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TW200508375A - Cerium-based abrasive containing fluorine and method of producing the same - Google Patents

Cerium-based abrasive containing fluorine and method of producing the same

Info

Publication number
TW200508375A
TW200508375A TW093119008A TW93119008A TW200508375A TW 200508375 A TW200508375 A TW 200508375A TW 093119008 A TW093119008 A TW 093119008A TW 93119008 A TW93119008 A TW 93119008A TW 200508375 A TW200508375 A TW 200508375A
Authority
TW
Taiwan
Prior art keywords
particle size
cerium
based abrasive
abrasive
treo
Prior art date
Application number
TW093119008A
Other languages
Chinese (zh)
Other versions
TWI249570B (en
Inventor
Naoyoshi Mochizuki
Daisaku Kobayashi
Akira Shimogawara
Hidehiko Yamasaki
Yoshiteru Domoto
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200508375A publication Critical patent/TW200508375A/en
Application granted granted Critical
Publication of TWI249570B publication Critical patent/TWI249570B/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The disclosed is a cerium-based abrasive, which contains fluorine and has a 90wt% or more mass ratio of a reduced mass of a total rare earth oxide (TREO) to an abrasive mass, a 0.05wt% or less mass ratio of a total content of Th and U to the TREO ((Th+U)/TREO), and an average particle size according to Blaine's method (DB) of 1.5μm to 2.5μm. The cerium-based abrasive in which the particle size had been set based on the average particle size according to Blaine's method (DB) has been controlled in terms of particle size distribution of the abrasive particles so that necessary abrasion rate can be secured. Therefore, application of the average particle size according to Blaine's method (DB) to standards for setting particle size decreases content of elements such as thorium and uranium and provides a cerium-based abrasive having a higher abrasion rate.
TW93119008A 2003-08-26 2004-06-29 Cerium-based abrasive containing fluorine and method of producing the same TWI249570B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003301327A JP3875668B2 (en) 2003-08-26 2003-08-26 Cerium-based abrasive containing fluorine and method for producing the same

Publications (2)

Publication Number Publication Date
TW200508375A true TW200508375A (en) 2005-03-01
TWI249570B TWI249570B (en) 2006-02-21

Family

ID=34405981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93119008A TWI249570B (en) 2003-08-26 2004-06-29 Cerium-based abrasive containing fluorine and method of producing the same

Country Status (3)

Country Link
JP (1) JP3875668B2 (en)
CN (1) CN1300278C (en)
TW (1) TWI249570B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3929481B2 (en) * 2005-04-04 2007-06-13 昭和電工株式会社 Cerium oxide-based abrasive, its production method and use
JP5512962B2 (en) * 2008-12-08 2014-06-04 三井金属鉱業株式会社 Cerium-based abrasive containing fluorine and sulfur
PH12013501563A1 (en) 2011-01-25 2016-09-23 Konica Minolta Inc Fine abrasive particles and method for producing same
JP6017315B2 (en) * 2011-01-27 2016-10-26 株式会社フジミインコーポレーテッド Abrasive material and polishing composition
JP6839767B2 (en) * 2017-09-11 2021-03-10 昭和電工株式会社 Method for manufacturing raw materials for cerium-based abrasives, and method for manufacturing cerium-based abrasives

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09183966A (en) * 1995-12-29 1997-07-15 Seimi Chem Co Ltd Production of cerium abrasive
JP3600725B2 (en) * 1998-03-24 2004-12-15 三井金属鉱業株式会社 Manufacturing method of cerium-based abrasive
JP2001152134A (en) * 1999-11-22 2001-06-05 Speedfam Co Ltd Composition and process for grinding oxide single crystal wafer
TW586157B (en) * 2000-04-13 2004-05-01 Showa Denko Kk Slurry composition for polishing semiconductor device, and method for manufacturing semiconductor device using the same
JP3838870B2 (en) * 2000-12-11 2006-10-25 三井金属鉱業株式会社 Method for producing raw material for cerium-based abrasive and raw material for cerium-based abrasive produced by the method
EP1285956A4 (en) * 2000-05-16 2004-09-29 Mitsui Mining & Smelting Co Cerium based abrasive material, raw material thereof and method for their preparation
AU2002218517A1 (en) * 2000-11-30 2002-06-11 Showa Denko K K Cerium-based abrasive and production process thereof
JP3694478B2 (en) * 2000-11-30 2005-09-14 昭和電工株式会社 Cerium-based abrasive and method for producing the same

Also Published As

Publication number Publication date
JP3875668B2 (en) 2007-01-31
CN1300278C (en) 2007-02-14
TWI249570B (en) 2006-02-21
CN1597829A (en) 2005-03-23
JP2005068312A (en) 2005-03-17

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