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TW200512463A - Current sensing device and its manufacturing method - Google Patents

Current sensing device and its manufacturing method

Info

Publication number
TW200512463A
TW200512463A TW092126978A TW92126978A TW200512463A TW 200512463 A TW200512463 A TW 200512463A TW 092126978 A TW092126978 A TW 092126978A TW 92126978 A TW92126978 A TW 92126978A TW 200512463 A TW200512463 A TW 200512463A
Authority
TW
Taiwan
Prior art keywords
current sensing
substrate
manufacturing
sensing device
strip
Prior art date
Application number
TW092126978A
Other languages
Chinese (zh)
Other versions
TWI220165B (en
Inventor
ming-qi Chen
Ying-Chang Wu
Guo-Shu Ceng
shi-cong Lin
hong-yi Zhuang
cai-bao Jiang
Original Assignee
Ta I Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ta I Technology Co Ltd filed Critical Ta I Technology Co Ltd
Priority to TW92126978A priority Critical patent/TWI220165B/en
Application granted granted Critical
Publication of TWI220165B publication Critical patent/TWI220165B/en
Publication of TW200512463A publication Critical patent/TW200512463A/en

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacture Of Switches (AREA)

Abstract

The present invention provides a manufacturing method of current sensing device, which is characterized in using a substrate having a plastic base to form a current sensing device. A plurality of parallel trenches are formed on the substrate to separate a plurality of strips. After forming a plurality resistance blocks spaced from each other on each strip, the whole substrate is electroplated to form a metal film for use as a terminal face electrode on two side faces of the strip. Then, the substrate is cut to form a plurality of current sensing devices, thereby achieving the effects of reducing the manufacturing time, decreasing the manufacturing cost and mass production.
TW92126978A 2003-09-30 2003-09-30 Current sensing device and its manufacturing method TWI220165B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92126978A TWI220165B (en) 2003-09-30 2003-09-30 Current sensing device and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92126978A TWI220165B (en) 2003-09-30 2003-09-30 Current sensing device and its manufacturing method

Publications (2)

Publication Number Publication Date
TWI220165B TWI220165B (en) 2004-08-11
TW200512463A true TW200512463A (en) 2005-04-01

Family

ID=34076631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92126978A TWI220165B (en) 2003-09-30 2003-09-30 Current sensing device and its manufacturing method

Country Status (1)

Country Link
TW (1) TWI220165B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024204B2 (en) 2011-07-28 2015-05-05 Cyntec Co., Ltd. Aresistive device with flexible substrate and method for manufacturing the same
TWI634568B (en) * 2017-03-15 2018-09-01 大毅科技股份有限公司 Current sensing element and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7213097B2 (en) * 2019-01-28 2023-01-26 サンコール株式会社 current detector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024204B2 (en) 2011-07-28 2015-05-05 Cyntec Co., Ltd. Aresistive device with flexible substrate and method for manufacturing the same
TWI497535B (en) * 2011-07-28 2015-08-21 Cyntec Co Ltd Micro-resistive device with soft material layer and manufacture method for the same
TWI634568B (en) * 2017-03-15 2018-09-01 大毅科技股份有限公司 Current sensing element and method of manufacturing the same

Also Published As

Publication number Publication date
TWI220165B (en) 2004-08-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees