TW200533894A - Computer control measuring center - Google Patents

Abstract

This invention disclosed a computer control measuring center including multiple fully modular and functional measuring probes, a common multi-axis motion platform, a common digital image guiding device, and a common data acquisition and processing module. The device under test (DUT) is fixed in the fixture of the said motion platform. According to the desired measuring items, the corresponding required measuring probes are installed into a probe fetching-fixture by a probe-changing-mechanism automatically or manually. The said probe fetching-fixture can rotate in three directions, such as pitch, roll, and yaw. Combining with the said digital image guiding device the probe can align and measure the specific point or area of the DUT. In this way the invention can measure more than one parameter of the DUT, especially the coupling parameters. A wireless communication module can be incorporated helping the measuring data storing into the data acquisition and processing module more conveniently in addition to using a conventional cable connection.

Description

200533894 V. Description of the invention (1) Designated representative map: (1) The designated representative map in this case is: (2). (II) Brief description of the component symbols of this representative diagram: Drawing number Name 210 Three-axis mechanical platform 211 Probe holding device 212 Probe library 213 Common data acquisition system 214 Personal computer

200533894 ------- V. Description of the invention (2) [Technical field to which the invention belongs] Application of equipment 'Using a multi-axis mechanism platform, dynamic or manual: the device of the indexing device and a data acquisition system, Take effect by yourself. The invention greatly shortens the detection time and increases the detection accuracy because the function of sharing a multi-axis platform and the effect 'significantly reduces the area and cost. [Previous technology] Under the vigorous development and continuous progress of the industry, handheld electronic devices, such as handheld devices, portable video cameras, and walkman, do not seek for refinement and miniaturization. That is to say, the smaller the area of the wafer _circuits, components, etc. on the substrate assembly, the better, and one of the key technologies-inspection technology and quality control. In folding positions ...,: the possibility of the coupling of key technologies, k 冋 also increases, which shows that the quality control of detection #M i is bound to become the next mainstream. Does not detect technology and

As shown in Fig. 1, a traditional in-line measuring instrument has a detection plane A 1 ′ ′ a detection probe 112 ′ a data acquisition σ ′ and the object to be measured is placed on the detection platform u. Take measurements first? ： The measured data is transmitted to the data acquisition system 1 1 4 as the iridium term by the value of A M and n n + ^ — transmission line 1 1 3. In practical applications, there are the following disadvantages: (1) can only be used for inspection of a single function 200533894 5. Description of the invention (3) ^^-(2) The instrument covers an area and cannot be used effectively ( 3) It is impossible to make a measurement with a coherent variable. Therefore, the measurement of multiple physical quantities requires multiple measurement instruments with different single functions, which occupies multiple surface areas and increases the purchase cost. As everyone knows, in production technology, the advantage of a cutting machining center is that the workpiece can be completed at one time without having to remove the workbench from the workbench and re-alignment. The accuracy can be greatly increased because it refers to the same reference. In addition, there is no need for multiple beds, all processing uses the same group of] axis platform 'tools placed in the tool magazine, and tool change modules are used to change tools. Based on this, in terms of measurement technology, the present invention proposes the concept of a measurement center machine. Both the mechanical flat table and the data acquisition system can be shared, and only the detector head needs to be replaced to achieve the multi-function of one machine to improve the above problems. . [Summary of the Invention] The main purpose of the present invention is to provide a common multi-axis motion detection to reduce the equipment footprint and increase the use of effective space. 0 Another object of the present invention is to provide a shared data acquisition. The acquired data can be accurately integrated for subsequent integration processing, which can make the measurement of variables. Coupling capability Another object of the present invention is to provide a common shadow or position measurement, which can make the measurement position more accurate, and can perform the measurement of the coherence variable in a specific area. 5 Positioning tool Another object of the present invention is to improve the multi-functionality of the measuring device.

200533894 V. Description of the invention (4) The purpose of multi-purpose machine, reducing the cost of testing equipment. In order for your reviewers to have a better understanding and understanding of the purpose, features and effects of the present invention, it is explained in detail below in conjunction with the following figures: Figure number comparison table Figure number Name

110 Inspection platform 111 Workpiece to be measured 112 Inspection probe 113 Signal transmission line 114 Data acquisition system diagram name 210 — Axis mechanical platform 211 Probe gripping device 212 Probe library 213 Common data retrieval system 214 PC diagram name 310 Measurement Probe 311 Camera lens Page 10 200533894 V. Description of the invention (5) 312 Work piece to be measured 313 Vertical distance between probe and work piece 314 Probe position 315 User-set starting point position 316 Probe position and user-set Horizontal distance from the starting point 317 Vertical distance between the position of the probe and the starting point set by the user Figure No. Name 410 Y-axis linear movement mechanism 411 X-axis linear movement mechanism 412 Z-axis linear movement mechanism 413 Object to be tested platform 414 Servo Motor 415 Probe gripping device Drawing number name 510 Standardized probe 511 Probe gripping mechanism 512 Probe gripping mechanism rotation axis X 513 Rotating the head gripping mechanism FIG axial center Y Number Name Number Name 610 in FIG source 615 second aperture 611 of a diaphragm 616 image receptor «widow

Page 11 200533894

V. Description of the invention (6) 612 Beamsplitter 613 Objective lens 614 Light focusing surface figure name 710 Outer probe 711 Outer probe 712 Inner probe 713 Inner probe 617 618 Light projection on non-confocal surface $ _ Light projection Path and drawing number on the confocal plane 810 CX axis 811 C y axis 812 Place image 813 Wafer position 814 Substrate position 815 Image manipulation 816 Charge coupled drawing number 817 818 Module platform 819 Device 820 Same as 1 〇 821 Card 822 Component (CCD) Name Power Supply Low Distortion No Coaxial Falling Lens Test Wafer Test Substrate Stereo Beamsplitter Group Light Source

The measuring probe is a probe library 212, such as a head, which houses each of the following: the movement of the probe. There is also a 2U gripping device, which can be used for automatic conversion.

Page 12 200533894 V. Description of the invention (7) _ together, and finally by the data acquisition system connection analysis. Because of the integration of the probe head and the test point, the test has the following advantages: (1) The multi-axis platform can be shared; (2) The computer can be shared (as long as the master can); Software replacement means (3) machines can be shared;;:; probe projects that determine the probe library required for visual work · (5) does not take up space; ^ shell project, (6) is particularly suitable for laboratories and research units (7 ) Micro-Electro-Mechanical Systems are particularly suitable, | (8) Coupling II is small and precise; ⑽㈣ software computing technology is measured and integrated (the following will be the measurement center, the hardware specifications, and the same: The description of the wheel: Includes the mechanism platform meter, the probe capture data conversion, the setting of the probe head gripping device, the correction of the device, and the design of the man-machine interface. (I) Integration of the wheel interface: _9 The material transmission interface can use the early RS232, and the data transmission time has also been greatly increased, which can reduce the measurement. USB 2n \, for more accurate data sampling, to achieve a fast and accurate 48 ^^ shirt Gao Chuangan's most popular wheel interface in the market, its speed, hot plug, allow different With wide equipment

Page 13 200533894 V. Description of the invention (8): Connected and working at the same time is USB 2 〇 winning the current reason 'Many new computer peripheral products have slowly become the main (pnnter port), RS-232 interface, Xinji locomotive , Printer, mouse, etc., all of them are very σ i / surface, such as data fi, a- ^ TIQR 9 nyv, production port and "port" has been slowly sent to USB 5 USB interface has become a computer High sex and cheap price. It is better to expand with 4: Ming =; 2: 2. 〇 As the data transmission interface of the probe, the comparison is as follows: The structure is shown in Figure 3, with _ Ηϋ β as the host ^; There are interface circuits in 电路, 、, σ, which can be used for power management and devices, Ϊ:; detection. The next layer can be directly connected to the standard, 2.0 specifications e «lower phase of the valley" probe, such as the probe is a non-standard USB interface twist $ / USB / Serial or USB / IDE interface conversion circuit for funding /-S ^ Conversion to achieve a unified interface. In the future, if a wireless transmission interface (Wireless) is used for sensing, such as 1EEE802 · 11G, μ # 02 · 15 · 3, etc., the probe can reduce the problem of wiring, and the popularity of the present invention will be further improved.夂 (2) Correct the data captured by the probe:

There are two sets of information obtained by the computer through the transmission interface, one is the position coordinate value of the mechanical platform = ^ return, and the other is the acquisition data of the probe. The two sets of data are obtained by independent operating systems. Only after the data obtained by the group are corrected & corrected, can they become valid data for subsequent analysis. A mathematical formula can be used to illustrate: D (X, y, Z): f (X, y, z, d)

Page 14 200533894 V. Description of the invention (9) -----

D (x, y, z) represents the meridian value of the probe at the mechanical coordinate (x, y, z), which is the last data we want to obtain, and f (X, y, z, d) is. Once the function is reached, through the calculation of this function, the coordinates of the machine can be returned and the mathematics and the probe's return value d can be integrated and corrected to obtain the required 欵 Z) (x'y, z), and The correction content of the function is as follows: 1. Material D (1) Data format correction The measurement value format and unit returned by different probes will be different. The software will modify the unit or format of the returned data so that all 2 = required the same.丨 The old Fuhui data grid (2) sampling frequency correction system for measurement, the computer will read two sets of data, one coordinate value, the other county fork π recognize you } The sampling frequency of Rong needs to be corrected by software. The problem should only occur, so the laser measurement is taken as an example: D (x, y, z) represents stupid _ δ. ± + «β Therefore: (x, y, z) coordinate data obtained at a particular time, Retrieval of mechanical coordinates' month * = 1 ~ η; U is the returned sampling value (Xi, yi)]

The laser probe's pick-up, w U When the time is the month and month is ΛT, the returned sample value is dj, j = 1 ~ m. According to the linear internal difference method, the mechanical coordinate corresponding to Yan 'is (Xi, y.) Go, find the corresponding time when the time is σ) Ding Yitian Sheshuo sampling value mountain:

200533894 V. Description of the invention (10) 乂 · = "winter +-heart.)] Χσ where j = int [cr / AT], dj is the j-th sampling value of the laser head, and dj + 1 is the first of the laser head. The (j ^) sampling values G are constants and can be used as unit corrections. The value of D (x, y, z) is (Xi, yi, di) d = l ~ n. (3) Measurement guidance device In the head and the machine, it is often necessary to be able to drill down to a specific position to be measured in advance for a specific position, = dagger, that is, a camera, which can be taken by the camera with a calibration probe = a measurement area. Introduced and installed, the commercially available measurement equipment is less than the actual measurement. The user of the present invention can determine his results and reduce the θ setting, instead of just the approximate position or statistics. Adding microscope: ;; Measure =: reduce the abrasion of the contact probe. Set its focal length and field of view. 1. 1 疋 zoom type, which can be beamed according to the observation range, otherwise the total capacity is usually vertical: 4 Unless the cantilever field can not see the shielding and blocking of the probe bottom 2 to the chuck, so that the lens depends on the surface condition of the three types of cameras. So generally can be proposed (1) side-mounted type: camera &drag; to solve this problem. The axial direction of the n probes separated by a known distance is parallel and provided in the horizontal direction. The image of the observation range, 'circle the circle, and then the system moves the probe to the circled circle_ Page 16 V. Description of the invention (II) The range is scanned and measured. (2) Coaxial: camera and probe and The surface of the object to be measured is separated by an image with the same axial direction and a vertical direction for the observation range. The user uses:, away, the camera is first lifted out, the probe is moved down to the circle: 2 circles, then the system (3) Scanning and measuring the range of the fiber bundle guide and the silly circle k. The camera-like / mirror fiber bundle guide image; the image of the surface of the object to be measured can be said to obtain the detection distortion in real time. Phenomenon, it is necessary to do the follow-up method, but in the example, the measurement guidance method set by a camera is to implement 31 〇 is the position of the measurement probe; η, 1 ′ are shown in Figure 4, among which Body beamsplitters, using wells as a camera, The camera is equipped with an image of the vertical position, that is, the probe wf; the principle of shooting allows the camera to acquire the measured object at the same time. During the measurement, the vertical image and the image of the object to be measured; 3 1 2 is the distance 313 to be known by the camera \ make / The last image is separated from the surface of the hoe and the object to be measured. The user can provide the image of the object to be measured 31 2 and the probe 31 points or range. Figure 5 is $ = mouse in the image of the object to be measured. At the beginning, Figure 5-a is the image obtained by the camera, the center point position, and Figure 5-b A is the position image of the probe, 3 1 4 is the measurement selected by the user of the probe. The image of the surface of the object to be measured, 315 is the image after the five-b overlap, "" position, Figure five-c is the position between Figure five-a and the starting point 315. You can see the probe position 314 and the use After referring to these two distances, the offsets 316 and 317 are set, and the software calculates that ',,,, and will move the camera 3 11 out, and after 3 1 6 and 3 1 7 200533894

The position of the probe is offset by the user when using a collet. After the camera is used, it is expected that the displacement can be finely adjusted. The selected starting point can be used as the probe's self-deflection. The axis can solve this problem. One can surely measure Xiu Shuo 3 1 0 down ^ ^ rK «V JE. 1 5. Use the image guide to change the Guangzheng. When replacing the probe, you need to consider whether the probe has deflection. Use self-alignment. Or move the probe to the microscope for better accuracy. The measurement is corrected, because the present invention does a subsequent measurement of a specific area or position to measure a single displacement probe to do multiple measurements. A data acquisition system is used to integrate the acquired data. When this sharing is used, The image guide and the 'measured position are more accurate, so you can make a coupling variable measurement after the same test'. (4) The hardware specifications of the common mechanical platform 411, the schematic diagram of the mechanical platform, including the X-axis linear moving device moving device 410, the Z-axis linear moving device 412, and the XY ^ linear moving device set up a workpiece placement platform 413, this The platform can be rotated again; there is also a probe head gripping device 4 1 5. One power unit uses four panasonic MSM series 200⑽ without brake pads servo motor 414, fixed frame speed 3000RPM, fixed frame output torque is port 2 1 'feeding motor driver uses panas ο NIC ΜI NAS Series of drivers, output capacity of 200W, AB-based encoder signal output, the maximum undistortion resolution can reach 10,000 divisions. One's bead guide screw adopts SNK products. The screw pitch is 10 mm, so the mechanical resolution of XY2 axis is 1 // m (10mm / 1 0 0 0 0), and the rotation phase resolution is 0.036. Degrees (360 / loooo).

200533894 V. Description of the invention (13) The motion control card is used by Ding A 丁 and W k. The control card of the Institute's EPCI0-6000 series is selected, which contains axis motion control and digital toilets that can be prepared, fed, and slow-moved; The f-type 1/0 power moon dagger can be shifted into a dual-mode nanometer platform, that is, Lixi ", etc ...: Yes. In addition, the degree of use can be increased to the nanometer range to install a piezoelectric actuator. Meter platform, make the system fine (five) the common chuck part =: a is the setting of the common chuck and the standard probe shape = head 1 Bu; packaged into a standard appearance 510, modularized to match the test component itself Restriction 'is also the probe head and probe fixture ^ 1 or Λ method, a standard detection probe shape 510 is designed. The figure shows a hoe fixture with two axial degrees of freedom 512, 513, the fixture and The detection probe is connected by the way of sliding grooves. Figure 7_b is the schematic diagram after the connection. [Embodiment] The standardized mechanical platform with various types of sensors or measuring elements can make this measuring device more Prototyping, multi-functional, more flexible. The following will propose various practical The case of the first embodiment of the present invention is that laser scanning measurement reverse engineering is to reconstruct the 3-D CAD model of the existing workpiece, model or sample through three measurement techniques and CAD / CAM software, and use this method. To

200533894 V. Description of the invention (14) The advantage of tracing back the original design data for modification or non-contact measurement is 2 1 _ To work. It is fast, can measure small or easily deformed ^ artificial point-by-point measurement, measuring the speed of the surface of the body causing damage, _center two forces, will not affect the object, can be used for laser ranging. ^ ^ After being placed on the laser probe body and reflected, the laser beams f and f on the probe are used to measure the distance to the object. With a standardized machine, it can perform single-point tracing and area scanning measurement. Structure: Displacement is used for line scanning ^ m. Results of line scanning for electroplated ceramic materials, "Not earlier than mm, NAIS u = Grade laser mae, gu, J 7 ο η, Jiuli Limei head sigh (3B original / skin length 78_, highest resolution of the probe [Example 2 of the present invention] Ultrasonic scanning detection (C — Scan) Ultrasonic detection It uses the high-frequency vibration of sound waves to introduce into the material. 2: Non-destructive detection method for measuring the surface or internal defects of the material. This inspection can be used to measure the thickness of the test piece in addition to 2 to detect defects. The penetrability difference or the change in sound velocity is %%. It is used to analyze the physical properties, grain size, or microstructure of materials, and it is very valuable for scientific research. In addition, because the ultrasonic detection system uses the principle of high-frequency vibration of sound waves, as long as the sound waves The energy can completely penetrate the thickness of the test object, and it can detect both non-metallic and non-metallic test pieces. This feature makes it more widely used in non-destructive detection methods. The ultrasonic frequency is about 0.5MHz to 25MHz. , And especially in

200533894 _ _ 5. Description of the invention (15) 1MHz to 5MHz is most commonly used. When these piezoelectric materials are applied with a positive-negative alternating voltage signal: the phenomenon of shrinkage of the crystal thin film when it is crystallized, so the film will form a thick and thin wave that is transmitted into the detection object, if it touches the ultrasonic wave . When the supersonic wave is positively and negatively altered at this time, the super-f-pulse wave will be reflected back, and will be subject to the compressive force of the positive and negative alternation. The greater the compressive force is 2; Lei Xian, who is compressing // ^, _ The greater the voltage generated on the two sides of the solar panel, this voltage signal is detected by the detector J Yawang Yuxian Qian crying as Ru Li, Shi ^ θ After the paper circuit is enlarged and enlarged, it appears to be unchangeable. Ultrasonic signal display and table (1) A-can · There are two types of stone type. This is the most common method for ultrasonic detection, type a ultrasonic detection. The probe is on the detection object-2: The path length of the echo wave or the echo of the sound wave. The position of the echo reflector is calculated by using the indication signal when it appears. The length of the vertical axis and the direction of the sound beam can be used to estimate the size of the defect. Ten times, with a high signal (2) B-scan: The message along the green section of the probe on the test object. The horizontal display J = U records the lower part of this line-the display indicates the passing field in the test object: the position of the multi-movement direction 'and the vertical display of the test object-on the cross section = 丄: the depth of the defect, so the B scan 丨 (3 ) C-scan: The general situation of the defect distribution. Cai Zhutou stepped on the surface of the test object below this surface-a whole message from the end = the entire surface is recorded, and the recorded is ~ 'This method of display and radiographic results Page 21 200533894 V. Outline of the invention (16) " '--Similar' can see the distribution and shape of the defects, but can't know the depth of standing. The ultrasonic probe is placed in the probe library of the measurement center machine, and the ultrasonic signal processor is used, for example, using an ultrasonic detector (Kraut Kramer, Germany, UjIP12 host with USH100 high-frequency amplifier) for ultrasonic measurement. Equipped with a common mechanical platform to make the plane of the object to be measured move, you can use ultrasonic A-SCan, B-scan and C-scan functions. [Embodiment 3 of the present invention] Three-dimensional measurement selection instrument: There are many types of probes. Depending on the occasion, cylindrical and 10,000 = mechanical probes. Common probes include spherical, cone, direction, and mouth: trigger probes. The characteristic is to detect the needle at any position / to a certain degree-a detection signal. The advantages of contact measurement are: 卩 Nissan precision, highly suitable for size measurement and product inspection. ) Can measure curved and rounded objects. (3) The cost is low. U Bendan picks up data from many features of the object under test. Head, for example: the probe of the central machine, the triggering of the detection probe placed in the three-dimensional measurement can be generated in the ancient wood, the primary measurement signal, and the measurement force of the same size is transmitted at the production point. Go to the computer for calculations. Then ’and the resulting τ ran through speculative mechanism platform and electricity

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It can achieve flatness, straightness, roundness, curved surfaces, etc. [The focal planes of the car can not use the general light. The point image outside the aperture can provide point brain data processing and measurement. The fourth embodiment of the invention] Image scanning (Confocal iamging Pr0filer) The images observed under a general microscope all come from the focal plane and non-convergent images. Therefore, the quality of the provided image is poor and the analysis is fuzzy. Microscopic observation. Conjugate focal microscopy technology collects images formed by the focus surface of the sample through the optical pinhole and excludes light that is not on the same focus surface from the optical pinhole. Therefore, the image formed is only the focus surface.The image is called conjugate focus (confocal image), which removes the higher optical resolution of the traditional microscope image, and provides better axial and side spread functions (Figure 9). The path of the light source hitting the focusing surface is shown by the solid black line 618 in the figure, 610 is the light source, passes through the first aperture (source pinhole) 611, and passes through a dichróic mirrór 612 after splitting light. Projected in the direction of the objective lens 6 1 3, the objective lens 6 1 3 focuses the light so that the focus falls on the focusing surface 614, and is reflected by the aperture 615 and then received by the image receiver 616. The dotted line 617 in the figure indicates that the light is projected on The path of the non-confocal plane, the reflected image will be blocked by the aperture 615, and the image will not be received by the image receiver 6 1 6. 6 1 8 is the path of light projected on the confocal plane. The reflected light after it is projected onto the object will pass through the aperture 6 丨 5, and will be transmitted by the shadow receiver.

6 1 6 reception, so the observer will only get the image of the object on the confocal plane.

Page 23 200533894 Description of the invention (18) Common light focus (C ο nf 〇ca 1) detection technology can also be applied to the measurement center machine, the detection head is placed on the device to clamp the detection head, the detection object is placed on the χγ platform , Use the probe to take the image, change the height of the Z axis one by one, change the image one time at a time, similar to the concept of tomography, and then reorganize the image to establish analysis. [Embodiment 5 of the present invention] The four-point probe is electrically measured in a micro-electromechanical system, and the resistivity is an index of the defect of the finished product. The carrier mobility and temperature and crystal defect density in the iit body are related to the resistivity. Become an important indicator of inspection. Four-point probe: The basic principle of the test is to use the Hall effect to perform the I test, which can be used to determine the carrier's method. Power is still low. The Hall effect amount: the basic principle: when a current flows through an applied magnetic field to generate a lateral force on the moving charge carrier, the magnetic field is generated, and the-side, and when the positive and negative charges accumulated on both sides: the more it is pushed to the body Slab conductors occur most often. This phenomenon can be attributed to the Hall effect. The phenomenon of measuring the lateral potential is called that the four-point probe contains four linear arrays and the material is measured, and these probes will contact the probes. Show at. The known current I flows through the two outer sides: the wide surface: the open voltage of the two probes 712 and 713 ν = the pins 71o and 7η, and the inner side is obtained through measurement. Ideal 200533894

V. Description of the invention (19) =-The voltage measurement will not affect the original current I, and Γ is large and the distance between the probes is equal to s. This is the resistivity of the sample to be measured in a semi-infinite volume. : Phases are designed for S = 2 π sV / i four-point probes used to drop Putian probes and moving objects; Under the =:-: 3 platform ==: see: the next measurement == two: with :: ask, both depend on the detection object, and up and down Jiang Qinyang people can control from m The correction is made in the software. The up and down movement of the probe is combined with the four-point probe measurement in which the test object is placed. Mouth, shift, can achieve a fully automatic [the accuracy of the surface roughness of the present invention to scan the object probe characteristics is limited by the conductor sensing signal produced by the test, the probe can be cropped Example 6] ^ alpha_step pr0fumeter) to determine the scanning area of all the tips of the prepared tip probe and use a needle tip motion to produce a path traced by the platform, and measure. < 1 ^ = The surface contour used to measure the object, and the surface roughness meter is made of diamond. Phase t: Widely obtain the information of the surface contour. versus . 22: The interaction between the probe and the scanned object No. 2 Shu T 2's movement trajectory across the surface of the object. The vertical movement of the needle tip was recorded. The object to be measured can be displayed via ’m. Knowing that the object to be measured is placed U 疋 on the sound of a fixed object: Also, the software is used to plan the scan accuracy summer measurement or the amount of surface features.

200533894

[Seventh embodiment of the present invention] The concept of combining and placing wafers' achieves cutting, gluing, singulating, and assembling work from a wafer fab. But before and after the packaging factory, it can be sent to the point where the wafer is' for accurate fixation. Sometimes, the precise part of the crystal is required to align the opaque object. The mechanical part and the Cy axis 811 are used. The flat nose is the measurement technology. It is a link, but it is also a complete integrated circuit that uses chip placement without additional modules and a common platform, which needs to be sent to a packaging and testing factory for crystal dejunction, power ore, and bent leg molding. The wafer only needs to be sent to the packaging factory for testing and dicing. Because the wafer is opaque and convex, the precision alignment work is performed. Finally, the wafer is sent to the reflow furnace for micro-electromechanical packaging technology. (Face-to-Face) With flip chip technology, in order to make this system work as an extraction system, as shown in Fig. 11, an additional platform 812,814 of Cx axis 8 10 group is added as a putting device. After the chip is placed and the circuit is finished, the final test of the wafer, wire, sealant, and slag is sent to the user. The flip-chip technology does not need to be so large to directly make bumps and wait for the user. When it is mounted, it is underneath, so it is necessary to place the wafer on the substrate specifically to complete the nose. In addition, the circle-to-wafer wafers are face to face, so the alignment method required is similar. Yes, in addition to the original common mechanism, the hardware part is also equipped with an imaging mold table. 8 1 3 is used as the wafer fetch-added image group, as shown in Figure 12, which contains 1 / 2-inch, e-element (CCD) 8 1 6. Low-distortion non-coaxial lens-type lens with double optical magnification 818, stereo beam splitter group 82, image capture card 815, self-made

Page 26 200533894 V. Description of the invention (21) ------- Light source 822 and CCD power supply 817; software part, using isual Basic as software development platform, and using MIL image processing functions Library for image processing. Adding this image to a standardized mechanical platform, the system 'can be used for combination of penetrating alignment and non-penetrating alignment. Therefore, a more difficult non-penetrating alignment combination is proposed in the example. Methods such as non-penetrating alignment are possible, in other words penetrating alignment is also possible.

There are many ways to align the wafer, and the additional imaging module can simultaneously take up and down images. Using this feature, an intuitive and fast alignment method is proposed. 'As shown in Figure 12, the device of the stereo spectroscope The 821 is placed between the wafer 819 and the substrate 8 2 0 to be aligned. At this time, the image of the bottom of the wafer 819 and the image of the substrate 820 can be obtained at the charge combining device (CCD) 8 丨 6 at the same time, and the correlation comparison adjustment is performed. After the CCD lens is removed, the wafer can be placed. The test piece of this experiment is shown in Figure 13. The left side of the figure is an opaque wafer. A black solder ball is made on the surface of the wafer. The diameter of the solder ball is 200βm. The distance between the solder balls is 500 / zm. The glass has white solder pads on the glass surface, and the diameter of the pad is 300 // m. The welding pad pitch is 500 // m. After the wafer is aligned, it is placed on the glass and then bonded. After flipping over, the alignment result is shown in Figure 14. It can be seen that the white solder pads on the glass completely cover the black solder balls underneath. It can be seen that the result of the alignment is correct. 1. Human-machine interface design: The human-machine interface design of the measurement center machine mainly includes the following parts (1) Setting of mechanical parameters ·· Setting the parameters of the common mechanical platform, such as operation

200533894 V. Description of the invention (22) Selection of moving coordinates, motor switch setting, mechanism return setting, safety factor setting, limit storage as an ini file, listen to ^ point mode settings, etc .; you can set the settings New parameter settings. ——— You can load this ini file when you turn on the machine, and you do n’t need to weigh C 2) 3 probe parameters are measured, and each set of probes uses a variety of measurement probe menu interfaces, so the group probe parameters are not bad, so This design-the parameters of the pull-down probe; π will be the household menu, and different doors can be set in the menu. 0. Christine .. Most of them are saved as an ini file, and the next time you boot, load this lni file. Yes, no need to reset. The following (3) software update: when it is a type of probe, there must be a new driver to make a 'Lead when you set a new setting option, control dr ::; need to enter: phase upgrade of a probe After the program is executed, the software can be provided-the software is very flexible, and it is easy to use the new "for measurement," the system becomes the yo data management part: after taking it in the probe field, it can be displayed in real time The window is for user's reference, and can also be stored in the second place to facilitate the comparison of data; it can also be used for file creation. Π 付 贝 枓 for printing

Use) control part: that is, the planning of the measurement trip, the planning of the movement path of the machine, the moving speed, etc., which are the schedule planning including the selection of the probes.

The energy meter is mainly divided into file management. Figure 15 ~ b is the shared machine. Figure 15-a is the function, parameter setting, and software update of the system man-machine interface.

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V. Description of the invention (23) The control interface of the platform has a linear movement. Five-c 疋 is the control interface of the hoe, which is a measurement parameter of the probe. , Origin return and other functions; Figure ten menu mode, you can set the software individually? Process ·· The software usage process is as follows: (1) Set the parameter settings in a month: that is, the season, can not carry the previously recorded parameter setting value A master parameter settings, etc., or the measurement path planning: the detection of the institutional platform The selection of the head is completed here; that is, the schedule is ^ — the speed of movement is strict, the head must be used for the origin return and the calibration steps of the probe, and the opening of the schedule (3) starts to execute the previously planned measurement steps. When the red light is extended, the system will first perform the steps of origin return and probe calibration (take correction parameters) to ensure the accuracy of the measured value. f (4) data processing of the head. This is the internal operation of the software. It is the data acquired by ^, which is used to convert the type of the data. It also establishes the correlation with fetching and obtaining the probe. The coordinates of the Is mechanism after processing. The needle is displayed in the window (5) Data management: It can be used for data archiving and printing.

200533894 V. Description of the invention (24) ΗΠ Page 30 200533894 The diagram briefly illustrates the conventional testing equipment used in a conventional multi-axis platform and a data acquisition system. Figure 2. Schematic diagram of the measuring center of the present invention. Contains a common detection platform, a common data acquisition device and multiple sets of measurement probes. Figure 3. Schematic diagram of the probe transmission interface integration of the invention. Figure 4. Schematic diagram of the image guidance device of the invention. The image obtained by the device. Figure 6. Schematic diagram of the common mechanical platform of the present invention. Figure 7. Schematic diagram of the probe fixture and standard probe of the present invention. Figure 8. Reconstruction results of the laser scanning surface of the present invention. The conventional four-point probe measurement diagram. Figure 11. Schematic diagram of the wafer pick-and-place alignment machine of the present invention. Figure 12. Schematic diagram of the camera module of the wafer pick-and-place machine of the present invention. Figure 14 The result of the wafer picking and placing of the present invention Figure 15 The human-machine interface design drawing of the present invention Figure 16 The present invention System flowchart

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Claims (1)

200533894 Six patent application scopes 1. Computer-controlled measurement center—a variety of fully modularized test probes; 疋 ”has a common multi-axis motion platform;-a common digital image guidance device; a common The control system contains a Thunderbolt Fingan, a communication interface, a data acquisition module and processing software; /, peripheral equipment, various principles, which are based on the principle of placing the test object in a so-called shared control system, which is borrowed according to the test item. By tumbling (two clever / shake, (the device of this 2 probes has a pitching device and a leading device) so it can be in any direction of the object to be tested: the image guide is divided into the detection, #this device is used for detection, not only Can: Then? One: The item parameters can be changed in the same position with coupling :: The acquisition of Erxue can be accomplished through the wired or wireless communication interface. In order to import a material, the measurement center as described in item 丨 of the patent application scope ^ and the motion control of the gripping probe are connected by a common controller. The controller contains each axis. Motor driver, as well as bit ^ , And the computer containing the control software. Hometown motion control \ As described in the scope of the patent application, the measurement center machine, the modular detection probe, the standard appearance design can be The design of the mechanism with joint can be groove joint, Chu arbitrary method. The measurement center machine, in which the so-called head returns data, is converted into phase calculation. The measurement center machine, in which the so-called measurement position confirmation, uses the surface image of the object, which can directly field; and the image guidance device can guide the image type. Testing center machine, in which the so-called unified transmission interface of the unified system '1 394 and other arbitrary transmission media 200533894 6. Patent application scope 4, the quantity as described in the patent application scope item 丨 can be read by various modules Different similarity formats are transmitted to the computer for subsequent operation. 5. The amount of image guidance device as described in item 1 of the scope of patent applications is mainly to allow user authors to see the test results through the image guidance device. The area to be measured is set on the image of the object to be measured. Side-mounted, coaxial, or fiber-optic beam guides are used. 6. The quantity communication interface described in item 1 of the patent application scope means that the probe and data acquisition system can use USB. 'Wireless or IEEE surface 0+, as described in the measurement center of the first patent application scope, where the so-called modular detection probe refers to a complete detection head and corresponding signal processing and amplification, and has A measurement device that communicates with the data acquisition system. 8. The measurement center as described in item 1 of the scope of patent application, where the so-called control system for f can share a user software interface and use a dynamic menu to switch the settings of each probe module. 1 S 1 1 I I i 1 1 1 1 page 33