TW200528193A - Processing device for substrate surface - Google Patents

Abstract

The present invention relates to a processing device for substrate surface, which can provide: (1). improving the accuracy during process and the speed of the same; (2). flowing the substrate smoothly under the jet impacting, in this way, the accuracy during process and the speed of the same can also be improved; (3). preventing the problems resulting from carrying. A surface processing device 7, which is in respect to a processing liquid jetted from spraying nozzles 10, is provided with a spraying type L on a way toward to the substrate A and an adjusting mechanism 11 adjusting the area according to the determined width of front and rear sides. Namely, a pair of limiting board 22 having front side and rear side spaces P and oppositely in front and rear can be utilized as the adjusting mechanism 11. Also, arrange the spraying nozzles 10 arranged in front, rear, left, right sides toward left and right with lean, and in front and rear sides there are no overlapping. Besides, concerning to a carrying means 9 which adopting straight roll 12 in upper side and a set of toothed rollers 13 in lower side.

Description

200528193 (1) Description of the invention: (1) Technical field to which the invention belongs The invention relates to a surface treatment device for a base plate. That is, it is a surface treatment device for a base material which sprays a treatment liquid onto a conveyed base material and performs a chemical treatment in a manufacturing process for a circuit board. (2) In the prior art, with the high performance, high performance, small size and light weight of electronic equipment, the substrates for its circuits are also moving towards higher accuracy, thinner, and more diverse. High density and fineness are noticeable. Then, with regard to the manufacturing process of this type of substrate, a surface treatment device is used in each of the procedures, and various processing liquids are sprayed on the substrate material being conveyed, and various chemical treatments are performed on the substrate material.

For example, with regard to the base plate, processing liquids such as a developing solution-etching solution-stripping solution are sequentially ejected, that is, a processing solution such as developing-etching-stripping film is gradually implemented to manufacture a circuit-forming substrate. In addition, for example, regarding the base plate, the impregnation of the electroless copper plating solution-the spraying of the developing solution-the impregnation of the electrolytic copper plating solution-the spraying of the stripping solution are sequentially performed, and the electroless copper plating-developing-electroplating plating is sequentially performed Figures 7 and 8 of the circuit-forming substrate are manufactured after treatment with copper-peeling and other chemicals, which provides a description of a surface treatment device for a base plate of this type of conventional example. Next, Fig. 7 (1) is an explanatory side view of the important part of the example of a completely conical nozzle, and Fig. 7 (2) is an explanatory plan view of the important part. (3) of FIG. 7 is a side view of an important part of an example of a slit nozzle. FIG. 5 (2005) 193 is an explanatory diagram, (4) of FIG. 7 is a plan explanatory diagram of the important part, and (5) of FIG. 7 is the important part. Front explanatory drawing of the part. (1) of FIG. 8 is a side view for explaining, and (2) of FIG. 8 is a plan for explaining. In this type of surface treatment device such as a developing device, an etching device, a peeling device, etc., the base plate A is conveyed in a horizontal posture by the conveying device 2. For the base plate A being conveyed, each of the spray nozzles 3 is disposed oppositely. The processing liquid B is ejected, and the base plate A is processed with the processing liquid B. As the conveying device 2, a linear group 4 of linearly advancing rollers is used, and a group of disks 6 arranged on the rotating shaft 5 at a constant pitch is typically used. Then, such linear rectilinear roller groups 4 and roulette groups 6 are arranged below the base plate A, or on the upper and lower sides, as shown in the figure. The spray nozzle 3 is a completely conical nozzle that sprays the treatment liquid B in a conical shape as shown in FIG. 7 (1) and FIG. 7 (2), as shown in FIG. 7 (3). As shown in (4) in FIG. 7 and (5) in FIG. 7, a slit nozzle for ejecting the treatment liquid B in a thin film form is typically used. Thereafter, as shown in the figure, the spray nozzles 3 are arranged on the substrate substrate a above or on both sides of the substrate a, as shown in FIG. As a conventional example of the surface treatment device 1 for the substrate A, for example, the following Patent Document 1 (refer to the conventional example in FIG. 7), and the Patent Document 2 (refer to FIG. 5, FIG. 6, and FIG. 7) Conventional example), Patent Document 3 (refer to the conventional example in FIG. 5), and the like. [Patent Document 1] Patent Publication No. 3 0 1 0487 [Knowledge Document 2] Patent Publication No. 3479636 [Patent Literature 3] JP 2 0 (H-7 1 4 7 8 9 Publication No. 200528193) In the conventional surface treatment apparatus 1 for substrate A, the following problems are questioned. (First problem)

First, in the surface treatment device 1 of the conventional example, the treatment liquid B sprayed from the spray nozzle 3 is as shown in FIG. 7. First, the denser the pressure is, the higher the pressure is closer to the spray center, and The closer to the outside, the more loose, the lower the pressure of the spray nozzle type C, that is, the spraying of the base plate A with the spray nozzle type C that follows the thick and light, therefore, the impact of the base plate A causes an error. At the same time, when the spray nozzle 3 is a fully conical nozzle as shown in Fig. 7 (1) and Fig. 7 (2), the treatment liquid B is sprayed in a conical or pyramidal shape. The weight of the plate A which is not sprayed is relatively high for the straight-forward roller 4 of the carrying device 2 or when it is sprayed for the wheel disc 6. Then, therefore, the processing impact on the base plate A becomes weak.

In other words, the treatment liquid B is scattered in the forward and backward conveying direction D due to excessive scattering, and the spray type C formed by the treatment liquid B (for example, the front and rear dimensions are 150 mm) will greatly exceed the space E of the conveying device 2. It will greatly exceed the space E (for example, front and rear dimensions 30mm) forming the space E for spraying the treatment liquid B between the straight-forward roller 4 and the disk 6, which is an effective area, causing scattering and waste. On the other hand, the spray nozzle 3 is shown in FIG. (3) In the case of the slit nozzles shown in (4) in FIG. 7 and (5) in FIG. 7, the treatment liquid B is sprayed in a thin film shape and approximately fan-shaped, and is before and after the base plate A. In the conveying direction D, it is sprayed with a relatively thin front and rear width dimension. _8-200528193 In other words, the processing liquid B is a thin horizontal film with a narrow width in the forward and backward conveying direction for the base plate A, and is mainly sprayed in a roughly straight line in the left and right width direction F. After that, The spray type C formed can only partially utilize the space between the front and back, which is the extremely narrow part of the front and back. Therefore, the processing effect on the base plate A will be limited.

In this way, in the conventional surface treatment device 1 of this type, the spray type C of the treatment liquid B sprayed onto the base plate A follows the lightness and darkness, and is scattered in excess and waste because it is not sprayed onto the base plate A. , Forming intermittent weak impacts with narrow width. Therefore, regarding the chemical treatment of the base plate A, for example, there have been problems in development processing, etching processing, peeling processing, processing accuracy, and processing ability, and it has been corrected.

That is to say, the density and miniaturization of the circuit formed as described above are quite significant. The base plate A and its substrate, which hardly tolerate errors, and the base plate A have a slow and uneven processing. Therefore, the width of the formed circuit will be too small and deviations and errors will occur. There is a problem of poor processing accuracy. In the case where the spray nozzle 3 is a slit nozzle, the circuit formed in the left-right width direction F is compared with the circuit formed in the front-rear conveyance direction D. The impact due to the flow of the processing liquid B Too strong, processing too fast and forming too small 'in this regard' the circuit is also prone to errors. In addition, there is a lot of waste of the processing liquid B, a waste of time in processing, etc. There are also problems with the processing speed and processing capacity, and it has been corrected. (Second problem point) -9-200528193 Second, the treatment liquid B sprayed from the spray nozzle 3 to the base plate A flows through the outer surface of the base plate A to the left or right in the width direction F to perform a potion treatment. And then shed from the left and right sides. However, in the case of the surface treatment device 1 of the conventional example, particularly when the spray nozzle 3 is a slit nozzle, the treatment liquid B that is sprayed flows not only in the left-right width direction F but also in the front-rear conveyance direction D. As shown in (8) of FIG. 8, the outer surface of the base plate A has a large amount of remaining on the outer surface of the base plate A after the accumulation liquid G is formed.

In addition, the aforementioned spray nozzles 3 are opposed to each other and are provided at the front, rear, left, and right sides of the base material A being transported. However, the front and rear transport directions D are located with other spray nozzles 3 and the spray center. Arranged overlapping.

In this way, in the surface treatment device 1 of the conventional example, the spraying center of the processing liquid B sprayed from each spray nozzle 3 is covered and overlapped along the conveying direction D, and the front and back conveying directions D flow through the base plate A. On the outer surface, there are many cases where the accumulated liquid G is formed and retained. Therefore, regarding the chemical treatment of the base plate A, for example, in the development processing, etching processing, and film peeling processing, from this aspect, there are problems in terms of processing accuracy and processing ability. That is, regarding the substrate of the base plate A, due to the overlap of the spray center, the forward and backward flow, and the accumulation of the liquid G, the processing is delayed and uneven-and then deviations and errors occur in the width of the formed circuit. There is a problem of poor processing accuracy. At the same time, there is a lot of waste of the processing liquid B, a waste of time in processing, etc. There are also problems in the processing speed and capacity -10- 200528193 (the third problem) Third, the base plate A of this type is as described above, Very thin and soft. In the conventional surface treatment device 1, the aforementioned base plate A 'is transported by the straight-forward roller group 4 and the roulette group 6 of the conveying device 2, and the treatment liquid B is ejected when the treatment liquid B is ejected from the spray nozzle 3. The weight is the cause, which causes trouble in transportation. That is, as shown in FIG. 8 (1) and FIG. 8 (2), the base plate A is prone to bending, corrugation, beryllium folding, bending, waist folding, sagging, and jamming. , Winding, falling, damage, etc. In this way, in the conventional surface treatment device 1, it is easy to cause troubles in transportation. Therefore, from this aspect, the problems of the processing accuracy and processing capacity of the base plate A have also been criticized. That is to say, the trouble of the substrate and the handling of the base plate A is caused by the non-uniformity of the processing. Then the circuit width will produce deviations and errors. At the same time, the waste will increase, and the processing accuracy and processing capacity will also occur. Something went wrong. (3) Summary of the Invention The surface treatment device of the base plate of the present invention has the purpose of solving the conventional problems in view of the foregoing practical problems. Then, the processing liquid 'ejected from the spray nozzle is characterized by being provided with an adjustment mechanism for adjusting the type of spray on the base material. That is to say, it is characterized by the use of a pair of opposing plates with back-to-back spacing. In addition, it is characterized in that the spray nozzles are arranged obliquely to the left and right, and are arranged so as not to overlap each other. Another feature is 200528193, which is a straight-forward roller group above and a toothed roller group below. Therefore, the present invention is to provide, the first, the processing accuracy and the processing capacity are improved, and the second, the sprayed processing liquid does not stay and flow through the base plate to the left and right, and the processing accuracy or the processing capacity is also improved in this respect. Third, to prevent troubles in transportation, in this respect, the purpose is to improve the processing accuracy or the surface treatment device of the base plate. (About each request)

The technology of the present invention that solves the aforementioned problems is as follows. First of all, the item 1 in the scope of patent application is as follows. Regarding the surface treatment device of the base plate applied for the first item of the patent scope, it is used in the manufacturing process of the base plate to perform chemical treatment on the substrate. It is characterized by: a transport device that horizontally transports the base plate; The liquid is sprayed on the base plate being transported; the adjustment mechanism adjusts the spray type of the base plate on the way regarding the processing liquid sprayed from the spray nozzle.

The second item regarding the scope of patent application is as follows. The surface treatment device of the base plate in the second scope of the patent application, in the first scope of the patent application, is characterized in that the adjustment mechanism is provided with a pair of restriction plates facing each other with a front-to-back spacing, and the spray nozzles are plural. It is arranged between the front and back spaces facing the aforementioned limiting plate. Regarding item 3 of the scope of patent application, the surface treatment device of the base plate for item 3 of the scope of patent application is described below. In item 2, the restriction plate of the aforementioned adjustment mechanism is sprayed with the presence of spray from the spray nozzle The processing liquid on the way to the base plate will pass through the above-mentioned space between each other vertically-12- 200528193. At the same time, there is a positional relationship between the contact with the processing liquid sprayed in the front and back direction and reflection and refraction. It is characterized in that the processing liquid is adjusted on the limiting plate of the adjusting mechanism, and the area is adjusted with a predetermined width before and after. It is concentrated in a spray type with little difference in shades and sprayed onto the base plate.

The fourth item regarding the scope of patent application is as follows. The surface treatment device of the base plate in the scope of the patent application item 4, in the scope of the patent application, the base plate is composed of a printed circuit base plate, and the aforementioned treatment liquid is composed of a developing solution, an etching solution, and a stripping solution. In the configuration, the spray nozzle is a completely conical nozzle. It is characterized in that the aforementioned adjusting mechanism is provided with a vertical restricting plate having a right and left length that balances the left and right widths of the base plate, and connecting elements that are respectively connected to the left and right ends of the front and rear restricting plates.

Regarding the item 5 of the scope of patent application, as described below, the surface treatment device for the base plate of the scope of patent application No. 5, in the scope of the scope of patent application, the aforementioned spray nozzles are plural in number relative to the base plate. Permutation settings. In this way, while facing the width direction that intersects the forward and backward conveying directions perpendicularly, it is set as an inclined spray angle; the number of the spray nozzles facing the left and the spray nozzles facing the right are set. It is the same, and each row of spray nozzles facing left or right in this way is provided with the aforementioned adjustment mechanism. It is characterized in that after the treatment liquid is continuously sprayed from the spray nozzle to the left or right, it is sprayed onto the base plate with the spray type adjusted by the adjustment mechanism, and flows through the substrate to the left or right. After the outer surface of the wood is treated with a potion, it flows down from the left and right sides. Regarding item 6 of the scope of patent application, as described below, the application of the surface treatment device for the base plate according to the item 6 of the patent scope 200528193 is characterized in that in the scope of patent application No. 5, spray nozzles, regarding the front and back handling In terms of direction, it is located at a position that is not opposite to other spray nozzles, and its spray centers are arranged so as to deviate from the left and right width directions without overlapping. The seventh aspect of the patent application is as follows. The surface treatment device of the base plate for item 7 in the scope of the patent application, in the item 6 for the scope of the patent application, the base plate is relatively thin and flexible; the handling device is used to carry the base plate up and down to carry it, and it has a level above Straight forward roller group and horizontal lower toothed roller group. The aforementioned straight-forward roller group and the toothed roller group are arranged in a corresponding manner except for the space for spraying the treatment liquid opposite to the spray nozzle. The above-mentioned space has at least the balance of the spray type of the treatment liquid. Area, but as a feature.

Regarding item No. 8 of the patent application, the surface treatment device for the base plate for item No. 8 of the patent application is described below. In item No. 7 of the scope of the patent application, the aforementioned straight-forward roller group is provided with a holding space that holds the aforementioned space and is located in an opposite position A pair of front and rear restriction rollers is characterized by the restriction rollers, which restricts and prevents the sprayed treatment fluid from flowing through the outer surface of the base plate in the subsequent conveying direction. The ninth scope of the patent application is as described below. For the surface treatment device of the base plate in the ninth scope of the patent application, in the eighth scope of the patent application scope, the toothed rollers of the aforementioned toothed wave group are formed by a plurality of recesses and protrusions alternately at the same pitch in the left and right directions. Concave-convex element, which is embedded and fixed on the shaft. In this way, in addition to the space between the front and rear toothed rollers, the recesses and projections are in a non-contact state with a slight gap at the corresponding position, sliding 1 4-200528193 after inserting the rotation overlap, and engaging as feature. (Regarding Action) The present invention is formed as described above, and thus is as described below. (1) This surface treatment device is a substrate treatment process using a substrate manufacturing process. Equipped with a spray nozzle that uses a conveying device and a processing liquid to adjust the spray type.

(2) In addition to the space, the conveying device is provided with a straight-forward roller group and a toothed roller group corresponding to the upper and lower sides. Partition space with at least a spray type area that balances the treatment liquid. (3) The spray nozzles are arranged in a plurality of rows in front, back, left, and right with respect to the base plate, and are arranged at an inclined spray angle while facing the left and right directions. The spray nozzles facing the left and the nozzles facing the right The number of spray nozzle rows is the same, and the aforementioned adjustment mechanism is provided on each row. In addition, the ejection centers in the front-rear direction are arranged so as to be offset without overlapping.

(4) The adjustment mechanism is provided with a limiting plate facing each other, and a plurality of spray nozzles are arranged between the front and back spaces facing the foregoing limiting plate. The restriction plate has the left and right lengths of the left and right widths of the balance base plate. Then, the treatment liquid passes through the back-and-forth interval vertically, and the treatment liquid sprayed in the front-back direction is reflected and bent. In addition, the adjustment mechanism can be easily mounted in a rear-mounted manner. (5) Therefore, after the treatment liquid is continuously sprayed obliquely from the spray nozzle toward the left or right-after the area has been adjusted by the adjusted mechanism, and the spray type is adjusted to the base plate-it flows to the left or right 1 15-200528193 After chemical treatment is performed on the outer surface of the substrate wood—flowing down from the left and right sides (6) Then, from the surface treatment device, although the first and second treatment liquids are sprayed by a completely conical nozzle—by The adjustment mechanism will adjust the area according to the predetermined width before and after-after forming a spray type with no difference in shades, spray it to the base plate. —As a result, for the base plate, a. No gradation is received by spraying, b. The width of the front and back of the compartment space is balanced by the spraying, and c. The width of the front and back is not sprayed. Therefore, from the perspective of the surface treatment device, the potion treatment of the base material is not slow and can be uniformized, and the error in the width of the formed circuit will be relieved. For example, the circuit in the left and right directions will form the same circuit as the circuit in the front and back direction width. In addition, the processing liquid is not wasted, and the processing speed (7) can be increased. Secondly, the spray nozzles are arranged in an oblique manner while facing left and right, and are arranged in an offset from front to back. In addition, the straight-forward roller group of the conveying device further includes a roller group.

Then, the treatment liquid does not flow in the front-back direction of the base plate, no accumulation liquid is formed, and the spray center is not covered. In this surface treatment device, in this respect, the chemical treatment is uniformized to remove the error, which will not cause waste of the treatment liquid, and can improve the treatment speed. (8) Third, as the conveying device, the straight-forward roller group and the toothed roller group are used in combination. Then, even if the base material is extremely thin and flexible, the toothed roller is maintained at the center for the weight and spray pressure of the processing liquid, and is supported without any trouble to carry. 1 16-200528193 This surface treatment device, in this respect, its chemical treatment is uniformized to eliminate the error, which will not cause the waste of the treatment liquid and can improve the treatment speed. (Effects of the Invention) (Features of the Invention) The surface treatment device for the base plate according to the present invention, as described above, is characterized in that the treatment liquid sprayed from the spray nozzle is provided with an adjustment for the base plate. Spray type adjustment mechanism. That is, it is characterized by the use of a restriction plate that faces each other with a back and forth space.

In addition, it is characterized by arranging the spray nozzles facing left and right and obliquely, and arranging them in a non-overlapping manner. The conveying device is characterized by the use of an upper straight roller group and a lower tooth roller group. Then, the surface treatment device for a base material of the present invention can exhibit the following effects. (First effect)

First, the processing accuracy and processing power are improved. That is, in the surface treatment device of the present invention, the treatment liquid sprayed from the spray nozzle is adjusted by the adjustment mechanism according to a predetermined interval before and after, and is concentrated on the spray type with little difference in light and shade to be sprayed onto the base plate. Then, the space between the front and back of the conveying device is balanced, and the space is appropriately distributed and sprayed. Then, as described in the foregoing conventional example, the phenomenon that the pressure becomes denser as it gets closer to the injection center is relieved, and the straight-forward rollers or toothed rollers of the conveying device can be prevented from being sprayed. In addition, it will not cause A narrow film-like spray phenomenon with narrow front and rear widths. Therefore, according to the surface treatment device of the present invention, the base plate and then the substrate are treated with -17-200528193, which can be uniformed without delay, and the deviation and error of the circuit width can be eliminated, thereby improving the processing accuracy. In addition, there is no waste of the processing liquid, and the processing speed is further reduced, and the local looseness and miniaturization of the circuit will become obvious, which is of great significance for a substrate that allows almost no errors. In addition, the aforementioned adjustment mechanism can be easily mounted in a rear position. (Second effect) Second, the sprayed processing liquid stays left and right and flows through the substrate material. From this aspect, the processing accuracy and processing ability can be improved. That is, with the surface treatment device of the present invention, the spray nozzles are arranged side by side and inclined toward φ, and are arranged without overlapping each other. Further, the straight-forward roller group of the conveying device is provided with a limited roller group. Therefore, as in the aforementioned conventional example, the phenomenon that the sprayed treatment liquid flows through the base plate in the forward and backward directions is restricted, the accumulated liquid is also released, and the spraying center does not cause overlap in the spraying direction. Therefore, from the perspective of the surface treatment device of the present invention, the chemical treatment of the base plate and the substrate can be uniformized without delay, and the deviation of the circuit width can be eliminated to improve the accuracy of the treatment. In addition, there is no waste of the processing liquid φ, and the processing speed can be increased. (Third effect) The trouble in the 3 'can be prevented. In this respect, the processing accuracy and the processing capacity are improved. That is, the surface treatment device I 'of the present invention is used as a conveying device, and the straight-forward roller group and the toothed roller group are used in combination. The toothed rollers below the weight of the processing liquid sprayed from the spray nozzle above are fully supported. -18-200528193 Therefore, even if the base material is extremely thin and soft, the surface treatment device of the present invention can prevent the bending, corrugation, wrinkling, bending, Waist folding, sagging, jamming, entanglement, falling, damage, etc. Therefore, from this aspect, the chemical treatment of the base plate and then the substrate can be uniformized, and the deviations and errors of the circuit width can be eliminated, thereby improving the processing accuracy. In addition, the processing liquid is not wasted, and the processing speed can be increased. In this way, all the problems existing in the conventional examples are solved, and the effect exerted by the present invention is significant and considerable. (IV) Implementation method Hereinafter, the surface treatment device of the base plate of the present invention will be described in detail based on the preferred embodiment of the present invention shown in the drawings. Figures 1, 2, 3, 4, 5, 5, and 6 are explanatory diagrams illustrating the preferred embodiment of the present invention. Next, Fig. 1 is a side cross-sectional explanatory view of an important part of the surface treatment device for the base plate material of the present invention, illustrating the best mode for carrying out the present invention. Fig. 2 is an explanatory front sectional view illustrating the best mode for carrying out the present invention. Fig. 3 (omitted from Fig. IV of the adjustment means) is an overall plan view of a spray nozzle illustrating the best mode for carrying out the present invention. Fig. 4 is a plan view illustrating important parts of the best mode for carrying out the present invention. Fig. 4 (1) shows a processing liquid flowing in the left direction, and Fig. 4 (2) shows a processing liquid flowing in the right direction. . (1) of FIG. 5 is a side sectional view of an example of an adjustment mechanism, (5) 200528193 (2) is a side sectional view of another example of an adjustment mechanism, and (3) of FIG. 5 is a spray spray directed to the left A plan sectional view of the nozzle row and the like. (4) in FIG. 5 is a plan sectional view of the spray nozzle row and the like facing to the right. Fig. 6 is a plan cross-sectional view illustrating a toothed roller group according to a preferred embodiment of the present invention. Fig. 9 is a plan explanatory view in which a substrate (base material) is modularized. (About the substrate J) The surface treatment device 7 for the base plate A is a manufacturing process for the base plate J for the circuit K. First, with reference to FIG. 9, the description of the substrate 7 will be described.

The substrate for the circuit K is widely used in various electronic devices, and there are various objects such as a single-layer substrate, a double-layer substrate, and a multilayer substrate (including objects of the recent assembly method). Next, as the aforementioned substrate; [a ring, semiconductor components such as IC, LSI element, passive element, driving element, capacitor, etc., there are a module substrate (a semiconductor package substrate) integrated with the circuit K, and the circuit K A glass substrate embedded with a semiconductor element in a glass body, that is, a glass substrate for a plasma display PDP or a glass substrate for a liquid crystal LCD, CSP, PBGA, and the like. Of course, the “substrate J” in the present invention refers to the aforementioned objects in addition to the conventional printed circuit substrate. Next, the substrate for the aforementioned circuit K [for example, along with the increase in performance, functionality, size, and weight of electronic devices such as mobile phones and cameras, high accuracy, miniaturization, and ultra-thinness and flexibility Towards more layers, diversification, etc., forming the outer surface, that is, the upper surface or the lower surface, or one of the inside or both sides of the circuit K, formed in more-20-200528193 high density of the internal circuit K The miniaturization system is quite remarkable. Substrate; [Aspect is, for example, a printed circuit board, and its length and width are, for example, about 500 mm x 500 mm. In terms of its meat thickness, the thickness of the insulating layer (core component) has continued to be extremely thin from 1.6 mm to 1.0 mm to 60 / zm.

The meat thickness of the K part (copper foil part) of the circuit is extremely thin from 7 5 // ιώ ~ 3 5 // m to the current level of 1 6 // m to 1 0 // πι. Even in the case of a multi-layer substrate, the overall thickness of the meat continued to be extremely thinned to about 1.0 mm to 0.4 m. The width of the circuit K or the space between the circuits K also ranges from 3 0 // m to 1 5 // m to the current 10 β m, which tends to be finer. The substrate is as described above. (Example of Manufacturing Method of Substrate J) Next, a manufacturing method of the substrate J of the surface treatment apparatus 7 used for the base plate A of the present invention will be described with reference to FIGS. 1 and 9. First, the manufacturing method of the first embodiment will be described. In the manufacturing method of the first embodiment, the substrate I, such as a printed circuit board, is manufactured by the following steps.

First, a base plate A of a copper foil laminated board to which copper foil is attached by hot stamping or the like is prepared on the outer surface of an insulating layer (core component) made of glass, ceramic, or sheet resin. . Then, for the prepared base plate A, the surface of the copper foil to be attached is subjected to roughening surface roughening treatment (soft etching), and then cut into short work pieces. Surface treatment has conventionally been performed by mechanical honing, but recently, the number of spraying treatment liquids has increased. Then, in most cases, a hole-cutting process for through-holes is performed using a laser such as -21-200528193. The through-holes are composed of minute through-holes between the two outer surfaces of the substrate A (substrate J). On each piece, hundreds of through-holes with extremely small diameters are formed, and the diameter of the through-holes ranges from 0. 5mm to 0. 2mm. There are many degrees below. Then, the through-hole is used as a conductive connection between the layers K on the two outer surfaces of the circuit K (copper foil) or the circuit κ (copper foil) of the multilayer substrate, and as a component mounted on the circuit K. For installation. Also, "recently" has formed a small protrusion-like, slightly conical-shaped protrusion as a connection point, instead of a through hole that needs to be processed. In terms of multilayer substrates, the protrusion has been developed to achieve the same function as a through hole. technology. The above-mentioned% bumps are manufactured according to the circuit K through a development process, an etching process, and a peeling process.

Then, on the outer surface of the copper foil A (the upper surface, the lower surface, the lower surface, or the inner surface or both sides), a film-shaped photosensitive resist is applied or attached. Then, in contact with the photograph of the negative circuit as the circuit K, the photosensitive resistance of the outer surface will be left by the exposure method, leaving the part of the circuit K that is hardened by the exposure, and the other unnecessary parts are caused by It is sprayed as a developing solution of the processing solution B to be dissolved and removed. Then, the copper foil of the aforementioned base plate A will leave the formation portion of the circuit K covered by the photosensitive resistance hardening, and the portion exposed by the dissolution and removal of the photosensitive resistance of the development will be used as the processing solution B Spray the etchant (copper chloride, ferrous chloride, or other corrosive solution), dissolve, remove and etch.

Next, the remaining K-type photoresistance of the circuit is removed by peeling off the spray of the etching solution as the processing solution B, and the remaining copper circuit forming part of the circuit K-22-200528193 is based on the basic A predetermined circuit K is formed on the outer surface of the plate A (the upper surface is the lower surface or the inner surface or both sides), and then the substrate J is manufactured. Moreover, in the aforementioned development program, uranium engraving program, and peeling program, post-processing is provided, or after the peeling program is combined and post-processed, water washing solution, neutralizing solution, and other cleaning solutions are sprayed. After the washing procedure, the developing solution, etching solution, and peeling solution B attached to the outer surface of the base plate A are washed and removed. The manufacturing method of the first embodiment is constituted by the aforementioned wet manufacturing method. The manufacturing method of the first embodiment is as described above. Next, a manufacturing method of the second embodiment will be described. In the manufacturing method of the substrate j, for example, a printed circuit board, the wet manufacturing method of the first embodiment is representative, and the semi-additive method is mostly used in the 21st embodiment.

Regarding the semi-additive method, firstly, the formation of the through-holes is performed by applying non-electrolytic copper plating on the outer surface of the substrate material A (the upper surface, the lower surface is one of the lower surface, or both). Then, after the non-electrolytic copper is plated with copper, the photosensitive resist is applied as a film, or the film is exposed. -Then, the photoresistive part will be left hardened by exposure, and the other part, that is, the circuit K forming part, will be dissolved and removed by spraying the developing solution as the processing solution B. Then, the -circuit K forms a portion, that is, a copper-plated portion whose photosensitive resistance is dissolved and removed by development, that is, an electrolytic copper plating is applied to the exposed portion of the electroless copper-plated copper to form a circuit K. —Residual— 23- 200528193 The remaining photoresistance of the hardened circuit K forming part is removed by spraying as a stripping solution as the treatment liquid B, and the exposed non-electrolytic copper copper plating is After being etched by spraying the etching solution as the processing solution B, it is melted and removed. -For post-processing of each program, a cleaning program is set up according to the above-mentioned place. In the semi-additive method of the second embodiment, as described above, a circuit K is formed on the electrolytic copper copper plating, and then a substrate is manufactured; [. The manufacturing method of the second embodiment is as described above.

However, other circuit substrates for printed circuit boards; and [manufacturing methods] have recently become more and more diverse. In addition to the first and second implementation examples described above, various other methods have been developed and used. The present invention is of course applicable to various substrates J of this type. (Summary of Surface Treatment Apparatus 7) Hereinafter, the surface treatment apparatus 7 of the base plate A of the present invention will be described with reference to FIGS. 1, 2, 3, 4, 5, and 6. Instructions.

The surface treatment device 7 is used in the above-mentioned manufacturing process of the substrate J, and sprays the treatment liquid B onto the base plate A being transported, and performs a chemical treatment on the base plate A. That is, in each process of the manufacturing method of the substrate, for example, in a development process, an etching process, or a peeling film process, it is used as a device development, uranium engraving device, or as a peeling device. A, spraying a treatment liquid B such as a developing liquid, an etching liquid, or a peeling liquid, respectively, to perform chemical treatment and surface treatment. Then, each of the surface treatment apparatuses 7 is provided in the treatment chamber 8 in common-24-200528193, and is provided with a transport device 9, a spray nozzle 10, and an adjustment mechanism 11. That is, the conveying device 9 for horizontally conveying the base plate A, the spray nozzle 10 for spraying the processing liquid B onto the base plate A being conveyed, and the atomizer type adjusting mechanism 1 1 for the base plate A in the middle. . The surface treatment device 7 'is as described above. (Regarding the conveying device 9) First, the conveying device 9 'of the surface treatment device will be described with reference to Figs. 1, 2, 4, and 6.

The conveying device 9 is provided with a straight forward roller 12 which is horizontally upward and a toothed roller group 13 which is horizontally downward, and is transported by holding the base plate A vertically. Then, the straight-forward roller group 12 and the toothed roller group 13 are held apart from the space E for ejecting the processing liquid B located opposite to the spray nozzle 10, and the substrate A to be conveyed is held. Arranged up and down.

The separation space E includes at least a region that is balanced with the spray type L of the treatment liquid B. That is, the space E is formed intermittently on the way to the roller group 12 and the toothed roller group 13 on the way, and the formation position in the conveying direction D is deviated, and at the same time, it is located opposite to the spray nozzle 10. . The 'space space E' is composed of a region almost the same as the spray type L of the base plate A sprayed with the branch treatment liquid B sprayed from the spray nozzle 10 (almost the left and right dimensions of the forward and backward dimensions of the conveying direction D and the width direction ρ). The same) 'or a wider area than the spray type L (the front and rear dimensions are longer than the conveying direction D, and are almost the same as the left and right dimensions in the width direction F). -25-200528193 Then, the upper straight-forward roller group 12 is provided at each interval E with a restriction roller M that holds the interval E and is located before and after the opposite position. This restricting roller µ restricts and prevents the discharged processing liquid B from flowing through the base plate A in the forward and backward conveying direction D. First, the straight-forward rollers 12 are in the shape of a long cylinder and are driven by rotation. While the shafts 14 are oriented in the left-right width direction F, a plurality of them are arranged horizontally in a row along the front-to-rear conveyance direction D. Push on the base plate A from above.

Restriction roller M. Although the aforementioned straight-forward roller 12 for carrying is used in the illustration, it can also be distinguished from the straight-forward roller 12 to set up a dedicated free roller. In the example shown in the figure, the straight-forward roller 1 2 used as the limiting roller M has a smaller diameter than an unused object. Anyway, the regular roller M can restrict and prevent the processing liquid B sprayed from above the base plate A. The forward and backward conveying direction D flows through the outer surface of the base plate A, and then forcibly flows to the left and right width directions F to play a guiding role. Features.

In contrast, as shown in FIG. 6, the toothed rollers 13 of the toothed roller group 13 on the lower side are concaves and convexes formed in the width direction F of the left and right at a constant pitch and alternately formed in an alternating manner. The element 17 is externally fixed to the shaft 18 which rotates and drives the shaft toward the left-right width direction F. Then, the aforementioned toothed rollers 13 are arranged in a row horizontally along a plurality of forward and backward conveying directions D, and are pressed against the base plate A from below. Then, in addition to the space E, the concave and convex toothed rollers 13 are located at corresponding positions, and are slidably inserted in a non-contact state with a relatively small gap to rotate and overlap each other. -26- 200528193 That is, the toothed roller 13 has a ring-shaped < concave-convex element 17 having a left and right width of the concave portion 15 or a convex portion 16 which is externally fixed to the shaft 18, and the peripheral surface becomes concave-convex and approximately toothed. shape. Then, among the front and rear toothed rollers 13, one of the concave portions 15 is opposite to the other of the convex portions 16, and one of the convex portions 16 and the other of the concave portions 15 are sequentially slidably engaged with each other. Between the recessed portion 15 and the convex portion 16 of the sliding fit, minute front and rear intervals and left and right intervals are formed.

In other words, the front and rear toothed rollers 1 and 3 are closely overlapped, and then the upper base plate A is brought into contact with the approximate surface contact from the approximate point contact, and is carried and maintained from below. The conveying device 9 is as described above. (About the spray nozzle 10) Next, the spray nozzle 10 of the surface treatment apparatus 7 is demonstrated with reference to FIG. 1, FIG. 2, FIG. 3, and FIG. 5. FIG.

The spray nozzle 10 is continuously opposed to the base plate A being conveyed, and is arranged in a plurality of rows throughout the front, back, left, and right, and is directed toward the width direction F that intersects the front and back conveying direction D perpendicularly, and sprays at an angle. Angle N is arranged. Then, the number of spray nozzles 10 directed to the left and the number of spray nozzles 10 directed to the right are the same, and thus the number of spray nozzles 10 directed to the left or right is provided with an adjustment mechanism. 1 1.

Therefore, the developing solution, the etching solution, the stripping solution, and other processing liquids B—will be sprayed obliquely from the spray nozzle 10 to the left or the right—with the spray type L adjusted by the adjustment mechanism 11 After spraying to the base plate A -27- 200528193,-after flowing through the outer surface of the base plate A to the left or right to perform a potion treatment, it flows down from the left and right sides. The spray nozzle 10 will be described in more detail. First, the treatment liquid B is pushed from the liquid tank 19 through the pump and the pipeline 20 to each spray tube 21 and then to the spray nozzle 10, and after being supplied, it is sprayed onto the base plate A. -> Then, afterwards, after recovering the liquid tank 19 again-it is used cyclically.

A plurality of spray tubes 21 are arranged parallel to each other while the base plate A being conveyed is facing up and down, and is inclined along the conveying direction D or the left-right width direction F. The spray nozzles 10 are constituted by completely conical nozzles arranged on each spray tube 21 at regular pitch intervals. Then, the treatment liquid B is introduced from a mouth with a larger diameter, and is diffused into a spray form from a small-diameter hole by passing it through a diffusion inclined plate or a screw plate.

Therefore, the sprayed treatment liquid B is closer to the center of the spray, and the pressure is higher and the impact is stronger. The closer it is to the peripheral edge, the lower the pressure and the weaker the impact. Such spray nozzles 10 have a vertical space for the base plate A being transported, and the conveyance direction D and the width direction F throughout the front and back are arranged at predetermined pitch intervals, and a plurality of them are arranged. Then, the spray nozzles 10 are as shown in Figs. 2 (3), 5 (3), and 5 (4), and each column faces left or right along the width direction F, and faces The column on the left and the column on the right have the same number of columns. In addition, in the example in Figure 3, the direction toward the conveying direction is -28- 200528193 to the left and the nozzle to the right is Arrange the settings interactively in order. At the same time, the spray nozzles 10 are arranged at an inclined spray angle N as shown in Fig. 2. In the spray nozzle 10, the left-facing nozzle and the right-facing nozzle are both mounted on the spray pipe 21 at a spray angle N of 30 degrees, 45 degrees, 60 degrees, and the like from the horizontal. Also, 'spray nozzle 1 0' is not the same as figure 3 '. In the conveying direction D behind the head, it is not located at a position opposite to other spray nozzles 10. The spray centers do not overlap, but are on the left and right. In the width direction F, they are arranged slightly off. Φ In other words, the front and rear spray nozzles 10 are not located on parallel and straight trajectories along the conveying direction D, but are arranged slightly deviated from the left and right width directions F. That is, most of the spray nozzles 10 used in the surface treatment device 7 do not deviate from each other by overlapping with the conveying direction D.

Therefore, the treatment liquid B sprayed from each of the spray nozzles 10 is dense and high-pressure, and the spraying centers with strong processing effects are not overlapped and dispersed, and then are sprayed onto the base plate A due to some strong impacts. Excessive processing can prevent it from occurring in the front-rear direction. In the example shown in the figure, although the spray nozzle 10 is provided on the upper and lower sides of the base material A to be transported, there are also embodiments in which the spray nozzle 10 can be provided on only one side. In this case, the aforementioned space between the spray tube 21 and the conveying device 9 and the restriction mechanism 11 described later may be provided only on one side. The spray nozzle 10 is as described above. (Regarding the adjustment mechanism 11) -29- 200528193 Next, the spray nozzle 1 of the surface treatment device will be described with reference to Figs. 1, 2, 4, and especially 5. The adjustment mechanism 1 1 is provided with a left and right length of a balance base plate A and its left and right widths, and further includes a restriction plate 2 in front and rear positions in a vertical posture, and connecting elements for connecting the branches in the front-rear direction with the left and right ends of the front and rear restriction plates 22 respectively. 23 In the example shown in the figure, the system is formed into a slightly box-like shape. Then, there are a plurality of back and forth intervals P on the restriction plate 22, and a pair of front and back are formed opposite to each other. The spray nozzles 10 are arranged in a manner of facing the restriction plate 22 in a manner of front and back space P. The φ restricting plate 22 is the processing liquid B sprayed from the spray nozzle 10 to the base plate a, and passes through the position relationship of the interval p between the front and back, and at the same time, it is directed toward the front and rear directions (inclined and discharged in the forward and backward directions). The processing liquid B is constituted by the positional relationship and width of touch reflection and refraction. Therefore, the processing liquid B is sprayed onto the base plate A after focusing on the spray type L with a small density difference while adjusting the area in accordance with the predetermined width before and after the adjustment plate 11 of the adjustment mechanism 11 described above.

The aforementioned adjustment mechanism 11 will be described in more detail. The restricting plate 22 is arranged vertically above the spray nozzles 10 arranged at the upper and lower positions, and is vertically arranged at the front and rear positions. For the row of spray nozzles 10 arranged below, the front-to-back space is positioned directly above it, and the front-to-back space is arranged vertically. Then, the restricting plate 22 is formed in a flat plate shape or a horizontally long plate shape having a left and right length of the left and right widths of the balance base plate a and a height between the spray nozzle 10 and the conveying device 9 above and below. -30-200528193 Adjustment mechanism 1 1 The front and rear-pairs are formed by the restriction plates 22 and used in the other illustrations shown in (1) of FIG. 5. The wider the 10 end of the spray nozzle, the closer it is to the narrower end of the base plate A, and the more inclined it is. That is to say, the two restricting plates 22 of the adjusting mechanism 11 in the example shown in the figure are arranged side by side in an inverted figure in the shape of an inverted figure in the positional relationship with the distance from the 10 end of the spray nozzle to the base plate A. By the above-mentioned oblique setting method, especially by the adjustment of the oblique angle, the treatment liquid B which is directed toward the base plate A can be easily reflected and refracted in an appropriate amount, and then the whole can be uniformly adjusted to have a small difference in density. The condition can be limited to the ideal spray type L. In addition, as shown in (2) of Fig. 5, there is also an embodiment in which the restriction plates 22 are arranged obliquely and in a front-to-back relationship, and are arranged in parallel vertically. That is, there may be embodiments in which the side cross-sections are provided in parallel. In this case, mainly by adjusting the interval P between the two limiting plates 22, the same ideal spray type L as in the previous embodiment can be obtained. In addition, although not shown, the pair of front and rear restriction plates 22 are upside down compared with the example shown in Fig. 5 (1) and so on, that is, the closer the interval P is to the closer The narrower the 10 end of the spray nozzle is, the wider it is nearer to the A end of the base plate. Several obliquely arranged embodiments are also possible. That is, an embodiment in which the side cross-section is arranged in a slightly sigmoid shape is also possible. In this case, the ideal spray type L can be obtained by the aforementioned tilt setting, especially by adjusting the tilt angle. In this way, the side cross-sections of the pair of front and rear restricting plates 22 can be, for example, inverse figure-shaped, parallel, slightly figure-shaped, etc., and can be appropriately selected and used from various mutual positional relationships. Then, the 'adjustment mechanism 11' can form the inclined restricting plate 22 or the vertical restricting plate 22 at the same time, and the back-and-forth interval p can be adjusted variably. Then, it can correspond to the interval e formed in the carrying device 9. In the case of the inclined restricting plate 22 as described above, the space P is not the end of the spray nozzle 10 but the end A of the base plate A, and it is the approximate target for adjustment because of the relationship with the space E.

Therefore, for example, when the space E at the 9th end of the carrying device is 30 mm before and after, the space P between the restriction plates 22 is also adjusted to 30mni, and then the width type before and after the spray type L is also 3 Omni. The spraying of the plate A is carried out. Also, for example, when the space E is 10 mm, 20 mm, or 40 mm, the same applies when the space P is equal to or less than 10 mm, 20 mm, or 40 mm.

However, it is not absolutely necessary for the aforementioned spacing space E to make the front-to-back spacing P or spray type L consistent. That is, as for the front and rear dimensions of the space E at the 9 ends of the conveying device, the front and rear space P of the 22 panels or the front and rear width dimensions of the spray type L may be adjusted to the necessary dimensions below. Of course, even in this case, the front-to-back interval P or front-to-back width dimension necessary for the distribution is set assured. The adjustment mechanism 11 is as described above. (Functions, etc.) The surface treatment device 7 'of the base plate A of the present invention is configured as described above. Therefore, the following is formed. (1) The manufacturing process of the surface treatment device 7 used for the substrate of the circuit K]-32- 200528193 sequence, for example, in the development procedure, the uranium engraving procedure, or the peeling procedure, the A substrate A such as a printed circuit board sprays a processing liquid B such as a developing liquid, an etching liquid, or a peeling liquid to perform a chemical treatment. The surface treatment device 7 includes a conveying device 9, a spray nozzle 10, and an adjustment mechanism 11. The conveying device 9 is used for horizontal conveyance of the base plate A, and the spray nozzle 10 is used to spray the treatment liquid B to the substrate plate A being conveyed. The adjustment mechanism 11 is for the treatment liquid B ejected from the spray nozzle 10 and is on the way. The spray type L of the base plate A is adjusted.

(2) First, the conveying device 9 of the surface treatment device 7 (refer to FIG. 1, FIG. 2, and FIG. 6). The straight forward roller group 12 and the lower toothed roller group 13 above it, except for the treatment liquid B spray. In addition to the space E used, the base plate A is held up and down correspondingly. The separation space E is an area located at a position opposite to the spray nozzle 10 and having at least the spray type L of the balance treatment liquid B.

In addition, the toothed rollers 1 3, the concave portions 15 and the convex portions 16 are formed alternately at a constant pitch in the left-right direction, and the front and rear toothed rollers 1 3 have the concave portion 15 and the convex portion except the space E. 1 is located in a relative position and overlaps with each other in a non-contact state with a slight gap. In the group of straight-forward rollers 12, the holding space E is located at the opposite position-the pair of restricting rollers M restricts and prevents the discharged treatment liquid B from flowing through the outer surface of the base plate A in the forward and backward conveying directions. (3) Secondly, the spraying nozzles 10 of the surface treatment device 7 are completely conical nozzles, which are opposed to the base plate A being conveyed, and are arranged in a plurality of directions. (Refer to Figure 1, Figure 2, Figure 3, Figure 5-33- 200528193). Then, while facing the widthwise direction F which intersects with the front-to-rear conveyance direction D perpendicularly, it is arranged at an inclined spray angle N. In addition, the columns of the spray nozzles 10 directed to the left and the columns of the spray nozzles 10 directed to the right have the same number. Each column of the spray nozzles 10 directed to the left or right is provided with adjustments. Agency 1 1. In addition, the spray nozzles 10 are not located opposite to the other spray nozzles 10 in the forward and backward conveying directions D, and the spray centers do not overlap, but are arranged in a slight deviation in the left and right width directions F (see (Figure 3). (4) Then, the adjustment mechanism 11 of the surface treatment device 7 has a pair of restriction plates 22 and a connection element 23 connecting the restriction plates 22 facing each other with a front-to-back interval P therebetween. A plurality of spray nozzles 10 are arranged in a manner of facing the restriction plate 22 in a spaced-apart manner P (see Figs. 1 and 5). Then, the restriction plate 22 is provided with a left-right length of the left-right width of the balance base plate A. Then, the regulating liquid 22 of the adjusting mechanism 11 and the spray nozzle 10 spray the processing liquid B on the way to the base plate A, and pass through the processing liquid B in a forward and backward direction while passing through each other vertically. Reflection, refraction. Further, the adjustment mechanism 11 having the aforementioned restricting plate 22 can be simply and easily attached to the existing surface treatment apparatus 7 and the spray nozzle 10 even if it is mounted rearward. That is, the space between the mist nozzle 10 and the conveying device 9 can be easily and easily installed even if it is mounted rearward. (5) Therefore, the treatment liquid B is sprayed obliquely from the spray nozzle 10 to the left or right 200528193 (see Fig. 2),-> The regulating plate 22 of the mechanism 1 1 is adjusted, as before and after The width is adjusted by region, focusing on the slightly flat spray type L with a small difference in shades (refer to Figures 1 and 5). -Then the treatment liquid B is sprayed onto the base plate A (see Fig. 1) with the spray type L being adjusted through the aforementioned adjusting mechanism 11,-flowing to the left or right through the outer surface of the base plate A After the potion treatment (refer to Figure 4),-flow down from the left and right sides of the base plate A. (6) Then, from the surface treatment device 7 of the base plate A, first, the first is as follows. In the surface treatment device 7, a treatment liquid B such as an image liquid, an etching liquid, or a peeling liquid is ejected in a conical or pyramidal shape from a spray nozzle 10 of a completely conical nozzle. -Then, on the way, by adjusting the spacing P between the front and back of the limiting plate 22 by adjusting the mechanism 11—the nozzles facing the front and rear directions will be reflected and bent by the front and rear limiting plates 22—and then, according to the predetermined width of the front and rear The area is slightly rectangular and is adjusted by the area.-≫ Focus on the spray type L, which has a slightly flat difference in shade,-spray to the base plate A 〇

Therefore, a. The treatment liquid B is sprayed to the base plate A with a spray type L with a small difference in density.-≫ The closer to the center of the spray, the higher the pressure, and the closer to the peripheral edge, the more loose the pressure will be. Eliminated. —As a result, the treatment effect of the base plate A is uniformized b. The treatment liquid B is used for the base plate A to balance the front and back widths of the spacing space E of the carrying device 9 so that the spray type is appropriately distributed without exceeding the effective area. L is ejected,-> Therefore, it is possible to prevent ejection even with the straight-forward rollers or toothed rollers 13 of the conveying device 9. -Therefore, the processing effect of-35- 200528193 on base plate A is strengthened. For example, when the front and rear dimensions are 30 mm, the width dimension of the spray type 1 is also about 30 mm or less, for example, 25 mm, 20 mm, and 15 mm.

c. The treatment liquid B is sprayed to the base plate a with the width of the front and back of the spacing space E of the conveying device 9 and sprayed with a spray type L that is not excessively narrow and is appropriately distributed. θ Therefore, there is no small and long front The width is formed into a thin film and a straight line. -Therefore, the processing effect of the base plate A can be ensured before and after expansion. According to a, b, and c, from the surface treatment device 7, the chemical treatment such as the development treatment, etching treatment, or peeling treatment of the base plate A can be uniformized without the difference between the speed and the speed. The width is uniform and deviations and errors are eliminated. The circuit K (refer to FIG. 9) formed in the left-right width direction F also has the same circuit K width as the circuit K in the transport direction D before and after formation, and can be formed in a well-balanced manner.

In addition, the processing liquid B is not wasted, and the processing speed can be improved. (7) According to the surface treatment device 7 of the base plate A, the second is as follows. In the surface treatment device 7, the plurality of spray nozzles 10 arranged in a line are arranged at an inclined spray angle N while facing the width direction F, and are arranged so as not to deviate from each other in the conveying direction D which overlaps the front and rear. In addition, the straight-forward roller group 12 above the conveying device 9 is provided with a pair of restriction rollers M which are spaced forward and backward to support the ejection space E. Therefore, in order to balance the width of the front and back of the spacing space E of the carrying device 9-36- 200528193, the treatment liquid B sprayed by the spray type L will flow to the left or right through the outer surface of the base plate A as expected. The potion works like it does. The treatment liquid B sprayed from the upper spray nozzle 10 is prevented from flowing through the outer surface of the base plate A in the conveying direction D, and no accumulated liquid G (see (1) in FIG. 8) is retained. In addition, the physical fluid B sprayed from the spray nozzle 10 below immediately after flowing through the outer surface of the base plate A in the left-right direction, immediately dropped due to its own weight, so that no flow or retention in the front-back direction occurs.

In addition, in the conveying direction D, the spray centers of the processing liquid B do not overlap. In this respect, the surface treatment device 7 can uniformize the chemical treatment of the base plate A without the difference between the speed and the speed. The width and deviation of the formed circuit K can be eliminated. Moreover, it will not cause waste of the processing liquid B, and can improve the processing speed.

(8) According to the surface treatment device 7 of the base plate A, the third, as described below. In the surface treatment device 7, as the conveying device 9, a straight forward roller group 12 above and a toothed roller group 13 below are used in combination. Then, the 'base plate A' is held between the straight-forward roller group 12 and the toothed roller group 1 3 for transportation. Therefore, although the base plate A is extremely thin and softened, the weight or spray pressure of the processing liquid B sprayed from the spray nozzle 10 above is a toothed roller that is engaged with each other with a slight gap below. Group 13 is fully supported as a center. The base plate A is a toothed roller group 1 3 which is closely arranged below, and is tightly maintained and guided, and is also held in a straight line with the upper-37- 200528193 roller group, without any trouble. The base material A that was smoothly received in the conveying direction D was transported by the aforementioned conveying device 9 'under the weight and spray pressure of the sprayed treatment liquid B, and was bent, corrugated, beryllium fold, bend, waist fold , Sagging, jamming, entanglement, falling, damage and other transportation troubles (refer to Figure 8) can be reliably prevented. In addition, after the treatment liquid B sprayed from the spray nozzle 10 below flows through the outer surface of the base plate A in the left-right direction, the ΔΔ moment falls due to its own weight, and there is no adverse influence of the base plate A on its weight and the like. Concerns. The surface treatment device 7 can prevent various annoyances during transportation as described above. From this aspect, the chemical treatment of the base plate A is uniformized, and deviations and errors in the width of the formed circuit K are also eliminated. Moreover, the processing liquid B is not wasted, and the processing speed can be improved. (V) Brief Description of Drawings Fig. 1 is a side cross-sectional explanatory view of an important part of a surface treatment device for a base plate material of the present invention, illustrating the best mode for carrying out the present invention. Fig. 2 is a cross-sectional explanatory view before explaining the best mode for carrying out the present invention. Fig. 3 is a plan view showing the entirety of a spray nozzle according to a preferred embodiment of the present invention. FIG. 4 is a plan view of important parts illustrating the best mode for carrying out the present invention. (1) of FIG. 4 shows a processing liquid flowing to the left, and FIG. 4 (2) shows a processing liquid flowing to the right. . Fig. 5 is a schematic diagram illustrating the best mode for implementing the present invention. Fig. 5-38- 200528193 (1) is a side sectional view of an example of an adjustment mechanism, and Fig. 5 (2) is an example of another example of an adjustment mechanism. Side sectional view, (3) of FIG. 5 is a plan sectional view of a spray nozzle row and the like facing to the left, and (4) of FIG. 5 is a plan sectional view of a spray nozzle row and the like toward the right. Fig. 6 is a plan sectional view illustrating a toothed roller group of the best mode for carrying out the present invention.

Fig. 7 illustrates a surface treatment device for a base plate of a conventional example, and U) of Fig. 7 is an explanatory side view of an important part of a fully conical nozzle example, and (2) of Fig. 7 is a plane of the important part Illustrating. (3) of FIG. 7 is a side explanatory view of an important part of the spray nozzle example, (4) of FIG. 7 is a plan explanatory view of the important part, and (5) of FIG. 7 is a frontal description of the important part. Fig. 8 is a diagram illustrating a surface treatment device for a base plate of a conventional example. Fig. 8 (1) is a side view explanatory diagram, and Fig. 8 (2) is a plan explanatory diagram. Fig. 9 is a plan explanatory view of a substrate (base plate) module. [Explanation of symbols]

1 ~ surface treatment device 2 ~ carrying device 3 ~ spray nozzle 4 ~ straight roller 5 ~ shaft 8 ~ disc 7 ~ surface treatment device 8 ~ processing chamber -39-200528193

9 ~ Transporting device 1 0 ~ Spray nozzle 1 1 ~ Adjustment mechanism 12 ~ Straight-forward roller 1 3 ~ Toothed roller 14 ~ Shaft 1 5 ~ Concave portion 1 6 ~ Convex portion 1 7 ~ Convex element 1 8 ~ Shaft 19 ~ Liquid tank 2 0 to line 21 to spray tube 22 to restriction plate 23 to connection element A to base plate

B ~ treatment liquid C ~ spray type D ~ conveying direction E ~ space F ~ width direction G ~ accumulated liquid Η ~ problem J ~ substrate-40-200528193 K ~ circuit L ~ spray nozzle M ~ regular roller N ~ spray angle P ~ Before and after interval

-41-

Claims (1)

200528193 The scope of patent application: 1 · A surface treatment device for substrates, used in the substrate manufacturing process, to chemically treat substrates, which is characterized by: a transport device that horizontally transports the substrate; spray nozzles that process The liquid is sprayed onto the base plate being conveyed; the adjustment mechanism adjusts the spray type of the base plate on the way regarding the processing liquid sprayed from the spray nozzle. 2 · Surface treatment device for base plate as in item 1 of the patent application scope, where The adjusting mechanism is provided with a pair of front and rear restricting plates facing each other with a front-to-back spacing, and the spray nozzles are disposed between the front and back spacings facing the limiting plate. 3. The surface treatment device for the base plate as described in the scope of patent application item 2, wherein The limiting plates of the adjusting mechanism are spaced back and forth from each other, and the processing liquid sprayed by the spray nozzle on the way to the base plate passes through the positional relationship vertically, and the processing liquid sprayed forward and backward will contact and reflect. The positional relationship between the refraction and the width are formed; the treatment liquid is adjusted on the limiting plate of the adjusting mechanism to adjust the area with a predetermined width, and at the same time, it is sprayed onto the base plate by focusing on the spray type with little difference in density. 4. The surface treatment device for the base plate according to item 3 of the scope of patent application, wherein the base plate is composed of a printed circuit base plate, the treatment liquid is composed of a developing liquid, an etching liquid, and a stripping liquid, and the spray nozzle A completely conical nozzle is used; the adjustment mechanism is provided with a vertical restriction plate having a left and right length that balances the left and right widths of the base plate, and connecting elements connected to the left and right ends of the front and rear restriction plates, respectively. _ 4 2-200528193 5. For example, the surface treatment device of the base sheet in the scope of patent application No. 4 ' The spray nozzles are arranged in a plurality of rows in front, back, left, and right with respect to the base plate, and are arranged in an inclined spray angle while facing the width direction that intersects the front and back conveying direction perpendicularly; toward the left The number of spray nozzles is the same as the number of spray nozzles facing the right. In this way, each row of spray nozzles facing left or right is provided with the adjustment mechanism. After the spray nozzle continuously sprays obliquely toward the left or right, it is sprayed to the base plate in the spray type adjusted by the adjusting mechanism, and flows through the outer surface of the base plate to the left or right to perform a potion treatment. , Flowing down from the left and right. 6 · According to the surface treatment device of the base plate according to item 5 of the patent application, the spray nozzle is located at a position that does not face the other spray nozzles with respect to the forward and backward conveying directions, and the spray centers do not overlap and deviate in the width direction Arrange the settings as usual. 7 · Surface treatment device for base plate as in item 6 of the patent application scope, where The base plate is relatively thin and flexible; the conveying device is used to carry the base plate up and down and carry it, and has a horizontal straight forward roller group and a horizontal downward tooth roller group, and the straight forward roller group and tooth roller In addition to the space for spraying the processing liquid located opposite to the spray nozzle, the group is arranged in a row corresponding to 'the space, which has at least an area that balances the spray type of the processing liquid. 8 · If the surface treatment device of the base plate is applied for item 7 of the patent scope, one of the straight-forward rollers is equipped with a holding space that is located in front of and behind the opposite space ~ For the limiting roller, the limiting roller will Restrict and prevent the discharged treatment liquid from flowing through the outer surface of the base plate in the forward and backward conveying directions. 9 · The surface treatment device of the base plate according to item 7 of the scope of the patent application, wherein the toothed rollers of the toothed roller group are concave and convex elements formed by concave portions and convex portions at the same pitch in the left and right directions, and are embedded externally. Fixed on the shaft In addition to the space between the front and rear toothed rollers, the concave and convex portions of the front and rear rollers are in a non-contact state with a slight gap at the corresponding position, and they are slid, inserted and overlapped to engage. One 4 4 one