TW200501437A - Optical sensor chip package - Google Patents
Optical sensor chip packageInfo
- Publication number
- TW200501437A TW200501437A TW092116795A TW92116795A TW200501437A TW 200501437 A TW200501437 A TW 200501437A TW 092116795 A TW092116795 A TW 092116795A TW 92116795 A TW92116795 A TW 92116795A TW 200501437 A TW200501437 A TW 200501437A
- Authority
- TW
- Taiwan
- Prior art keywords
- optical sensor
- sensor chip
- flexible substrate
- chip package
- contact pads
- Prior art date
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
An optical sensor chip package includes a flexible substrate, an optical sensor chip and a transparent encapsulation body. The flexible substrate has a plurality of contact pads and a plurality of terminals for making external connections, wherein the contact pads are electrically connected to the terminals. The optical sensor chip is disposed on the flexible substrate and electrically connected to the contact pads on the flexible substrate. The transparent encapsulation body covers the optical sensor chip and the contact pads of the flexible substrate, wherein the terminals of the flexible substrate are all formed on only one side of the flexible substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92116795A TWI297955B (en) | 2003-06-20 | 2003-06-20 | Optical sensor chip package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92116795A TWI297955B (en) | 2003-06-20 | 2003-06-20 | Optical sensor chip package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200501437A true TW200501437A (en) | 2005-01-01 |
TWI297955B TWI297955B (en) | 2008-06-11 |
Family
ID=45069250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92116795A TWI297955B (en) | 2003-06-20 | 2003-06-20 | Optical sensor chip package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI297955B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8249723B2 (en) | 2006-09-27 | 2012-08-21 | Huntington Medical Research Institutes | Apparatus and method for treating obstructive sleep apnea |
US11654045B2 (en) | 2018-10-18 | 2023-05-23 | Huntington Medical Research Institutes | Methods and devices for treating sleep apnea |
-
2003
- 2003-06-20 TW TW92116795A patent/TWI297955B/en not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8249723B2 (en) | 2006-09-27 | 2012-08-21 | Huntington Medical Research Institutes | Apparatus and method for treating obstructive sleep apnea |
US8359108B2 (en) | 2006-09-27 | 2013-01-22 | Huntington Medical Research Institutes | Apparatus and method for treating obstructive sleep apnea |
US8774943B2 (en) | 2006-09-27 | 2014-07-08 | Huntington Medical Research Institutes | Apparatus and method for treating obstructive sleep apnea |
US11654045B2 (en) | 2018-10-18 | 2023-05-23 | Huntington Medical Research Institutes | Methods and devices for treating sleep apnea |
US12144763B2 (en) | 2018-10-18 | 2024-11-19 | Huntington Medical Research Institutes | Methods and devices for treating sleep apnea |
Also Published As
Publication number | Publication date |
---|---|
TWI297955B (en) | 2008-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200503209A (en) | Semiconductor package | |
TW200631201A (en) | Semiconductor light-emitting device and method of manufacture | |
EP1221716A3 (en) | IC chip package | |
MY159521A (en) | Resin-sealed light emitting device and its manufacturing method | |
SG144891A1 (en) | Image sensor package with die receiving opening and method of the same | |
WO2004077508A3 (en) | Lead frame with included passive devices | |
WO2006094025A3 (en) | Fabricated adhesive microstructures for making an electrical connection | |
TW200620607A (en) | Flip chip and wire bond semiconductor package | |
TW200513766A (en) | Bonding pad structure for a display and fabrication method thereof | |
TW200727421A (en) | Package structure and fabricating method thereof | |
TW200419762A (en) | Bumpless chip package | |
TW200515549A (en) | Flip-chip LED package structure | |
TWI268628B (en) | Package structure having a stacking platform | |
TW200627555A (en) | Method for wafer level package | |
TW200725852A (en) | Build-up package and method of an optoelectronic chip | |
TW200501437A (en) | Optical sensor chip package | |
TW200737445A (en) | Chip package structure | |
TW200639983A (en) | Integrated package | |
TW563895U (en) | Thin type ball grid array package | |
WO2006023184A3 (en) | Qfn package and method therefor | |
TW200635053A (en) | Package structure (I) of image sensing device | |
TW200608277A (en) | Integrated ball grid array optical mouse sensor packaging | |
TW200605371A (en) | Integrated circuit package with improved power signal connection | |
WO2006044061A3 (en) | Die attach paddle for mounting integrated circuit die | |
TW200723551A (en) | Image sensor chip package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |