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TW200513796A - Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method - Google Patents

Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method

Info

Publication number
TW200513796A
TW200513796A TW093124377A TW93124377A TW200513796A TW 200513796 A TW200513796 A TW 200513796A TW 093124377 A TW093124377 A TW 093124377A TW 93124377 A TW93124377 A TW 93124377A TW 200513796 A TW200513796 A TW 200513796A
Authority
TW
Taiwan
Prior art keywords
photosensitive
formation method
pattern formation
imagine
transcription sheet
Prior art date
Application number
TW093124377A
Other languages
Chinese (zh)
Other versions
TWI352875B (en
Inventor
Morimasa Sato
Yuichi Wakata
Masanobu Takashima
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200513796A publication Critical patent/TW200513796A/en
Application granted granted Critical
Publication of TWI352875B publication Critical patent/TWI352875B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G03F1/56—Organic absorbers, e.g. of photo-resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/06—Silver salts
    • G03F7/07—Silver salts used for diffusion transfer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

There is provided a photosensitive transcription sheet on which the desired pattern with different thickness inside the imagine can easily be formed and a sensitive laminate. There is a sensitive transcription sheet which is made by laminating the first photosensitive layer composed of the photosensitive resin composition containing binder, polymerizable compounds, and photo polymerization initiators, then the second photosensitive layer composed of the photosensitive resin composition containing binder, polymerizable compounds, and photo polymerization initiators, which reveals comparatively higher photosensitivity than the one of the first layer, on the support by order. And there is a photosensitive laminate including the said first photosensitive layer and the said second photosensitive layer.
TW093124377A 2003-08-15 2004-08-13 Photosensitive transcription sheet, photosensitive TWI352875B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003293713 2003-08-15
JP2003433829 2003-12-26

Publications (2)

Publication Number Publication Date
TW200513796A true TW200513796A (en) 2005-04-16
TWI352875B TWI352875B (en) 2011-11-21

Family

ID=34593897

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124377A TWI352875B (en) 2003-08-15 2004-08-13 Photosensitive transcription sheet, photosensitive

Country Status (3)

Country Link
KR (1) KR20050017596A (en)
CN (1) CN1580953A (en)
TW (1) TWI352875B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462830B (en) * 2007-02-28 2014-12-01 Nippon Paper Chemicals Co Ltd The method of forming an ultraviolet hardening adhesive layer transfer sheet and a light shielding pattern
TWI724062B (en) * 2015-11-26 2021-04-11 日商富士軟片股份有限公司 Transfer material, method of manufacturing transfer material, laminated body, method of manufacturing laminated body, method of manufacturing capacitance-type input device, and method of manufacturing image display device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101017760B1 (en) * 2005-08-29 2011-02-28 도판 인사츠 가부시키가이샤 Photosensitive coloring composition, color filter substrate, and transflective liquid crystal display device
JP4711862B2 (en) * 2006-03-08 2011-06-29 富士フイルム株式会社 Photosensitive composition, photosensitive film, permanent pattern forming method, and printed circuit board
KR101338110B1 (en) * 2006-12-29 2013-12-06 엘지디스플레이 주식회사 Dry film flim and method of forming liquid crystal display panel using it
JP4902369B2 (en) * 2007-01-25 2012-03-21 富士フイルム株式会社 Curable composition, color filter and method for producing the same
WO2013084283A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element
WO2013084282A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element
JP6870612B2 (en) * 2015-07-30 2021-05-12 昭和電工マテリアルズ株式会社 Photosensitive element, resin composition for forming a barrier layer, method for forming a resist pattern, and method for manufacturing a printed wiring board
JP6839476B2 (en) * 2016-09-26 2021-03-10 カンタツ株式会社 Pattern forming sheet
WO2018179095A1 (en) * 2017-03-28 2018-10-04 日立化成株式会社 Transfer-type photosensitive film, method for forming cured film pattern, cured film and touch panel
CN107180298A (en) * 2017-04-26 2017-09-19 北京望远迅杰科技有限公司 A kind of recommendation method of investment project
CN114641143B (en) * 2022-02-16 2024-10-18 盐城维信电子有限公司 Manufacturing method of outer thin circuit of flexible circuit board
CN115837790B (en) * 2022-12-02 2024-12-27 杭州福斯特电子材料有限公司 Photosensitive dry film laminate, preparation method and circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462830B (en) * 2007-02-28 2014-12-01 Nippon Paper Chemicals Co Ltd The method of forming an ultraviolet hardening adhesive layer transfer sheet and a light shielding pattern
TWI724062B (en) * 2015-11-26 2021-04-11 日商富士軟片股份有限公司 Transfer material, method of manufacturing transfer material, laminated body, method of manufacturing laminated body, method of manufacturing capacitance-type input device, and method of manufacturing image display device

Also Published As

Publication number Publication date
TWI352875B (en) 2011-11-21
KR20050017596A (en) 2005-02-22
CN1580953A (en) 2005-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees