TW200413740A - Adapter for testing one or more conductor assemblies - Google Patents

Abstract

The invention relates to an adapter for testing a conductor assembly, in particular for testing a chip carrier. Such a conductor assembly has on one side contact elements which are note arranged with a high density and have a minimum spacing of e.g. 0.5 mm. The adapter has one more contact fields each with one set of contact elements, wherein with the contact elements of the contact field in each case one conductor assembly may be contacted at the contact points which are not very densely arranged. Each of the contact of this or another contact field, so that the conductor paths of two conductor assemblies are electrically connected to one another and may be tested simultaneously.

Description

200413740 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to an adapter for testing one or more conductor components. In particular, the present invention relates to an adapter for testing circuit boards and other generally plate-like non-element-type conductor assemblies. The above-mentioned conductor assembly having a chip side (such as a wafer carrier) has a plurality of contact points to be connected to an integrated circuit, and one connection side of the conductor assembly has a larger contact point to be connected to another conductor assembly. These contact points on the connection side can be arranged in a regular grid pattern. [Prior art] Known circuit board devices for testing non-components can be divided into two groups in principle. The first group includes devices with several adapters, called parallel testers, in which all contacts of a circuit board can be contacted simultaneously using one adapter. The second group includes what are called finger testers. These devices can continuously review each contact point with two or more test fingers. These testers with adapters are disclosed in the following patents, for example: DE 42 37 591 Al, DE 44 06 538 Al, DE 43 23 276 A, EP215 146B1 and DE3838413A1. The above-mentioned adapters are basically used to match circuit boards with asymmetrical contact points and to the preset basic grid of the electronic tester for testing. When testing today's circuit boards, the contact points are no longer configured in the same grid shape, so the adapter in the contact grid and the contact 3 200413740 points are also tested by different paths. The test is to test the sound of the measuring board, to form a special electric circuit, and to calculate the contact pins connected between 0 and 0 are arranged in an inclined or skewed shape. It is possible to configure a so-called translator (translator). To "translate" the contact grid into asymmetrically arranged contact points. These transfers are thus called mule-matching adapters. Regardless of the type of device, each conductor of a non-component circuit board will perform circuit interruptions in these conductor paths (open circuit test) and electrical connection tests to other conductor paths (short circuit test). Detection of low impedance and high impedance connections. Different measurement techniques are well known in open circuit testing and short circuiting. This involves testing each conductor path to see if it is shorted and branching each conductor path to see if the circuit is interrupted, so for today's circuit boards with multiple body paths, a correspondingly high number of test operations must be performed. A test circuit method is known from the European patent EP 0 508 062 B1. The circuit board to be tested is affected by a non-uniform electric field and because a measuring probe is connected to the non-uniform electricity at a contact point. The potential of the site, and this potential is compared with other test points with / or with a reference value. This method describes the electric field measurement. A further improvement of this electric field measurement is described in the EP 0 772 054 A2 case. In a further improvement of this electric field measurement, in testing a first circuit board, each conductor path is measured by an electric field measurement to test whether it is short and a resistance measurement is used to check whether a circuit is interrupted. Admittances obtained from the measured values are used as a reference guide for testing another circuit board. By using these reference admittances to test another circuit board, each conductor can be tested by 200413740 electrical% measurement. Whether the path is short-circuited and the circuit is interrupted. US patents US 5,268,645 and US 5,903,160 (which correspond to European patents EP 0 508 062 B1 and EP 0 772 054 A2, respectively), the disclosures of these patents are incorporated herein by reference. The German patent case DE 1 97 00 505 A1 discloses a method for testing a circuit board, in which many power networks and / or ground networks of a circuit board are short-circuited and a signal network with a high test voltage is compared. These networks are combined to test for short circuits. This involves first applying a high potential to the bond networks and then testing the various signal networks against the bond. In this way, the number of tests can be significantly reduced. Since these signal networks do not need to test the mother-power and / or ground networks, it will often save time due to the inclusion of high voltages. In the so-called wafer carrier test, the test device needs to have special requirements. There is a small circuit board or conductor component on one side of the chip carrier, and the chip side and the contact points can be directly connected to one or more integrated circuits without a cover, and electrically connected to the chip carrier by bonding. Contact point. Each of these contact points on the chip side is electrically connected to a contact point on the opposite side of the wafer carrier and the connection side by a conductor path. The wafer carrier may have a three-dimensional structure (refer to US Pat. No. 5,006,093). The contact points on the wafer side are generally small and closely arranged with each other. In technical terms, it is called "high-pitch". The contact points on the connection side are usually many and are generally arranged in a grid pattern. It is generally a grid in the shape of a ball grid array (BGA). The above chip carrier is exemplarily described in MC2M㊣BGA Type Multi-Chip 200413740

Modules article. This article can be obtained from the website w w w · v a 11 r ο n i c. C h. Such wafer carriers are further disclosed in U.S. Patent No. 5,066,963.

The aforementioned contact points on the wafer side of the wafer carrier have been properly constructed and are in close contact with each other, so they cannot be contacted with ordinary adapters. And the wafer carriers are produced in large quantities, so it is impossible to test the wafer carriers with a parallel tester. If a conventional finger tester is used for testing, although the contact points on the wafer side can also be contacted, it is not economical because continuous inspection and testing of all contact points of the wafer carrier take a lot of time. Therefore, in order to test the chip carriers, the industry has started to develop a special test device that can contact the connection side, and an adapter with several contact elements, and the contact elements are configured to communicate with the connection side on the connection side. The contact points of the wafer carrier correspond. Usually, the contact elements of the adapter are arranged in a predetermined grid, especially in a grid of the BGA type. On the other hand, the wafer side of the wafer carrier is connected by a large number of traversed contact fingers. These devices for testing wafer carriers can therefore incorporate parallel / finger testers. With this device, the wafer carriers can be tested with a relatively high throughput. However, these special devices are very expensive, so it is not only necessary to provide an electronic evaluation unit suitable for a parallel tester, but also an electronic evaluation unit suitable for a finger tester. At the same time, the test device can be used for various special conductor components. These wafer carriers. A device for testing non-component circuit boards is known from the US patent application US 2001/0 1 3783 A1. This device is a so-called probe section, which is for an adapter with multiple probes. The language is comparable. One of the circuit boards to be tested is placed on this probe section. The circuit board to be tested is provided with an insulation film as a test point. The probe evaluates the early element, and the unit is used for testing. There are electronic components. There is a needle bed. The plate β is included as a contact, and the combination of the various descriptions is performed.

On the probe tip film of these test heads, the insulation is wound around the & edge 4 film which can be removed to contact each needle segment. The red and red circuit board measuring pins are connected via a conversion device. Then, a parallel device is formed by the probe section, "W-to-electronic conversion electronic components and the reviewer. Μ 早 _ by the German 44 1 7 5 8OC2 electronic circuit board device" ... known in the case Home. This test fits Sun's circuit board. The U device is used to test the adapters with the type of test described here (0-d-〇f-nails). On it: The upper surface of the board is a contact pin that can be moved on the board. A functional test of 70 pieces, which is similar to a parallel / finger tester. Shetian has known that a contact area for a circuit has an adapter or an electronic tester from the German patent DE 3 8 3 8 4 1 3 A1, which is made of a conductive spring body Cushion plug.

European patent case EP 0 772 054 A2 relates to a method for connecting a finger tester, but the purpose of the adapter is not disclosed here. The present invention is based on the foregoing problems, and uses a conventional test device and a non-component-type conductor assembly (for a wafer carrier or a similar wafer carrier) to provide a simple, low-cost and fast test method. These problems mentioned above can be solved by one of the adapters described in item 1 of the scope of patent application, and other advantages will be raised in these subsidiary items. 7 200413740 [Summary of the invention] An adapter according to the present invention is used for testing one or more conductor assemblies having a plurality of conductor paths in a finger tester, wherein one side of the conductor assembly is provided with a plurality of contact points. , Which is at least a predetermined distance from the nearest neighboring contact point, so that the conductor component on this side can be contacted by an adapter, which at least includes:

At least one contact region and a group of contact elements, wherein the contact elements of the contact region are arranged in a layout corresponding to the contact points of the conductor assembly, wherein each of the contact elements of the contact region is A method is electrically connected to another contact element, and the method refers to combining the conductor paths of the conductor component / component group to form a test network, the test network being on the side of the conductor component / component group or the There are one or more contact points on the equal side that are not in contact with the adapter.

The invention thus creates an adapter that can be used to contact a conductor assembly on one side, where the conductor paths of the conductor assemblies are electrically connected to one or more conductor paths of this or another conductor assembly. The test networks thus form at least one contact point on the side of the conductor assembly (which is not in contact with the adapter), so that the test networks can be contacted by the test fingers of a finger tester . All conductor paths to be tested are part of the accessible test network on the side of the conductor assembly that cannot be accessed with the adapter. The adapter system and one or more conductor assemblies can be fixed in a finger tester, and the test networks can be inspected. As a result of this adapter, many conductor paths can be combined into several test networks. Each measurement operation 8 200413740 _ " Same as v ', there are several conductor paths, that is, the test phase in the conventional finger test state. Below, there is a considerable increase in test rate. Yu Although the adapter itself is not directly connected to the electronic evaluation unit, it can be manufactured in a simple and cost-effective manner when the parallel tester is known. It is especially useful when the contact points of the conductor assembly are arranged in a predetermined standard grid. For the above-mentioned conductor assemblies, in some cases it can even be used as a standard adapter 'without having to specifically design certain conductor assemblies. ^ According to a preferred embodiment of the present invention, the body path of the conductor component / component group is electrically connected through an adapter, and the test network is on the side or the side of the conductor: component / component group. There are at least two contact points that are not in contact with the adapter. It is possible to supply at least two contact points in a test network: perform an open circuit test of the test network by a resistance measurement method. Since the manufacturer of Sixi Conductor Assembly believes that electrical measurement is the most reliable method in the event of a high impedance circuit interruption, the conductor invasion of these conductor assemblies will be required to perform a circuit interruption test by means of resistance measurement. If the adapter is in the above-mentioned way, <, + ,. ^ t Shangjiang million type sigh meter, the conductor / material conductor path in a finger tester can quickly and easily use the resistance measurement to interrupt the path test. This does not mean that the adapters themselves are connected to the electronic evaluation. M is the test finger.1 The adapter according to the present invention can be manufactured at a lower cost and extend the field of use of the finger tester. Reduce the test time. ^ ^ 1 Compared with some conductor components with parallel testers or specific design test devices, the ancient 00 and σ use a connector with a finger tester to test. More economical way. The adapter according to the invention also allows conductors with contact points on both sides. 9 200413740 The component is tested with a single-sided finger tester. Therefore, according to the adapter, the application range of the conventional single-sided finger tester can expand the conductor assembly with contact points. With the adapter of the present invention, the different conductor paths can be electrically connected to a single test network. The connector can also provide several conductor components on an adapter, wherein the conductor paths of the body components can be connected to each other through the adapter, and the conductor paths of the components can also be connected by the adapter to form a circuit. The present invention has the same conductor set on both sides, a revolution of the invention, a single conductor, a different conductor, and a test net.

Preferably, many conductor paths can also be connected by the adapter 4 to form several test networks. Ideally, only a negative circuit is formed. It is easy to think of the so-called proximity shielding quasi-male Adjacency Criterion), that is, because the position of the $ melon in the conductor assembly will not form the conductor path of the relevant test network; conductor paths that are not part of this test network It is a boundary layer formed on the conductor assembly at another position. Because the paths are connected to each other by an adapter, the conductor paths are connected. The test network can reduce some measurement short-circuit measurement operations. Providing a minimum number of test networks also allows high test 1 without loss of time. At the same time, it only takes a few times for the test network to increase the electricity M. This principle patent case 1 97 00 5…, the full text of which is incorporated in:-Test two special. Do not use the method of electric field measurement 'the test network ^ Ml road M' and even if suitable 4 can be used The test circuit is interrupted. ^ This electrical connection is connected to a test network (Shielded some conductors, since the limit between the use of only some conductors to some voltages is described in Germany for reference. You can test the admittance one by one,

10 200413740 These test measurements can be performed with a known finger tester and the amount is not lower than a test device specifically designed for testing wafer carriers. When used for electric field measurement, the throughput can even increase. [Embodiment] An adapter according to the present invention is used for testing four wafer carriers 2, as shown in a schematic perspective view of FIG. The adapter has an adapter body 3, which in this embodiment is a non-conductive plastic sheet material. There are several through holes 4 in the adapter body 3, and each through hole can receive a contact pin 5. The through-holes are arranged in two arrays, and each array has a number of 10 × 10 through-holes. In any case, the distance from the center to the center of the two adjacent through holes 4 is 0.5 mm. The through holes 4 are regularly arranged in a rectangular grid to correspond to a ball gate array (BGA). Each of the contact pins 5 has a probe tip 6, 7 at both ends. To simplify the drawing, the contact pins 5 shown in FIG. 3 protrude from the through hole 4 in some ways. In a specific embodiment, the probe tips 6, 7 of the contact pins 5 extend only one tenth of a millimeter from the upper surface 8 or the lower surface 9 of the adapter body 3. The contact pins 5 are preferably so-called spring contacts # made of a spring element, so that the contact pins 5 can be pressed in a spring manner. The material contact pin preferably has an anti-friction agent on its longitudinal center region to ensure that the contact pins 5 do not fall out of the through hole 4. The probe tips 6 and 7 of the array of contact pins 5 in each of the two surfaces 8 and 9 of the adapter body 3 respectively form a contact area} 7 and 1 8 to contact a wafer carrier 2. 11 200413740 In the embodiment of the present invention, the above-mentioned wafer carrier 2 is-a small circuit board with a wafer side 10 and a connection phase, 17 ^, and a connection side 11 (refer to the first and small contact pins) 12ic〇ntart eh ®) ° P (〇ntact pad) is formed on the wafer side 10

The formation-plane has a ring shape of four curved sections 13. These contacts are shaped as integrated integrated circuits (not shown). A number of conductor paths 14 thus lead to the conductive hole 15 with a portion. All or at least contact = connect via a conductor path 14 to a conductive hole 15. In the q * figure, only a part of the conductor paths & 14 are shown for simplicity. These conductive holes' are formed on the wafer carrier in the form of a grid of a ball brake array ... and usually 15 the wafer side 10 extends to the connectors i. At the connection side U, each of the electrical holes 15 forms a contact point i 6 ^ The conductive holes ^ 5 are through holes with a conductive diameter (for example, less than 0.1 mm), which are all conductive Finishing of the material = coating or filling. In the area of the contact point 6, the conductive material forms a contact pin 12. The diameter of the contact point 16 is significantly larger than the length or width of the contact pin 12 on the wafer side 10 (for example, greater than about 0.5 mm). The contacts 16 are arranged in a regular grid (B G A grid) manner as described above, so they are wider than the contact pins 12 on the chip side 10, so they are easier to contact with an adapter. Because of the high density of contact points on the wafer side, these wafer carriers are generally formed as a multilayer circuit board. Because of this, the dedicated conductive hole in the wafer carrier of the above type does not always extend through all wafer carriers. Figures 1 to 4 have been simplified in this way. One typical feature of these wafer carriers is that all or at least the main conductor path is guided from the wafer side to the connection side. In the embodiment 12 200413740 of the present invention, the connection from the chip side to the connection side can be affected by the conductive holes. In the case of a non-complex wafer carrier, the conductor paths are only connected by the two contact points on the wafer side, and will not be guided to the connection side, so the number of these conductor paths is more guided than the wafer side to the connection side. Those are few.

To test the wafer carrier 2 described above, a wafer carrier 2 is placed on a set of probe tips 6 with their contact points 16 and each probe tip forms a contact area 17. Another wafer carrier 2 with its contact points 16 is placed on the probe tip 7 to form another contact area 18. The probe tips 6, 7 of the contact areas 17, 18 are electrically connected in pairs with each other via the contact pins 5, so that the contact points 16 of the two wafer carriers 2 are electrically connected in pairs with each other (as shown in FIG. 4). As shown). In one embodiment of the present invention, two pairs of wafer carriers 2 may be fixed on the adapter 1 and electrically connected to each other at contact points 16 opposite to the wafer carrier 2.

For testing, the adapter 1 and the wafer carrier 2 are set in a finger tester 20 (as shown in Fig. 7). The aforementioned finger tester 20 has a plurality of test fingers 21, and each test finger is integrated with a test electrode 22. The test electrodes 22 are connected to an electronic evaluation unit. The test fingers 21 can be moved in parallel on the upper and lower surfaces of the adapter so that the electrodes can be contacted by the contact pins 12 of the wafer carrier 2. The above-mentioned finger tester has several test fingers 21, for example, eight test fingers can be arranged on the adapter 1 and the eight test fingers can be arranged on the adapter 1 so that the two sides of the adapter 1 are arranged on the adapter 1. The wafer carrier 2 can be connected. Each test finger 21 is fixed to a slider 23, and the slider 23 can slide on a plane parallel to the surface of the adapter 1. Each of these slides 23 has a vertically aligned actuating cylinder 24, and the test fingers 21, 13 and 14740 can be rotated by the actuating cylinder 24 about the vertical axis. The test fingers 21 can also be combined with a movable device to move on the surface of the wafer carrier 2 at a correct angle, so that the contact pins 12 can contact the test electrode 22.

By the connection of the pair of contact points 16 of the adapter 1, for example, the two conductor paths 25 of the two chip carriers 2 are electrically connected to each other and are formed together with the electrical connection of the connector. (4) The adapter includes at least one of the contact pin 5 and a test network. In each case, the endpoints of the test network described above are formed with a contact pin 12. Since the conductor paths 25 of the chip carrier are not branched, the above-mentioned test network usually has two ends. The two ends and the corresponding contact pins 12 can be synchronized with each other by one of the test electrodes 22. If a measurement current can be applied to the test network by the test electrode 22 to determine the resistance of the test network, and then the measurement result can be used to determine whether the two conductor paths 25 of the two chip carriers 2 have a circuit interruption. This is equivalent to the conventional resistance measurement method used to test whether the circuit is interrupted. Therefore, by coupling the two-chip carrier with the adapter, in any case, it will be possible to test the conductor path 25 on the two-chip carrier with a single measurement for a circuit interruption. The adapter itself is not connected to the electronic evaluation unit. During the test operation, the test networks are only connected to the electronic evaluation unit via the test fingers 21. When measuring a short circuit by resistance measurement, in any case, a test electrode 22 can be used to contact the adjacent test network and measure the resistance between two adjacent test networks. Here, two pairs of conductor paths 25 are performed at the same time test. The adaptor 1 using the present invention can be tested in a conventional finger tester. 14 200413740 These wafer carriers are tested, in which at least two wafer carriers are tested simultaneously in a test operation. The throughput of the wafer carrier to be tested can be matched with the special test device with an adapter and a test finger as described in the first two. 2 Another embodiment of the present invention-the adapter is shown in the 5th and 6 Figure. & The device 1 has its adapter body 3, which is a multilayer circuit board. On the surface of the connector body 3, in addition to the above-mentioned contact protrusions made of the above-mentioned electroconductive rubber material, it can also be used as: guiding these contact protrusions 26, 27 to form two contact areas 17, 18 at a time. The contact areas of the iso-convex protrusions 26 27 are positioned corresponding to an array of the contact points 16 of the crystal body 2 to be tested, so that each contact contacts a contact point 16. In one embodiment of the present invention, the contact bumps 26 of the two contacts P 17, 18 are equal to the contact position. Λ corresponds to the matrix of the BGA as the mating hammer 1 Α 28 of the contact area 17 is connected to the 嗲 u contact convex # 26 is a matrix of the number of nets in the contact area 18 of the "King Mumu Wang" via the electrical conductor path.甬 ... the convex part 27, that is, the same number of rows and columns, and the old known m father Jia described the contact area in each contact area 1, 7, 18 ", 18 pairs of contact: the piece J as in the lower left corner of Figure 6 . The upper part is placed in the contact area in the same arrangement. Two: The contact has a considerable influence on the same type of conductor path of the wafer carrier. The conductor paths 14 of these types are made together: they are electrically connected to each other. As the same pair of miscellaneous works, try (that is, contact the chip carrier 2 < corresponding contact pin 12 to perform a test algorithm. Open circuit test), so it will greatly simplify except to connect the pair of contacts 17, Conductor 15 of the contact element of 18 200400740 path 28, the adapter has one or more conductor paths 29 (as shown in FIG. 6) as antennas 29 for the electric field measurement step. The electric field measurement procedure is described in detail in European patent cases EP 5 0 0 6 2 B 1 and EP 7 7 2 0 5 4 A 2. To perform a non-uniform electric field measurement, an antenna 29 is generally used, and the potential obtained in the test network can then be connected by the test finger 2 ^. By comparison with another test network and / or a reference value, it can be determined whether the test network is shorted. This electric field measurement can be used for short-circuit testing only with the test samples of the test network involved.

If the channels of each test network can be used as a reference, in accordance with the method of conforming to the European patent EP 0772 054 A2, only a single test sample in the required test network can also be used to determine whether the electric field measurement method is used. Power interruption. • Kissing and finding a network containing two chip carriers 2 and at least two conductor paths, one can leave θ and test at least two conductor paths simultaneously. Because the electric field measurement method 4 ^, J method only uses a single test network to test whether the circuit is interrupted and / or short-circuited, and the mother-test sample simultaneously tests multiple conductor paths. This means to test

Measure 1 Η μ # μ #] The processing amount of 日 日 片 carrier 2 has a considerable increase compared to the special dream of the conventional / P5 Jie type dian tablet carrier1.

According to the transition described in the invention B ', the embodiment of the month II text, in the case of pull, these contact areas are scarcely connected to each other. When the chip carrier forms a circuit board, the contact elements of 8 are connected to each other in pairs. There are several wafer carriers provided on the board. 1 It is customary to provide five or ^ on a circuit board, which is the so-called application. For example, it is convenient to provide one adapter for such an application. In this case, the parent-application is designated in a contact area, and the contact elements corresponding to the 16 200413740 contact areas are electrically connected to each other in the aforementioned manner. Since circuit board manufacturers usually require resistance measurement to test whether the circuit is interrupted, in practice, this method preferably includes a resistance measurement method and an electric field measurement method to test whether the circuit is interrupted or shorted. In order to test whether the circuit is interrupted, all the endpoints of the test networks must be contacted at least once, and each test network must be tested once when the short circuit is tested, in order to test the diversity of the conductor paths simultaneously on various applications or on the chip carrier. Possibility.

Fig. 8 shows another adapter, which has a similar design to the adapter shown in Figs. The adapter 1 has an adapter body 3 on a circuit board. The surface of the adapter body 3 is configured as a number of contact protrusions 30, which are made of conductive rubber material. These contact protrusions form a single contact area 31, each of which is positioned to correspond to the configuration of the contact points of the wafer carrier 2 to be tested, so that a contact point 16 under any circumstances Each of the contact protrusions 30 can be contacted. In the embodiment of the present invention, the contact protrusions 30 are arranged in a 10 × 10 array corresponding to a BGA.

In this embodiment, in the columns of each array, the contact protrusions 30 are connected to each other by the conductor paths 32. In each case, the conductor path 32 is connected to each of the second contact protrusions of one or more of the rows. Two conductor paths 32 are provided for one row of the contact protrusions. The above-mentioned conductor assembly may be formed directly on the surface of a sample circuit board in the form of a multilayer circuit board for this purpose. In the embodiment of the present invention, the five contact protrusions 30 are electrically connected to each other. This means that the five conductor paths of the chip carrier 2 and all contact points 16 to be connected by a conductor 17 200413740 path 14 are connected. Can be electrically connected to each other. The above adapter can be used to test a wafer carrier 2 having a plurality of contact points 16 on a connection 11 (which is configured in a standard grid layout). This means that the adapter can be used for different wafer carriers 2, and the grid pattern of the contact points 16 is consistent with the layout of the contact protrusions 30. This means that in principle, do not design a new adapter for a wafer carrier so that it can be tested in a finger tester, and the layout of the contact points 16 of the wafer carrier 2 is standardized and aligned with the The layouts of the contact protrusions 30 of the adapter 1 match. Of course, it is also possible to interconnect the contact protrusions 30 in different ways. For example, the contact protrusions of different columns may be electrically connected to each other, or electrically connected to each other. The number of the contact protrusions may be more or less. It is also quite advantageous to provide several contact areas 31 on an adapter. In the contact area, the contact elements (here, the contact protrusions 30) are electrically connected to each other, and each contact element in different contact areas can also be For example, in the adapter shown in FIG. 8, each of the conductor paths 32 can be electrically connected to the corresponding conductor path in a corresponding contact area. Figure 9 is a schematic and very simplified representation of the conductor path of a wafer carrier 2, each of which is directed from the wafer side to the connection side. With the adapter in Figure 8, the second conductor diameter of one of the conductor paths is electrically connected. The two test networks 33, 34 are shaped in each column to form another conductor path of a test circuit between two adjacent conductor paths of a test network. This will ensure that two adjacent conductor paths of one test network will not form a short circuit, and the other conductor path of the other test network will not be short circuited because it is arranged between the two conductor paths. This series is described on the side of the figure. The other example is the road-shaped network, which is adjacent to the network. 18 200413740 Shielded Adjacency Criterion, so each conductor circuit is the nearest one from the same test network. Shielding of the conductor path. The test network formed in this way can ensure that any short circuit between the conductor paths in the chip carrier can be detected by a short circuit test between the relevant test networks (each of which includes multiple conductor paths). In the adapter according to FIG. 8, five conductor paths are connected to each other. Of course, more conductor paths can also be connected to each other so as to form at least 50 conductor paths. Ideally, all conductor paths are connected to form only two test networks, so only a single measurement is required to test whether the chip carrier is shorted. In a simpler embodiment, if the purpose is to provide a longer, branched conductor path on the wafer carrier, such as a power or ground conductor path, to connect these longer conductor paths to each other, to obtain relative to other conductors. Router is a larger test network for independent testing. Then, for example, a high test voltage can be applied to the test network, and all other conductor paths to be tested can be applied to the high voltage in a short time. Please refer to the German patent DE 1 97 00 505 A1 for related references. Fig. 10 shows another adapter according to the present invention, which is similar to the design shown in Fig. 3, and the same parts are given the same reference numbers. The adapter 1 is an array with four 10 × 10 through holes 4, each supporting a contact pin 5. Eight contact areas are formed in seasons to support eight wafer carriers 2. Adjacent to each adapter body 3 is an antenna board 35 with a cable 36 on each antenna board as a possible application for the antenna board. The antenna board 35 has a plurality of through holes as channels for the contact pins 5. The antenna can be formed in the antenna plate 3 5 as a vertical extension of all days 19 200413740 The needle and the four holes of the needle are all contact with the screw and are connected to the contact layer of the plate 3 5 and are insulated only in the area of the through hole. To accommodate such contacts 5. However, the antenna may have a complicated structure. The adapter shown in FIG. 10 also has two calibration plates 37 having the same outer dimensions as the adapter body 3 and the wire plate 35. These calibration plates 37 have apertures 38, which are slightly smaller than the shape of the wafer carrier 2 to be measured. The lower part of these diameters 38 is slightly reduced to form a continuous inwardly protruding continuous boundary plate 39 at each aperture 38, and the wafer carrier can be inserted into each aperture 38, and the end of the crystal carrier is suitable for the Boundary plate 3 9. The calibration plate 37, the antenna plate 35, and the adapter body 3 have corresponding holes 40, and the holes are screw connection devices 41 (such as suitable bolts or nuts). The calibration plate 37 and the connector body and the antenna plate 35 are fixed between them and clamped to each other to form a group. At the same time, each wafer carrier is pressed by the calibration plate 37 to the corresponding connection area. The screw-shaped connection device 41 represents a clamp device. These clamp devices are evenly distributed on the surface of the adapter, so the adapter is subjected to a uniform load. The adapters for clamping the wafer carriers by the quasi-plates 37 are components fixed in the zigzag test β and tested. In the finger tester itself, other fixing devices are required to support the adapter and the wafers. Convenient clamping components can also be used without using the aforementioned screw connection device 41. Tian ..., there is also a solid g * gull device (which is formed directly on the adapter) without the need to use a calibration plate 37 and a screw connection assembly 20 200413740 and 41. A die-formed surface a # Fei Gu Pei Zhi, which has a corresponding pressure plate in the finger tester. ^ Since the Dowow & field conductor assembly is clamped to the adapter, the strength must be tested, and only some of the pre-tested conductor assemblies and adapters are tightly combined There are more M, and then the conductor components of other groups are clamped and tested. The physical problem of high stress formation due to simultaneous clamping of all applications ☆ This is particularly suitable for the testing of multiple conductor components formed on-circuit boards, so-called applications. When testing a circuit board with many applications, it is more convenient to use only one column of t to the adapter. If this is the case, there is no need for a calibration board and two "tongs horizontal #", each of which is configured to abut the circuit board Both sides of the row of applications are clamped to the adapter body. ~ "Another method of a circuit board with Dou Xi application is to provide an adapter that can be used to test only one or very few applications, in other words < This adapter has only one or a few contact areas. The adapter is pressed to the-side of the circuit board by an appropriate mechanism so that the adapter can reach the 纟 and perform related measurement operations. After the measurement operation is completed, A will move it to a short distance from the circuit board, and perform another measurement operation by switching to another application according to the pressed ^. The adapter Press to select # between each application or a few application groups.当然 Of course, within the scope of the present invention, it is also possible to replace the conductor path formed on the wafer carrier with an X line. This can be used as a source and used for wafers. When there are large and branched conductor paths, for example, ^ t is used for power supply and ground conductor paths. Horse: ¾ pick up 21 200413740

The adapter according to the present invention has been explained in detail in the foregoing and the embodiments of the test wafer carrier. However, the adapter according to the present invention can also be used not only to test the wafer carrier, but also to test any type of conductor assembly having contact points on one side (referring to the fact that the contact points on one side are not closely arranged with each other and, for example, have at least 0.5 mm), and the contact point on the other side can be formed in any way. Since the above-mentioned contact points can be contacted by the test finger without difficulty, the contact points can be very small and close to each other. The adapter and the finger tester according to the present invention can also test a wafer carrier having a three-dimensional shape in a wafer-side region. The invention can be briefly summarized as follows:

The present invention relates to an adapter for testing a conductor assembly, and is particularly useful for testing a wafer carrier. The above-mentioned conductor assembly has contact elements on one side, and its configuration is not high-density and has a minimum pitch of about 0.5mm. The adapter has at least two contact areas, and each contact area has a group of contact components. The adapter contact area These contact elements can be in contact with non-closely arranged conductor components. Each contact element in the contact area is electrically connected to a contact element in another contact area, so that the conductor paths of the two conductor assemblies can be electrically connected to each other and can be tested simultaneously. [Brief Description of the Drawings] The present invention is described in detail with an exemplary example and a diagram of a power port, wherein: Fig. 1 is a perspective view of two wafer carriers, which are respectively the side view directions of the wafer side and the connection side. Figure 2 is a diagram of the wafer carrier of Figure 1 with only contact points, conductor paths, 22 200413740 conductive holes, and the edge boundary. Fig. 3 is an adapter having a wafer carrier according to Figs. 1 and 2 according to the present invention. Figure 4 is the contact pin array of the adapter and the wafer carrier of Figure 3. Figure 5 is a perspective view of another adapter according to the present invention.

Figure 6 is the adapter of Figure 5, showing the conductor paths (in plan view) of the adapter. Fig. 7 is a finger tester in which an adapter according to the present invention is used. Figure 8 is a plan view of another adapter according to the present invention. Figure 9 illustrates the configuration of the conductor paths of a wafer carrier interconnect in a more simplified form. Fig. 10 is a perspective view of an adapter on which the wafer carriers are fixed.

[Simple description of component representative symbols] 1 Adapter 2 Wafer carrier 3 Adapter body 4 Through hole 5 Contact pin 6, 7 Probe tip 8, 9 Surface 23 200413740 ί Wafer side 11 Connection side 1 2 Contact pin 1 3 Bend Segment 1 4 conductor path 1 5 holes 1 6 contact points 17, 18 contact area φ 2 0 finger tester 21 test finger 22 test electrode 23 slider 24 actuating cylinder 2 5 conductor path 26, 27, 30 contact protrusion 28 32 conductor path 29 antenna 31 contact area 33 > 34 test network 3 5 antenna board 3 6 cable 3 7 calibration plate 3 8 aperture 3 9 boundary plate 24 200413740 40 through hole 4 1 screw connection

25

Claims (1)

200413740 Patent application scope: 1. An adapter for testing one or more conductor components (2) with several conductor paths in a finger tester, wherein one side of the conductor component / component group ( 1 1) has a plurality of contact points (1 6), which are arranged at least a predetermined distance from the nearest contact point, so that this side of the conductor assembly can be contacted by an adapter, wherein the adapter The device (1) has at least one contact area (17, 18) provided with a set of contact elements (6, 7; 26, 27), and the contact elements (6, 7; 26) of the contact area (17, 18). , 27) are arranged in a pattern corresponding to the contact points (16) of the conductor assembly, and the contact elements (6; 26) are in each case electrically connected to another contact element (7; 27), the method is to combine the conductor paths of the conductor component / component group into several test networks, and the test networks have at least one contact on the side or the sides that are not in contact with the adapter Point 2 · The adapter described in item 1 of the scope of patent application, characterized in that these test networks Having at least two contact points on the conductor side or those sides of the contacts of the adapter assembly / assembly of the group. 3. The adapter according to item 1 of the scope of patent application, characterized in that the adapter (1) has at least two contact areas (17, 18), and each contact area has a set of contact elements (6, 7; 26, 27), and at least several contact elements (6; 26) of one of these contact areas (17) 26 200413740 are in each case electrically connected to the other contact area (18)-contact element (7; 27). The adapter according to item 2 of the patent scope, characterized in that the adapter 至少 has at least two contact areas (17, 18), and the-contact area has-a group of contact elements (6, 7; 26, 27 ), And at least several contact elements (6; 26) of one of the contact regions 电 are in each case electrically connected to a contact element (7; 27) of the other contact region (18). 5. The adapter according to item 3 of the scope of patent application, characterized in that all contact elements (6; 26) of one contact area (17) are connected in pairs to the other contact area (18) Element (7; 27). 6. The adapter according to item 4 of the scope of patent application, characterized in that all contact elements (6; 26) of one contact area (17) are connected in pairs to the contacts of another contact area (18) Element (7; 27). The adapter as described in item 3 of the scope of patent application, characterized in that the contact elements (26, 27) of each contact area (17, 18) are connected to each other in a way 'this way is in each case One of the contact elements (26) of the contact region (17) and one of the contact elements (27) of the other contact region (18) are formed by a certain point of the contact region (17) and the other contact region (18). The corresponding points are electrically connected. 27 200413740 8 · The adapter described in item 6 of the scope of patent application is characterized in that the contact elements (26, 27) of each contact area (17, 18) are connected to each other in a manner that is based on In each case, a contact element (26) of one contact region (17) and / a contact element (27) of another contact region (18) are connected to the other contact region (17) at a certain point of the contact region (17). 18) The corresponding points are electrically connected. 9 · The adapter according to item 1 of the scope of patent application is characterized in that the contact elements (30) of the contact area (31) are another contact element (30) electrically connected to the contact area (31) ). 10. The adapter according to item 8 of the scope of patent application, characterized in that the contact elements (30) of the contact area (31) are another contact electrically connected to the contact area (31) Element (30). 1 1. The adapter according to item 9 of the scope of patent application, wherein the contact elements are electrically connected in pairs with each other. 1 2 · The adapter according to item 10 of the scope of patent application, characterized in that the contact elements are electrically connected in pairs with each other. 1 3 · The adapter described in item 1 of the scope of patent application, characterized in that the several contact elements in the contact area 28 200413740 are electrically connected to each other, so that several conductors of the type 5 conductor assembly to be tested The paths combine to form a test network. 1 4 · The adapter according to item 10 of the scope of patent application, characterized in that several contact elements in the contact area are electrically connected to each other, so that several conductor paths of a conductor component to be tested are combined to form A test network. 1 5 · The adapter according to item 1 of the scope of patent application, characterized in that the conductor component is a wafer carrier, which has a connecting side for connecting to another conductor component, wherein the special terminal on the connecting side The contact point can be contacted by an adapter, and the wafer carrier has a wafer side with a plurality of contact points (12) for connecting to a integrated circuit. 16 · The adapter according to item 12 of the scope of patent application, characterized in that the conductor component is a wafer carrier, which has a connection side for connecting to another conductor component, wherein the connection side The iso-contact point can be contacted by an adapter, and the wafer carrier has a wafer side, and there are several contact points (12) for connecting to a integrated circuit. 1 7 · The adapter according to item 14 of the scope of patent application, characterized in that the conductor component is a wafer carrier having a connection side for connecting to another conductor component, wherein the connection side The iso-contact point can be contacted by an adapter, and the wafer carrier has a wafer side with several 29 4U740 contact points (12) ^ connected to the -integrated circuit. The adapter described in item 1 of Shengu Patent Le 1 is characterized in that the contact 7G pieces (6, 7) are in each case represented by the tip of a contact pin (5). 19 · The adapter according to item 7 of the declared patent, characterized in that the contact elements (6, 7) are represented in each case by the tip of a contact pin. 20. The adapter as described in item i of the patent application range, characterized in that the contact elements (26, 27) are in the form of convex portions of a conductive rubber material. 2 1. The adapter according to item 17 of the scope of patent application, characterized in that the contact elements (26, 27) are in the form of convex portions of conductive rubber material. 200413740 In the case of the tip (6) of one of the contact pins (5), the tip (6) of the contact element of a contact area (17), and the tip (7) of the other end of the contact pin (5) ) Means one of the contact elements of the other contact area (18). See 2 4 · The adapter according to item 1 of the scope of patent application, characterized in that the adapter (1;) has an adapter body (3) with several conductor paths (28) thereon Connected to the contact elements to make them electrically connected to each other. 25. The adapter according to item 23 of the scope of patent application, characterized in that the adapter ⑴ has-an adapter body (3), which has several conductor paths only (2 8) connected to the adapter Wait for the contact elements to be electrically connected to each other. 26. The adapter according to item 1 of the scope of the patent application, characterized in that the contact points (16) for connection of these huntable-adapter are connected by a distance of at least 0 and preferably a distance. : Application: The adapter described in the patent No. 25, which is characterized in that the contact points (16) which can be contacted by the adapter are at a distance of at least 0.5 mm and preferably 1 mm. 2 8 · The adapter as described in the patent application fan map 隹 target circle item 1 is characterized in that these contact points (16) can be borrowed from an adapter of no less than 0.5mm per mu. contact. 31 413740 29. The contact point such as the adapter described in item 27 of the scope of patent application can be touched by a diameter of not less than 0.05mm. It is characterized by the adapter as the patent application scope! The adapter described in the above item may be configured with a contact point (16) for contact by an adapter, such as a spherical grid array. It is characterized by these regular patterns i The adapter described in item 29 of the scope of patent application, etc. The contact point (16), which can be borrowed by an adapter, is configured, for example, a spherical cymbal array. It is characterized by the regular grid shape. 32. As described in the patent application scope, the adapter is characterized in that the adapter has an antenna (29) to generate a non-uniform electric field. 33. The adapter described in item 31 of the scope of patent application, characterized in that the adapter has an antenna (29) to generate a non-uniform electric field. 34. The adapter according to item 1 of the scope of patent application, characterized in that the adapter (1) has several contact areas on the opposite side to support a conductor assembly in each case (17, 18) . 32 200413740 3 5 · The adapter described in item 33 of the scope of patent application, characterized in that the adapter (1) has several contact areas on the opposite side to support a conductor assembly in each case ( 17, 18). 36. The adapter according to item 1 of the scope of patent application, characterized in that the adapter (1) has a positioning device for fixing one or more conductor components to the adapter (1). 37. The adapter according to item 35 of the scope of patent application, characterized in that the adapter (1) has a positioning device for fixing one or more conductor components to the adapter (1) . 38. The adapter according to item 36 of the scope of patent application, characterized in that the positioning device has a calibration plate that can be fixed to an adapter body by a fixing device, and the positioning device has at least one Aperture, which is slightly smaller than the outer shape of the conductor component to be tested, so that a conductor component can be fixed to the aperture when a conductor component is disposed between the adapter body and the calibration plate in the aperture area, and the conductor component (2) One side that is not in contact with the adapter body is easy to access. 39. The adapter according to item 37 of the scope of patent application, characterized in that the positioning device has a calibration plate that can be fixed to an adapter body by a fixing device, and the positioning device has at least one Aperture, which is slightly smaller than the shape of the conductor component to be tested, so that a conductor component can be fixed to the aperture when a conductor component is disposed between the adapter body and the calibration plate in the aperture area, and the conductor One side of the component (2) that is not in contact with the adapter body is easy to access. 40. The adapter according to item 38 of the scope of patent application, wherein the fixing device is a screw-shaped connection. 41. The adapter according to item 39 of the scope of patent application, characterized in that the fixing device is a screw-shaped connection form. 42. The adapter according to item 38 of the scope of patent application, characterized in that the fixing device is in the form of a fast-moving clamp. 43. The adapter according to item 39 of the scope of patent application, characterized in that the fixing device is in the form of a fast-moving clamp. 44 · A method for testing a conductor component in a finger tester, which is performed by using an adapter in item 1 of the scope of patent application, wherein at least one conductor component (2) has several sides that can be connected with one The contact point of the adapter (1), wherein the contact elements (6, 7; 26, 27) of a contact area of the adapter (1) are made with the corresponding contact points of the conductor assembly (2). Electrical contact, 34 200413740 A unit component including at least the conductor component (2) and the adapter (1) is arranged in the finger tester, and the unit component can be directly used without the adapter (1). The contact points (1 2) connected to an electronic evaluation unit and the conductor component on the side not in contact with the adapter are contacted by several test fingers (2 1) to test the conductors Whether the conductor paths (14) of the component (2) are short-circuited and / or interrupted. 45 · —A method for testing a conductor component in a finger tester, which is performed by using an adapter in item 37 of the scope of patent application, wherein at least one conductor component (2) has a number of A contact point contacted by an adapter (1), wherein the contact elements (6, 7; 26, 27) of a contact area of the adapter (1) are corresponding contact points with the conductor assembly (2) Make electrical contact, A unit component including at least the conductor component (2) and the adapter (1) is arranged in the finger tester, and the unit component can be directly connected to an electronic evaluation unit without the adapter (1). , And the contact points (12) of the conductor component on the side that are not in contact with the adapter are contacted by several test fingers (21) to test the conductors of the conductor component (2) Whether the path (14) is short-circuited and / or interrupted. 46. The method according to item 44 of the scope of patent application, characterized in that the conductor paths (1 4) of the conductor 35 200413740 body component (2) are tested for resistance by measuring resistance. 47. The method according to item 45 of the scope of patent application, characterized in that the conductor paths (1 4) of the conductor assembly (2) are tested for resistance by means of resistance measurements. 48. The method according to item 44 of the scope of patent application, characterized in that the conductor paths (1 4) of the conductor assembly (2) are tested by electric field measurement to determine whether they are interrupted. 49. The method according to item 45 of the scope of patent application, characterized in that the conductor paths (1 4) of the conductor assembly (2) are tested by electric field measurement to test whether they are interrupted. 50. The method as described in item 44 of the scope of patent application, characterized in that the conductor paths (1 4) of the conductor assembly (2) are tested for resistance by a short circuit. 5 1 · The method as described in item 45 of the scope of patent application, characterized in that the conductor paths (1 4) of the conductor component (2) are tested for resistance by a short circuit. 36 200413740 52. The method as described in the scope of patent application " 4, characterized in that the conductor paths (14) of the conductor assembly (2) are tested for short circuit by electric field measurement. 53. The method as described in item 47 of the scope of the patent application, characterized in that the conductor paths (14) of the conductor assembly (2) are tested for short circuit by electric field measurement. 54. The method as described in item 49 of the scope of patent application, characterized in that the conductor paths (14) of the conductor assembly (2) are tested for electrical shorts by electric field measurement. 5 5 · The method described in item 44 of the scope of patent application, the method of soil ^ π / η *, is characterized by a Korean technology β Α with an integrated antenna (29). When performing this electric field measurement method0 The method described in item 1, characterized in that a connector (1) is used to perform the electric field measurement 56. The method described in item 0 of the method for turning an integrated antenna (29) as described in the scope of patent application No. 53, its characteristics It is because a life saver (1) is used to perform the electric field measurement. 57. If the scope of the patent application is 54th, there is an integrated antenna (29) conversion method. 0 37 200413740 5 8. If the scope of the patent application is 44, 45 or 52 to The method described in item 57 is characterized in that in each case one of the conductor paths (14) of the conductor assembly (2) to be tested is used as an antenna (29) to implement the electric field measurement method. ❿ 38