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TW200508271A - Phosphorus-modified epoxy resin - Google Patents

Phosphorus-modified epoxy resin

Info

Publication number
TW200508271A
TW200508271A TW093100057A TW93100057A TW200508271A TW 200508271 A TW200508271 A TW 200508271A TW 093100057 A TW093100057 A TW 093100057A TW 93100057 A TW93100057 A TW 93100057A TW 200508271 A TW200508271 A TW 200508271A
Authority
TW
Taiwan
Prior art keywords
phosphorus
epoxy resin
modified epoxy
polyepoxide
weight
Prior art date
Application number
TW093100057A
Other languages
Chinese (zh)
Other versions
TWI301841B (en
Inventor
Christian Rottlaender
Melanie Graefen
Susanne Krusenbaum
Heinz-Gunter Reichwein
Original Assignee
Bakelite Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bakelite Ag filed Critical Bakelite Ag
Publication of TW200508271A publication Critical patent/TW200508271A/en
Application granted granted Critical
Publication of TWI301841B publication Critical patent/TWI301841B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1405—Polycondensates modified by chemical after-treatment with inorganic compounds
    • C08G59/1422—Polycondensates modified by chemical after-treatment with inorganic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a phosphorus-modified epoxy resin, to a method for producing the same, and to a phosphorus-modified epoxy resin and to its use. The aim of the invention is to provide a phosphorus-modified epoxy resin that can be produced in a simple manner and that has excellent fire-retardant properties while being temperature and moisture resistant. The phosphorus-modified epoxy resin is produced by reacting at least one polyepoxide having at least two epoxide groups with, based on 100 % by weight of the polyepoxide, 5 to 50 % by weight of polyphenylene methylphosphonate having a molecular weight of 500 to 20000 g/mol at a temperature of 80 DEG C to 150 DEG, preferably 130 DEG C to 140 DEG C, and a reaction time of 0.5 to 6 hours. The reaction is substantially carried out in the melt of the polyepoxide.
TW93100057A 2003-01-07 2004-01-02 Phosphormodifiziertes epoxidharz TWI301841B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003100462 DE10300462A1 (en) 2003-01-07 2003-01-07 Phosphorus modified epoxy resin

Publications (2)

Publication Number Publication Date
TW200508271A true TW200508271A (en) 2005-03-01
TWI301841B TWI301841B (en) 2008-10-11

Family

ID=32519747

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93100057A TWI301841B (en) 2003-01-07 2004-01-02 Phosphormodifiziertes epoxidharz

Country Status (4)

Country Link
EP (1) EP1583788A1 (en)
DE (1) DE10300462A1 (en)
TW (1) TWI301841B (en)
WO (1) WO2004060957A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101679675B (en) * 2007-06-14 2013-06-05 巴斯夫欧洲公司 Flame retardant compositions
CN101831139B (en) * 2009-03-11 2013-08-28 联茂电子股份有限公司 Epoxy resin composition and film and substrate made thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004113411A1 (en) * 2003-05-22 2004-12-29 Supresta Llc Polyphosphonate flame retardant curing agent for epoxy resin
US20080057314A1 (en) * 2004-04-01 2008-03-06 Supresta U.S. Llc. Low Heat Release and Low Smoke Reinforcing Fiber/Epoxy Composites
US7910665B2 (en) 2004-05-19 2011-03-22 Icl-Ip America Inc. Composition of epoxy resin and epoxy-reactive polyphosphonate
BR112018013479B1 (en) * 2015-12-30 2023-03-07 Cytec Industries Inc MULTIFUNCTIONAL COVERING MATERIAL, COMPOSITE STRUCTURE AND METHOD FOR FORMING A COMPOSITE STRUCTURE

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2925207A1 (en) * 1979-06-22 1981-01-29 Bayer Ag THERMOPLASTIC, BRANCHED, AROMATIC POLYPHOSPHONATES, THEIR USE AND A METHOD FOR THE PRODUCTION THEREOF
CN1109702C (en) * 1995-06-27 2003-05-28 日立化成工业株式会社 Epoxy resin compsn. for printed wiring board and laminated board produced with the use of the same
DE19608611A1 (en) * 1996-03-06 1997-09-11 Hoechst Ag Phosphorus-modified coating compositions, a process for their preparation and their use
JPH1180178A (en) * 1997-09-12 1999-03-26 Hitachi Chem Co Ltd Oligomer terminated with phosphorus-containing phenol and its production
KR100904566B1 (en) * 2001-10-04 2009-06-25 슈프레스타 엘엘씨 Oligomeric Hydroxy-Terminal Phosphonates and Compositions Comprising the Same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101679675B (en) * 2007-06-14 2013-06-05 巴斯夫欧洲公司 Flame retardant compositions
TWI450921B (en) * 2007-06-14 2014-09-01 Ciba Holding Inc Flame retardant compositions
CN101831139B (en) * 2009-03-11 2013-08-28 联茂电子股份有限公司 Epoxy resin composition and film and substrate made thereof

Also Published As

Publication number Publication date
EP1583788A1 (en) 2005-10-12
WO2004060957A1 (en) 2004-07-22
TWI301841B (en) 2008-10-11
DE10300462A1 (en) 2004-07-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees