信號於第1圖所示調變數據製 成處理部31之比較回路4 1。此外,計數回路38Α、38Β在攝 影機構5 —開始讀取動作時,依其讀取開始信號而重新整 定。又先前畫素計算回路40在於預先指定的既定曝光圖型 形成終了時,依曝光圖型終了信號而重新整定。 其次,在下文中說明這樣構成的曝光裝置1之動作及 圖型形成方法。首先一經投入電源於曝光裝置1,光學系 控制機構7即被驅動。由是雷射光源2起動而發射雷射光 φ。同時多角形鏡1 2開始回轉而雷射光束得以掃描。但此 時光開關9尚在OFF狀態,雷射光束尚未照射。 • 其次,搭載玻璃基板8於搬運機構4的站台1 8上。又由 _於搬運機構4係以一定速度搬運玻璃基板8,是以如第6圖 所示’雷射光束的掃描軌跡(箭頭B)對站台18的移動方向Page 14 200535453 V. Description of the invention (11) Counting circuit 3 8A according to the number of coincidences; used to compare the output of the counting circuit 38 A with the exposure start day number from the memory section 30 shown in Figure 1, two data When they are consistent, the exposure start number is output. The modulation data shown in Figure 1 is used to create the comparison circuit 3 1 of the processing unit 31. The input is used to input the final exposure position determination result and calculate the image data corresponding to the second reference position. The counting circuit 38B for the number of times; used to compare the output of the counting circuit 38B with the end-of-exposure pixel number 'obtained from the memory portion 30 shown in FIG. 1 when the two values match, and the end-of-exposure / signal is output as shown in FIG. 1 The modulation data is made into a comparison circuit of the processing unit 31 / 39B; a previous Λ pixel counting circuit 4 0 for calculating the previous pixel number based on the output of the counting circuit 38A; and a comparison circuit for comparing the previous pixel counting circuit 40 0 The exposure pixel row number obtained from the memory unit 30 shown in FIG. 1 is output. When the two values are consistent, the exposure pixel row designation signal is output to the comparison circuit 4 1 of the processing unit 31 as the modulation data shown in FIG. 1. . In addition, the counting circuits 38A and 38B are reset according to the reading start signal when the camera 5 starts reading operation. In the previous pixel calculation circuit 40, when the predetermined exposure pattern has been formed, it is reset according to the exposure pattern end signal. Next, the operation and pattern formation method of the exposure apparatus 1 configured as described above will be described below. First, once the power is turned on in the exposure device 1, the optical system control mechanism 7 is driven. The laser light source 2 is activated to emit laser light φ. At the same time, the polygon mirror 12 starts to rotate and the laser beam is scanned. However, at this time, the optical switch 9 is still in the OFF state, and the laser beam is not irradiated yet. • Next, the glass substrate 8 is mounted on the platform 18 of the conveyance mechanism 4. In addition, since the transport mechanism 4 is used to transport the glass substrate 8 at a constant speed, the movement direction of the station 18 is shown by the scanning trajectory (arrow B) of the laser beam as shown in FIG. 6.

第15頁 200535453 i、發明說明(12) (箭頭A )相對成為斜向。是以當把玻璃基板8與該移動方向 (箭頭A )平行設置的場合,如同第6圖(a)所示,曝光位置 在黑色矩陣2 1的掃描開始畫素2 2 a及掃描終了畫素2 2b有所 偏差。遇此場合時如同第6圖(b)所示,將玻璃基板8對搬 運方向(箭頭A方向)傾斜設置,俾使畫素2 2的排列方向與 雷射光束知描軌跡(箭頭B) —致即可。惟現實上雷射光束 •掃描速度遠快於玻璃基板8的搬運速度,該偏差量並不 •大。是以將玻璃基板8對移動方向平行設置,而依據攝影 /機構5攝得的數據,計測偏差量,而控制曝光光學系3的光 偏向機構1 0來修正偏差量亦可。又在下文說明中,係假定 上數偏差量為可以忽略者。 其次,驅動搬運驅動部2 〇移動站台1 8於第1圖之箭頭A 方向。此時搬運驅動部2 0,係由光學系控制機構7的搬運 控制器2 6控制為一定速度者。 其次,當形成於玻璃基板8的黑色矩陣2 1到達於攝影 機構5的攝影位置時,攝影機構5即開始攝影,依據所攝得 黑色矩陣2 1的畫像數據檢出曝光開始位置及曝光終了位 置。以下參照第7圖所示流程圖來說明圖型形成方法。 首先在步驟S 1,以攝影機構5取得黑色矩陣2 1的畫素 #晝像。此取得之畫像數據送入第4圖所示畫像處理部2g ,三個環狀緩衝記憶體3 3A、3 3B、3 3C而受處理。於是, 取新的三個數據分別自各環狀緩衝記憶體33A、33B、33(: 輸出。此時例如自環狀緩衝記憶體3 3 a輸出前二個數據, 自環狀緩衝記憶體33B輸出前一個數據,自環狀緩衝記憶Page 15 200535453 i. Description of the invention (12) (arrow A) is relatively oblique. When the glass substrate 8 is set in parallel with the moving direction (arrow A), as shown in FIG. 6 (a), the scanning start pixel 2 2 a and the end pixel of the black matrix 21 are exposed at the exposure position. 2 2b is biased. In this case, as shown in Fig. 6 (b), the glass substrate 8 is tilted to the conveying direction (arrow A direction), so that the arrangement direction of the pixels 22 and the laser beam trace (arrow B) — Just get it. However, in reality, the laser beam • scanning speed is much faster than the conveying speed of the glass substrate 8, and the deviation is not large. The glass substrate 8 is set in parallel with the moving direction, and the deviation is measured based on the data captured by the camera / mechanism 5. The deviation of the light can be corrected by controlling the light deflection mechanism 10 of the exposure optical system 3. In the following description, it is assumed that the deviation of the upper number is negligible. Next, the conveyance drive unit 20 is driven to move the mobile station 18 in the direction of arrow A in FIG. 1. At this time, the conveyance driving unit 20 is controlled by the conveyance controller 26 of the optical system control mechanism 7 at a constant speed. Next, when the black matrix 21 formed on the glass substrate 8 reaches the photographing position of the photographing mechanism 5, the photographing mechanism 5 starts photographing, and the exposure start position and the end of exposure are detected based on the captured image data of the black matrix 21 . The pattern forming method will be described below with reference to the flowchart shown in FIG. 7. First, in step S1, a pixel #day image of the black matrix 21 is obtained by the photographing mechanism 5. The acquired image data is sent to the image processing unit 2g shown in FIG. 4, and three ring buffer memories 3 3A, 3 3B, and 3 3C are processed. Then, the three new data are fetched and output from each of the ring buffer memories 33A, 33B, 33 (.). At this time, for example, the first two data are output from the ring buffer memory 3 3a, and output from the ring buffer memory 33B. Previous data, self-circulating buffer memory

200535453 五、發明說明(13) 體33C輸出乘新數據。再者,這些各個數^ 緩衝記憶體3 4 A ' 3 4B、3 4C配製成例如3 x 於同一時間軸。結果獲得例如第8圖(a)所 把此晝像數值化,即對應於同圖(b )之3 x 值化的晝像因排列於同一時間轴上,可藉 界值比較而2值化。例如臨界值為、、4 " 被2值化成如與同圖(c )者。 其次在步驟S2中,係檢出曝光開始及 -位置。具體上基準位置的檢出在曝光開始 中,比較該2值化數據與得自第丨圖所示記 _始位置用LUT的數據。 例如指定曝光開始位置的第一基準位 第9圖(a )所示之黑色矩陣2 1的晝素2 2之左 光開始用LUT即如同圖(b)所示, 為、'_〇no『。因此上述2值:;據先 LUT數據、' 0 0 00 1 1 0 1 1 〃相比較,兩數據一 5所取付畫像數據被判定為第一基準位置, 位置判定回路36輸出開始位置判1定結果。 示,有六個晝素2 2並列,則各晝素2 2的左 —基準位置。 一 此外,如第1 1圖所示,站台丨8或玻璃 -物或傷痕,而由攝影機構5在畫素22内取名 4 2之畫像時’可能將該缺陷4 2誤認為基準 發明第一實施例中,把攝影機構5所取得, 良分別由三個行 3的CCD畫素畫像 示之畫像。如果 3數值。這些經數 比較回路3 5與臨 ,同圖(a )的晝像 曝光終了的基準 位置判定回路3 6 憶部3 0的曝光開 置,係設定在如 上端角落時,曝 開始用LUT數據 被與曝光開始用 致時,攝影機構 而從曝光開始 又如第1 0圖所 上端角落該屬於 基板8上存在異 F該異物等缺陷 位置。於是在本 I素列L1的畫像200535453 V. Description of the invention (13) The body 33C outputs multiplication new data. Furthermore, each of the buffer memory 3 4 A ′ 3 4B, 3 4C is configured as, for example, 3 x on the same time axis. As a result, for example, the day image as shown in FIG. 8 (a) is digitized, that is, the day image corresponding to the 3 x value of the same figure (b) is arranged on the same time axis, and can be binarized by comparison of boundary values. . For example, the critical values are, 4, " are binarized into those as in the same figure (c). Next, in step S2, the exposure start and -position are detected. Specifically, the detection of the reference position is performed at the start of exposure, and the binary data is compared with the data obtained from the LUT for the start position shown in the figure. For example, to designate the first reference position of the exposure start position, the left light of the black matrix 2 1 in the black matrix 21 shown in Fig. 9 (a) starts to be LUT, as shown in Fig. (B), as "_〇no" . Therefore, the above two values: According to the comparison of the first LUT data and '0 0 00 1 1 0 1 1 〃, the image data taken by the two data and 5 is determined as the first reference position, and the position determination circuit 36 outputs the start position determination 1 result. It shows that there are six celestial elements 2 2 juxtaposed, then each celestial element 2 2 is left-reference position. In addition, as shown in FIG. 11, when the platform 8 or the glass object or the scar is taken by the photographing agency 5 in the picture 22 of the pixel 4 2, the defect 4 2 may be mistaken for the standard invention. In one embodiment, the images obtained by the photographing mechanism 5 are shown by the CCD pixel images in three rows 3, respectively. If 3 value. These meridian comparison circuits 3 5 and Pro are the same as the reference position determination circuit 3 6 at the end of the daylight image exposure in the same figure (a). The exposure setting of the memory 30 is set at the upper corner, and the exposure starts with the LUT data. When it is used for the start of exposure, the photographing mechanism from the beginning of the exposure, as shown in FIG. 10, should belong to a defect position such as a foreign object or a foreign object on the substrate 8. So in this portrait of Prime L1

第17頁Page 17

200535453 五、發明說明(14) 數據記憶於記憶部2 0。於是取p * 據時,從記憶部2 0讀出晝素列:個畫素列L2之晝像數 (a) 圖所示晝像處理部29之坡璃、】至像數據,而就如同 向)前後互相位於同一位置的^;?板98移動方向(箭頭A方 理和。此時在兩個畫像2 2同—之畫像數據’取其論 率,乃極為稀小,因此,取久^9同時存在缺陷42之機 ^ α &素2 2書傻數攄之論理知 即可從畫像數據去除缺陷42。 一像歎據怠_理和, :像數據,檢出如上述之基準位置,利用無缺陷的畫素列晝 德ί么對取仗列的畫素列’因無法取得新的晝素列晝 •ί德:5 :上述方法去除缺陷42。此時可取相鄰畫素22的 1%像數據确理和’而去除缺陷42晝像。具體上如第1 i圖 (b) 所不,就取得最後列畫素列“畫像,與該畫素列“晝 像在列方向偏移一節距的晝像,在玻璃基板8移動方向(箭 頭A方向)的前後互相位於同—位置的晝素22之畫像數據, 取其論理和。此時甚罕見有缺陷42同時存在於相鄰兩晝象 素22之同一位置。由是,藉取各畫素22畫像數據之論理 和’即使對最後列的畫素列Ln,亦可去除其畫像的缺陷 4 2。因此可製成無缺陷的畫素列。200535453 V. Description of the invention (14) The data is stored in the memory section 20. Therefore, when taking the p * data, the day element row is read from the memory unit 20: the number of day images of the pixel row L2 (a). The image of the day image processing unit 29 shown in the figure, to the image data, is like ^ ;? 98 at the same position in front and back of each other in the same direction (arrow A squares sum up. At this time, the portrait data of the two portraits 2 2 are the same, which is extremely rare, so take a long time. ^ 9 Simultaneous existence of defect 42 ^ α & Prime 2 2 The theory of silly numbers can remove defect 42 from portrait data. An image like sigh and sorrow, like image data, detect the benchmarks as described above Position, use non-defective pixels to arrange the day of the day? Is it possible to obtain a new day of the day? • 5: The above method removes the defect 42. Adjacent pixels may be taken at this time The 1% image data of 22 is correct, and the defect 42 day image is removed. Specifically, as shown in Fig. 1 (b), the last column of pixel images is obtained, and the pixel image "day image is listed" The day image with a direction shift of one pitch, the image data of day element 22 located at the same position in front and back of the glass substrate 8 moving direction (direction of arrow A), take its theory and At this time, it is very rare that the defect 42 exists at the same position of the adjacent two-day pixel 22. At the same time, the theory of borrowing the image data of each pixel 22 and 'even the last pixel row Ln can be removed Defects in the image 4 2. So you can make defect-free pixel rows.

其次,依據上述判定結果,於第5圖所示計數回路38A 讀|可计付上述之一致次數。而且其計得次數,在比較回路 3 9 A與得自第1圖所示記憶部3 〇的曝光開始畫素號碼比較, .兩數值一致時,把曝光開始信號輸出於第1圖所示調變數 據衣成處理部3 1。此時如第1 〇圖所不’例如在雷射光束掃 •描方向以第一個畫素221及第四個畫素224的左上端角落設Secondly, according to the result of the above judgment, the counting circuit 38A shown in FIG. And the number of counts is compared in the comparison circuit 3 9 A with the exposure start pixel number obtained from the memory section 3 0 shown in FIG. 1. When the two values match, the exposure start signal is output to the adjustment shown in FIG. 1 Variable data into processing unit 31. At this time, as shown in FIG. 10, for example, in the laser beam scanning direction, the upper left corner of the first pixel 221 and the fourth pixel 224 is set in the drawing direction.

第18頁 200535453 五、發明說明(15) ---- 定為基準位置,則對應於該給 盆淮你班的i%旦/ ^ %弟一基準位置的攝影機構5沾 行CCD之元件地址,例如、' ]ηπΛ// π π π - ^ i 0 〇 〇 ” 、 4 0 0 0 被記憶於# 開關控製器2 4。 、尤 另 路37中 數據相 在第12 合,上 時曝光 ^匕數據 _兩數據 光終了 位置判 之例如 一方面,上述2值化數據,在曝光終了位置判定回 ,與得自第1圖所示記憶部30的曝光終了位置用UT 比較。例如指定曝光終了位置的第二基準位置設定 \a)圖所示之黑色起陣2丨的畫素22右上端角落之場心 述曝光終了位置用LUT為同第12 (b)圖所示者,此 終了位置用LUT數據為、' 11〇n〇〇〇(r 。於是該2值 ,與該曝光終了用L U T數據Μ 1 〇 1 1 〇 〇 〇 〇,,相比較, 一致時,攝影機構5所取得的畫像數據被判定為曝 基準位置,而由曝光終了位置判定回路3 7輸出終了 定結果。此外’如前述情形同樣,如有第1 〇圖所示 畫素2 2並列六個時,各畫素2 2的右上端角落即為第 位置。 依據該判定結果’在第5圖所示計數回路3 8 Β中,計算 上述成一致之次數。於是該計得之數,與得自第丨圖所示 記憶部3 0的曝光終了畫素地址,在比較回路3 9 β中相比 較,兩數值一致時,把曝光終了信號輸出於第1圖所示的 讀p變數據製成處理部3 1。此時如第1 〇圖所示,例如在雷射 光束掃描方向第一個晝素221及第四個畫素224之右上端角 .洛設定為第一基準位置,則對應於該第二基準位置的攝影 機構5之行C C D的元件地址,例如、、1 g⑽",、、4 g⑽//被記 憶於光開關控制器22中。於是,依照上述方式檢出曝光開Page 18 200535453 V. Description of the invention (15) ---- If it is set as the reference position, then the camera corresponding to the reference position of the i% den / ^% one reference position of the class 5 will be assigned to the component address of the CCD For example, '] ηπΛ // π π π-^ i 0 〇〇 ”, 4 0 0 0 is stored in # 开关 开关 2 4. The data phase in the other road 37 is at the 12th position, and the exposure is performed when it is on ^ For example, on the one hand, the two data are judged at the end position. The above-mentioned binary data is determined at the end position of the exposure, and compared with the end position of the exposure obtained from the memory unit 30 shown in FIG. 1 by UT. For example, specifying the end of the exposure The second reference position setting of the position \ a) The black starting line 2 丨 pictured in the picture shows the end position of the pixel in the upper right corner of the pixel 22 in the right corner. The LUT is the same as that shown in Fig. 12 (b). The LUT data is '11 〇〇〇〇〇〇 (r.) Then the 2 value, compared with the end of the exposure with LUT data M 1 〇 1 1 〇 00, compared with, when the agreement, the photo agency 5 obtained The image data is determined as the exposure reference position, and the end-of-exposure position determination circuit 37 outputs the final determination result. In addition, "As in the previous case, if there are six pixels 2 2 shown in Fig. 10 juxtaposed, the upper right corner of each pixel 22 is the second position. Based on the result of this judgment," the count is shown in Fig. 5. In the loop 3 8 B, the number of coincidences is calculated. Therefore, the counted number is compared with the pixel address of the exposure end obtained from the memory portion 30 shown in FIG. 丨. In the comparison loop 3 9 β, two When the values are the same, the end-of-exposure signal is output to the reading p-variation data shown in Fig. 1 to form the processing unit 31. At this time, as shown in Fig. 10, for example, the first day element 221 is in the laser beam scanning direction. And the upper right corner of the fourth pixel 224. If the first reference position is set, the element address of the CCD in the row of the camera 5 corresponding to the second reference position is, for example, 1 g⑽ ", 4 g⑽ // It is stored in the optical switch controller 22. Therefore, the exposure opening is detected in the above manner.

第19頁 200535453 五、發明說明(16) 始位置及曝光終了位置的基準位置後,進入步驟U。 在v麟S 3中’係進行檢出在玻璃基板8移動方 光位置。於此如第3圖所示,雷射光束掃描位置F與摄&曝 構5的攝影位置E間之距離D,因設定成畫素2 2移動方〜機 排列節距P的整數倍(η倍),故可藉計算雷射光束掃插^的 而獲知曝光位置。例如第13圖所示,雷射光束掃描位^, 攝影機構5的攝影位置間之距離D,係設定為例如畫+二 列節距P之3倍、則在步驟以中檢出晝素22端部有第二二 二基準位置後(參照同圖(a)),玻璃基板8移動而晝素列中 _^線抵達攝影機構5的攝影位置時(參照同圖(b )),即與雷 射光.束掃描開始時機_致。於是當雷射光束係以週期T掃 描時’玻璃基板8的搬運速度與雷射光束之週期τ同步,控 制在只移動相當於晝素2 2之一節距。因此,在下一 τ間, 畫素22移動至同圖(c)所示位置,又在2了後,畫素22移動 裏同圖(d)所示位置,於是在3了後,如同圖(e)所示,晝速 2 2的列中心線就到達於雷射光束掃描位置。如此得以檢出 曝光位置。 其次,在步驟S 4中,一面以雷射光束掃描,一面調整 曝光位置。具體上如第1 4圖所示,曝光位置之調整,係以 #於ί 透鏡1 3的行傳感器1 7檢出之現在雷射光束掃描位置 (元件地址)與預先設定的基準元件地址相比較而檢出其偏 盖量’而控制光偏向機構1 〇,使雷射光束掃描位置與基準 元件地址(基準掃描位置)一致即可。 其次在步驟S 5中,要開始曝光作業,曝光之開始,係Page 19 200535453 V. Description of the invention (16) After the reference position of the start position and the end position of exposure, proceed to step U. In the vlinS 3, the detection is performed on the glass substrate 8 at the position where the light is moved. Here, as shown in FIG. 3, the distance D between the scanning position F of the laser beam and the photographing position E of the exposure structure 5 is set to a pixel 2 2 moving side to an integer multiple of the machine arrangement pitch P ( η), so the exposure position can be obtained by calculating the laser beam scanning ^. For example, as shown in FIG. 13, the scanning position of the laser beam ^ and the distance D between the photographing positions of the photography mechanism 5 are set to, for example, 3 times the picture + two-column pitch P. Then, the day element 22 is detected in the step. When the end has the second and second reference positions (see the same figure (a)), when the glass substrate 8 moves and the _ ^ line in the day column reaches the photographing position of the photography mechanism 5 (see the same figure (b)), that is, Laser light. Beam scanning starts at the same time. Therefore, when the laser beam is scanned at the period T, the transport speed of the glass substrate 8 is synchronized with the period τ of the laser beam, and it is controlled to move only by a pitch corresponding to the day prime 2 2. Therefore, in the next τ, pixel 22 moves to the position shown in the same figure (c), and after 2 again, pixel 22 moves to the position shown in the same figure (d), so after 3, it is as shown in the figure ( As shown in e), the center line of the column with a diurnal speed of 2 2 reaches the laser beam scanning position. This will detect the exposure position. Next, in step S4, the exposure position is adjusted while scanning with a laser beam. Specifically, as shown in FIG. 14, the exposure position is adjusted by comparing the current laser beam scanning position (element address) detected by # 于 ί lens 1 3 line sensor 1 7 with the preset reference element address. It is only necessary to detect the amount of deflection of the cover and control the light deflection mechanism 10 so that the laser beam scanning position is consistent with the reference element address (reference scanning position). Next, in step S5, the exposure operation is started.

200535453 五、發明說明(17) 以光開關控制器2 4來控制光開關9的投入時機。此時首先 要使光開關9成0N的狀態而以雷射光束掃描,並以行傳感 器1 7在檢出雷射光束掃描開始時刻後立即關閉光開關9。 此時從調變數據製成處理部3 1讀出對應於例如第1 0圖之曝 光開始位置的攝影機構5之元件地址'' 1 0 0 0 〃 ,並在控制 部3 2演算自雷射光束掃描開始時刻至曝光開始位置止之時 間11。此時預先計測自雷射光束掃描開始時刻至攝影機構 —5之元件地址v' 1 〃的掃描時間t 0,而且使雷射光束掃描速 度同步於攝影機構5之行CCD時間軸CLK,即以計算至元件 地址'' 1 0 0 0 〃為止之時間軸數,可容易求得掃描開始時刻 —1 = t ϋ + 10 0 0CLK 〇於是從雷射光束掃瞄開始時刻起11後 投入光開關9開始曝光。 其次在步驟S 6中,進行檢出曝光終了位置作業。曝光 終了位置與上述情形同樣,例如元件地址1 9 0 0 〃的曝光 終了時刻12 = t 0 + 1 9 0 0 C LK。由是在雷射光束掃瞄開始時 刻起t 2後關閉光開關9而終止曝光。 其次在步驟S 7中,要判定雷射光束之掃描是否終了。 於此判定為N 0 〃時,返回S 2而重複上述動作。於是在S 2 中如第1 0圖所示,例如檢出第二曝光開始位置、、4 0 0 0 "及 0二曝光終了位置、' 49 0 0 〃 ,則經S4而進入S5,與上述情 形同樣,自元件地址' 4 0 0 0 〃開始曝光,而在元件地址 -v' 4 9 0 0 〃終止曝光。 又在步驟S 7中,假如判定為Y ES ",即返回S 1,移 P行於檢出新曝光位置的動作。於是反覆實行上述動作,對200535453 V. Description of the invention (17) The optical switch controller 24 is used to control the input timing of the optical switch 9. At this time, firstly, the optical switch 9 should be scanned with a laser beam in the ON state, and the line sensor 17 should be turned off immediately after detecting the laser beam scanning start time. At this time, from the modulation data preparation processing section 31, the component address `` 1 0 0 0 〃 '' of the photographing mechanism 5 corresponding to the exposure start position of, for example, FIG. 10 is read out, and the self-laser is calculated by the control section 32. Time from beam scanning start time to exposure start position 11. At this time, the scan time t 0 from the start time of the laser beam scanning to the component address v '1 摄影 of the photography mechanism-5 is measured in advance, and the scanning speed of the laser beam is synchronized with the CCD time axis CLK of the line of the photography mechanism 5, that is, Calculate the number of time axis up to the component address '' 1 0 0 0 〃, you can easily find the scan start time — 1 = t ϋ + 10 0 0CLK 〇 Then put the light switch 9 after 11 from the laser beam scan start time Start exposure. Next, in step S6, the operation of detecting the end position of exposure is performed. The exposure end position is the same as above, for example, the exposure end time of the device address 1 0 0 0 12 12 = t 0 + 1 9 0 0 C LK. The exposure is terminated by turning off the optical switch 9 after t 2 from the start of the laser beam scanning. Next, in step S7, it is determined whether the scanning of the laser beam is finished. When it is determined that it is N 0 返回, the process returns to S 2 and the above operation is repeated. Therefore, as shown in FIG. 10 in S 2, for example, when the second exposure start position, 4 0 0 " and 0 2 exposure end position are detected, and '49 0 0 〃, S5 is entered via S4, and In the same situation as above, the exposure starts at the component address '4 0 0 0 〃, and the exposure ends at the component address -v' 4 9 0 0 〃. In step S7, if it is determined as Y ES ", it returns to S1 and moves P to the operation of detecting a new exposure position. So the above actions are repeated,

第21頁 200535453 五、發明說明(18) 所希望領域進行曝光圖形之形成。 ,依照上述實施形態,攝影機構5所取得記憶於 如此 記憶部2 0之第一畫素列畫像數據予以讀出後,與新取得之 下一個畫素列畫像數據取兩者之論理和,由是去除因站台 1 8與玻璃基板8上附著之異物與傷痕之缺陷4 2造成之與本 來的畫素列畫像相異之畫像,而可製成無缺陷之晝素列畫 像數據。藉此,可防止把上述缺陷誤認為基準位置而予曝 光’故可提高既定機能性圖型之曝光精度。 本又’由於利用該無缺陷畫素列畫像數據檢出預先在畫 22上=疋之基準位置,依據該基準位置形成曝光圖型, 故y k南對晝素2 2的機能性圖型之重合精度。由是如果使 :複數的,光裝置1適用於積層圖型之形成製程之場合, ^ ^ w度之重合精度。如此一來,不必取齊各曝光裝 間^,械精度,並抑制曝光裝置1的成本。Page 21 200535453 V. Description of the invention (18) Formation of exposure patterns in the desired area. According to the above-mentioned embodiment, after the image data of the first pixel row obtained by the photographing mechanism 5 and stored in the memory unit 20 is read, the theoretical sum of the two with the newly acquired image data of the next pixel row is obtained by It is the image which is different from the original pixel image caused by the defects 42 and the foreign matter and flaws attached to the platform 18 and the glass substrate 8 and can be created without defects. Thereby, it is possible to prevent the above-mentioned defects from being mistakenly regarded as a reference position and to be exposed ', so that the exposure accuracy of a predetermined functional pattern can be improved. Ben's use of the defect-free pixel row image data to detect a reference position on the picture 22 = 疋 in advance, and form an exposure pattern based on the reference position, so Yk Nan's functional pattern overlap of the day element 2 2 Precision. The reason is that if the number is plural, the optical device 1 is suitable for the occasion of forming a laminated pattern, and the accuracy of the degree of coincidence is ^ ^ w. In this way, it is not necessary to obtain the exposure units ^, the precision of the machinery, and the cost of the exposure device 1 is suppressed.

Wt 攝影機構5讀取在畫素2 2預先設定的基準位 必事= 5位置為基準而進行曝光及停止曝光,是以不 施。 仃|素22與曝光圖型之對準,曝光作業容易實 祕此m i第二發明之曝光裝置實施形態概念圖。又, 此第二發明中,口呈供一 相異之部份加以說明。在 ♦ # # if >1 ^ " σ較雷射光束掃瞄範圍為狹小的 旦像處理領域之攝影機構5。 ο认〗的 在此%合’設定於黑色矩陣 檢出,如第1 m π -於/丨早Z1的畫素22之基準位置 弟16圖所不,係以攝影機構5 一台取得例如畫素之The Wt photographing mechanism 5 reads the preset reference position at the pixel 2 2 and must take 5 position as the reference to perform the exposure and stop the exposure.仃 | The alignment of the element 22 and the exposure pattern makes it easy to perform the exposure operation. This is a conceptual diagram of the embodiment of the exposure device of the second invention. Also, in this second invention, a different part is described for explanation. In ♦ # # if > 1 ^ " σ is smaller than the laser beam scanning range of the imaging agency in the field of image processing5. ο Recognition is set here in the black matrix to detect, as shown in the first m π-the reference position of the pixel 22 in / Zao Z1, as shown in Figure 16, which is obtained by the photography agency 5 Motoyuki

200535453 五、發明說明(19) 列L 1的畫像數據,而與第5圖所示曝光開始位置用L UT及曝 光終了位置用L U T相比較。由此例如在第一個畫素2 2 1的佐 上端角落設定曝光開始位置,在第四個晝素2 2 4的右上端 角落設定曝光終了位置,則將與此對應之攝影機構5的行 CCD之元件地址,例如M00CT及M00(T記憶於記憶部 20 〇 另一方面,如果畫素2 2以既足之即此列方向排列 時,把攝影機構5所取得畫素列畫像複印於後續於該攝影 •1.機構5的晝像處理領域4 3 Α的領域,以補全攝影機構5不能 •取得的晝素列晝像,並依據該經補全之畫素列晝像進行曝 光。亦即如果列方向畫素22排列節距為W(如IOooclk)時, 後續於攝影機構5的畫像處理領域4 3 A的畫素列晝像,例如 第16圖(a)所示,從曝光開始位置、、1〇〇〇〃起4?( = 4〇⑽ )後開始。於是自記憶部20讀出之曝光開始位置 ''ΙΟΟΟ"與曝光終了位置、、49 0 (T之間的、、39 0 (T CLK時 巧進行曝光後’以相同之曝光控制(例如曝光時間、、3 9 〇 〇 )適用於自曝光開始位置M〇〇(T起挿後之領域(被 =印之畫素列畫像領域43Β),就如第16圖(b)所示、,對德 ’於攝影機構5之畫像處理領域43A的畫素列,亦 •全mr4。再者,反覆實行同樣操作心工 ,,此依照第二發明,可將攝影機構5所取得畫素 象设印於後續之畫像缺落領域而製成畫素 ’、旦 乂成的畫素列畫像曝光,因而對該攝影機構5未能取;領所200535453 V. Description of the invention (19) The image data of column L 1 is compared with that shown in Fig. 5 using LUT for the exposure start position and LUT for the end position of exposure. Therefore, for example, the exposure start position is set at the top corner of the first pixel 2 2 1, and the end position of the exposure is set at the upper right corner of the fourth day pixel 2 2 4. CCD element address, such as M00CT and M00 (T is stored in the memory section 20) On the other hand, if the pixels 22 are arranged in a sufficient direction, that is, in this column direction, the image of the pixel column obtained by the photography agency 5 is copied in the subsequent In the field of the daytime image processing area 4 3 A of this photography 1. institution 5, the daytime sequence day image that the photography institution 5 cannot obtain is complemented, and exposure is performed based on the complemented daytime image of the pixel sequence. That is, if the pixel pitch in the column direction 22 is W (such as 10 ooclk), the day-to-day image of the pixel row subsequent to the image processing area 4 3 A of the photographing mechanism 5 is shown in FIG. 16 (a). Start position, 4? (= 4〇) from 1000. The exposure start position `` ΙΟΟΟ " read from the memory section 20 and the end of exposure, 49 0 (T, , 39 0 (after exposure at T CLK, 'the same exposure control (for example, exposure time, 3 9 〇 〇) Applicable to the field from the exposure start position 〇〇 (T from the field after the insertion (being printed in the pixel image field 43B), as shown in Figure 16 (b), for Germany 'in the photography agency 5 The pixel sequence of 43A in the image processing field is also full mr4. Furthermore, the same operation is repeatedly performed. According to the second invention, the pixel image obtained by the photography agency 5 can be printed on the subsequent image. The field is made of pixels, and the image sequence of the pixels is exposed, so the photography agency 5 could not obtain it;

第23頁 ZUU^35453 五、發明說明(20) 域之畫素列’亦可以^ 精度 又’可以減少不必取彳^ ^露既定之機能性圖型。 設置台數’因而抑滅曝光壯思素列全畫像的攝影機構5之 領域43A可以較狹,故可衣置^成本。在此場合,畫像處理 基準位置檢出精度。是以可鬲解析度之攝影機構5,提高 度。 更力°提高曝光圖型之曝光精Page 23 ZUU ^ 35453 V. Description of the invention (20) The pixel array of the domain can also be used with ^ precision and 'can reduce the need to take 彳 ^ ^ to reveal the established functional pattern. The number of installations' therefore suppresses the area 43A of the photographing mechanism 5 of the exposure full-length portrait full-length portrait, which can be narrow, so that it can be installed at a cost. In this case, the image processing reference position detection accuracy. It is possible to increase the resolution with a photographing mechanism 5 capable of providing a high resolution. More effort ° Improve the exposure precision of the exposure pattern

Λ外;在圖1 5中1 I 上方之情形’但亦可配置於=攝影機構5配置於搬運機構4 形成於站台1 8之用以吸著^運機構4之下方。此時由於 f-1等之存在,可能5丨起攝旦彡2,板8之吸著機構及裝設螺 _板8的黑色矩陣21之書素列口時先形成於玻璃基 ^ —柃吋之缺洛。此時與上述情 形同樣,補全攝影機構5所不能取得的晝素列畫像,則對 隱蔽於吸著溝或裝設螺閃旁之畫素列,亦可以&高精度曝露 既定之機能性圖形。 又’上述之第一與第一貫施形態中,照明機構採取背 面照明,但投射照明亦町° 本發明之曝光裝置’並不限定適用於液晶顯示器的彩 色滤光器等大型基板,办可適用於半導體等曝光裝置。Λ outside; the situation above 1 I in FIG. 15 ′, but it can also be arranged at = the photographing mechanism 5 is arranged at the transporting mechanism 4 and is formed below the platform 18 to suck the transporting mechanism 4. At this time, due to the existence of f-1, etc., it is possible that the photon 2 is started. The suction mechanism of the plate 8 and the book element opening of the black matrix 21 equipped with the screw 8 are first formed on the glass substrate. In inches. At this time, as in the above case, to complement the daytime row portraits that cannot be obtained by the photographing mechanism 5, the pixel rows hidden in the suction grooves or next to the screw flash can also & accurately expose the established functionality Graphics. In the above-mentioned first and first embodiments, the illumination mechanism adopts back lighting, but the projection illumination is also used. The exposure device of the present invention is not limited to large substrates such as color filters suitable for liquid crystal displays. Suitable for exposure devices such as semiconductors.

第24頁 200535453 圖式簡單說明 【圖式簡單說明】 第1圖為本發明之曝光裝置實施形態概念圖。 第2圖為說明光開關構成及動作之斜視圖。 第3圖為表示雷射光束掃瞄位置與攝影機構攝影位置 之間關係之說明圖。 第4圖為表示晝像處理部内部構成中處理系統前半部 之方塊圖。 • 第5圖為表示畫像處理部内部構成中處理系統後半部 之方塊圖。 第6圖為移動於對雷射光束掃瞄方向正交方向之黑色 ®矩陣與雷射光束掃瞄執跡關係之說明圖。 第7圖為說明利用該曝光裝置的圖型形成方法及順序 之流程圖。 第8圖為表示2值化環狀緩衝記憶體的輸出之狀態之說 明圖。 第9圖為表示預先設定於黑色矩陣畫素的曝光開始位 置晝像與其觀察台之說明圖。 第1 0圖為表示預先設定於黑色矩陣晝素的基準位置與 攝影機構元件間關係之說明圖。 φ 第1 1圖為表示排除存在於黑色矩陣畫素内的缺陷畫像 之狀態說明圖。 . 第1 2圖為表示預先設定於黑色矩陣晝素的曝光開始位 置晝像與其觀察台之說明圖。 第13圖為表示檢出在玻璃基板搬運方向上的畫素曝光Page 24 200535453 Brief description of drawings [Simplified description of drawings] Fig. 1 is a conceptual diagram of an embodiment of an exposure device of the present invention. Fig. 2 is a perspective view illustrating the structure and operation of the optical switch. Fig. 3 is an explanatory diagram showing the relationship between the laser beam scanning position and the photographing position of the camera. Fig. 4 is a block diagram showing the first half of the processing system in the internal configuration of the day image processing section. • Figure 5 is a block diagram showing the second half of the processing system in the internal configuration of the image processing section. Figure 6 is an explanatory diagram of the relationship between the black ® matrix moving in the direction orthogonal to the laser beam scanning direction and the laser beam scanning performance. Fig. 7 is a flowchart illustrating a pattern forming method and procedure using the exposure apparatus. Fig. 8 is an explanatory diagram showing a state of an output of a binary ring buffer memory. Fig. 9 is an explanatory diagram showing a day image and an observation table of an exposure start position set in advance in a black matrix pixel. Fig. 10 is an explanatory diagram showing a relationship between a reference position set in advance in the black matrix and a photographic mechanism element. φ Fig. 11 is an explanatory diagram showing a state in which a defect image existing in a black matrix pixel is excluded. Fig. 12 is an explanatory diagram showing a day image and an observation table of an exposure start position set in advance on a black matrix day element. Figure 13 shows the pixel exposure detected in the glass substrate transport direction

第25頁 200535453 圖式簡單說明 位置之狀態說明圖。 第1 4圖為表示修正雷射光束掃瞄位置狀態之說明圖。 第1 5圖為第二發明之曝光裝置實施形態說明圖。 第1 6圖為表示製成所缺落黑色矩陣晝素列畫像並予曝 光的狀態說明圖。 【主要元件符號說明】 1 :曝光裝置 2 :雷射光源 3 :曝光光學系 4 :搬運機構 5 :攝影機構 6 :背面照射機構 * 7 :光學控制機構 8 :玻璃基板 9 ·.光開關 1 0 :偏光機構 1 1 :第一鏡子 1 2 :多角鏡 1 3 : f (9透鏡 1 4 :第二鏡子 1 5 A ·.第一偏光元件 1 5 C :第二偏光元件 1 6 :電氣光學調變器 1 7 :行傳感器 1 8 :站台 1 9 :搬運滾輪 2 0 :搬運驅動部 2 1 :黑色矩陣 2 2 :晝素 2 3 :光源驅動部 φ 2 4 :光開關控制器 2 5 A :光偏向機構驅動部 2 5 B :多角型驅動部 2 6 :搬運控制器 2 7 :背面光控制器 2 8 : A/ D變換部 2 9 :畫像處理部 3 0 :記憶部 3 1 ·.調變數據製成處理部 3 2 :控制部P.25 200535453 Brief description of the drawing Fig. 14 is an explanatory diagram showing the state of the laser beam scanning position correction. FIG. 15 is an explanatory view of an embodiment of an exposure apparatus according to the second invention. Fig. 16 is an explanatory view showing a state in which a missing black matrix day image column image is made and exposed. [Description of main component symbols] 1: exposure device 2: laser light source 3: exposure optical system 4: conveying mechanism 5: photographing mechanism 6: back-illuminating mechanism * 7: optical control mechanism 8: glass substrate 9 · light switch 1 0 : Polarizing mechanism 1 1: First mirror 1 2: Polygon mirror 1 3: f (9 lens 1 4: Second mirror 1 5 A ·. First polarizing element 1 5 C: Second polarizing element 16: Electrical optical adjustment Inverter 17: Row sensor 18: Platform 19: Carousel 2 0: Carrying drive unit 2 1: Black matrix 2 2: Daylight unit 2 3: Light source drive unit φ 2 4: Optical switch controller 2 5 A: Light deflection mechanism drive unit 2 5 B: Polygon drive unit 2 6: Carrying controller 2 7: Back light controller 2 8: A / D conversion unit 2 9: Image processing unit 3 0: Memory unit 3 1 Variable data creation processing unit 3 2: control unit

第26頁 200535453 圖式簡單說明 3 5 :比較回路 3 3A,33B,3 3C :環狀緩衝記憶體 34A,34B,34C :行緩衝記憶體 3 6 :曝光開始位置判定回路 3 7 :曝光終了位置判定回路 3 8 A :計數回路 3 9 A :比較回路 3 8 B :計數回路 3 9 B :比較回路 4 0 :先前畫素計數回路 2 2a :掃描開始畫素 2 2 b :掃描終了畫素 4 2 :缺陷 ❿Page 26 200535453 Brief description of the diagram 3 5: Comparison circuit 3 3A, 33B, 3 3C: Ring buffer memory 34A, 34B, 34C: Line buffer memory 3 6: Exposure start position determination circuit 3 7: Exposure end position Decision circuit 3 8 A: Counting circuit 3 9 A: Comparison circuit 3 8 B: Counting circuit 3 9 B: Comparison circuit 4 0: Previous pixel counting circuit 2 2a: Scanning start pixel 2 2 b: Scanning end pixel 4 2: Defect ❿

第27頁Page 27

Claims (1)

200535453 六、申請專利範圍 1 . 一種曝光裝置,係以曝光光學系所照射的光束相對 掃描於與被曝光體移動方向成正交的方向,而在該被曝光 體上以既定節距曝露機能性圖型者,包含: 用於攝取預先形成於該被曝光體上做為基準曝光位置 的基準機能性圖型之攝影機構;及 用以對該攝影機構所取得該基準機能性圖型的晝像數 據進行既定畫像處理,排除對應於該光束掃描領域的基準 機能性圖型畫像的缺陷,以製成無缺陷的基準機能性圖型 晝像,在該無缺陷基準機能性圖型晝像上檢出曝光開始或 _终了之基準位置,並以該基準位置為基準來控制該光束的 P照射開始或照射停止之光學系控制機構。 2. 如申請專利範圍第1項之曝光裝置,其中所述光學 系控制機構,係利用該攝影機構所取得基準機能性圖型中 之兩個畫像數據,以擇取各畫像數據之論理和,而製成該 無缺陷基準機能性圖型畫像者。 3. 如申請專利範圍第2項之曝光裝置,其中所述光學 系控制機構,係利用該攝影機構所取得前一個基準機能性 圖型畫像數據與新取得的基準機能性圖型畫像數據,取得 位於該被曝光體移動方向前後而互相同位置的各畫素數據 #理和,以製成無缺陷基準機能性圖型畫像。 4. 如申請專利範圍第2項之曝光裝置,其中所述光學 系控制機構,係利用該攝影機構所取得基準機能性圖型畫 像數據中相鄰之基準機能性圖型畫像數據,取得各晝像數 據之論理和,而製成無缺陷基準機能性圖型畫像。200535453 VI. Application for Patent Scope 1. An exposure device that scans the light beam irradiated by the exposure optics in a direction orthogonal to the moving direction of the object to be exposed, and exposes the function of the object at a predetermined pitch on the object to be exposed. The patterner includes: a photographing mechanism for capturing a reference functional pattern previously formed on the subject as a reference exposure position; and a day image of the reference functional pattern obtained by the photographing mechanism. The data is subjected to a predetermined image processing to eliminate defects in the reference functional pattern portrait corresponding to the beam scanning field, to create a non-defective reference functional pattern day image, and inspect the non-defective reference functional pattern day image. An optical system control mechanism that outputs a reference position at which exposure starts or ends, and uses the reference position as a reference to control the start or stop of P irradiation of the light beam. 2. For the exposure device according to item 1 of the scope of patent application, wherein the optical system control mechanism uses two portrait data in the reference functional pattern obtained by the photography agency to select the theoretical sum of each portrait data, The person making the defect-free reference functional pattern portrait. 3. For the exposure device according to item 2 of the scope of patent application, wherein the optical system control mechanism uses the previous reference functional pattern image data obtained by the photographing mechanism and the newly obtained reference functional pattern image data to obtain The pixel data located at the same position before and after the moving direction of the object to be exposed are combined to form a defect-free reference functional pattern portrait. 4. For the exposure device according to item 2 of the patent application scope, wherein the optical system control mechanism uses adjacent reference functional pattern image data among the reference functional pattern image data obtained by the photographing mechanism to obtain each day Like the theory of data, and make a defect-free reference functional figure portrait. 第28頁 200535453 六、申請專利範圍 5 . —種曝光裝置,將曝光光學系所照射的光束相對 掃瞄於與被曝光體移動方向成正交的方向,而在該被曝光 體上以既定節距曝錄機能性圖型者,包含: 用以攝取預先形成於該被曝光體上做為基準曝光位置 的基準機能性圖型之攝影機構;及 用以把該攝影機構所取得既定領域中該基準機能性圖 型之畫像數據,複印於該既定領域的後續領域,而補全以 該攝影機構未能取得的基準機能性圖型晝像,在該補全之 』_基準機能性圖型畫像上檢出曝光開始後終了之基準位置, 並以該基準位置來控制該光束的照射開始或照射停止。Page 28 200535453 VI. Application for Patent Scope 5. — An exposure device that relatively scans the light beam irradiated by the exposure optics in a direction orthogonal to the moving direction of the object to be exposed, and uses the predetermined section on the object to be exposed. The distance recording function pattern includes: a photographing mechanism for taking a reference functional pattern formed in advance on the object to be used as a reference exposure position; and a photographing mechanism for taking the photographic mechanism in a given field. The reference functional pattern image data is copied in the subsequent fields of the established field, and the reference functional pattern day image that is not obtained by the photography agency is supplemented. In the complement, the reference functional pattern image A reference position that ends after exposure starts is detected, and the irradiation start or stop of the beam is controlled by the reference position. 第29頁Page 29
TW094113749A 2004-04-28 2005-04-28 Exposing apparatus TWI347450B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004134443A JP4253708B2 (en) 2004-04-28 2004-04-28 Exposure equipment

Publications (2)

Publication Number Publication Date
TW200535453A true TW200535453A (en) 2005-11-01
TWI347450B TWI347450B (en) 2011-08-21

Family

ID=35241832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113749A TWI347450B (en) 2004-04-28 2005-04-28 Exposing apparatus

Country Status (5)

Country Link
JP (1) JP4253708B2 (en)
KR (1) KR101103155B1 (en)
CN (2) CN101846889B (en)
TW (1) TWI347450B (en)
WO (1) WO2005106596A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101002156B1 (en) 2008-03-31 2010-12-17 다이니폰 스크린 세이조우 가부시키가이샤 Pattern Writing Apparatus and Pattern Writing Method
KR102065012B1 (en) * 2016-07-26 2020-01-10 에이피시스템 주식회사 Laser Processing Apparatus And Method
JP6917727B2 (en) * 2017-02-15 2021-08-11 株式会社ディスコ Laser processing equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010730A (en) * 1983-06-30 1985-01-19 Toshiba Corp Positioning method of semiconductor wafer
JP2551049B2 (en) * 1987-11-10 1996-11-06 株式会社ニコン Alignment device
JP2797506B2 (en) * 1989-08-31 1998-09-17 凸版印刷株式会社 Exposure equipment
JPH03201454A (en) * 1989-12-28 1991-09-03 Fujitsu Ltd Aligning method for semiconductor device
JP2004012903A (en) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd Aligner

Also Published As

Publication number Publication date
KR20070001252A (en) 2007-01-03
JP4253708B2 (en) 2009-04-15
KR101103155B1 (en) 2012-01-04
CN101846889A (en) 2010-09-29
CN101846889B (en) 2012-05-09
WO2005106596A1 (en) 2005-11-10
JP2005317800A (en) 2005-11-10
TWI347450B (en) 2011-08-21
CN1947069A (en) 2007-04-11
CN1947069B (en) 2010-09-29

Similar Documents

Publication Publication Date Title
US7812920B2 (en) Production method of substrate for liquid crystal display using image-capturing and reference position detection at corner of pixel present in TFT substrate
TWI397776B (en) Exposing apparatus
JPH01202607A (en) Detection of difference for repeated fine pattern
TW201109645A (en) Substrate inspecting method, substrate inspecting device and storage medium
TWI475337B (en) Alignment method, alignment apparatus and exposure apparatus
JP2017129629A (en) Pattern inspection device
JP5235061B2 (en) Exposure equipment
TW200844649A (en) Method and apparatus for inspecting a defect in a gray tone mask, method of inspecting a defect in a photo mask, method of producing a gray tone mask, and method of transferring a pattern
TWI394007B (en) Exposing apparatus
US20050099628A1 (en) Mark for position detection, mark identification method, position detection method, exposure method, and positional information detection method
TW200535453A (en) Exposing apparatus
TW201118512A (en) Alignment method, alignment apparatus and exposure apparatus
TWI380134B (en) Exposure pattern forming method
TWI758383B (en) Photographing device, bump inspection device, and photographing method
JP4951036B2 (en) Exposure equipment
JP6879484B2 (en) Image acquisition device, exposure device, and image acquisition method
JP6906823B1 (en) Mask inspection method and mask inspection equipment
JP4235584B2 (en) Exposure apparatus and pattern forming method
JP4195413B2 (en) Exposure apparatus and pattern forming method
JP4613098B2 (en) Exposure equipment
JP2006178056A (en) Exposure apparatus
CN117745770A (en) Template generation device, drawing system, template generation method, and storage medium
TWI386762B (en) Apparatus for and method of exposure patterns
JPH04105049A (en) Circuit pattern inspecting device
JPH07234107A (en) Position detecting method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees