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TW200511714A - Embedded surface acoustic wave (SAW) filter and the manufacturing method thereof - Google Patents

Embedded surface acoustic wave (SAW) filter and the manufacturing method thereof

Info

Publication number
TW200511714A
TW200511714A TW092124074A TW92124074A TW200511714A TW 200511714 A TW200511714 A TW 200511714A TW 092124074 A TW092124074 A TW 092124074A TW 92124074 A TW92124074 A TW 92124074A TW 200511714 A TW200511714 A TW 200511714A
Authority
TW
Taiwan
Prior art keywords
saw
filter
manufacturing
acoustic wave
layer
Prior art date
Application number
TW092124074A
Other languages
Chinese (zh)
Other versions
TWI224892B (en
Inventor
Mau-Phon Houng
Yeong-Her Wang
Shih-Hung Tsai
Original Assignee
Mau-Phon Houng
Yeong-Her Wang
Shih-Hung Tsai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mau-Phon Houng, Yeong-Her Wang, Shih-Hung Tsai filed Critical Mau-Phon Houng
Priority to TW92124074A priority Critical patent/TWI224892B/en
Application granted granted Critical
Publication of TWI224892B publication Critical patent/TWI224892B/en
Publication of TW200511714A publication Critical patent/TW200511714A/en

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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

An embedded surface acoustic wave (SAW) filter and its manufacturing method are provided. A chromium layer is used to produce a window with interdigital transducers (IDTs) structure and a proton exchange method is applied to exchange the protons of the part of the piezoelectric substrate that is exposed by the interdigital transducers (IDTs window. Through controlling proton exchange time, the etching depth of the piezoelectric substrate (lithium niobate LiNbO3) can be controlled. Then, utilize the substrate back-illumination process, a PR layer isolates the aluminum and chromium layers, and hence the chromium layer can be removed without affecting the aluminum layer. Good surface structure can be kept while unifying device. Therefore, the yield of the integrated device can be effectively raised and the product characteristic is improved as well.
TW92124074A 2003-09-01 2003-09-01 Embedded surface acoustic wave (SAW) filter and the manufacturing method thereof TWI224892B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92124074A TWI224892B (en) 2003-09-01 2003-09-01 Embedded surface acoustic wave (SAW) filter and the manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92124074A TWI224892B (en) 2003-09-01 2003-09-01 Embedded surface acoustic wave (SAW) filter and the manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI224892B TWI224892B (en) 2004-12-01
TW200511714A true TW200511714A (en) 2005-03-16

Family

ID=34568500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92124074A TWI224892B (en) 2003-09-01 2003-09-01 Embedded surface acoustic wave (SAW) filter and the manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI224892B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI802380B (en) * 2022-04-21 2023-05-11 立積電子股份有限公司 Acoustic wave device and fabrication method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8552819B2 (en) * 2011-10-26 2013-10-08 Triquint Semiconductor, Inc. High coupling, low loss saw filter and associated method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI802380B (en) * 2022-04-21 2023-05-11 立積電子股份有限公司 Acoustic wave device and fabrication method thereof

Also Published As

Publication number Publication date
TWI224892B (en) 2004-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees