TW200400879A - Releasing film - Google Patents
Releasing film Download PDFInfo
- Publication number
- TW200400879A TW200400879A TW92114140A TW92114140A TW200400879A TW 200400879 A TW200400879 A TW 200400879A TW 92114140 A TW92114140 A TW 92114140A TW 92114140 A TW92114140 A TW 92114140A TW 200400879 A TW200400879 A TW 200400879A
- Authority
- TW
- Taiwan
- Prior art keywords
- release
- film
- item
- release layer
- aforementioned
- Prior art date
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- 229920000728 polyester Polymers 0.000 claims abstract description 59
- 239000002245 particle Substances 0.000 claims description 105
- -1 polydimethylsiloxane Polymers 0.000 claims description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 25
- 229910052710 silicon Inorganic materials 0.000 claims description 25
- 239000010703 silicon Substances 0.000 claims description 25
- 239000004575 stone Substances 0.000 claims description 22
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 7
- 238000007259 addition reaction Methods 0.000 claims description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 239000010954 inorganic particle Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 229920002050 silicone resin Polymers 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 150000001993 dienes Chemical class 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 2
- 229920001225 polyester resin Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 abstract description 3
- 230000001747 exhibiting effect Effects 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 96
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 51
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 229920000139 polyethylene terephthalate Polymers 0.000 description 20
- 239000005020 polyethylene terephthalate Substances 0.000 description 20
- 238000005259 measurement Methods 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 238000000576 coating method Methods 0.000 description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 8
- 102100039388 Polyamine deacetylase HDAC10 Human genes 0.000 description 7
- 101710107444 Polyamine deacetylase HDAC10 Proteins 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000011146 organic particle Substances 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 239000011242 organic-inorganic particle Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002685 polymerization catalyst Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- BTVWZWFKMIUSGS-UHFFFAOYSA-N dimethylethyleneglycol Natural products CC(C)(O)CO BTVWZWFKMIUSGS-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229940071125 manganese acetate Drugs 0.000 description 3
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- VDCSGNNYCFPWFK-UHFFFAOYSA-N diphenylsilane Chemical compound C=1C=CC=CC=1[SiH2]C1=CC=CC=C1 VDCSGNNYCFPWFK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000007759 kiss coating Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229910052762 osmium Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- HOPZRLCSOGMTPK-UHFFFAOYSA-N 1-(2-methylpropyl)pyrene Chemical compound C1=C2C(CC(C)C)=CC=C(C=C3)C2=C2C3=CC=CC2=C1 HOPZRLCSOGMTPK-UHFFFAOYSA-N 0.000 description 1
- BXJGUBZTZWCMEX-UHFFFAOYSA-N 2,3-dimethylbenzene-1,4-diol Chemical compound CC1=C(C)C(O)=CC=C1O BXJGUBZTZWCMEX-UHFFFAOYSA-N 0.000 description 1
- XCSGHNKDXGYELG-UHFFFAOYSA-N 2-phenoxyethoxybenzene Chemical compound C=1C=CC=CC=1OCCOC1=CC=CC=C1 XCSGHNKDXGYELG-UHFFFAOYSA-N 0.000 description 1
- KTFJPMPXSYUEIP-UHFFFAOYSA-N 3-benzoylphthalic acid Chemical compound OC(=O)C1=CC=CC(C(=O)C=2C=CC=CC=2)=C1C(O)=O KTFJPMPXSYUEIP-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- VKYUUJCJFNLIMX-UHFFFAOYSA-N 6,6,6-triphenylhexanoic acid Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(CCCCC(=O)O)C1=CC=CC=C1 VKYUUJCJFNLIMX-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 244000291564 Allium cepa Species 0.000 description 1
- 235000002732 Allium cepa var. cepa Nutrition 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- DJHGAFSJWGLOIV-UHFFFAOYSA-N Arsenic acid Chemical compound O[As](O)(O)=O DJHGAFSJWGLOIV-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- 240000001972 Gardenia jasminoides Species 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 244000018633 Prunus armeniaca Species 0.000 description 1
- 235000009827 Prunus armeniaca Nutrition 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 101100425597 Solanum lycopersicum Tm-1 gene Proteins 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229940000488 arsenic acid Drugs 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AIXAANGOTKPUOY-UHFFFAOYSA-N carbachol Chemical group [Cl-].C[N+](C)(C)CCOC(N)=O AIXAANGOTKPUOY-UHFFFAOYSA-N 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- DTPCFIHYWYONMD-UHFFFAOYSA-N decaethylene glycol Chemical compound OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO DTPCFIHYWYONMD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ONIHPYYWNBVMID-UHFFFAOYSA-N diethyl benzene-1,4-dicarboxylate Chemical compound CCOC(=O)C1=CC=C(C(=O)OCC)C=C1 ONIHPYYWNBVMID-UHFFFAOYSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000011899 heat drying method Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- VMGAPWLDMVPYIA-HIDZBRGKSA-N n'-amino-n-iminomethanimidamide Chemical compound N\N=C\N=N VMGAPWLDMVPYIA-HIDZBRGKSA-N 0.000 description 1
- SVKQJKDFMLYPSM-UHFFFAOYSA-N n'-methylpropanimidamide Chemical compound CCC(=N)NC SVKQJKDFMLYPSM-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- BOLDJAUMGUJJKM-LSDHHAIUSA-N renifolin D Natural products CC(=C)[C@@H]1Cc2c(O)c(O)ccc2[C@H]1CC(=O)c3ccc(O)cc3O BOLDJAUMGUJJKM-LSDHHAIUSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000035922 thirst Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
200400879 玖、發明說明: 【發明所屬之技術領域3 技術領域 本發明係有關脫模膜。更詳細而言,係有關一種具有 5 其表面的凹凸不會轉印在成形薄片之良好表面特性,並且 加工性良好,脫模特性亦佳脫模膜。 【先前技3 以往領域 目前脫模膜係被使用在例如樹脂薄片的成形用、黏著 10 劑脫模用、醫療用、電氣•電子零件製造用等用途,而對 於由脫模膜所成形的樹脂等成形物而言,成形物表面的平 坦化是重要的課題。由基膜所成形之成形體的品質可說是 繫於其表面的精度和品質,即,繫於脫模膜表面的精度和 品質。 15 脫模膜其本身,係在聚酯基膜上設置例如矽樹脂層之 具有脫模性的樹脂層所形成。通常,聚酯基膜中會摻合粒 子,以改善例如滑動性、捲取特性的加工適性,一般而言, 雖進行粒子的添加可改善操作性,但卻會造成基膜表面粗 糙化。若不摻合粒子以避免以上缺點而得到平坦的表面 20 性,則所製得的基膜滑動性和脫氣性將急劇惡化,且在加 工時產生皺褶,或不能捲取成圓筒狀。又,當基膜附帶有 矽的塗布層時,由於矽層覆蓋隱藏聚酯基膜表面的突出 物,更使其加工適性降低。 以往,由脫模膜所成形的成形物或成形薄片,對其表 5 200400879 面特性並未嚴格的要求,即使某種程度的粗面亦不致造成 品質上的問題,但是近年使用脫模膜之成形薄片對其表面 特性的要求非常嚴格。例如,氯化乙烯樹脂和聚胺基甲酸 酯樹脂的薄片,係將此類樹脂溶液在脫模膜上進行流塑形 5 成薄片。這些薄片,對成形面特別需要具有高的光澤性。 又,黏著膠帶用的脫模膜,由於脫模膜表面的凹凸轉印形 狀於黏著膠帶黏著劑層的表面,故例如將黏著膠帶張貼在 玻璃面時,空氣由玻璃面向黏著膠帶進入轉印形狀後的凹 部,致使不能取得美好的外觀。因此,表面需要具有嚴格 10 的平坦性。 又,電子零件之工程材料等所使用的脫模膜,對其表 面特性的要求特別高。例如,製造陶竟電容器的薄層薄片 時,係將使陶瓷粉體和結合劑分散在液狀介質之陶曼漿液 塗布在脫模膜上,製成3μηι以下非常薄的薄片。由於若使 15 薄片愈薄,則脫模膜的表面凹凸與直接成形薄片的不良率 增加愈有關聯,故對脫模膜的表面特性的要求高。又,作 為顯示器用途之工程材料使用時,由於成形薄片的薄層化 亦需要使脫模膜表面平滑化。 【發明内容】 20 發明的開示 本發明的目的係解決此類以往技術的缺點,並提供一 種具有脫模膜表面之大的凹凸不致轉印在成形薄片之良好 的表面特性,同時其加工適性優異,脫膜特性亦良好的脫 模膜。 6 200400879 本發明之其他目的及優點可由以下的說明得知。 第一 ’依據本發明,本發明之上述目的及優點,可經 一種脫模膜(以下稱為本發明的第1脫模膜)而達成,其特徵 在於包含: 5 (a)具有中心線平均粗度Ra在15nrn以下並且十點平均 粗度Rz為30〜500nm之表面的聚|旨基膜;及 (b)形成於兩述聚酯基膜的前述表面上並且厚度係前述 表面之Rz之〇_8倍以下的矽脫模層。 又,第二,依據本發明,本發明之上述目的及優點, 10可經一種脫模膜(以下稱為本發明的第2脫模膜)而達成,其 特徵在於包含: (a’)聚酯基膜,具有中心線平均粗度^^在如瓜以下並且 十點平均粗度Rz在30nm以下之表面;及 (b’)矽脫模層,形成於前述聚酯基膜之前述表面上並且 15 含有滿足下述式(1)之惰性粒子 0.3d^t^2.5d n、 …⑴ 其中d為惰性粒子的平均粒徑—係石夕脫模層的厚度 (nm), 且厚度在300nm以下。 20 【實施方式】 發明的理想實施形態 兹將本發明詳述如下。首先針對第1脫模膜加以說明。 第1脫模膜’係由聚醋基膜(a)及其表面上所形成的石夕脫 核膜(b)所構成。 200400879 該聚酯基膜(a)之聚酯,係使用以芳香族二羧酸為主的 酸成份並以脂肪族乙二醇為主的乙二醇成份之聚酯為佳。 此類聚酯實質上呈線狀,並且具有基膜成形性,尤其是熔 融成形之基膜成形性。 5 該芳香族二羧酸,可舉例如對苯二甲酸、萘二羧酸、 間苯二甲酸、二苯氧基乙烷二羧酸、二苯基二羧酸、二苯 基醚二羧酸、二苯磺基二羧酸、二苯酮基二羧酸及蔥基二 羧酸。 該脂肪族乙二醇,可列舉例如乙二醇、三甲撐二醇、 10 四曱撐二醇、五甲撐二醇、六甲撐二醇及十甲撐二醇等之 碳原子數2〜10的聚甲撐二醇,以及如環己烷二甲醇等之脂 環族二醇。 本發明中之聚酯,係以使用以對苯二甲酸烷撐酯或烷 撑'秦酸,酯為主要構成成份者為佳。 15 此類聚酯,例如聚對苯二甲酸乙二醇酯或聚乙烯-2,6- 萘酸酯為宜。應可理解的是該聚對苯二甲酸乙二醇酯包含 其中全二羧酸成份例如8 0 %莫耳以上為對苯二曱酸並且全 乙二醇成份例如80%莫耳以上為乙二醇的共聚物。同樣地 應可理解的是該聚乙烯-2,6-萘酸酯包含其中全二羧酸成份 20 例如80%莫耳以上係2,6-萘二羧酸而全乙二醇成份例如80% 莫耳以上係乙二醇之共聚物。 若為此類共聚物,則其中20%莫耳以下可為與對笨二 甲酸或2,6-萘二羧酸不同之其他的二羧酸成份。其他此類二 羧酸成份,可以為例如上述之芳香族二羧酸;例如己二酸、 8 200400879 癸二酸之類似脂環族二羧酸或例如環己烷-1,4-二羧酸之類 似脂環族二羧酸等。 又,全乙二醇成份之20%莫耳以下可以是與乙二醇不 同之其他乙二醇成份。其他此類乙二醇成份,可為例如上 5 述乙二醇;例如氫醌 '間苯二酚、2,2-二(4-羥苯基)丙烷之 芳香族二醇;1,4-二羥基二甲基苯之具有芳香環的脂肪族二 醇或聚乙二醇、聚丙二醇、聚四甲撐二醇之聚烷撐二醇(聚 氧烷撐二醇)等。 又,本發明中之聚酯亦包含將例如羥基安息香酸之芳 10 香族含氧酸,例如ω-羥基己酸之脂肪族含氧酸等取自含氧 羧酸的成份,相對於二羧酸成份及含氧羧酸成份的總量以 20%莫耳以下共聚合或結合者。 又於聚酯中,實質呈線狀範圍的量係例如相對全酸成 份為2%莫耳以下的量,且亦包含3官能基以上之聚羧酸或 15 聚經基化合物,例如三苯六叛酸,季戊四醇共聚物。 上述聚酯,其本身眾所周知,可以依其本身公知的方 法加以製造。上述聚酯係以作成正氯酚中的溶液並在35°C 進行測定取得之固有黏度為0.4〜0.9者為佳。 本發明中之聚醋基膜(a),以含有惰性粒子為佳。惰性 20 粒子的平均粒徑,以小於1 μπι為佳,0.01 μιη以上小於1 μηι更 佳,0.03μηι以上小於Ιμηι則更加理想。該惰性粒子,無論 有機粒子、無機粒子皆可,或有機粒子和無機粒子的混合 粒子亦無妨。又,惰性粒子的長徑和短徑的比(長徑/短徑) 以在1.0〜1.2者為宜。藉由摻合此類惰性粒子,可以在基膜 9 ZUU呤UUO✓7 表面形成適當的凹凸。此類惰性 舻萨鉦上Λ 生极子的具體例,可舉例如 火-夂鈣、兩嶺土、氧化矽、硫酸 ^Α _ 、乳化鈦、氧化鋁等之 …機粒子;交聯聚苯乙烯、交聯 ^ 夕树月曰粒子、交聯丙烯酸 树月曰粒子、交聯聚苯乙烯樹月旨 A4, 比卞寺之有機樹脂粒子及無 钱材料和有機材料具有殼芯構造形態的粒子。 此類惰性粒子,可以以單猶赤 词次2種以上例如3種或4種混 合加以使用。200400879 (ii) Description of the invention: [Technical field 3 to which the invention belongs] TECHNICAL FIELD The present invention relates to a release film. More specifically, it relates to a release film which has good surface characteristics such that the unevenness on the surface does not transfer to the formed sheet, and has good processability and mold release. [Prior Art 3 In the past, the release film system is currently used for, for example, resin sheet molding, adhesive 10-part mold release, medical use, and electrical / electronic parts manufacturing. For resins formed from the release film, For a molded product, planarization of the surface of the molded product is an important issue. The quality of the molded body formed from the base film can be said to be related to the accuracy and quality of its surface, that is, the accuracy and quality to the surface of the release film. 15 The release film itself is formed by providing a polyester-based film with a resin layer having a release property such as a silicone resin layer. Generally, particles are blended in a polyester-based film to improve processing suitability such as sliding properties and take-up characteristics. In general, although the addition of particles can improve the workability, the surface of the base film is roughened. If particles are not blended to avoid the above disadvantages and a flat surface is obtained, the sliding and degassing properties of the base film will be sharply deteriorated, and wrinkles will be generated during processing, or it cannot be rolled into a cylindrical shape. . In addition, when a coating layer of silicon is attached to the base film, the silicon layer covers the protrusions on the surface of the polyester base film, which further reduces the processing suitability. In the past, the surface properties of the formed article or formed sheet formed from the release film are not strictly required. Even a rough surface to some extent does not cause quality problems, but in recent years, The requirements for the surface properties of the formed sheet are very strict. For example, the sheets of chlorinated vinyl resin and polyurethane resin are formed by flow-molding such a resin solution on a release film. These sheets are particularly required to have high glossiness on the molding surface. In addition, the release film for an adhesive tape has a concave-convex transfer shape on the surface of the release film on the surface of the adhesive layer of the adhesive tape. Therefore, for example, when an adhesive tape is placed on a glass surface, air enters the transfer shape from the glass surface The rear recessed portion does not make it possible to achieve a good appearance. Therefore, the surface needs to have strict flatness. In addition, the release film used for engineering materials of electronic parts has particularly high requirements for its surface characteristics. For example, in the manufacture of thin layers of ceramic capacitors, a ceramic film and a binder are dispersed in a liquid medium, and a talman slurry is applied to a release film to form a very thin sheet of 3 μm or less. Since the thinner the 15 sheets, the more uneven the surface unevenness of the release film and the increase in the defective rate of the directly formed sheet, the higher the requirements for the surface characteristics of the release film are. In addition, when used as an engineering material for display applications, it is necessary to smooth the surface of the release film due to the thinning of the formed sheet. [Summary of the Invention] The purpose of the invention disclosed in the present invention is to solve the disadvantages of such conventional technologies and provide a surface with large irregularities on the surface of the release film that does not transfer to the good surface characteristics of the formed sheet, and at the same time has excellent processing suitability. , Release film is also good release characteristics. 6 200400879 Other objects and advantages of the present invention will be apparent from the following description. First, according to the present invention, the above-mentioned objects and advantages of the present invention can be achieved through a release film (hereinafter referred to as the first release film of the present invention), which is characterized by including: 5 (a) having a centerline average Poly-based film with a surface having a thickness Ra of 15nrn or less and an average ten-point thickness Rz of 30 to 500 nm; and (b) formed on the aforementioned surfaces of the two polyester-based films and having a thickness equal to Rz of the aforementioned surfaces 〇_8 times the silicon release layer. Secondly, according to the present invention, the above-mentioned objects and advantages of the present invention can be achieved through a release film (hereinafter referred to as the second release film of the present invention), which is characterized by comprising: (a ') a polymer An ester-based film having a surface having a centerline average thickness ^^ below Rugua and a ten-point average thickness Rz below 30nm; and (b ') a silicon release layer formed on the aforementioned surface of the aforementioned polyester-based film And 15 contains 0.3d ^ t ^ 2.5dn of inert particles satisfying the following formula (1), where d is the average particle diameter of the inert particles-the thickness (nm) of the Shi Xi release layer, and the thickness is less than 300nm . [Embodiment] An ideal embodiment of the invention The present invention is described in detail below. First, the first release film will be described. The first release film 'is composed of a polyacetate-based film (a) and a stone wicking film (b) formed on the surface. 200400879 The polyester of the polyester base film (a) is preferably a polyester using an acid component mainly composed of an aromatic dicarboxylic acid and an ethylene glycol component mainly composed of an aliphatic ethylene glycol. These polyesters are substantially linear and have base film formability, especially base film formability by fusion molding. 5 Examples of the aromatic dicarboxylic acid include terephthalic acid, naphthalene dicarboxylic acid, isophthalic acid, diphenoxyethane dicarboxylic acid, diphenyl dicarboxylic acid, and diphenyl ether dicarboxylic acid. , Diphenyl sulfo dicarboxylic acid, benzophenone dicarboxylic acid and onion dicarboxylic acid. Examples of the aliphatic ethylene glycol include ethylene glycol, trimethylene glycol, 10 tetramethylene glycol, pentamethylene glycol, hexamethylene glycol, and decaethylene glycol. The number of carbon atoms is 2 to 10. Polymethylene glycol, and cycloaliphatic diols such as cyclohexanedimethanol. The polyester in the present invention is preferably one which uses an alkylene terephthalate or an alkyl 'qinic acid, and an ester as a main constituent. 15 Such polyesters, such as polyethylene terephthalate or polyethylene-2,6-naphthoate, are preferred. It should be understood that the polyethylene terephthalate contains a total dicarboxylic acid component such as 80% mol or more of terephthalic acid and a full ethylene glycol component such as 80% mol or more of ethylene Copolymer of alcohol. It should also be understood that the polyethylene-2,6-naphthyl ester contains 20% of the dicarboxylic acid component, such as 80% mol or more of 2,6-naphthalenedicarboxylic acid, and the total ethylene glycol component, such as 80% Above Mohr is a copolymer of ethylene glycol. If it is such a copolymer, 20% or less of it may be a dicarboxylic acid component different from p-dicarboxylic acid or 2,6-naphthalenedicarboxylic acid. Other such dicarboxylic acid components may be, for example, the aforementioned aromatic dicarboxylic acids; for example, adipic acid, 8 200400879 sebacic acid-like alicyclic dicarboxylic acids, or, for example, cyclohexane-1,4-dicarboxylic acid Similar to alicyclic dicarboxylic acids and the like. In addition, 20% or less of the total ethylene glycol content may be other ethylene glycol components other than ethylene glycol. Other such ethylene glycol components may be, for example, the above-mentioned ethylene glycols; for example, hydroquinone 'resorcinol, aromatic diols of 2,2-bis (4-hydroxyphenyl) propane; 1,4- Dihydroxydimethylbenzene is an aliphatic diol having an aromatic ring or polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polyalkylene glycol (polyoxyalkylene glycol), and the like. In addition, the polyester in the present invention also contains a component derived from an oxygen-containing carboxylic acid, such as an aromatic oxo acid of hydroxybenzoic acid, such as an aliphatic oxyacid of ω-hydroxyhexanoic acid, and the like with respect to dicarboxylic acid. The total amount of the acid component and the oxygen-containing carboxylic acid component is copolymerized or combined at 20% or less. Also in the polyester, the amount in a substantially linear range is, for example, an amount of 2% or less relative to the total acid content, and also contains a polycarboxylic acid with a functional group of 3 or more or a polyacrylic acid compound such as triphenylhexanate. Acid acid, pentaerythritol copolymer. The above-mentioned polyester is known per se, and can be produced by a method known per se. The above-mentioned polyester is preferably a solution in n-chlorophenol and measured at 35 ° C to obtain an inherent viscosity of 0.4 to 0.9. The polyester-based film (a) in the present invention preferably contains inert particles. The average particle diameter of the inert 20 particles is preferably less than 1 μm, more preferably from 0.01 μm to less than 1 μm, and more preferably from 0.03 μm to less than 1 μm. The inert particles may be organic particles, inorganic particles, or mixed particles of organic particles and inorganic particles. The ratio of the major axis to the minor axis of the inert particles (major axis / minor axis) is preferably 1.0 to 1.2. By blending such inert particles, it is possible to form appropriate irregularities on the surface of the base film 9 ZUUUUUO✓7. Specific examples of Λ-producing poles on such inert saccharides include organic particles such as fire-fluoride calcium, amphibious clay, silica, sulfuric acid ^ A_, emulsified titanium, alumina, and the like; cross-linked polybenzene Ethylene, cross-linked ^ Yukiyuki-yuki particles, cross-linked acrylic-yuki-yuki particles, cross-linked polystyrene-yuki-yuki A4, organic resin particles of Hagi-ji Temple, and particles of non-money and organic materials with a shell-core structure . Such inert particles can be used in a mixture of two or more types, such as three or four, in a single word.
此類惰性粒子的添加量’相對聚自旨而言係讀〜〇.3重 量%。 又曰基膜(a),以具有所含有的惰性粒子平均粒徑 之0.1〜30倍的厚度者為宜。 聚酯層的厚度,小於平均粒徑的〇1倍時所含有之惰性 粒子容易脫落,故不理想。又,超過平均粒徑的30倍時則 聚I旨層中所含有的惰性粒子容易發生重疊,且容易在基膜 15的表面形成凹凸,故亦不理想。The addition amount of such inert particles is read to 0.3% by weight relative to the purpose of polymerization. The base film (a) preferably has a thickness of 0.1 to 30 times the average particle diameter of the inert particles contained. When the thickness of the polyester layer is less than 0.01 times the average particle diameter, the inert particles contained therein are liable to fall off, which is not desirable. When the average particle diameter is more than 30 times, inert particles contained in the polyimide layer are likely to overlap and unevenness is easily formed on the surface of the base film 15, which is also undesirable.
聚酯基膜(a),具有中心線平均粗度Ha在15mn以下並且 十點平均粗度RZ係3〇〜500nm的表面。當Ra超過15nm時, 將發生成形體表面形狀轉印。Ra以在iwBnm為宜。 又’當Rz小於30nm時,以|昆形態之捲取或與通過輥之 滑動惡化而使加工程序的操作性不良,另一方面,超過 500nm時,將發生成形體表面形狀轉印。The polyester-based film (a) has a surface having a center line average thickness Ha of 15 m or less and a ten-point average thickness RZ of 30 to 500 nm. When Ra exceeds 15 nm, surface shape transfer of the formed body will occur. Ra is preferably at iwBnm. When Rz is less than 30 nm, the operability of the processing program is deteriorated due to the winding in the form of | Kun or the sliding with the roller, and on the other hand, when it exceeds 500 nm, the shape of the surface of the molded body is transferred.
Rz以50〜300nm為宜。 聚酯基膜(a)的厚度,以1〇〜ι〇〇μπι為宜’ 25〜50μηι更 佳。 10 200400879 本發明之第1脫模膜,係在具有上述Ra及Rz之聚酯基膜 (a)的表面上,形成有後述的矽脫膜層(b),但亦可於與形成 該膜模層(b)面的反對侧表面上,設有其他之聚酯層。 其他之該聚酯層,可以與聚酯基膜(a) —併形成積層基 5 膜。積層基膜,至少可由2層所構成者,並以共押出所製造 而成者為宜。此時,構成層的聚酯相同者亦或不同者皆可, 而以相同者為宜。 積層基膜,例如若以B層、C層代表其他的聚酯層,可 以採用例如聚酯基膜(a)層/B層、聚酯基膜(a)層/B層/聚酯基 10 膜(a)層或聚酯基膜(a)層/B層/C層之類似的積層構造。 若為積層基膜,則與形成有脫模層(b)之聚酯基膜(a)層 相反侧的最外層,例如上述例中之B層及C層,宜含有惰性 粒子。此時,惰性粒子以具有0.1〜Ι.Ομηι的平均粒徑為佳。 上述積層基膜係以該包含聚酯基膜(a)層為全體的總 15 厚,且以具有10〜1 ΟΟμηι的厚度為佳,而具有25〜50μηι的 厚度則更佳。 聚酯基膜(a)及積層聚酯基膜本身,可依從過去以來眾 所周知,或者當業界所累積的方法製得。為製得雙轴定向 基膜,例如在融點(Tm : °C)〜(Tm+70)°C的溫度下將聚酯熔 20 融·共押出製得固有黏度0.4〜0.8 dl/g之未延伸基膜。接著 將該未延伸薄腊在單轴方向(縱方向或橫方向)(Tg : 10)〜 (Tg+70)°C的溫度(其中Tg :聚酯之玻璃轉移溫度)下以2.5倍 以上,且3倍以上更佳的倍率進行延伸,接著再與上述延伸 方向成直角方向丁8〜〇^+70)它的溫度下以2.5倍以上,且3 11 L以上更佳的倍率延伸處理。 或橫方向進行再度延伸。經此如亦可依需要在縱方向及/ 面積延伸倍率9倍以上為宜,12=之全延伸倍率,以作成 其理想。又,雙轴定向基膜可叫Γ更佳,15〜25倍則尤 溫度(其中Tm:聚_ _ g+7GK〜(Tm-1 〇) C的 疒盔 進仃熱固定處理,例如180〜250 為°熱固定時間以1〜60秒較佳。 時,所⑼、中由不同承知基膜所形成各層之積層基膜 °月<點及玻璃轉移溫度, π 度的融點Λ ”、了請係彳日具有較同>皿 10 者0 者。 麵轉移溫度之聚1旨為祕職玻璃轉移温度 面上形成所述,係在聚®旨基膜⑷的表 的單面或雙面上;脫模層(b)形成在聚酯基膜⑷ 15 二曱芙辟、之㈣層’宜為聚二甲基錢烧,或者以聚 成者\狀為主成份,摻合τ述⑴或⑺的成份於其中而 述(3)_之_:甲基魏烧繼下述⑺ 之加成型石夕樹脂所構成。 20 Κ—甲基秒氧燒聚合物中具有下述D單位、Τ單位及 ^早位構&之石夕樹脂。將該石夕樹脂摻合在聚二甲基石夕氧 燒中層中的甲基濃度可使表面張力增加。又, X夕树月曰的摻合比例依固體成份濃度以1〇〜6〇重量%者為 宜。樹脂摻人晉 ^ " Q夏,€10重量%以下則形成成形薄片時潤渴 性不良’沾附性不佳。又當60重量%以上其剝離力大,成 形體不能剝離。 12Rz is preferably 50 to 300 nm. The thickness of the polyester base film (a) is preferably from 10 to 100 μm, and more preferably from 25 to 50 μm. 10 200400879 The first release film of the present invention is formed on the surface of the polyester-based film (a) having the above Ra and Rz, and a silicon release layer (b) described later is formed, but the film may also be formed on the surface On the opposite side surface of the mold layer (b) surface, another polyester layer is provided. The other polyester layer may be laminated with the polyester-based film (a) to form a laminated-based film. The laminated base film may be composed of at least two layers, and is preferably manufactured by co-extrusion. In this case, the polyesters constituting the layer may be the same or different, and the same is preferred. For laminated base film, for example, if B layer and C layer represent other polyester layers, polyester base film (a) layer / B layer, polyester base film (a) layer / B layer / polyester base 10 can be used. The film (a) layer or the polyester-based film (a) layer / B layer / C layer has a similar laminated structure. In the case of a laminated base film, the outermost layer on the opposite side to the polyester base film (a) on which the release layer (b) is formed, such as the B layer and the C layer in the above example, should preferably contain inert particles. At this time, the inert particles preferably have an average particle diameter of 0.1 to 1.0 μm. The laminated base film has a total thickness of 15 layers including the polyester base film (a) as a whole, and preferably has a thickness of 10 to 100 μm, and more preferably has a thickness of 25 to 50 μm. The polyester-based film (a) and the laminated polyester-based film itself can be produced according to a method well-known in the past or a method accumulated in the industry. In order to obtain a biaxially oriented base film, for example, melting and co-extrusion of polyester at a melting point (Tm: ° C) to (Tm + 70) ° C for 20 to produce an intrinsic viscosity of 0.4 to 0.8 dl / g The base film is not stretched. Next, the unstretched wax is 2.5 times or more at a temperature in a uniaxial direction (longitudinal or horizontal direction) (Tg: 10) to (Tg + 70) ° C (where Tg: glass transition temperature of polyester), And the stretching is performed at a better rate of 3 times or more, and then orthogonal to the above-mentioned stretching direction (8 ~ 0 ^ + 70). It is stretched at a temperature of 2.5 times or more and a better rate of 3 11 L or more. Or horizontal extension. After that, if necessary, the extension ratio in the longitudinal direction and / area is 9 times or more, and the full extension ratio of 12 = is made to make it ideal. In addition, the biaxially oriented base film may be better called Γ, especially at 15 to 25 times the temperature (where Tm: poly_ _ g + 7GK ~ (Tm-1 〇) C, the heat treatment of the helmet is performed, for example, 180 ~ 250 ° is preferably 1 to 60 seconds for the thermal fixation time. At this time, the laminated base film of each layer formed by different known base films °° < point and glass transition temperature, π melting point Λ '', Please refer to those who have the same > dish 10 and 0 on the next day. The surface transfer temperature of the poly 1 is for the formation of the secret glass transition temperature surface, as described on the single or double surface of the poly® base film sheet. Surface; the release layer (b) is formed on the polyester base film. The components of osmium or osmium are described in (3) __: Methyl Weisao is made up of the following ⑺ addition and molding stone resin. 20 K-methyl second oxygen polymer has the following D units, Τ unit and ^ early structure & stone eve resin. Blending the stone eve resin with the concentration of methyl groups in the middle layer of polydimethyl silicate fire can increase the surface tension. Also, Blend ratio depends on the solid The serving concentration is preferably 10 to 60% by weight. The resin is blended with Jin Xia, and if it is less than 10% by weight, the thirst is poor when forming a shaped sheet, and the adhesion is not good. When it is 60% by weight Above, the peeling force is large, and the formed body cannot be peeled.
R D —O — 一O— 二官能性R D —O — One O—difunctional
R R T -O-Ji-O- 三官能性 ci- O 一 Q —〇—丄―〇— 四官能性 其中R代表烷基,且以曱基為佳,或代表芳香族碳化 氫,且以苯基為佳。 (2) 氧化矽填料。藉由在聚二甲基矽氧烷聚合物中摻合 氧化矽填料可以進行調整以提高脫模層中之一Si — 0H基的 濃度。又,該氧化矽填料平均粒徑以Ιμηι以下者為宜。平 均粒徑超過Ιμιη時基膜的濁度(Haze)增大,使用在需要求透 明性之用途時有困難,或在加工步驟中使基膜滑行時發生 脫模層的刮傷,故不理想。氧化矽填料的摻合比例依固體 着 成份濃度計以0.01〜1重量%者為佳。當摻合比例少於〇.〇1 重量%時的面與輥的滑行性惡化,而超過1重量%時氧化石夕 填料由脫模層刮除而脫落,故不理想。 (3) 將聚二甲基矽氧烷聚合物中之甲基的一部份以苯基 取代後之變性聚二曱基矽氧烷。由於苯基的立體阻礙,例 如抑制聚合物中一Si —O—Si —鍵周圍的回轉運動,結果脫 模層表面的甲基濃度減少,故可使其表面張力增加。又, 13RRT -O-Ji-O- trifunctional ci- O -Q —〇— 丄 —〇— tetrafunctional, in which R represents an alkyl group, preferably a fluorenyl group, or an aromatic hydrocarbon, and a phenyl group Better. (2) Silica filler. By adding a silica filler to the polydimethylsiloxane polymer, it can be adjusted to increase the concentration of one Si-0H group in the release layer. The average particle diameter of the silica filler is preferably 1 μm or less. When the average particle size exceeds 1 μm, the turbidity (Haze) of the base film increases, and it is difficult to use in applications that require transparency, or the release layer is scratched when the base film slides in the processing step, which is not ideal. . The blending ratio of the silica filler is preferably 0.01 to 1% by weight based on the solid component concentration. When the blending ratio is less than 0.01% by weight, the sliding properties of the surface and the roll deteriorate, and when it exceeds 1% by weight, the oxide oxide filler is scraped off by the release layer and falls off, which is not desirable. (3) Denatured polydioxosiloxane in which a part of the methyl group in the polydimethylsiloxane polymer is substituted with a phenyl group. Due to the steric hindrance of the phenyl group, for example, the rotation motion around a Si—O—Si— bond in the polymer is suppressed, and as a result, the methyl group concentration on the surface of the release layer is reduced, so that its surface tension can be increased. Again, 13
ZUU4UU5/V 該苯基的取代比例以在1〇〜 少於!0%莫耳時成形層 。、者為宜。该取代比例 、 易脱離,有不能塗布的情況,杏 超過60%莫耳時有造成脫楔 田 5 10 15 20 之脫模性不良,故不理想。各種黏著劑及各種薄片間 (4)使具有比較高遺庚 基的聚二甲基⑧醇絲?氧料反應活性 脂(例如醇酸樹脂、聚賴鮮和^子内具有氫氧基之有機樹 性聚二甲基石夕氧燒。該變性曰1稀酸樹脂)進行反應取得變 .„ 0/ ni ^ 重里/〇者為宜。該比例少於10 重置%時造成脫模性不良’去 印,故不佳。 田超過3〇重量科發生石夕的轉 (5)加成反應型之敌谢 夕糾,例如由導人乙烯基後之聚二 减和氫化1錢所構叙加纽應型之石夕樹 月曰:具有乙稀基之聚二甲基石夕氧垸和氫化二烯石夕烧間之比 例係,相對氫化二烯魏中之,基i g莫耳,聚二甲基 石夕氧烧中乙縣為丨力〜2.轉耳的比例為宜。 當調整脫模層中甲基的濃度,可使表面張力增加。因 此,將上逑⑴之石夕樹脂摻合於該石夕樹脂亦無妨。該石夕樹脂 的掺合比例’由取得適當的剝離力觀點而言,依固體成份 濃度丄60重量%以下為宜,〇1〜3〇重量%則更理想。 含有乙烯基之上述聚二甲基石夕氧烧,除-Si(CH3)2-基 以外另含有-SiAr2 —、— SiAr(R卜基亦無妨。其中A咖 芳香族碳化氫基’苯基則更佳。R基為烧基,曱基則更佳。 具有乙烯基之聚二甲基石夕氧燒含有一 ⑶3)—基或— 14 200400879ZUU4UU5 / V The substitution ratio of the phenyl group is less than 10 ~! 0% Mohr forming layer. Is better. This replacement ratio is easy to peel off and may not be applied. When the apricot exceeds 60% Mohr, it may cause poor wetting of the wedge field 5 10 15 20, so it is not ideal. Various adhesives and various sheets (4) Make polydimethylfluorene filaments with relatively high heptyl groups? Oxygen-reactive active lipids (such as alkyd resins, polyisocyanates, and organic tree-type polydimethylsparene oxides with a hydroxyl group in the oxidant. The denaturation is a dilute acid resin). The reaction is changed. 0 / ni ^ Zhongli / 〇 is appropriate. This ratio is less than 10 reset% caused poor mold release 'deprinting, so it is not good. Tian more than 30 weight division occurred Shi Xi's conversion (5) addition reaction type Enemy Xie Xijiu, for example, the Shixueshu type, which is composed of polyethylene dihydrogenation and hydrogenation after the introduction of vinyl, is said to have: polydimethyllithium oxygenation and hydrogenation The ratio of olefinic sintering is relative to that of hydrogenated diene succinate, sigmamor, and polydimethyl sulphur oxysintering in Yixian ~ 2. The ratio of turn ears is suitable. When adjusting the release layer The concentration of the methyl group can increase the surface tension. Therefore, it is also possible to mix the stone resin of the above resin with the stone resin. The blending ratio of the stone resin is from the viewpoint of obtaining an appropriate peeling force, The solid content concentration is preferably 以下 60% by weight or less, and more preferably 0 to 30% by weight. The above-mentioned polydimethyllithium oxide containing a vinyl group In addition to the -Si (CH3) 2- group, it also contains -SiAr2-, -SiAr (R) is not a problem. Among them, aromatic aromatic hydrocarbon group 'phenyl group is more preferred. R group is a carbyl group, and fluorenyl group is Even better. Polydimethyl sulfide with vinyl groups contains a CD3) -based or — 14 200400879
Si(Ph)2-基的情形,壓㈣分子構造的紊亂,由確保適度 的剝離力和充分的硬度觀點而言,相對—si(CH3)2一基1莫 耳,這些基則以在0.5莫耳以下者為宜。其中孙係苯基。 加成反應型之销脂,形成3次元交聯構造而成者亦無 5妨,3次元交聯構造,可以藉由使用白金催化劑使其反應而 取得。 10 15 20 又’石夕之硬化_型,除上述熱硬化型者以外,亦^ 使用紫外線硬化型及電子線硬化型之矽。 石夕脫模層的厚度,在其上解成切脫模層以在聚酿 基膜(a)表面十點平均粗度尺2之〇 8倍以下者至為重要。冬寿 術之罐時,彻旨會進人由於基膜峰子之微 部份的凹部份,結果魏層表蚊巾心料均粗度Ra和4 點平均粗度Rz降低,而笋峰工招& 、_ 作性不良和脫模層霉, 連(月面轉印)之缺點。 〜:脫模層’以含有平均粒徑隋性粒子者, 由於含有該惰性粒子而可以取得良^程内 性及黏連的改善效果。 木乍禾 本發明之第1脫模膜’石夕脫模 均粗度Ra係在15_以下且其十=表:之中心線, 500職為宜。 十』千均粗度Rz係刚、In the case of Si (Ph) 2-groups, the disorder of the molecular structure of the pinch is, from the viewpoint of ensuring a moderate peel force and sufficient hardness, compared to -si (CH3) 2-one group and 1 mole, these groups are in the range of 0.5 Those below Mo'er are preferred. The grandson is phenyl. Addition reaction type grease can also be formed by a three-dimensional cross-linked structure. The three-dimensional cross-linked structure can be obtained by reacting it with a platinum catalyst. 10 15 20 In addition to the above-mentioned heat-curable type of stone evening sclerosis, UV-curable and electron-wire-cured silicon are also used. It is important that the thickness of the release layer of Shi Xi be decomposed into a release layer on the surface of the polymer base film (a) to be ten times the average thickness of 2 × 8 times or less. When the pot of winter life is used, the purpose is to enter the concave part of the base membrane peaks. As a result, the average thickness Ra of the core material of the Wei layer surface mosquito towel Ra and the average thickness Rz of 4 points are reduced, and Tricks &, _ poor workability and mold release mold, even (lunar transfer) disadvantages. ~: The release layer 'contains those particles having inert particles with an average particle size, and the inert particles can be used to improve the internal and adhesion improvement effects. Muzhahe The first release film of the present invention, the stone mold release average thickness Ra is 15 or less and its ten = table: the center line, preferably 500 jobs. Ten "thousand average thickness Rz is rigid,
本發明之弟1脫模膜, 的和以在12nm以上者為宜 及與通過輥之滑行不良, 之黏連(背面轉印)。 兩方露出表面中心線平均粗度Ra :小於12_時,以輥形態之捲取 1生工祆之操作性不良及脫模層 15 200400879 脫模層而言在不妨害本發明之目的的範圍下可以捧合 公知的各種添加劑。該添加劑,亦可依需要例令济紫 線吸收劑、顏料、消泡劑、帶電防止劑。 本發明中,亦可在《基膜(a)和脫模層⑻之間設置接 5著層,以提高聚酯基膜(a)和脫模層(b)間之密著性。該接著 層例如可以妥適地使用珍烧結合劑。該矽烷結合劑,可列 舉以式Y-Si-域代表者。其中¥係顯示例如以氨基、環 氧基、乙烯基、甲基丙烯基、巯基等所代表的官能基,X 顯示以烷基所代表之加水分解性的官能基。上述接著層的 10理想厚度係0·1〜左右,尤其以0.02〜〇·5μηι為宜。接 著層的厚度在上述的範圍時聚酯基膜0)和脫模層(b)的密 著性良好,又設置有接著層(b)之聚酯基膜由於黏連不易操 作時不易發生障礙。 本發明中之脫模層,例如可以將含有脫模層成份的塗 15液塗布的基膜上,再經加熱乾燥處理加以塗設。該塗液的 塗布方法,公知之任意的塗工法皆可適用。該可適用的塗 布方法,可列舉例如輥塗法、板片塗布法,但未必限定於 此類的方法。用以形成塗布層之加熱乾燥,在7〇〜17〇它, 進行20〜60秒為宜。 20 接著’針對本發明之第2脫模膜加以說明。 第2脫模膜,係由聚酯基膜(a’)和其表面上所形成的脫 模膜(b’)所構成。 16 1 亥聚酯基膜(a’)之聚酯,可以使用與有關第1脫模犋所 記載之相同的聚酯。 200400879 八7基膜(〇,含有惰性粒子或不含有惰性粒子皆可。 含有惰性粒子時,可以使用與有關第1脫模膜之聚s旨基膜(a> 所記载之相同的惰性粒子。此類惰性粒子可以以單獨或2種 以上摻合使用。這類惰性粒子,相對聚醋可以依〇·2重量% 5以下予以摻合。 聚Ϊ旨基膜(a,),*有中心線平均粗度_5函以下並且 十點平均表面粗度㈣3Gnm以下的表面。中心線平均粗度 ㈣超過5_時對薄層成形薄片會損及其表面的平滑性,= 點平均表面粗度(RZ)超過30nm時其成形薄片上產生厚斑, 1〇在電子材料用途上產生電氣特性不良的情形。—〜 0·5ηπι為宜’ Rz則以3〜3〇nm為佳。 聚龜基膜(〇的厚度,以10〜1〇〇_為宜,15〜5〇帅 更理想。 本發明之第2脫模膜,係在具有上述以及以聚輯基膜 15 (a )的表面上’形成有後述㈣脫模層&,),與形成該脱模 層(b )面之反對側的表面上,具有其他之聚目旨層亦無妨。其 他此類聚6旨層,可以與酯基膜(a,)_併形成積層基膜。有關 该積層基膜,曾於第说模膜的記載予以說明,經聚酷基膜 0’)將聚酯基膜(a)取代並仍舊適用應可理解。 2〇 又,聚酯基膜(a’)及上述積層基膜,可以與有關第丨脫 模膜所記載的製造方法相同的過程加以製造。 本發明之第2脫模膜,如上所述,係於聚醋基膜⑹的 表面上形成有矽脫模層(b,)者。 矽脫模層(b’)形成在聚酯基膜(a,)的單面或雙面上皆In the present invention, the release film 1 preferably has a sum of 12 nm or more, and has poor adhesion to the sliding through the roller (back transfer). The average thickness Ra of the centerline of the exposed surfaces of both sides is less than 12_, and the poor operability and release layer 15 of a roll of roll in the form of a roll 15 200400879 The release layer is within a range that does not hinder the object of the present invention. Various well-known additives can be combined. This additive can also be used to order violet absorbers, pigments, defoamers, and antistatic agents as needed. In the present invention, an adhesive layer may be provided between the base film (a) and the release layer ⑻ to improve the adhesion between the polyester base film (a) and the release layer (b). For this adhesive layer, for example, a sintered binder can be appropriately used. The silane coupling agent may be represented by a formula Y-Si-domain. Among them, ¥ represents a functional group represented by an amino group, an epoxy group, a vinyl group, a methacryl group, a mercapto group, and the like, and X represents a hydrolyzable functional group represented by an alkyl group. The ideal thickness of the adhesive layer is about 0.1 to about 0.1, and more preferably about 0.02 to about 0.5 μm. When the thickness of the adhesive layer is within the above range, the adhesion of the polyester-based film (0) and the release layer (b) is good, and the polyester-based film provided with the adhesive layer (b) is difficult to cause trouble when it is difficult to handle due to adhesion. . The release layer in the present invention may be coated on a base film coated with a coating liquid containing 15 parts of the release layer component, and then heat-dried. This coating liquid can be applied by any known coating method. The applicable coating method includes, for example, a roll coating method and a sheet coating method, but is not necessarily limited to such a method. The heat-drying for forming the coating layer is preferably performed at 70 to 170 for 20 to 60 seconds. 20 'Next, the second release film of the present invention will be described. The second release film is composed of a polyester-based film (a ') and a release film (b') formed on the surface. As the polyester of the polyester film (a '), the same polyester as described in the first release sheet can be used. 200400879 8 7 base film (0, either with or without inert particles. When inert particles are contained, the same inert particles as those described for the poly-based base film of the first release film (a >) can be used. . Such inert particles can be used alone or in combination of two or more. Such inert particles can be blended in an amount of 0.2% by weight or less relative to polyacetic acid. Polyimide base film (a,), * with center Line average thickness _5 or less and ten-point average surface roughness ㈣ 3Gnm or less. When the centerline average thickness 5 exceeds 5_, the thin layer forming sheet will damage the surface smoothness, = point average surface roughness (RZ) When the thickness exceeds 30nm, a thick spot will be formed on the formed sheet, and 10 will cause poor electrical characteristics for the use of electronic materials.-~ 0 · 5ηπι is preferred 'Rz is preferably 3 ~ 30nm. The thickness of the film (0 is preferably 10 to 100%, more preferably 15 to 50%). The second release film of the present invention is provided on the surface having the above-mentioned and a base film 15 (a). 'Formation of the below-mentioned ㈣ release layer &,), and a table on the opposite side of the surface forming the release layer (b) It does not matter if there are other polyimide layers. Other such polyimide layers can be combined with the ester-based film (a,) to form a laminated base film. The laminated base film was described in the first film. It should be understood that it is understandable that the polyester-based film (a) is replaced by the polymer-based film 0 ') and is still applicable. 20 Also, the polyester-based film (a') and the above-mentioned laminated base film can be separated from the related The manufacturing method described in the mold film is produced in the same process. As described above, the second release film of the present invention is formed by forming a silicon release layer (b,) on the surface of the polyacetate-based film ⑹. Silicon release The mold layer (b ') is formed on one or both sides of the polyester-based film (a,).
17 200400879 可。 脫模層,以聚二甲基矽氧烷或以該者為主成份,摻合 有關第1脫模膜之脫模層的前述(1)或(2)成份者為宜,由同 樣的前述(3)或(4)之變性聚二甲基矽氧烷或同樣的前述(5) 5之加成型矽樹脂所構成。此類之中,以加成型矽樹脂為理 想。 第2脫模膜中之石夕脫模層,以具備有微小硬度測定中之 lOOmgf/μιη2以上的硬度者為宜。由於將硬度設定為1〇〇 mgf/μηι以上,以防止黏連,可以將基膜捲取成輥狀時的接 10觸面積十分的狹窄化,而可抑制剝離帶電現象。 石夕脫模層的厚度,係在3〇〇nm以下,30〜3〇〇ηηι為宜, 50〜200nm則更理想。當超過3〇〇nm造成容易引起黏連。當 小於30nm其剝離特性不安定化,剝離困難,故不理想。 本务明中之;ε夕脫模層含有惰性粒子。惰性粒子,職與 15平坦的脫模層面眾多微細的凹凸。該凹凸由於非常的微 細’凹凸的形狀由脫模膜即使轉印在成形薄片亦不致產生 缺陷的水準。由於該惰性粒子的添加,可以改善對脫模層 背面的轉印(黏連),可改善工程適性。 為該目的,惰性粒子的平均粒徑,1〜1〇〇ηηι為宜,3 20〜80nm更佳,3〜50nm則尤其理想。又,惰性粒子的長徑 和短徑的比(長徑/短徑)以l.〇〜i.2為宜。 此類惰性粒子無論有機粒子、無機粒子皆可,有機粒 子和無機粒子的混合粒子亦無妨。此類惰性粒子的具體 例,可列舉碳酸鈣、高嶺土、氧化矽、硫酸鋇、氧化鈦、 18 200400879 氧化鋁、氧化鎂、氧化锆等之無機粒子、交聯聚苯乙烯樹 脂粒子、交聯矽樹脂粒子、交聯丙烯酸樹脂粒子、交聯聚 苯乙烯樹脂粒子等之有機樹脂粒子及有機材料和無機材料 具有殼芯構造形態的粒子。尤其微細粒子的情形係以無機 5 粒子為佳。 對石夕脫模層之惰性粒子的摻合量,以0.1〜25重量%為 宜,0.3〜5重量%則更理想。添加量小於0.1時引起滑動性 及脫模層的黏連,造成脫模層之剝離特性不安定,故不理 想。當超過25重量%透明性降低,容易引起凝集發生粗大 10 凝集物故不理想。 矽脫模層有必要滿足下述式(1): 0.3d^t^2.5d ---(1) 其中t(nm)係石夕脫模層的厚度而d(nm)則係惰性粒子的 平均粒徑。 15 石夕之脫模層的度t(nm)小於0.3d時引起惰性粒子的脫 落,造成異物發生的原因,當超過2.5d時不能形成表面微 細的凹凸造成滑動性不良,產生操作和捲取性、剝離帶電 不良。 本發明之第2脫模膜,有關脫模層露出表面之突出物, 20 以滿足下述式(2)及(3)的關係者為佳。 HD52 500 個/nm2 ---(2) HD102100 個/nm2 ---(3) 其中HD5係高度5nm以上之突出物的個數而HD10係高 度1 Onm以上突出物的個數, 19 以滿足上述式者為理想。 HD5當小於500時’造成滑行性不良,並產生操作及捲 取性、剝離帶電不良故不宜。HD1〇當超過1〇〇時其形狀轉 印在成形薄片表面,造成薄片厚斑的原因故不理想。 5 又’ HD5及HD10,以滿足下述關係(2,)及(3,)者更理想。 10,000^HD5^ 1,〇〇〇 …(2,) 廳 HD10S70 "·(3,)17 200400879 Yes. The release layer is composed of polydimethylsiloxane or the main component, and it is preferable to mix the aforementioned (1) or (2) components of the release layer of the first release film. (3) or (4) is made of modified polydimethylsiloxane or the same silicone resin as (5) 5 above. Among these, the addition of silicone resin is ideal. The stone release layer in the second release film is preferably one having a hardness of 100 mgf / μm 2 or more in the measurement of micro hardness. Since the hardness is set to 100 mgf / μηι or more to prevent blocking, the contact area when the base film is rolled into a roll shape can be extremely narrowed, and peeling and charging can be suppressed. The thickness of the release layer of Shi Xi is below 300 nm, preferably 30 to 300 nm, and more preferably 50 to 200 nm. When it exceeds 300nm, it is easy to cause adhesion. When it is less than 30 nm, the peeling characteristics become unstable and peeling becomes difficult, which is not desirable. In this matter, the ε release layer contains inert particles. Inert particles, with many fine unevenness on 15 flat release levels. Since the unevenness is very fine, the shape of the unevenness is such that the defect is not generated even if the release film is transferred to the formed sheet. The addition of the inert particles can improve the transfer (adhesion) to the back surface of the release layer, and can improve processability. For this purpose, the average particle size of the inert particles is preferably from 1 to 100 nm, more preferably from 3 to 20 to 80 nm, and particularly preferably from 3 to 50 nm. The ratio of the major axis to the minor axis of the inert particles (major axis / minor axis) is preferably 1.0 to i.2. Such inert particles may be either organic particles or inorganic particles, and mixed particles of organic particles and inorganic particles may be used. Specific examples of such inert particles include inorganic particles such as calcium carbonate, kaolin, silica, barium sulfate, titanium oxide, 18 200400879 alumina, magnesium oxide, zirconia, crosslinked polystyrene resin particles, and crosslinked silicon. Organic resin particles such as resin particles, cross-linked acrylic resin particles, and cross-linked polystyrene resin particles, and particles having organic and inorganic materials having a shell-core structure. Particularly, in the case of fine particles, inorganic 5 particles are preferable. The blending amount of the inert particles in the release layer of Shi Xi is preferably 0.1 to 25% by weight, and more preferably 0.3 to 5% by weight. When the addition amount is less than 0.1, sliding properties and blocking of the release layer are caused, and the release characteristics of the release layer are unstable, so it is not desirable. When it exceeds 25% by weight, the transparency is lowered, which may cause coarsening of aggregates. 10 Aggregates are not preferable. The silicon release layer must satisfy the following formula (1): 0.3d ^ t ^ 2.5d --- (1) where t (nm) is the thickness of the stone release layer and d (nm) is the thickness of the inert particles. The average particle size. 15 When the degree t (nm) of Shi Xizhi's release layer is less than 0.3d, the inert particles will fall off and cause foreign matter. When it exceeds 2.5d, the fine unevenness on the surface cannot be formed, resulting in poor sliding properties, resulting in handling and coiling. Poor electrical properties and peeling. In the second release film of the present invention, the protrusions on the exposed surface of the release layer are preferably 20 so as to satisfy the relationship of the following formulae (2) and (3). HD52 500 pcs / nm2 --- (2) HD102 100 pcs / nm2 --- (3) HD5 is the number of protrusions above 5nm in height and HD10 is the number of protrusions above 1 Onm in height, 19 to meet the above It is ideal. When HD5 is less than 500, it is not suitable because it causes poor sliding properties, and results in poor handling, rewindability, and peeling charging. When HD10 exceeds 100, its shape is transferred to the surface of the formed sheet, which causes the sheet to have thick spots, which is not ideal. 5 'HD5 and HD10 are more preferable to satisfy the following relationships (2,) and (3,). 10,000 ^ HD5 ^ 1, 〇〇〇… (2,) Hall HD10S70 " · (3,)
本發明之第2脫模膜,其矽脫模層(b,)露出表面之中心 線平均粗度Ra係在5 n m以下且其十點平均粗度r z係在3 〇 n m 10 以下為宜。 本發明中之脫模層,在不妨害本發明目的之範圍下, 添加添加劑亦無妨。該添加劑,可以例示例如紫外線吸收 劑、顏料、消泡劑、帶電防止劑。又,亦可與脫模層另外 將該添加劑摻合在樹脂,再將該樹脂塗設在聚酯基膜(a,) 15 的表面。In the second release film of the present invention, the center line average roughness Ra of the exposed surface of the silicon release layer (b,) is preferably 5 nm or less, and the ten-point average thickness rz thereof is preferably 300 nm or less. The release layer in the present invention may be added with an additive as long as the object of the present invention is not impaired. Examples of the additive include an ultraviolet absorber, a pigment, an antifoaming agent, and an antistatic agent. Alternatively, the additive may be blended with a resin separately from the release layer, and the resin may be coated on the surface of the polyester-based film (a,) 15.
本發明中’為提高聚酯基膜(a,)和脫模膜間之密著性將 聚酯基膜(a’)進行電暈處理或在聚酯基膜(a,)和脫模層之間 設置接著層亦無妨。接著層以使用矽烷合劑者為宜。該矽 烧結合劑,可以採用與有關第1脫模膜所記載之相同的者。 20上述接著層之理想的厚度係0.005〜Ο.ίμηι程度,尤其以0.01 〜Ο.ΐμπι為宜。接著劑的厚度係在上述的範圍時聚酯基膜(a,) 與脫模層的密著性良好。 脫模層的形成可以依有關第1脫模膜所記載的方法進 行相同的過程。又,有關第2脫模膜未記載的事項可以依有 20 關第1脫模膜所記載的事項依舊或當業者自明的變更之下 予以適用應可理解。 實施例 茲列舉實施例將本發明進一步說明如下。 又,基膜之各特性值依下述的方法進行測定。 (1) 惰性粒子的平均粒徑(d) 使用島津製作所製CP-50型離心粒子尺寸分析儀 (CENTRIFUGAL PARTICLE SIZE ANALYZER)進行測定。 由所取得之遠心沈降曲線為基礎經算出各粒徑的粒子和其 存在量間之累積曲線,推測相當於百分50之粒徑,再將該 值5又疋為上述平均粒徑。(book「粒度測定技術」日刊工 業新聞發行,1975年,頁242〜247參照)。 (2) 基膜中之惰性杻子的平均粒徑與長徑/短徑比 將基膜試樣埋入環氧樹脂,以50μηι的厚度切出斷面, 再置於ΤΕΜ(穿透電子顯微鏡)測定斷面中的粒子形狀。 (3) 中心線平均粗度(Ra(nm))、HD5及HD10 接觸式測定法 中心線平均粗度(Ra)係依據JIS-B0601所定義的值,使 用(株)小坂研究所的觸針式表面粗度計(SURFCORDER SE-30C)進行測定。測定條件則依以下所述。 (a) 觸針先端半徑:2μηι (b) 測定壓力 :30mg (c) 模缝脊 :0.25mm (d) 測定長 :1.0mm 200400879 (2)中心線平均粗度Ra(nm) 非接觸式測定法In the present invention, in order to improve the adhesion between the polyester-based film (a,) and the release film, the polyester-based film (a ') is corona treated or the polyester-based film (a,) and the release layer are corona-treated. It does not matter if there is a bonding layer between them. The next layer is preferably a silane compound. As the silicon-fired bonding agent, the same ones described in the first release film can be used. 20 The ideal thickness of the above-mentioned adhesive layer is about 0.005 to 0. Ιμηι, especially 0.01 to 〇.ΐμπι. When the thickness of the adhesive agent is in the above range, the adhesion between the polyester base film (a,) and the release layer is good. The formation of the release layer can be performed in the same manner as described in the first release film. It should be understood that matters not described in the second release film may be applied in accordance with the matters described in the first release film in 20 sections, or with changes clearly understood by the practitioner. EXAMPLES The present invention will be further illustrated by the following examples. In addition, each characteristic value of the base film was measured by the following method. (1) The average particle diameter (d) of inert particles is measured using a CP-50 centrifugal particle size analyzer (CENTRIFUGAL PARTICLE SIZE ANALYZER) manufactured by Shimadzu Corporation. Based on the obtained telecentric sedimentation curve, a cumulative curve between particles of each particle size and the amount of existence is calculated, and a particle size equivalent to 50% is estimated, and the value 5 is again referred to as the average particle size. (The book "Particle Size Measurement Technology" published by Nikkan Kogyo Shimbun, 1975, pp. 242 ~ 247). (2) The average particle diameter and the major / minor diameter ratio of the inert gardenia in the base film. The base film sample was embedded in epoxy resin, and the section was cut out at a thickness of 50 μm, and then placed in a TEM (transmission electron microscope). ) The particle shape in the cross section is measured. (3) Centerline average thickness (Ra (nm)), HD5 and HD10 contact measurement method Centerline average thickness (Ra) is a value defined in accordance with JIS-B0601, using the stylus of Kosaka Research Institute Surface roughness meter (SURFCORDER SE-30C). The measurement conditions are as follows. (a) Stylus tip radius: 2μηι (b) Measurement pressure: 30mg (c) Die slit ridge: 0.25mm (d) Measurement length: 1.0mm 200400879 (2) Centerline average thickness Ra (nm) Non-contact measurement law
中心線平均粗度(Ra),係採用WYKO CORPORATION NT-2000之非接觸式表面粗度計進行測定。測定條件如以下 5 所述。 ⑷測定範圍:〇.〇462μηι (b)測定倍率:25倍 又’ HD5 ' HD10依WYKO測定數據,取得粒徑和突出 分佈並將5nm粒徑時之突出數設定為HD5,10麵粒徑時之 籲 10 突出數設定為HD10。 (4)十點平均粗度(Rz(nrn)) 接觸式測定法 十點平均粗度(RZ)係依據JIS-B0601所定義的值,本發 明中採用(株)小圾製作所之觸針式表面粗度計 15 (SURFC〇RDER SE-30C),由所取得之數據的斷面曲線只抽 取基準長的部份中,顯示第5號為止之山頂標高的平均值與 由最深至第5號為止之谷底標高的平均值間之差的值。 · 非接觸式測宗法 十點平均表面粗度Rz,係採用WYKO CORPORATION 20 NT-2000之非接觸式表面粗度計進行測定。測定條件如以下 所述。 ⑻測定範圍:〇.〇462μηι (b)測定倍率:25倍 即便任何一種的測定法,亦由所取得之數據的斷面曲 22 200400879 線僅抽取基準長的部份中,顯示第5號止之山頂標高的平均 值和由最深至第5號為止之谷底標高的平均值間之差的值。 (5) 石夕的膜厚測定(Tsi(nm)) 將脫模膜的斷面經微切片機割斷,再將所取得的試料 5 置於TEM經觀察,進行測定矽層的厚度。 (6) 操作性 動摩擦係數pS : 將脫模膜2枚重疊置於玻璃板上,再將重疊後基膜的下 側(與玻璃板接觸的基膜)基膜以定速輥拉離,並將檢驗器固 10 定在上側基膜的一端用以檢驗基膜/基膜間的拉伸力(F)。 又,基膜上添掛200g/50cm2的負重(P)。 pS=F(g)/P(g) pS=l以下操作性良好 ◎ 以上2以下操作性可能 〇Centerline average roughness (Ra) is measured using a non-contact surface roughness meter from WYKO CORPORATION NT-2000. The measurement conditions are as described in 5 below. ⑷Measurement range: 0.0462 μηι (b) Measurement magnification: 25 times HDI HD10 according to WYKO measurement data, obtain particle size and protrusion distribution, and set the protrusion number at 5 nm particle size to HD5, 10 face particle size Call of Prominence 10 is set to HD10. (4) Ten-point average roughness (Rz (nrn)) The ten-point average roughness (RZ) of the contact measurement method is a value defined in accordance with JIS-B0601. In the present invention, a stylus type manufactured by Kogyo Co., Ltd. is used. Surface roughness meter 15 (SURFCORDER SE-30C), only the length of the reference length is extracted from the section curve of the obtained data, and the average value of the summit elevation up to No. 5 and the deepest to No. 5 are displayed. The value of the difference between the mean values of the trough bottom elevations. · Non-contact measurement method The ten-point average surface roughness Rz is measured by a non-contact surface roughness meter of WYKO CORPORATION 20 NT-2000. The measurement conditions are as follows. ⑻Measurement range: 0.0462 μηι (b) Measurement magnification: 25 times Even if any kind of measurement method is used, the section curve 22 of the data obtained is obtained from the 200400879 line. Only the length of the reference length is displayed, and No. 5 is displayed. The value of the difference between the average of the peak elevation and the average of the valley bottom elevation from the deepest to the fifth. (5) Film thickness measurement (Tsi (nm)) of Shi Xi The section of the release film was cut with a microtome, and the obtained sample 5 was placed in a TEM and observed to measure the thickness of the silicon layer. (6) Operational dynamic coefficient of friction pS: Put two release films on the glass plate, and then pull the base film under the base film (the base film in contact with the glass plate) after the overlap, and pull it away at a constant speed, and The tester is fixed at one end of the upper base film to test the tensile force (F) between the base film and the base film. In addition, a load (P) of 200 g / 50 cm 2 was placed on the base film. pS = F (g) / P (g) pS = 1 or less Good operability ◎ Operate more than 2 or less is possible.
15 pS=2以上操作不能 X 黏連: 將脫模膜捲取1000成輥狀,60°C XI個月之老化後,目 視基膜的脫模面和其背面之黏貼現象依下述基準加以評 價。 20 〇:無黏連現象 X :有黏連現象 剝削性: 將基膜表面以黑色擊用紙磨耗,目視白霧狀的發生並 依下述基準加以評價。 23 200400879 〇:無白霧現象 X :有白霧現象 (7)硬度的測定 硬度的測定係使用(株)工U才二夕又社製 5 ΕΝΤ-llOOa’直接測定脫模層膜的硬度。測定係置於添掛有 2mgf負重之三角錘壓頭,由脫模層的變形量,算出其硬度。 實施例1 致準備裝對本一甲酸乙二醇酯A及B,將聚對苯二甲酸 乙一醇fe A使用於s又置有脫膜層側的層,而將聚對笨二甲酸 10乙二醇酯B使用在另一方的層,製造成由2層構造之積層聚 西旨基膜。 首先,將對苯二甲酸二甲醋和乙二醇,使用醋酸錳作 為醋交換催化劑,使用三氧化錄作為聚合催化劑,使用亞 鱗酸作為安定劑,並摻合平均粒子㈣1μπι之氧化石夕〇 3%wt I5作為滑劑的惰性粒子,依常法進行聚合,製得固有黏度(鄰 氯酚’35°C)〇.62的聚對笨二甲酸乙二醇酿A。 取代氧化破,摻合平均粒子徑〇 之交聯石夕粒子 (長徑/短徑=1.05)〇 〇5重量%和平均粒子徑卿之氧化 I呂粒子〇.4重夏%作為滑劑的惰性粒子,其他則與上述聚對 2〇笨二甲酸乙二醇脂A以同樣的方法,製得聚對苯二甲酸乙二 醇酯B。 將這類來對笨—甲酸乙二醇酷的顆粒在17代經3小時 f燥後供給2台押出機料斗,在熔融溫度·〜3贼進行溶 ^使用多官型押出模使其積層,押出在表面加工〇上程 24 200400879 度表面,皿度20C之回轉冷卻鼓上,製得厚度別哗之未 延伸2層積層基膜。 將、工該過所取得之未延伸積層基膜在乃。〔預敎,又 在低速、高速之輥間離15_上方安置一具9〇代表面溫度 5之IR加熱器進行加熱延伸成36倍,急冷,接著供給擴幅 機,在105°C下橫方向延伸成3 9倍。再將所取得之雙轴定 向基膜在205 C的溫度下進行5秒間熱固定,製得厚度%降 (設置有脫模層側的聚醋八層的厚度36_,與該反對側的聚 醋B層的厚度2μιη)之熱固定雙袖定向積層聚醋基膜。 1〇 #於該基膜上,將聚二甲基梦氧烧和二甲基氫化二烯 石夕烧的混合溶液添加白金催化劑產生加成反應類型之硬化 型矽(k越矽(株)製KS-847(H))使其溶解於甲基乙基甲酮、 異丁酮及甲苯的混合溶劑中,製成全固體成份濃度3重量% 形成的溶液,經使用常法之輥塗布法,製得而成塗布後乾 15燥膜厚551101之脫模膜。加熱乾燥,係置於160。(3進行30秒。 兹將該脫模膜的特性顯示在表1。 實施例2 將實施例1中摻合於聚對苯二甲酸乙二醇酯的惰性粒 子變更成〇.12重量%平均粒徑徑〇·3μηι的交聯矽粒子;聚對 20 苯二曱酸乙二醇Β,則變更成未摻合有惰生粒子者。將該聚 對苯二曱酸乙二醇酯製成Α/Β/Α的構成,而置於多管壓模進 行共押出加工,並經調整押出量使厚度構成形成Α/Β/Α=2 μηι/34μηι/2μηι。又脫模膜製成77nm。除此之外,與實施例1 依同樣的方法,製得脫模膜。 25 200400879 實施例3 只使用實施例2中所使用的聚對苯二甲酸乙二醇酯A, 製作38μιη的基膜,脫模層則製成為77nm。除此以外則與實 施例2以同樣的方法,製得脫模膜。 5 比較例1 將對苯二甲酸二甲酯和乙二醇,使用醋酸錳作為酯交 換催化劑,使用三氧化銻作為聚合催化劑,使用亞磷酸作 為安定劑,依常法進行聚合,製得固有黏度(鄰氣酚,35°C) 之聚對笨二甲酸二乙醇酯。聚對苯二甲酸乙二醇酯中摻合 10 平均粒徑1 · 7 μ m之氧化矽0.0 5重量%作為滑劑之惰性微粒 子,製得單層的基膜,並將脫模層的厚度設定為98nm,除 此以外與實施例1以同樣的方法,製得脫模膜。 比較例2 將比較例1之惰性粒子以平均粒徑0· 1 μηι的粒子取代以 15 外與比較例1依同樣的方法,製得脫模膜。 比較例3 係於實施例1中所製得之基膜上塗布成矽脫模膜厚為 200nm以外則依同樣的方法,製得脫模膜。 26 200400879 表115 pS = 2 or more can not be X-adhesive: take the release film 1000 rolls, roll at 60 ° C after XI months aging, visually observe the release phenomenon of the release surface of the base film and its back surface according to the following criteria Evaluation. 20 〇: No blocking phenomenon X: There is blocking phenomenon Explosiveness: The surface of the base film was abraded with black paper, and the occurrence of white haze was visually observed and evaluated according to the following criteria. 23 200400879 〇: No white haze phenomenon X: White haze phenomenon (7) Measurement of hardness The hardness is measured by using EKT Co., Ltd. Co., Ltd. 5 Ent-110a 'to directly measure the hardness of the release layer film. The measurement system was placed on a triangular hammer head with a weight of 2 mgf, and the hardness was calculated from the amount of deformation of the release layer. Example 1 Preparations were made of polyethylene terephthalate A and B. Polyethylene terephthalate fe A was used in a layer with a release layer side, and polyethylene terephthalate 10 ethylene glycol was prepared. Alcohol ester B is used in the other layer, and is manufactured as a laminated poly-Si-based film having a two-layer structure. First, dimethyl terephthalate and ethylene glycol, manganese acetate as a vinegar exchange catalyst, trioxide as a polymerization catalyst, and linolenic acid as a stabilizer, and an average particle size of 1 μm of oxidized stone are used. Inert particles with 3% wt I5 as a slip agent were polymerized according to the usual method to obtain polyethylene terephthalate A with inherent viscosity (o-chlorophenol'35 ° C) 0.62. Instead of oxidative breakdown, cross-linked stone particles (major diameter / minor diameter = 1.05) with an average particle diameter of 0 and 0.05% by weight and an average particle diameter of oxidized particles with 0.4% by weight are used as a lubricant. Inert particles, and others were prepared in the same manner as the aforementioned polyethylene terephthalate A polyethylene glycol terephthalate B. The particles of this kind of stupid-ethylene glycol formate were fed to two extruder hoppers after drying for 3 hours in the 17th generation, and were melted at the melting temperature of ~ 3 thieves. Extruded on a surface-processed surface. On the surface of a rotary cooling drum with a surface temperature of 20 ° C and a dish temperature of 20C, an unstretched 2-layer laminated base film was prepared. The non-stretched laminated base film obtained should be obtained. [Preliminarily, an IR heater with a 90 representing surface temperature of 5 is placed above the low-speed and high-speed roller space 15_ to be heated and stretched 36 times, quenched, and then supplied to the tenter, and horizontally at 105 ° C. The direction extends 39 times. Then, the obtained biaxially oriented base film was heat-fixed at a temperature of 205 C for 5 seconds to obtain a thickness% drop (the thickness of the eight-layer polyacetate provided with the release layer side was 36 mm, and the polyacetate on the opposite side was Heat-fixed double-sleeve oriented laminated polyacetate-based film with a thickness of B layer of 2 μm). 1〇 # On this base film, a mixed solution of polydimethylmethane and dimethylhydrodiene stone is added to a platinum catalyst to produce an addition reaction type hardened silicon (manufactured by Koshi Silicone Co., Ltd.) KS-847 (H)) was dissolved in a mixed solvent of methyl ethyl ketone, isobutyl ketone and toluene to make a solution having a solid content concentration of 3% by weight, and by a conventional roll coating method, A release film having a film thickness of 551101 and dried after coating was prepared. Heat and dry, place at 160. (3 for 30 seconds. The characteristics of this release film are shown in Table 1. Example 2 The inert particles blended with polyethylene terephthalate in Example 1 were changed to 0.12% by weight on average. Cross-linked silicon particles with a particle diameter of 0.3 μm; polyethylene terephthalate B is changed to those without inert particles. This polyethylene terephthalate is made The composition of Α / Β / Α was placed in a multi-tube stamper for co-extrusion, and the thickness was adjusted to form A / B / A = 2 μηι / 34 μηι / 2 μηι. The release film was made to 77 nm. Except for this, a release film was prepared in the same manner as in Example 1. 25 200400879 Example 3 Using only polyethylene terephthalate A used in Example 2 to make a 38 μm base film The release layer was made to 77 nm. Except for this, a release film was prepared in the same manner as in Example 2. 5 Comparative Example 1 Dimethyl terephthalate and ethylene glycol were used, and manganese acetate was used as the ester. Exchange catalyst, using antimony trioxide as a polymerization catalyst and phosphorous acid as a stabilizer Viscosity (o-phenol, 35 ° C) of poly (ethylene terephthalate). Polyethylene terephthalate is blended with 10 silicon dioxide with an average particle diameter of 1 · 7 μm 0.05% by weight as a slip The inert fine particles of the agent were used to prepare a single-layered base film and the thickness of the release layer was set to 98 nm. A release film was prepared in the same manner as in Example 1. Comparative Example 2 Comparative Example 1 The inert particles were replaced with particles having an average particle diameter of 0.1 μm, except for 15. In the same manner as in Comparative Example 1, a release film was prepared. Comparative Example 3 A silicon film was coated on the base film prepared in Example 1 A mold release film having a thickness other than 200 nm is prepared in the same manner. 26 200400879 Table 1
\ 聚酯基膜 脫模膜 Ra(片面) (nm) Rz(片面) (nm) Ra(他面) (nm) 片面(離型層侧) 他面 (nm) 粗度的和 (nm) Tsi(nm) 加工適性 Ra(nm) Rz(nm) 實施例1 12 132 12 10 76 12 22 77 〇 實施例2 7 74 9 5 35 9 14 55 〇 實施例3 13 142 14 11 83 13 24 77 〇 比較例1 29 870 29 27 790 29 56 98 比較例2 5 58 5 3 12 5 8 55 X 比較例3 7 74 9 2 10 9 11 200 V · —J 實施例4\ Polyester-based film release film Ra (one side) (nm) Rz (one side) (nm) Ra (other side) (nm) One side (release side) Other side (nm) Roughness (nm) Tsi (nm) Processing suitability Ra (nm) Rz (nm) Example 1 12 132 12 10 76 12 22 77 〇 Example 2 7 74 9 5 35 9 14 55 〇 Example 3 13 142 14 11 83 13 24 77 〇 Comparison Example 1 29 870 29 27 790 29 56 98 Comparative Example 2 5 58 5 3 12 5 8 55 X Comparative Example 3 7 74 9 2 10 9 11 200 V · J Example 4
首先’將對苯二甲酸二曱酉旨和乙二醇,使用醋酸猛作 為酯交換催化劑,使用三氧化銻作為聚合催化劑,使用亞 5鱗酸作為安定劑’並依常法進行聚合,製得固有黏度(鄰氯 酚’ 35°C)0.62之聚對苯二甲酸乙二醇酿。 將該聚對苯二甲酸乙二醇酯的顆粒,在17〇它3小時乾 燥後供給押出機料斗,在熔融溫度28〇〜3〇〇〇c下熔融,使 用押出模,押出在表面加工〇.3s程度,表面溫度贼之回轉 10冷卻鼓上,製得厚度540μιη之未延伸基膜。First, 'diethyl terephthalate and ethylene glycol are used as a transesterification catalyst, antimony trioxide is used as a polymerization catalyst, and pentanosuccinic acid is used as a stabilizing agent'. Polyethylene terephthalate with inherent viscosity (o-chlorophenol '35 ° C) 0.62. The pellets of polyethylene terephthalate were dried at 170 ° C for 3 hours, and then fed to the extruder hopper. The pellets were melted at a melting temperature of 280 to 3000 ° C, and were extruded on the surface using an extrusion die. At a level of 3s, the surface temperature is reduced on a 10 cooling drum to produce an unstretched base film with a thickness of 540 μm.
將該未延伸基膜,在75。〇預熱,並於低速概和高速槪 之間’離15mm上方經安置1具90〇。〇表面溫度之汛加熱器二 面加熱,-面縱方向單軸延伸成3.6倍,之後急冷,接^供 給擴幅機’在105°C橫方向延伸成3 9倍製得雙軸定向基 15膜。將該雙轴定向基膜,在2〇5t的溫度下進行你間熱固 定,製得厚度38哗之熱固定熟定向基膜4,單轴延伸 後之石夕的固定處理,係將3_環氧丙氧基丙基三甲氧基石夕燒 水溶液依吻塗法進行塗布處理。 27 200400879 取_於該熱固定雙軸定向基膜上,將苯基咖莫耳以下之 甲土夕氧院和—甲基氫化二締的混合溶液添加自 . 金催化劑產生加成反應類型之硬化型石夕樹脂(信越、> 口 3 >社製KS 774) ’冷解於甲基乙基甲嗣、異丁基嗣及甲苯 5的混合溶劑,並添加相當石夕樹脂成份0.5重量%之氧化石夕粒 子(日本工了 口 ':;儿社製R972平均粒徑⑽作為無機粒 子’製成全固體成份濃度1重量%形成之溶液,依常法之輕 塗布法,製得塗布後形成乾燥膜厚度為45腿之脫模膜。概 塗布法中之加熱乾燥,係在15〇t進行2〇秒。兹將該脫模膜 ^ 10 的特性顯示在表2。 貫施例5 將對苯二甲酸二曱醋和乙二醇,使用醋酸锰作為醋交 換催化劑,使用三氧化銻作為聚合催化劑,使用亞碟酸作 為安定劑,並摻合0.12重量%平均粒子徑〇1μηι之氧化石夕作 15為滑劑的惰性粒子,依常法進行聚合,製得固有黏度(鄰氣 酚,35°C )0.62之聚對苯二甲酸乙二醇酯。 將該聚對笨二曱酸乙二醇醋之顆粒,在i7(rc經3小時 乾燥後供給押出機料斗,在溶融溫度28〇〜遍。c進㈣ · 融’使用押出模’押出在表面加工〇.3s程度,表面溫度 20 ^之回轉冷卻鼓上,製得厚度540μηι之未延伸基膜。 將該未延伸基膜,在75°C預熱,位在低速輥和高速輥 之間’離15mm上方安幻具如代表面溫度的爪加熱器—面 加熱,一面在縱方向單軸延伸成3 6倍,之後急冷,接著供 給擴幅機,在l〇5t橫方向延伸成3·9倍,製得雙軸定向基 28 200400879 膜。將該雙軸定向基膜,在2〇5°C的溫度下進行5秒間熱固 定,製得厚度38μηι之熱固定雙軸定向基膜。又,單軸延伸 後該矽之固定處理,係將3-環氧丙氧基丙基三甲氧基矽烷 水溶液以吻塗法予以塗布處理。 5 於該熱固定雙轴定向基膜上,將白金催化劑添加於聚 一甲基矽氧烷和二曱基氫化二烯矽烷的混合溶液使其產生 加成反應類型之硬化型矽樹脂(信越シ4 :7 一 y社製 KS-774),溶解於甲基乙基甲酮、異丁基酮及甲苯的混合溶 ^再"』、、加相當;δ夕樹脂成份〇.2重量%氧化石夕粒子(日本工7 10 口汐儿社製R972平均粒徑30nm)作為無機粒子,製成全固體 成份濃度1重量%職的溶液,依f法之魅布法,塗布而 成乾燥膜厚度為Μ·,製得脫模膜。以輥塗布法中之加熱 乾燥’係在l5〇t進行2〇秒。兹將該脫模膜的特性顯示在表 2。 15 貫施例6 使用實施例4中所作成之聚對苯二甲酸乙二醇酿和實 施例2中所作成之聚對苯二甲酸乙二醇_a,製成聚對苯二 曱酸乙二醇酉旨/聚對苯二甲酸乙二醇醋A=36卿/2卿構成 之基膜’除此之外與實施例4以同樣的方法製得脫模膜。 2〇 比較例4 、、 未摻合有無機粒子於實施例1之石夕脫模層,⑨此以外與 實施例4以同樣的方法製得脫模基膜。茲將該脫模膜的特性 顯示在表2。 比較例5 29 200400879 將實施例4之矽脫模層的厚度設定為lOOOnm,除此之 外與實施例4以同樣的方法製得脫模膜。茲將該脫模膜的特 性顯示在表2。 比較例6 5 將實施例4之矽脫模層中添加的粒子設定為30重量 %,除此之外與實施例4以同樣的方法製得脫模膜。茲將該 脫模膜的特性顯示在表2。 比較例7 經添加二苯基矽氧烷使脫模層中的二苯基矽氧烷含有 10 量成為5%莫耳,除此之外與實施例4以同樣的方法製得脫 模膜。茲將該脫模膜的特性顯示在表2。 表2The unstretched base film was at 75 ° C. 〇 Preheat and place a 90 ° above 15mm from the low-speed profile and the high-speed profile. 〇The surface temperature of the flood heater is heated on both sides, and the uniaxial extension of the plane in the longitudinal direction is 3.6 times, and then it is quenched, and then the supply expander is extended to 39 times in the transverse direction at 105 ° C to obtain a biaxial orientation base 15 membrane. The biaxially oriented base film is thermally fixed at a temperature of 205t to obtain a heat-fixed cooked oriented base film 4 with a thickness of 38, and the fixing process of the stone eve after uniaxial extension is 3_ An aqueous solution of glycidoxypropyltrimethoxysparite was applied by a kiss coating method. 27 200400879 Take _ on the heat-fixed biaxially oriented base film, add a mixed solution of formazan oxygen and methyl hydrogenated diphenyl below the phenylgomer, from the gold catalyst to produce an addition reaction type of hardening Type Ishiba resin (Shin-Etsu, > Mouth 3 > KS 774, manufactured by the company) 'Cold in a mixed solvent of methyl ethylformamidine, isobutylpyrene and toluene 5, and add 0.5% by weight of Ishiba resin content. Oxide stone eve particles (Nippon Kogyo ':; R972 average particle size manufactured by Kojisha Co., Ltd. was used as inorganic particles to make a solution with a solid content concentration of 1% by weight. The light coating method according to the usual method was used to form the solution after coating The thickness of the dried film was 45-leg mold release film. The heat-drying method in the rough coating method was performed at 15 t for 20 seconds. The characteristics of the release film ^ 10 are shown in Table 2. Dimethyl phthalate and ethylene glycol, using manganese acetate as a vinegar exchange catalyst, using antimony trioxide as a polymerization catalyst, using arsenic acid as a stabilizer, and admixing 0.12% by weight of oxidized stone with an average particle diameter of 0 μm 15 as inert particles of lubricant, according to the usual method Polymerization was carried out to obtain polyethylene terephthalate with an inherent viscosity (orthophenol, 35 ° C) of 0.62. The granules of the polyethylene terephthalate were prepared at i7 (rc for 3 hours). After drying, it is supplied to the extruder hopper and melted at a temperature of 280 ~. C. Into the melt · Use an extruder to extrude on a rotary cooling drum with a surface processing of about 0.3s and a surface temperature of 20 ^ to obtain a thickness of 540μm Extend the base film. Preheat the unstretched base film at 75 ° C, located between the low speed roller and the high speed roller, 15mm away from the high speed roller. The uniaxial stretching was 36 times, and then it was quenched, and then supplied to the tenter, which was extended to 3.9 times in the transverse direction of 105t to obtain a biaxially oriented base film 28 200400879. The heat-fixing was performed at a temperature of 〇5 ° C for 5 seconds to obtain a heat-fixed biaxially oriented base film with a thickness of 38 μm. In addition, after uniaxial stretching, the silicon was fixed with 3-glycidoxypropyltrimethyl The oxysilane solution is applied by a kiss coating method. 5 On the heat-fixed biaxially oriented base film, apply A gold catalyst is added to a mixed solution of polymethylsiloxane and difluorinated hydrogenated diene silane to produce an addition reaction type hardened silicone resin (Shin-Etsu 4: 7 KS-774, manufactured by YI Corporation) and dissolved In the mixed solvent of methyl ethyl ketone, isobutyl ketone and toluene ^ "", plus equivalent; δ resin content 0.2% by weight of oxidized stone particles (manufactured by Nippon Kogyo Co., Ltd. 7 10 R972 average particle diameter 30nm) As inorganic particles, a solution with a solid content concentration of 1% by weight was prepared, and the dry film thickness was M · coated in accordance with the Charm Cloth method of f method to prepare a release film. Roll coating The heating and drying method in the method was performed at 150 t for 20 seconds. The characteristics of this release film are shown in Table 2. 15 Example 6 The polyethylene terephthalate prepared in Example 4 and the polyethylene terephthalate_a prepared in Example 2 were used to prepare polyethylene terephthalate. A release film was prepared in the same manner as in Example 4 except that the base film was composed of diol / polyethylene terephthalate A = 36 ° / 2/2 °. 20 Comparative Example 4 A mold release base film was prepared in the same manner as in Example 4 except that the inorganic particles were not blended with the stone mold release layer of Example 1. The characteristics of this release film are shown in Table 2. Comparative Example 5 29 200400879 A release film was produced in the same manner as in Example 4 except that the thickness of the silicon release layer of Example 4 was set to 100 nm. The characteristics of this release film are shown in Table 2. Comparative Example 6 5 A release film was produced in the same manner as in Example 4 except that the particles added to the silicon release layer of Example 4 were set to 30% by weight. The characteristics of this release film are shown in Table 2. Comparative Example 7 A release film was produced in the same manner as in Example 4 except that diphenylsilane was added to the diphenylsilane content of 10% in the release layer by adding 5% mol. The characteristics of this release film are shown in Table 2. Table 2
Ra(nm) Rz(nm) 硬度 mgf/μηι2 HD5 個/mm2 HD10 個/mm2 t/d 黏連性 剝削 實施例4 0.9 13 108 1200 70 1.5 〇 〇 實施例5 3.8 28 104 9600 95 2 〇 〇 實施例6 0.9 13 108 1300 72 1.5 〇 〇 比較例4 0.7 10 105 100 40 — X 〇 比較例5 13 48 104 8300 180 3,3 X X 比較例6 26 63 102 13000 230 1.5 〇 X 比較例7 0.78 13 93 1100 Ί5 1.5 X 〇 t圖式簡單說明3 (無) 15 【圖式之主要元件代表符號表】Ra (nm) Rz (nm) Hardness mgf / μηι 2 HD5 pieces / mm2 HD10 pieces / mm2 t / d Adhesive exploitation Example 4 0.9 13 108 1200 70 1.5 〇 Example 5 3.8 28 104 9600 95 2 〇〇 Implementation Example 6 0.9 13 108 1300 72 1.5 〇〇 Comparative Example 4 0.7 10 105 100 40 — X 〇 Comparative Example 5 13 48 104 8 300 180 3, 3 XX Comparative Example 6 26 63 102 13000 230 1.5 〇X Comparative Example 7 0.78 13 93 1100 Ί5 1.5 X 〇t Schematic description 3 (none) 15 [Representative symbol table of main components of the diagram]
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JP4313614B2 (en) * | 2003-05-27 | 2009-08-12 | 帝人デュポンフィルム株式会社 | Release film |
KR100879003B1 (en) * | 2005-05-26 | 2009-01-15 | 주식회사 코오롱 | Release Film |
KR100830938B1 (en) * | 2007-02-09 | 2008-05-22 | 도레이새한 주식회사 | Manufacturing method of polyester release film for polarizing plate and polyester release film for polarizing plate manufactured therefrom |
KR100928148B1 (en) * | 2007-08-23 | 2009-11-24 | 도레이새한 주식회사 | Polyester release film for polarizing plate |
JP5080232B2 (en) * | 2007-12-13 | 2012-11-21 | 帝人デュポンフィルム株式会社 | Release film for green sheet molding and method for producing the same |
MY159687A (en) * | 2009-01-08 | 2017-01-13 | Asahi Glass Co Ltd | Mold-releasing film and method for manufacturing light emitting diode |
JP5495287B2 (en) * | 2009-04-15 | 2014-05-21 | 帝人デュポンフィルム株式会社 | Release film |
KR101099879B1 (en) * | 2009-07-22 | 2011-12-28 | 도레이첨단소재 주식회사 | Polyester release film for molding green sheet of capacitor and manufacturing method of green sheet using same |
WO2011028251A2 (en) | 2009-08-24 | 2011-03-10 | Sion Power Corporation | Release system for electrochemical cells |
JP5412321B2 (en) * | 2010-02-25 | 2014-02-12 | 藤森工業株式会社 | Release film with excellent transparency |
EP2687374A4 (en) * | 2011-03-14 | 2015-03-04 | Nitto Denko Corp | Release liner |
EP2788189B1 (en) * | 2011-12-09 | 2017-04-26 | CPFilms Inc. | Modified release coatings for optically clear film |
JP5907640B2 (en) * | 2012-07-02 | 2016-04-26 | 三菱樹脂株式会社 | Release film |
JP2014008720A (en) * | 2012-07-02 | 2014-01-20 | Mitsubishi Plastics Inc | Release film |
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KR102204965B1 (en) * | 2013-09-30 | 2021-01-19 | 코오롱인더스트리 주식회사 | Release film and manufacturing method thereof |
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KR101481712B1 (en) * | 2014-02-05 | 2015-01-13 | 도레이첨단소재 주식회사 | Release film for protecting coverlay |
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JP6434437B2 (en) * | 2016-03-24 | 2018-12-05 | 藤森工業株式会社 | Release film with excellent releasability |
JP6982793B2 (en) * | 2017-09-22 | 2021-12-17 | 東洋紡株式会社 | Release film |
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