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TW200505994A - Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them - Google Patents

Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them

Info

Publication number
TW200505994A
TW200505994A TW093120364A TW93120364A TW200505994A TW 200505994 A TW200505994 A TW 200505994A TW 093120364 A TW093120364 A TW 093120364A TW 93120364 A TW93120364 A TW 93120364A TW 200505994 A TW200505994 A TW 200505994A
Authority
TW
Taiwan
Prior art keywords
multilayer printed
resin composition
thermosetting
adhesive film
forming
Prior art date
Application number
TW093120364A
Other languages
Chinese (zh)
Other versions
TWI340153B (en
Inventor
Masao Arima
Yasukazu Watanabe
Makoto Hayasi
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200505994A publication Critical patent/TW200505994A/en
Application granted granted Critical
Publication of TWI340153B publication Critical patent/TWI340153B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)

Abstract

A thermosetting resin composition and a thermosetting adhesive film for forming a resin insulation layer in a process for producing a multilayer printed wiring board by at least going through a coating or film laminating step for forming the resin insulation layer on an inner layer circuit board, a boring step and a conductor layer forming step. The thermosetting resin composition contains, as essential components, (A) polyimide resin having a linear hydrocarbon structure having a carboxyl group or an acid anhydride group and a number-average molecular weight of 300-6,000, (B) epoxy resin, and (C) an organic solvent having a boiling point of 100DEG C or above. The thermosetting adhesive film is obtained by forming a film of the thermosetting resin composition on a support base film under semicured state.
TW093120364A 2003-07-10 2004-07-07 Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them TW200505994A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003272908 2003-07-10
JP2003272911 2003-07-10

Publications (2)

Publication Number Publication Date
TW200505994A true TW200505994A (en) 2005-02-16
TWI340153B TWI340153B (en) 2011-04-11

Family

ID=34067377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120364A TW200505994A (en) 2003-07-10 2004-07-07 Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them

Country Status (4)

Country Link
JP (2) JP5214106B2 (en)
KR (1) KR101058972B1 (en)
TW (1) TW200505994A (en)
WO (1) WO2005006826A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI280043B (en) 2005-09-29 2007-04-21 Asustek Comp Inc Television capable of performing reminding function
JP4872125B2 (en) * 2006-06-28 2012-02-08 Ｄｉｃ株式会社 Curable resin composition for multilayer printed wiring board, thermosetting adhesive film, and multilayer printed circuit board
JP2008189852A (en) * 2007-02-06 2008-08-21 Taiyo Ink Mfg Ltd Thermosetting resin composition and method for manufacturing printed wiring board using the same
JP5119754B2 (en) * 2007-06-12 2013-01-16 Ｄｉｃ株式会社 Thermosetting polyimide resin composition
TWI412560B (en) * 2007-06-14 2013-10-21 Ajinomoto Kk And a resin composition for interlayer insulation of a multilayer printed wiring board
NL1037120C2 (en) 2009-07-15 2011-01-18 Holland Novochem Technical Coatings B V Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating.
JP5466070B2 (en) * 2010-04-12 2014-04-09 株式会社カネカ Bonding sheet for multilayer printed wiring boards
NL1038104C2 (en) 2010-07-14 2012-01-23 Holland Novochem Technical Coatings B V Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating.
US20130153275A1 (en) * 2011-12-19 2013-06-20 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
KR20140008871A (en) * 2012-07-12 2014-01-22 삼성전기주식회사 Epoxy resin composition for build-up insulating film, insulating film made therefrom, and multilayer printed circuit boards having the same
WO2015037555A1 (en) * 2013-09-12 2015-03-19 住友電気工業株式会社 Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board
US10662304B2 (en) 2013-12-31 2020-05-26 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
WO2016059828A1 (en) 2014-10-16 2016-04-21 味の素株式会社 Support body, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board
WO2020241899A1 (en) * 2019-05-31 2020-12-03 三菱瓦斯化学株式会社 Insulating-resin-layer-equipped substrate, and laminated body and laminated body manufacturing method using same
US20250075062A1 (en) * 2021-01-27 2025-03-06 Taiyo Holdings Co., Ltd. Resin composition, resin-attached metal foil, cured product, metal-based substrate, and electronic part

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3415144B2 (en) * 1989-12-21 2003-06-09 ロックヒード マーティン コーポレーション Epoxy / polyimide copolymer blend dielectric and multilayer circuit using the same
JP3695848B2 (en) * 1996-06-17 2005-09-14 住友ベークライト株式会社 Heat resistant film adhesive and method for producing the same
JP4560886B2 (en) * 2000-05-01 2010-10-13 Ｄｉｃ株式会社 Carboxyl group-containing amideimide resin and / or carboxyl group-containing imide resin
JP2003089784A (en) 2001-09-18 2003-03-28 Nippon Steel Chem Co Ltd Heat-resistant adhesive film for buildup substrate
JP4217952B2 (en) * 2002-01-31 2009-02-04 Ｄｉｃ株式会社 Thermosetting polyimide resin composition, method for producing polyimide resin, and polyimide resin
JP2004071827A (en) * 2002-08-06 2004-03-04 Taiyo Ink Mfg Ltd Method for manufacturing multilayer printed wiring board
JP2004333672A (en) * 2003-05-02 2004-11-25 Kanegafuchi Chem Ind Co Ltd Photosensitive resin composition and photosensitive dry film resist with favorable storage stability, and use method thereof

Also Published As

Publication number Publication date
KR101058972B1 (en) 2011-08-23
JP2011236428A (en) 2011-11-24
JPWO2005006826A1 (en) 2007-09-20
JP5564012B2 (en) 2014-07-30
WO2005006826A1 (en) 2005-01-20
JP5214106B2 (en) 2013-06-19
TWI340153B (en) 2011-04-11
KR20060056309A (en) 2006-05-24

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