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TW200511546A - A method to improve high lead solder bump reliability in flip chip assembly application - Google Patents

A method to improve high lead solder bump reliability in flip chip assembly application

Info

Publication number
TW200511546A
TW200511546A TW092125277A TW92125277A TW200511546A TW 200511546 A TW200511546 A TW 200511546A TW 092125277 A TW092125277 A TW 092125277A TW 92125277 A TW92125277 A TW 92125277A TW 200511546 A TW200511546 A TW 200511546A
Authority
TW
Taiwan
Prior art keywords
solder bump
flip chip
improve high
chip assembly
high lead
Prior art date
Application number
TW092125277A
Other languages
Chinese (zh)
Inventor
Chang-Bing Lee
Shiow-Mei Jaw
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW092125277A priority Critical patent/TW200511546A/en
Publication of TW200511546A publication Critical patent/TW200511546A/en

Links

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method to improve high lead solder bump reliability in flip chip assembly application is disclosed. The method utilizes a relative low melting temperature metal (alloy) layer formed on a solder bump to bond a chip and a substrate. The method thereby provides a reliable joint, avoids cold joint and the use of Pb so as to meet the requirement of environment protection.
TW092125277A 2003-09-12 2003-09-12 A method to improve high lead solder bump reliability in flip chip assembly application TW200511546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092125277A TW200511546A (en) 2003-09-12 2003-09-12 A method to improve high lead solder bump reliability in flip chip assembly application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092125277A TW200511546A (en) 2003-09-12 2003-09-12 A method to improve high lead solder bump reliability in flip chip assembly application

Publications (1)

Publication Number Publication Date
TW200511546A true TW200511546A (en) 2005-03-16

Family

ID=57798544

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125277A TW200511546A (en) 2003-09-12 2003-09-12 A method to improve high lead solder bump reliability in flip chip assembly application

Country Status (1)

Country Link
TW (1) TW200511546A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8779587B2 (en) 2008-09-16 2014-07-15 Agere Systems Llc PB-free solder bumps with improved mechanical properties
TWI469288B (en) * 2009-06-11 2015-01-11 Chipbond Technology Corp Bumped chip and semiconductor flip-chip device applied from the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8779587B2 (en) 2008-09-16 2014-07-15 Agere Systems Llc PB-free solder bumps with improved mechanical properties
US9443821B2 (en) 2008-09-16 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Pb-free solder bumps with improved mechanical properties
TWI469288B (en) * 2009-06-11 2015-01-11 Chipbond Technology Corp Bumped chip and semiconductor flip-chip device applied from the same

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