TW200302960A - System including power conditioning modules - Google Patents

Abstract

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of includes vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

Description

200302960

V. Description of the Invention (1) [Field of the Invention] The present invention relates to a method and device for electric power systems. In particular, the present invention is based on the following two features: electric power adjustment technology for capture and rejection management systems, and thermal capture and shift. Related to the inside or above of integrated silicon, germanium, gallium arsenide). It can be integrated into the point processor and must be able to be integrated into the point processor (such as: [the know-how is increased with the rapid increase of half. In addition, the power adjustment is increased with the increase in microprocessing consumption.) Furthermore, the consumption between the more and more heat-generating power-supplying power supply and this device is described earlier. The work conductor is installed, and the electronic is processed by the micro-processing video or the ground due to the adjustment of the heater speed. The capture and transfer device is a demand rate device that uses a limited line device (for example, and a power supply device that continuously increases the rejection capacity and the transistor demand holder) (such as image processing or micro processing integrated by the responder) It is already used for full installation, but often has a long-term change (for example: the demand of the micro-set for the increase of the amount of demand also increases. For example: the completion of the device) rapid change of the speed of the device and a micro Processing to become another foot power requires a certain capacitor and lead to power teaching: the processor.) The external power's support for this continues to increase, electrical work. In addition, with these functions, the power of the power dissipation transistor is this rapid. Increasing demand, however, the distance. This inductor, the transmission time in the processor) power-on crystal demand is also a similar device. For example, the rate (usually more and more often the rate adjustment consumes time and purpose to increase the demand for more and more. For a system that provides a continuous increase in the number of time bodies that may be delayed, the more average power is used to use the floating system The state and the air force port, the logic device requires. Power supply and this will because. If the first change will

200302960 V. Description of the invention (2) It increases with the increase of processor speed and with more and more processors. In view of this, the integration of the power adjustment power ^ into this setting will get closer and closer to the consumer device. Place these: electronic systems (such as: voltage regulators, capacitors, DC / DC converters) next to this consumer device, these power adjustment two: DC) converter to meet. The first consideration is shown in Figure 1. The system usually includes a separate capacitor, a voltage regulator, and a voltage regulator. This (AC-DC) or direct-current direct-current (DC-Dc) conversion; :: AC and DC capacitors are usually placed in this integrated circuit device. Two = to say, the discrete circuit device is electrically connected. In this way, the device can work with the wool product and can pass the storage of the capacitor to the sudden supply to meet the necessary demand to increase the voltage at this time. This kind of capacitor is usually called, / first, relatively constant output and is analog circuit design, digital circuit ... yfaSS) capacitor Π, common components. 5 Designed and designed for power device circuits

Voltage (for example, voltage (for example, the current variation of this low voltage set. The regulator is usually, and more accessible, the output of direct current (DC-DC, 7V): 1 to 5V) 'It is usually for this' It can be used in analogy and can be placed in a voltage regulator to receive high input power and output relatively stable low output power. Voltage regulators tend to provide high voltage level changes or this consumption device increases significantly Immunity (immuni ty) The design of the digital electronic power adjustment system has fast time-varying power requirements. The device is a direct current (AC-DC) and direct-current (DC) converter.

200302960 V. Description of the invention (3) It is used to supply a specific supply from a convenient source. For example, this integrated circuit device "consumes up to two types, so that the power circuit will provide a single phase." (Medium, 110V K), to take the example of this integrated belt: 48V DC or the supply voltage (for example, ·· 丨 to ^ ^ 彳 can also require a very different device to convert this power, and down, Conversion In some systems, the input voltage required to convert 1 θ clothes is converted. Side, I think that. 彳, °° 疋 m can be set next to this consumer device .: Yu 2 ': Set the power generated Provide stable electricity during consumption changes. Meiqiol /,? ,, for example, U.S. Patent No. 1 ^ 59 0 1 040; US6191945 AUS6285550 〇): In addition to power management considerations, the increase in power consumption of these devices will also affect the two ' Energy management systems (ie, systems that capture and / or reject thermal energy) ^ Extramaxillary burdens. For this reason, the thermal energy management system will use, for example, heat sinks, blowers, and Cooling plate j⑶Id of cooling water Plates) systems, and / or the combined techniques of the above-mentioned combinations, to complete the heat capture, removal, and rejection from, for example, integrated circuit devices. This type of conventional thermal energy management design is to integrate these heat Capturing and rejecting 70 pieces placed above or near the package of this integrated circuit device. (Refer to 'for example, US Patent Nos. US6191945 and US62855 50.) For example, please refer to Figure 1. The heat sink usually Includes a metal plate with straight tail fins to use natural convection to transfer thermal energy from the consumer to the surrounding gas. The heat sink is usually placed directly above or above the package of the integrated circuit device. The heat sink is used to increase this The contact area of the device and the surrounding gas, thereby reducing the temperature rise of a given power.

Page 10 200302960 V. Description of the invention (4) Strengthening a certain heat sink and its surroundings It is a common use of a blower (typical motor drive) and a heat sink. Inside the drum device, a heat transfer learning system that uses faster heat dissipation than the natural convection and the surrounding gas is used to enhance this thermal energy. This is to reduce the consumption device and the dispersive technique usually involves the number of layers between the device and the space. And the laminated thickness is reduced. Patent numbers US6 1 9 1 945 and US62855 50

All in all, the conventional system is a typical, conventional layout as shown in the figure that the catch and reject components are set as far as possible to meet the needs of power adjustment and thermal energy management. Please refer to a nested circuit. The heat dissipation device of this heat energy consumption device. In some implementations (via a cooling device), the power adjustment circuit (DC (AC-DC) and DC (DC) are next to a consumer device, so as to reduce the line length of this space. It is known that the power consumption and heat capture of existing devices may not be able to meet the speed of other existing gas, and the speed of the cyclone can be lost at the same time. When managing the thermal device package (please see °), integrate this product. In this figure 1, the example of the physical component is 1¾. Capacitor-DC) A technology that can manage and reject the device and the heat transfer. The rotor blades use electrons to allow gas to circulate in this heat, thereby strengthening a certain The thermal impedance between the other technologies of this system. This technology and the heat sink are based on, for example, some power adjustment and thermal capture circuit devices in the United States. By doing so, this will lead to the consumption device as shown in Figure 1 and Figure 1. However, it is a contact with this adiabatic capture, removal and rejection, voltage regulator, AC conversion) is placed in the device and the integrated circuit wear A technique to meet the demand does' However, conventional power means future s f

Page 11 200302960 Fifth, the description of the invention (5) and the cat # of heat capture, removal, and rejection of silk are the period for raising a new kind of care: plus. Therefore, the present invention's individual consumption and heat capture, removal, 'and positive technology' can be used to adapt to power consumption at the same time. In addition, the present invention! Expected increase in demand. And thermal management technology, so that the same two: Nai Yi provides an improved power adjustment and thermal capture, removal, rejection of power consumption of existing and future devices is provided-a kind of improved: rate 氕 :: 敎: 5 '本Invented-a personal device. In this regard, the present invention (for example ... portable computer) heat capture, rejection elements are added to the second is to adjust these power and meet power consumption and heat capture, the purpose: the volume, and at the same time, in addition, one of the invention π is the expected increase in demand. And thermal capture, rejection technology, so as to integrate this improved power adjustment element with this consumer device (for example, ^ positive and thermal capture, rejection, Jia Ermu /, a certain integrated circuit device) integration & Reduce the power generated due to signal transmission delays, such as lack of power, and equipment handles due to physical separation and additional interfaces. Positive and negative * ^ A device to the thermal impedance of this scattered device. In this way, the power and efficiency of this system can be improved at the same time. … Surrounding structure and thermal energy management capabilities: I's clear extension: Objective t is to provide power adjustment and utilization of tight: structure ^ 's thermal capture, = :, to complete a tightly packed delivery delay And strengthen the thermal properties of 14 packaging devices. Again: ’Although this entire technology may be suitable for some applications, one of the goals of this rabbit is to provide a power adjustment technology by which

Page 12 200302960 V. Description of the invention (6) Meeting all applications One purpose of the invention can be implemented in space One purpose is the expected increase of and

= Expected increase in consumption. For example, the present invention restricts the use of improved power adjustment techniques to limit the use of equipment. It is used to provide improved power: technology. In view of this, the present invention has a strict way to adapt to power Application device Q that consumes severe space requirements [Invented because of the integrated substrate of the entire module, in the second hole, the use of a separate substrate on the second interface on the first interface is summarized.] interface. In order to provide the corresponding interface on the corresponding interface on the surface, the two interfaces and at least one of the electrical components should also have the power of the first one that is determined by a product in accordance with the present invention. This first interface and the first, in addition, this function is sexually connected to the first set of pads, and the surface is perforated. In addition, a second group of cymbal pads is perforated. A power adjustment mode to adjust the power to be applied to the first interface. Also, this container. The essential features of the two interfaces that explain this feature, the circuit device has a power-adjusting two interface, and the rate adjustment mold. The present invention is used to adjust the module to be assembled. The second group has one interface with one interface and The second interface 塾 will adjust the die pads separately and these solders. This function and these solders are connected to the group and also connected to the power adjustment. This semiconductor interface is connected to the interface and placed in the first interface. The second dielectric group has at least one product, and the first circuit has at least one circuit, which is placed in a semiconductor circuit, and implements one less work surface, the rate of pads, and power. This or both voltage regulators and power regulator modules are placed in this semiconductor

Page 13 200302960 V. Description of the invention (7) —______ At least one power pad in the body substrate is used for dental salvation. This power hole is electrically connected to at least one of the device and the capacitor to the second interface and these voltage adjustments are connected to the semi-conductor. In addition, this power hole can also be electrically mated, perforated, and conductive. A power duct in the base. This power welding voltage and voltage adjustment ^ and ί are used to provide electrical connection between at least one of the second interface and an electrical & capacitor. -Case t 'The power adjustment module may also have at least ㈡Γ. This output power conduit can be connected to an input placed on the first integrated circuit device. Liche is corresponding to this feature of the present invention. This power adjustment module may also have a current sensor, which is placed in the semiconductor substrate to provide the integrated circuit device and / or this. Information about the current consumption of the circuit ^ In addition, a controller, which is coupled to the current sensor, can also receive this information, and thereby adjust the cooling of the integrated circuit device and / or this function. In addition, this power adjustment module also has: a temperature sensor,

The semiconductor substrate is used to indicate the temperature of the near area of the temperature sensor 1. In addition, a controller, its sensor, can also receive this information and use it to adjust the solitary position and / or the cooling of the power adjustment module. k integrated circuits! In response to the second main feature of the present invention, the present invention is a H _ ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ / ^ / I this invention is a H-integration and thermal energy management module to respond to a second major feature of our invention, which is used to couple an integrated circuit dream = solid power Zhangling exhibition. This achievement

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V. Description of the invention (8) The adjustment and thermal energy management module has a surface and a second interface, wherein the power adjustment element of the first interface also has a hole, which is placed in the semiconductor substrate to the power of the integrated circuit device . Whole family and at least one capacitor. In addition, the first interface and the second interface of the rate adjusting element. The power adjusting element has a first interface relative to the second interface. In addition, the semiconductor substrate, a plurality of interface interfaces, and a circuit are used to adjust the circuit to be applied with at least one voltage adjustment. The circuit can also be placed on the work interface, or both. Has one side, where, the first piece, in addition to the operating period, this thermal system has to place its fluid through. This feature of the invention, the power adjustment and thermal energy management module is a thermal energy management element, which has a first interface and a second interface, which are opposite to the second interface. This thermal energy management element uses a fluid with a liquid phase to capture thermal energy. The energy management element also has a base, wherein at least a part of a microchannel in the base is structured to allow the thermal energy management module to have a plurality of interface perforations to connect to the thermal energy management. The first interface of the component and the dagger are connected to this * A plurality of interface perforations of 70 pieces of thermal energy management can be tapped into this integer unit "corresponding interface perforations to provide electrical two interface doors. The first interface and the song between this thermal energy management element. In this regard, this marriage partner is connected to f ^… the first interface of the moon and the moon can be added to the second interface of the rate adjustment element . Micro-channel :: Function: 5 and thermal energy management module can also have circuits and-,,,, ... structure. A circuit is placed in this semiconductor substrate to

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Adjust the power to be applied to this integrated circuit device. This circuit can be placed on the first interface, on the second interface, or on both interfaces. 'In addition, this circuit has at least one voltage regulator and at least one capacitor. The microchannel structure has at least one microchannel, which is placed in the bottom of the semiconductor to capture thermal energy. & In accordance with this feature of the present invention, it may also have a current sensor. These current sensors, temperature sensors, power adjustment and thermal management modules are used in the current sensor and / or temperature sensor, and the microchannel junction is used to control the fluid flow rate output by the controller. XI power adjustment and thermal management modules, a temperature sensor, and a controller and / or controller can be placed here. This controller can be coupled to these electric currents to receive current or temperature indications to adjust the thermal energy capture rate. In this regard, the fluid flow in the microchannel and / or this = an embodiment of this feature of the present invention, these two m will have at least one power placed on the second interface = to 'i, using t ί. The power pad is electrically connected to the power connector and is electrically connected to the second interface and the electrical G. This power piercing system can be electrically connected to one: connected to this power welding ^ 2. This power conduit system provides electrical connections. Pads and at least one of the voltage regulators and capacitors. In another embodiment, there is at least one output power pipe with the full power to the integrated circuit. The power adjustment and thermal energy management module assembly is coupled to this. Circuitry to provide adjustments. This output power conduit can be connected to

Page 16 200302960 V. Description of the Invention (ίο)

An input work 2 pad is placed on the first interface of the power adjustment element. ^ = &Quot; Input power pads can correspond to the power output of the integrated circuit 11. & Clothing [It is better to implement the integrated circuit technology and system optimization application device above or below to provide these additional benefits of implementation benefits, as well as the demand for circuit technology application devices. The detailed description of the space removal and rejection or integration similar to the footprint example is clearly related to the device. In the present example, a plug-in device can provide a rate adjustment system as an example. The present invention is also a technology and system for managing consumption devices. The present environmental limitation (power adjustment and thermal limit the application capacity in several embodiments. In addition, the rate adjustment circuit and a footprint) adjust the consumption device (for example, a power technology and system. This kind of the invention Several embodiments of the power adjustment circuit that use the power adjustment circuit to input power of the consuming device of the consumption circuit are suitable for space-constrained portable or handheld applications, which may require a well-adjusted input Power supply. In this way, an effective, compact (reduced volume), cost related to a heat capture, transfer invention, for example, can manage the ability, the device of the present invention, which can also be the heat management element of these embodiments. In the base, the adjustment and consumption devices are intended to apply power division and / or rejection, and the power adjustment technology and system are optimized or strengthened in response to this and this consumption device and system. In this regard, such technologies and systems may also be suitable as needed. Nandu heat capture and transfer technologies and systems can also be combined in the same substrate, with • and / or this Consumption means

200302960, this device and / or. This control or power adjustment of the heat capture, working fluid cartridge is to meet this change and further reduce some thermal energy pipes or structures. Structure to capture heat. In addition, the present invention can also be used to improve the capability of the whole circuit. This controller can be used to remove the circuit and capture the fluid flow. The expected low consumption of this physical element is captured and moved. V. Description of the invention (11). In this way, in order to provide effective and compact, the present invention also has a controller to respond to the feedback signal, a thermal capture, movement. In addition, the tube containing the controller and / or components is provided for this operation, and the rate of consumption is used as a trace. This is based on the additional power of the base microchannel circuit to adjust the power density and cost-effectiveness of these embodiments. A thermal energy tube is used. Receive parameter sensors (for example, and adjust a division and / or rejection element accordingly to use a rate adjustment circuit to respond to the heat generation and / or reject energy and remove thermal energy, or adjust the device and / or thermal energy management The power adjustment can be related to this Lu, these heat removal in addition to the consumption is clearly to provide a weight and optimization based on the needs of this system. In addition, the adjustment and thermal energy management system can be adjusted and thermal energy management technology The embodiment of the physical element has, for example, temperature, pressure, or flow, ie, the fluid flow of the ceramic, or fluid flow in the adjusted microchannel structure. Current sensing provides information indicating this current consumption to each piece of information. It is expected that This consumption activates and adjusts these thermal management capabilities. For example, when using 唧 'this controller can adjust these micro- The power flow adjustment element of the fluid flow in the channel is integrated with the power adjustment module corresponding to the foot and heat energy management system. The official management element can use a device and / or the power adjustment rate and heat energy management module, which can or Demand 'to effectively convert the power and heat of this invention

200302960 V. Description of the Invention (12) The setting or arrangement of the management module can enhance or optimize the heat capture, removal and / or rejection capabilities of this system. In this regard, the relative arrangement or position of these power adjustment elements and thermal energy management elements with respect to each other or with this consuming device can also enhance or optimize this thermal energy management element and power adjustment performance. In certain cases, the present invention can implement more than one thermal energy management element to further heat capture and rejection capabilities, which can further enhance the reliability of the system (for example, the power management module and the consumer). Please refer to Figs. 2, 3, and 4. In one embodiment, the present invention is a power adjustment module 100, which can be placed in the device 200 (for example, an integrated circuit device such as · A microprocessor) and the printed circuit board 400Q (as shown in the figure), or between the device 200 and the thermal management module 300 (as shown in figure 4). The position of the power adjustment module 丨 〇〇, relative to the consumption device 200 and the thermal energy management module 300, can be selected according to the system's power, heat, and space considerations. The power adjustment module in Fig. 2 includes a semiconductor substrate, interface holes 104 & to 10411, interface pads 1063 to 1061), power and location holes 108a and 108b, power and location The pads 11 and 10) and the bottom m have a first interface for the second or interface and the first one; and the surface for the base or the circuit board 400 (one = uniform printed circuit board) , Such as: a host or a daughter board) matching or interposing this semiconductor substrate 102 can use several kinds of words: Shi Xi or germanium. In specific cases, we used the material shaker as an example, 200302960 V. Description of the invention (13) Ϊ; 2: The base of the same, or can have similar characteristics (for example, ★ ,,,,,,,,,,,,,,,,,,,,,,,,,,,,) . This architecture can provide enhanced operation: the similar thermal expansion characteristics of the module 10 ° and the device 2 °° on Tuesday can work: Therefore, the potential of the electrical connection defect between the devices 200 is minimized. The same material can also have the same system. The benefits of technology and ingenuity ‘in = interface perforation ma to mh75 is used to provide the electrical connection of the device 2_ = but it is not provided for power adjustment. In this regard, the power adjustment module: is an electrical interconnection used to provide other signals utilized by the device 2000, such as: and address signals. For example, when the device 200 is a micro-processor. . %%, " face perforation 10 "to 1〇4} 1 can, through the power adjustment module 0 :, in a microprocessor and 'for example' dynamic random access memory (AM) or static random The access memory (SRAM) memory device provides: a circuit path. For example, & system, system 1 () (for example, dynamic random access memory (DRAM) or static random access memory (SRAM) memory device) other parts of the signal can use the printed circuit board 4 The signal trace on the 〇〇, through the power adjustment module 100, travels to the device 200 using the interface perforation 101 to 104. These interface perforations 104a to 104h can be made using conventional processing techniques. When the number of signals that the device 200 travels or transmits is large, it is best for us to use high anisotropic etching to form narrow paths in the substrate 102 and deposit in these paths (for example, using chemistry Vapor Deposition (VCD) or Low Pressure

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Chemical Vapor Deposition (LPCVD) technology) A highly conductive material (such as gold, copper, aluminum) or erbium-doped polycrystalline silicon to make a highly conductive interconnect. Please continue to refer to Figure 2. This implementation The exemplary power adjustment module 100 may further include interface pads 10 to 1061), so as to promote greater conductivity between the power adjustment mold 100 and the device 200 or the circuit board 400. In this regard, these interface pads 106a to 106P may provide greater tolerance when matching or interface power adjustment module 100 to circuit board 400 and / or device 200. These interfacial pads 1063 to 10613 can be fabricated using conventional techniques using high-conductivity & electrical materials (such as: gold, copper, aluminum). In a preferred embodiment, the perforations 10 to 10 and interface solders 106 & 10 are preferably made of the same material. In fact, pads 1063 to 1061) can be fabricated using the same or similar methods and materials used in a ball grid array (bga wafer rule package (CSP) device. The term " pads ", as described herein,) , Wafer ruler packaging (called, and spherical (ba 11) connection technology such as ==. Then, please continue to refer to Figure 2. The power adjustment module 丨 〇〇 can also include power and location perforations 108a and 108b. Provide a supply voltage, supply current, reference voltage, and / or location (supply) voltage to the circuit 丨 2 ', ... These power and location perforations 108a and 108b can be applied in the same way as interface perforations. Design and production. Additional power and location perforation due to power and location penetration conditions It should be noted that although the present invention only introduces two holes, those skilled in the art should be able to perforate according to needs and other powers and locations. In addition, should pay attention to,

200302960 V. Description of the invention (15) 108a and 108b are also V to provide other voltages or currents required by the circuit 112, so as to provide the functions described in the report and the article or other desired functions. This power adjustment module 100 can also have power and location pads 11 〇 a and 100 b to enhance the electrical conductivity between the power adjustment module 100 and the printed circuit board 400. These power and location pads 1 10a and 1 lb are the same as the interface pads 06a to 106p, but they are used for matching or interface power adjustment module 100 and circuit board 400 days for greater valley tolerance. Degrees or mismatch. In addition, these power and spot welding pads (1033 and 1101) can also be designed and manufactured using the same method as the interface pads 1063 to 10613. The power adjustment module 1 00 may also include a circuit 112. This circuit Π2 is used to transmit the adjustment power to the device 20. In particular, the circuit ^ 2 appropriately adjusts the voltage parameters (for example, supply voltage ^ location) and current parameters (for example, supply, peak value, and typical operating current) required by k to supply device 200. The voltage and current available to the device 200 can, for example, fall into the range and tolerance required for proper and reliable operation during, for example, normal operation, startup and / or shutdown. This circuit 2 can also have a voltage regulator, a bypass capacitor, a DC-DC converter, and an AC-DC converter, which can use conventional techniques and examples. , The conventional complementary metal-oxide-semiconductor (CMOS) or dual-transistor (BJT) design and manufacturing technology) force rain, architecture, and design. A brief overview of these elements has been introduced in the background of the invention and will not be repeated for reasons of time. ==, badly set the circuit 112, such as: voltage regulating capacitors next to the device 200, ferrous bead, DC-DC conversion

Page 22 200302960 converter and / or AC-DC converter, and the above considerations of power adjustment can be satisfied. In addition, the horizontal and vertical gaps consumed by the circuit 2 can also be considerably reduced compared to the conventional techniques and systems shown in Figure 1 and US Patent No. US628 5550. In addition, setting the power adjustment module / 〇〇 above or near the thermal energy management module 300 can also promote the effective capture and rejection of the thermal energy generated by 1 () 0 / circuit 112. Sheep is positive, and the circuit 112 shown in FIG. 2 is placed above the first interface of the substrate 102. = This embodiment can also promote the transmission of electrical power and the location of the device 200; Surface: ,,: And, it should be noted that the circuit 1 1 2 can also be placed in Figure 4 = second Above the interface. This architecture can, for example, enhance the thermal energy capture and rejection capabilities of the circuit relative to the power adjustment module 100, and can strengthen the signal conduction between the signal tracks on the device 2000 and the printed circuit board 400 # In addition, the structure shown in FIG. 4 can also be adapted to the packaging of the device 2000 = 1 ya and can reduce the heat of the power adjustment module 100 and the consumption device 200. The embodiment of FIG. 4 can also adapt to the manufacturing restrictions of the circuit 1 12 of the power adjustment module 100. *, The extension circuit 112 can also be placed on the first and second interfaces at the same time: the door can be placed above the first and second interfaces at the same time-the layout can be added =: the power adjustment needs of the clothing can be considered for power The power of the adjustment module 100 ::, it ’s important to note that, in addition to the power adjustment module 100 to perform the filter function, the additional separate power power adjustment element can also use similar conventional systems Method to place. In this case, the power rate adjustment module 100 will not perform all the power adjustment functions of the system 10

200302960 V. Description of the invention (17) The rate of the module; the module 10 ° will only perform the voltage and electricity in conjunction with the separation of the power and power adjustment: Second: the power rate adjustment element from the power 1 can be used to control the system and / or additional Adjustment function. For example, a system can use 100% of the external power supply (power, Iw, and other components) to provide 100, and adjust with the rate. This power adjustment module provides regional power adjustments to the power of the device at 200 nY. Including the device m supply can provide this material, it can still be implemented; and i this: many advantages of the 10 ° module, the additional separation power and power adjustment elements can increase the overall System power adjustment footprint. These reference voltages and currents used by the circuit 112 can be provided to or wound around the circuit 112 by a number of methods. 10. Electricity and current can be provided to the circuit using power and location-officials 114a and 114b 112, which is embedded in the semiconductor substrate 102. These power and location conduits U4a & U4b are extended from the power and location perforations 108a and 108b and connected to the circuit 112, as specified by the specific power adjustment circuit design implemented. In this embodiment, the power and location perforations 108a and 108b need not extend to the entire length of the semiconductor substrate 102 (as shown in Figure 2), because the power and location conduits 114a & 114b can be inside the substrate 102 Reach a good connection. These power and location conduits and 114b can also be made using conductive materials (for example, gold, copper, aluminum, or highly doped sparlite), and use conventional semiconductor processing or fabrication techniques ( For example, 'the familiar lithography, grave, and Shen Jichu;

Page 24 200302960

Please refer to Fig. 6. The formation of the power and location ducts 114a and 1141) can also face the interface of the semiconductor substrate 102 (but still inside the substrate 102). In this embodiment, the power and ground perforation 108a And 1081) can also extend to the entire or almost the entire length of the semiconductor substrate 102. Since the power and location conduits 11a and 114b will be connected to the circuit 112 closer to the interface surface of the substrate 102. These power and location ducts (n4a and 1141) in Figure 6 can be extended by power and location perforations 108a and 108b (not shown in Figure 6) and connected to the circuit 112 'which is also made on the substrate 102 Near the interface. These power and location conduits 114a and 114b can be fabricated using conventional processing and fabrication techniques using conductive materials such as gold, copper, aluminum, or highly doped polycrystalline silicon. Figures 4 and 7 show another method of supplying power and location to the circuit 112. In these embodiments, the power and location are provided to the circuit 112 using a conventional winding connection technique, which uses the conventional winding and connection pads 1 2 2 shown in FIG. 4. Those skilled in the art should understand that the method of supplying power and location to the circuit i i 2 via the circuit board 400 (or power supply, not shown) can also utilize many other technologies. All technologies that provide power and location connections on the circuit, whether known or derived in the future, should fall within the scope of the present invention. ~ ~ As mentioned earlier, the circuit 112 uses conventional methods to adjust the power and transmits this required power to the device 200. This circuit 112 (for example, a voltage regulator, a bypass capacitor, a DC-DC converter, and / or an AC-DC converter) may also use conventional techniques and equipment.

Page 25, 200302960 V. Description of the invention (19) ί y (Ϊ; D: f) The conventional complementary metal oxide half of the power adjustment function is arranged and interconnected, so that at all times of operation, = and = Kai) force, Prepare, and shut down period strictly], provide appropriate electricity and current to the device 2000. This round &, ^ ^, 1U of the power adjustment module 1 00 can be used to output power and / or location, which can be used in the circuit U2 such as for the circuit board 400 (or power supply = work location technology, so that Provide or wind the wire. In this regard, please refer to Figure 5. In one example, the electric power output is n Rpi ^ ^. Location duct—the output power perforation 118a, and the output location perforation 11 8b, which can be used to enrich the teeth hole 11 8a 2 00. Then, the signal path can be improved and the location to the device and 1 1 6b Twist the circuit for the output power and location of the conduit 1 1 6a and 116 = to the power and input of the device 2000. Or, please continue to refer to Figure 5, 116a and U6b can also be directly wound 2: Corresponds to the power of the device 200 and the ground surface 2 "on the surface, matching or example, the specific welding hole can be perforated 118aM18b. In this implementation, the ducts U6a and 116b will be slightly different due to the power and location of the 200 In the case of appropriate power and location in turn / connection, it is' wound to the device this Output power and / ¾ ground 歹 Niu · "§ Brother, power adjustment module 100 to device 20. Place can also use the method shown in Figure 6 to wind the line is to use ΐ: 6 drawing as a technical wheel / Power and location ducts 116a, U6b, and 116c devices are formed inside the substrate 102 and correspond to 10 6z. In this embodiment '106x, 106y, and, the output and location perforations are not necessary Page 26, 200302960 V. Description of the invention (20), because the output power and location of the duct is directly above the interface of the bottom 102, matching or specified welding to the soil, and 116b can pass through conductive materials (for example, gold Aluminum alloy 6 a-quality polycrystalline silicon) was made. 铭 次 同 # In addition, the output power, f, and location of the power adjustment module 100 are provided to the device using conventional winding connection technology. It is known that the winding 1220 (and the connection pads are not shown in the figure. The output of the power adjustment module 100 is interconnected to the appropriate input of the device 200. It should be noted that the power adjustment module 100 can use a two Stage processing power = :, of which perforations 104 and 108 (And: mutual; conduits 114 and 116) are formed first, and then the circuit 112 is formed next using a ϋϊϋ crystal (CMOS) or a bipolar transistor (BJT). In fact, it should be understood that Production skills ^ § Any production technology (and materials used in it) of the whole module 100, benefit: 疋 known # or future development should belong to the scope of the present invention. With reference to all the embodiments in the description, the training tape can understand and understand that there are still many other technologies that can provide the aging or output power and location of the packet path 12 to the device 200. Fen ?: It is understood that the design and production of solder pads, perforations, conduits, circuit shells, and coils, whether known or developed in the future, are all within the scope of the present invention; It should be understood that these bases

Page 27, 200302960 V. Description of the invention (21) and any developments used in the winding connection should also belong to the background of the hair material, solder pads, perforations, conduits, circuits, materials, whether they are now known or Within the future. The present invention is particularly suitable. Setting the power adjustment element to a cost footprint allows integrated circuit devices to be integrated. For example, external static or dynamic features can be used to reduce system speed and memory operation. In space-constrained environments. In this regard, the gap around the substrate, which is substantially the same as that of the integrated circuit device, can provide other uses. The memory can be set closer to the moving time of the micro processor k. This can also be obtained. This power adjustment module 100 can also be installed in the device 200 and Lei Yueyou 400, as shown in Figure 3. In the example of the two-year-old and two-year-old Chuan and the circuit board Shiyue y & 彳 nn ° Beijing example, the structure of the power port week weighting group 100 shown in Figure 2 is different from the bismuth disk. These perforations can also promote the electrical connection of other signals that are used by _ wind return clothing 20 0 (but not for power 蜩 敕:, and 100), for example, dynamic random storage: two self Memory f (DRAM) or static random access memory (SR set the lean material and address signal. GU basket clothing if π power adjustment module 1 00 can also be set in the device 200 and the energy tube and 7 as shown in the figure. Power modulation = dynamic electrical layer (for example, circuit 112) 0 is separated from the circuit board side, and Q becomes a required electrical connection between this electrical layer and the circuit board 400. As described previously This can be accomplished using wire-wound connections 12 (as shown in Figures 4 and 7), or other interconnection technologies now known or developed in the future, and these should all fall within the scope of the invention. In the case, the thermal energy management element 300 should preferably be set away from

200302960 V. Description of invention (22) Other elements of system 10. In this regard, the thermal energy management module 300 can be referred to as a fan capable of allowing gas to travel above the components of the system 10, and the thermal energy generated by the module 100 and the device 200. This architecture can promote the use of 9 2 space-constrained environments, and also the power adjustment function of 2 = in a small footprint. In this embodiment, the remote device management module 300 can be placed in the device without any interference with other system requirements of the peripheral devices (such as: memory two: storage device). Area of sufficient volume for the fan. Near 0 '-In addition, in a specific embodiment, implement a more tight place #group 3 0 0 may be straighter than the conventional straight tail shown in Figure 3: :: More, ::: Modulus for example' 如 接 ' I'm going to mention that using one has. = Capture element capture and removal device 2000 and / or == $ will be even more rampant. Subsequently, this energy can be 2: the heat generated by the device can be an area relative to the device 200-a heat, insulation element ', it should be understood that the aunt is rejected and rejected. Facts, whether it is now known: = and rejection of any technical scope of the device or subsystem. Anything or future development should belong to the invention. For example, = 疋 ^ 情 " The next Λ thermal energy management module 300 can also be an unnecessary Crusoe processor, you can use the mouth, the cold chip ", such as: Transmeta company can because of its micro: footprint: 5 now: thermal curve If so, the system 10 can be a portable or handheld device yoke in a space-constrained environment (for example, thermal capacity and space test), and does not care about another feature of the thermal management module 300 corresponding to the present invention The present invention is an integrated power. Page 29 200302960 V. Description of the invention (23) and thermal energy management module, which can integrate this power adjustment element (ie: power adjustment) and this thermal energy management element (ie: thermal energy (Capture, remove, and / or reject) functions are added to a single structure. In contrast, in the previously discussed embodiments, these power adjustment and thermal capture, remove, and reject modules are implemented using various architectures. The stacked separation structure is separated from the device 2000 to form a three-layer structure. In accordance with this feature of the present invention, the power adjustment element and the thermal energy management element It is added to a single structure. For example, in addition to the benefits described previously, we can also obtain additional benefits, such as greatly reducing the overall occupied volume, and the consumption device, the power adjustment module, and the thermal energy The direct physical contact between the management modules can also promote the capture and rejection of the power adjustment structure and / or the thermal energy of the consuming device. In addition, this feature of the present invention can also provide a unique packaging structure for this combined power management module—the structure of the consuming device. ; Mention two and two in this consumption split and this power adjustment module ;; t one of the energy management office integrated power adjustment and thermal management module six; two additional thermal energy capture and rejection components will also be able to Omit: Modal tongue 1: Features' because in some examples, this power adjustment module is not: heavy? Can reach the operating temperature of the device 20 0. In addition, make this thermal energy management module " Miniature rate adjustment and thermal energy management module in a high space limit if promoting integration] The thermal energy capture of the thermal energy management element and the ability to reject it: Implementation. In order to enable these thermal energy capture functions to be separated specifically, borrow a structure " this single structure (the integration of the function of the warrior's week is integrated in the power adjustment not shown in Figure 8)

Page 30, 200302960 V. Description of the invention (24) " 'and thermal energy management module 1 0 0 0) will be implemented inside the package of an integrated circuit device (please refer to, for example, Figure 丨 丨) . These thermal energy insulation functions can be performed using a heat sink placed on the surface of the device / package, or remotely from the device / package. Please refer to Figures 8 and 9. The power adjustment and thermal management module 1000 can have a power adjustment element 1 100. This power adjustment element can be substantially similar to the power adjustment module 100 shown in Figs. 2 to 7, and can have, for example, the aforementioned through holes, pads, and circuits. For the convenience of explanation, the details and functions of the power reduction element 11 100 will not be repeated here. The power adjustment and thermal management module 1000 may also include a thermal energy management element 1200. The heat management element 1200 is used to capture and remove the thermal energy generated by the device and / or the power adjustment module 1 1 00, so that the temperature of the device 2 0 and / or the power adjustment module 1 1 0 0 will not More than a given temperature. This thermal energy management piece 12 00 can also be used to reject this thermal energy. In this way, in operation, the thermal moon dagger 1200 pieces can capture the thermal energy generated by the device 2000 and the power adjustment module 丨 丨 〇〇 and remove this thermal energy so that it can pass through convection Or a heat rejection element (for example, a conventional heat sink) is spread to the surrounding environment. The power adjustment and thermal energy management module 1000 can also have a substrate 102, which forms a main part of the power modulation module 10000, and a substrate 102b, which forms a thermal energy management element 1 A part of 2 0 0. These two substrates can be used, for example, anodically or fus i on, glass, or eu tec tic, or adhesive bonding of glass and semiconductor structures. Connect. In addition, metal structures can also be used

I

Page 31 200302960 V. Description of the invention (25) It is connected by welding, soldering, eutectic bonding, or adhesive. This combined substrate 102a and 102b can form a power adjustment and thermal energy tube = group 1 0 0 0. In this architecture, an interface hole providing electrical connection between the printed circuit board 400 and the signal path of the input / output of the device 200 can be fabricated in two steps. First, a separate combined interface hole is formed in each substrate of the power adjustment element 1100 and the thermal energy management element 1200. Subsequently, when the two substrates are connected, an interface perforation in the substrate 102a will match the corresponding interface perforation in the substrate 102b, thereby forming an interface perforation of the module 1000. First, in order to enhance the electrical continuity between the interface perforations in the substrates 102a and 102b, the intermediate interface pads can be placed on the surfaces of the mating interfaces in the substrates 102 and 102). After the two pads are connected, the pads on each matching interface will contact the corresponding pads on the other matching interface. This architecture can provide greater tolerance when matching and matching the area power adjustment element 1 100 and the thermal energy management element 12 00 '. In this way, the power adjustment and thermal energy management module 丨 0 00 can be strengthened. When perfectly aligned, the electrical interface between the exposure interfaces is continuous. Μ In addition, in those cases where power and location perforations are used to provide external power to the power adjustment fork = 110, we can use the production techniques described previously to form these power and location perforations. However, in those examples where a winding connection is used to provide external power to the power conditioning module 00, power and location perforations are not necessary.凊 Continuing the tests of Figures 8 and 9, in one embodiment, the thermal energy management module 1220 can have a micro-channel thermal energy exchanger 丨 2 丨 〇, which has a plurality of micro

Page 32 200302960 V. Description of the invention (26) '--Channel 1 220. The micro-channel thermal energy exchanger 121〇 may also include a heat pump 1230, a fluid inlet 1240, a fluid outlet 1250, and a pipe j 2 6o, and the fluid is supplied to the microchannel 1220. Stomach & Please refer to Figures 10A and 10B. The microchannel thermal energy exchanger 121 can be 3, for example, a microfabricated semiconductor substrate, a mechanically fabricated gold substrate, or a mechanically fabricated glass substrate. The 10A and log diagrams are respectively a top view and a cross-sectional view of an example microchannel structure 1 220. The substrate of the thermal management element 1200 may have a pattern of microchannels i22- and 1220-2 etched into the interface. These micro-channels 1220-1 and 1220 ~ 2 can also be arranged above the interface of the thermal energy ~ management element 1200 in response to the thermal energy removal requirements of a specific area of the power adjustment element 1 100. The density of the microchannel structure 122 can be increased corresponding to the predicted or measured area of the excess thermal energy source, or the windings of the microchannel 12 ^ -1 and 1 2 2 0 — 2 can also be designed to exchange the microchannel thermal energy. 1 2 1 0, the temperature gradient from the inlet to the outlet is reduced and / or minimized. The width, depth, and shape of these micro-channels 122-umo-2 can also be set; and manufactured to improve the temperature consistency of the device or to meet the hot spots above the device 200 and / or the power adjustment element 1100. In fact, the formation and arrangement of the microchannel structure 1220 can also be approved by the United States Patent Application ("Electroosmotic Microchannel Cooling System", filed by Kenny et al. On January 19, 2002, application) The thermal model tools described above are used to assist in design or decision. In addition, many different types of 埶 121〇 and microchannels 122〇-U 1 22 0-2 = change layout, and architecture will be described in Kenny et al. Description and introduction in the US patent application filed on January 19,

Kenny et al. U.S. patent application filed on January 19, 2002 (issued

200302960 V. Description of the Invention (27) The application name “π electroosmotic microchannel cooling system” has not been obtained. The US patent application filed by Kenny et al. Will be referred to in this specification as “ Kenny patent application π. In addition, this Kenny patent application, as a whole, will also provide a reference to this specification. It should be noted that 'microchannel 1 2 2 0 can also be extended to the inside of the interface of the power adjustment element 1 1 0 0 In addition, the micro-channel structure 丨 22 〇 can also be formed on the first and first matching interface of the thermal management module 12 2000 at the same time. In this embodiment, the 'micro-channel heat exchanger 1 2 1 〇 can be more effective Ground capture and removal of the thermal energy generated by the device 2000 and the power adjustment element 1 1 00 is partly due to the heat generated between the parent converter 1 2 1 0 and the device 2 0 0 and the power adjustment element 1 1 0 0 Closer physical contact. 'The microchannel heat exchanger 1210 can also use microchannels 122〇_1 and 1 220-2, with at least one fluid path, as shown in Figure 10A. These independent paths can be In accordance with the requirements and / or design of this application device, connect and connect to different drums 1 230 and / or different thermal energy rejection elements 141〇. As mentioned earlier, microchannel heat exchanger 121〇 and microchannel 1 22 0 — 1 And 1 220_ Many different types of arrangements, layouts, and architectures have been described and introduced in the Bu Yi Ya patent °, which can be further referenced. Ming Department of this tube 1 2 3 0 can be any type of tube device, 1 can The capture device 2000 and / or the power adjustment element 丨 丨 〇〇 required to generate thermal energy = 2, kinetic and pressure. In this regard, the cartridge can be of an electroosmotic type, as described in the Kenny patent application and Introduction. This kind of electroosmotic jacket device is not described in detail here, and its corresponding discussion will be filed in the patent of Kenny * and Kenny.

Page 34, 200302960 V. Description of the invention (28) The power adjustment and thermal energy management module in Figs. 8 and 9 can be adjusted with power το 11 〇〇 Effective management components near the device 2000 Remove the power adjustment elements u 调整 and ^ for additional benefits of ^^. In addition, 'by placing these work finishing components in a single module below the device 2000, the surface (for example, the upper surface) of the device 2000 will be stained with Γ: Γ ΐΐ;) And, or the placement of memory devices. This placement step can also make the surface of the device 200 = for example: an additional thermal energy management element (as shown in Figure 3 = 2) or a second thermal energy management element (as shown in Figures 17A and 7β) ^ ", made In addition, the power adjustment and thermal energy management modules in Figures 8 and 9 can also promote effective package attack as a separate device. In this regard, please refer to Figure 12A, module ^ No. 11 and package wear 1 30 0, Medium ^ Add to a typical electronic body with pin 13⑽: Medium, eight can be adjusted to meet the required flow of the thermal energy management element 1 2 0 0 The device shown in the embodiment of Figure 11 can be used-kind of practice Known ice σ: square, spherically connected fixed architecture to an electrical interconnection array. In addition, the town device 2000 can also use a method similar to the previously described (please participate in the description, device 0 uses an orientation Bottom, spherical connection fixed II: Wide provides several additional benefits, including providing device 20 0 and heat pipe prosthetic pile 20 ° (and micro channel 1 220 filled with fluid) thermal energy capture capacity 6 ^ lt, and provides back access for device 2000, for which Dagger power month, as previously described.

Page 35, 200302960 V. Description of the invention (29) The upwardly-oriented, winding-connected fixing brackets of the conventional V-type faces described in the embodiment of FIG. 12A may be unnecessary. Two connections: In this embodiment, these The interconnect is connected to the device 2000. However, the winding connection technology of / ,, and: ^ can provide electrical properties, including, for example, the implementation of 1 300 in order to allow power; ς = ..., can capture components added to the bag 5 weeks, the whole piece 11 00 and in addition, this embodiment can also get another; set 2 ° 0 to keep close. 200. The power adjustment element i7 '· provides the device with touch to make the device _, or the power adjustment element = 〇] = 二 to effectively capture (using the hot moon moon of the cow in the microchannel 122〇 can be implemented. Another benefit is device 2. Heart ^^: Other devices;: r (such as: ccd), and / or optical switch. Dry the imaging garment first. Implementing device 20001300 in a rough environment may be More favorable choices. For example, 2 packs and 3 packs can be far removed, and Pak Gedi's package is not as good as the pack. The pack's entire power of 1 000 and 1 packs can be provided: a sealed environment, in which the mold touches. This cover i_ ;: opaque r: = 2 ° may also be infrared or visible with = (eg = see device). Integrating power adjustment and thermal management functions here ^ ^ can make the best operation of thermal sensing devices, such as imaging Array. In the case where the Pei 200 is directly fixed on the substrate (for example, printed circuit board 400, page 36, 200302960 V. Description of the invention (30)), the fixed fluid is used to supply the operating fluid to the thermal energy management option. Figure 13: This moving channel or pipe 1260 The microchannel heat exchanger is provided with a solder, and / or an adhesive or embedded pipe 1 260 is directly fixed to (not shown in the figure) and the fluid outlet to promote the implementation of the module 1000 in the wafer transfer. Module 1 0 0 0's components 1 2 0 0 can be used for fluid rate adjustment and heat 1 2 1 0. Pressing agent (adhesi microchannel thermal energy (not shown in the figure) (pick-pi substrate production channel can be a more favorable choice) By using the built-in or shape energy management module 1 0 0 0's (press fit) and welding ve), these channel exchangers 12 1 0 can flow in). The architecture of Figure 13 can be a) components There should be a technique in the process, which can be used to connect to the two surface energy exchangers in the hole connection pipe or use the welding. In the case of the 13th and the thermal energy. Note that there are many channels These are, for example, channel segments and / or positioning. These links can be connected to the top or channels of the solder or sticky module 1 0 0 0, so as to match one. In the end, the internal funeral 1 2 1 0 Fluid inlets and transmissions should be developed with embedded channel architecture Module 1 0 0 0 is packaged as shown in Figure 13. This, embedded or formed or pipeline 1 260 is connected to the module [000] can be formed in the module 1 000 Other couplings can be inserted into the module 1000, so as to press fit, or adhesive. Or, our bottom surface is formed with an opening, and an opening is connected to one or more above these openings. All techniques for fixing channels or pipes 1260 to microchannel heat out, whether they are now = fall within the scope of the invention. It can also be applied to the consumption device and power adjustment, and the packaging fluid is fixed to the substrate. The action fluid can be used for power adjustment using a fixed consumption channel or pipe ^

200302960

The microchannels of the thermal energy management module (or internal disputes a, t ^ This piece can be used to fix the fluid J Sr;) is directly fixed to the channel (or internal, ff & Packaged fluid enters σ and outlet. In these cases, in this example of fluid inlet and outlet, these channels (the channels and channels of the formula = can provide the interconnection between the substrates. Or & 迢) and micro-pass the thermal energy Exchanger fluid inlet and outlet In addition, for the module 10 G 〇 for more timely cooling and rate trimming and thermal energy pipes, the temperature, the reactor 1 270 is information (for example, it will be wound Close to control 1 0 0 〇 function

The power adjustment and thermal energy management module 丨 〇 〇 〇 can also have circuits or devices to provide parameter information to achieve more efficient and power adjustment. Please refer to FIGS. 4 and 5, the power module 1 0 0 0 of the present invention may additionally have a sensor 2 7 0 (for example, a force and flow sensor) and a controller 128 0. These senses provide the 'operating temperature' indicating the operating conditions of the device 2000 and the module 100). The signal of the sensor 1 270 is then used to provide power adjustment and thermal management module loop control. In particular, when the sensor 2700 is equipped with a 1280 series, this temperature can be used to adjust the operation of the thermal management element 1200 and the power adjustment. In these cases, the power is operated in a thermal control mode, in which the feedback signal of the system 1 2 0 0 is measured by one or more temperature sensors. This control information is used to decide, for example, when there is a temperature measurement sensor, the data provided by the control sensor is used to change or adjust the component 1100, and / or the device 200 adjustment and thermal energy management module 1 〇〇〇 Scattered in the entire module 1000, one temperature change can be provided as a controller 1 2 0 0 can use the sensor 1 2 70, for the module 1 0 0 0 and / or device

P.38 200302960 V. Description of the invention (32) The average temperature of (20) 200 and the spatial variation of the temperature with respect to the module 1 0 0 and / or the device 2 0 0. In response to this information, the controller 1280 can adjust the fluid flow rate through the microchannel 1 220 of the microchannel heat exchanger 1 210. In addition, this control cry 1 280 can also control the operation of the drum 1 230, or adjust the fluid distribution in different channel forms through the micro-channel thermal energy exchange, thereby adjusting the fluid flow rate in the micro-channel 1220. In addition, the control 1 2 8 0 ′ is deciding to be ㈣ / phoenix, and it looks like a fool, to warn that the device 200 may exceed (or have exceeded) its rated operating temperature. By this means, the device 200 can activate a low power mode, thereby reducing its operating temperature and power consumption. Furthermore, consuming less power will also reduce the thermal energy generated by the device 200 and the power adjusting element 1100. This device can enter a shutdown procedure based on information related to its operating temperature as a protective measure. Other actions in response to temperature fluctuations are described in the Kenny patent application, which can also provide further reference. The placement or location of sensors 1 270 (for example, temperature, pressure, and / or flow sensors) within substrates 102a and 102b can be based on several considerations. For example, placing a temperature sensor laterally relative to the predicted or measured heat source of these microchannels 1220 and the circuit 112 and / or the device 200 may be a very advantageous option. In addition, placing temperature sensors at different depths (vertical positions) of the substrates 02 and 102b may also be a very advantageous option. Figures 10a, 10b, 14 and 15 show the sensors 1270 placed in various positions in the power adjustment element 100 and the thermal energy management 1200. These sensors are used to indicate the operating conditions (for example, 'temperature') of the device 200 and the module 1000 in a specific area to the controller 128.

Page 39, 200302960 Five 'Invention Description (33) Detailed discussion, operation, and placement or position of various sensors 1 270 J ^ brother Ming in the Kenny patent application, which can also provide further = Note that, Although the embodiments in Figs. 9 and 15 only refer to the same (ie, the tube 1 230), it is also possible to use the power of the ancient moon, and it is also okay, and the ancient evening is added to the sheep's mouth and the thermal management module. 1000 λ corpse, 夕 Xi Yu in a single tube mechanism. An additional cartridge mechanism can also be implemented, providing the flow control in a specific area of the module 1000. This is particularly important in the case where the device 200 and / or the power adjustment element 1100 are hot spots. For example, more than one capsule can have a separate and independent microchannel 12 core from the microchannel thermal energy converter 1210, as shown in Figure 1 () A. In addition, other implementation examples that utilize more than one tube mechanism also detail the sKenny patent application for further reference. / 、 For example, in a nutshell, the power adjustment and thermal energy management module 1 0 0 0 of FIG. 5 is used to provide the power adjustment function of the device 200, and the device and / or the power adjustment element 1100. Cold energy maintained within an acceptable temperature range. Attacking a controller 1 280 and cooperating with a sensor 1270 is to complete the analysis and detection of 200 and work > rate adjustment and thermal energy management module 丨 00 operation parameter changes. Such changes may be caused by changes in the soap rate used by the device 2000. Therefore, the thermal management element 120 can adjust the cooling capacity (for example, using a control signal of the fluid cartridge to increase the fluid flow rate), thereby maintaining the temperature of the device 2000 within an acceptable temperature range. In addition, the power adjustment and thermal energy management module i 〇 〇 〇 can also have an electric t sensor to detect the current consumption of the device 2000. Please refer to Figure 6

/; IL

200302960 V. Description of the invention (34) The current sensor 1 2 9 0 can be embedded in the tomb to identify the i + shishi π πηη / 丄 门 gan is inserted into the base of the toad body 102 to provide a table device 2 0 〇 And / or circuit 丨 丨 2 lightning method ^ ^ ^ ^ z4 consumes poor signal to the controller 1 2 8 0.

After Ik, the controller 1 280 can hold the grip of I2, π, τ, _, and thermal energy management το. Spot ^ 士 1 9 Q 〇 ^ '0,1 ^ ^ For example, in response to the current demand change of the current sensor 1 2 9 (Μ 贞), ^ 19 ^ 0 ^ ^ ^ ^ ^ t is controlled to 1 280 It is possible to increase or decrease the flow of the L body with i Z d U, so as to outline it. T. ≫ The fluid cooling of the thermal management element 1 2 0 0 is required to be changed precisely. Detects and analyzes the temperature change of the current demand piece 1100 of the device 200. The moo and / or power adjustment element of the pre-continued page continues to refer to FIG. 16, the electric chip *-, 4- 1 1 Λ η ,, motor sensor 1 290 can also detect the current through the circuit 1 1 2 of the power adjustment element 11 00 (for example, the central% mn snow 4 one plus, j, the electric adjustment device). This passes through the circuit 1 1? &Amp; fγ The w 2 current can represent the current and power consumption of the device 200 and the demand and power consumption of the device. This batch of controllers can also use the resources and / or power of the sensor 1 290 to open up 1 1 nn At first, the temperature change caused by the current consumption change of the device 200 ^ ^ J Γ can be increased or decreased. In addition, this controller can also use the heat energy generated by the change in the resource. Catching and rejecting the demand. The power consumption is based on the current measurement of the positive current setting after these voltage adjustments are made. We can determine the power consumption and voltage of the voltage regulator. Crying at 丨 1 1 9 q η, 1 ~ & set the power consumption of 2 0 0, so that control σσ 1 2 8 0 b is enough to determine the overall work car, and by the red parallel port, 1 〇 · «Η ΛΛ MA, +4 is used to adjust the thermal energy of the microchannel to capture and remove the thermal energy of 1 2 1 0 and remove the stains, furnace traps, and power. The microchannel thermal energy exchanger m〇 captures this And removing the i-force can also be adjusted by changing the flow rate (for example, adjusting 9Qn & = A action fluid failure v al ^ is the same as the output flow rate of 1 230). In addition, the controller 1 2 0 0 is also possible, A baby cutting knife with the mouth around J with, in the capture and removal device 2000 and the mold

Page 41 200302960 V. Description of the invention (35) After the thermal energy of group 1 0 0, adjust the thermal energy rejection capability. Other technologies that change the thermal energy capture and removal capabilities of the microchannel heat exchanger 1 2 10 are described in detail in the patent application, which can also provide further reference. ny In the embodiment of FIG. 16, the inductor 2 9 0 is integrated with the voltage regulator of the power regulator 1100. It should be noted that the control ^ ^ can also be directly determined by the power consumption and / or consumption of the device by the power consumption of the device 200 during operation. Subsequently, the controller 280 can use this information to determine or implement appropriate actions, for example, to adjust the thermal energy capture and removal capabilities of the channel heat exchanger 1210 ^ = ability to reject, as previously described. The heat of the system is as follows: The function / operation performed by the controller 1 280 is also in the meaning of 0, and it is contained inside the device 200. In this case, ^ 'for example,' sensor 127. (For example, temperature, d first%: Ge current sense; information about i29 °, or clock rate, 3 Ϊ: U theory ... and analog current output states can adjust the power to adjust the power of the first year i⑽ / Pass this, the device 200 can also adjust the thermal energy tube. In addition, the ability to remove, and / or reject. Use the thermal energy of the device 2 〇 = ° 〇 to capture or move some or all of the functions / operations can promote 0 cracks For example, the controller 1280 executes the clock rate, and the device can supply the information. T Existing benefits from different sources of transportation In addition, for performing repeated or predictable functions, it is possible to predict the power consumption changes of the device, and arranging & we also use a dynamic model of i systems

Page 42 200302960 V. Description of the invention (36) The best or strengthened strategy for generating thermal energy capture and refusal of management, in order to minimize the temporal or spatial variation of temperature within the event. This device 2000 controller 1 280 can also implement complex control algorithms, so that the device core and / or controller 1 280 can determine the appropriate thermal management element 12 00. Device 200 and / or power Adjusting element 11. 〇The temperature can be maintained. In addition, this information can also be used to develop a thermal energy capture, absolute operating procedure, in order to achieve the best balance between the temperature change of the device 2000 and the operating cost of the thermal energy management module 1000. This type of operation == 200 consumes power, computational complexity, and / or operations in the range of better flow and thermal energy. Besides 9nn /, the device 200 and / or the controller 1 280 can also use the information representing the device 2 00 # to predict the spatial distribution of the power consumption inside the device 2000. Two, for example, if the device 200 is a microprocessor, the floating-point processing state and power consumption may occupy a small part of the surface of the microprocessor. Part of the power consumption. In this type of example, the temperature of the subsystem of a microprocessor will rise rapidly to a level higher than that of the second gallon. As such, the device 200 and / or the controller 1280 preferably can consume the dense power consumption of the device 200 and thereby provide the necessary thermal energy to capture this force, which presents dynamics to the dense power consumption area of the device 200. According to another feature of the present invention, the present invention is a closed loop aging and thermal energy management system. Please refer to Figure 7A. In one embodiment, only a closed loop power adjustment and thermal energy management system 2000 series has a power adjustment π, this answering module 1 000, as described earlier, and is matched with Thermal energy capture and rejection, Bago group 1,400. In this embodiment, the power adjustment and thermal management module

200302960 V. Description of the invention (37) '' " "-1000 is placed on the surface of the printed circuit board 400, and the device 200 is placed on the surface of the power adjustment and thermal energy management module 100, and the thermal energy is captured. And the rejection module 丨 400 is placed on the surface of the device 200. In this architecture, the power adjustment element 1100 of the power adjustment and thermal management module is placed near the device 200, thereby providing the power adjustment benefits previously described. In addition, the micro-channel heat exchanger 1210 / is placed near the power adjustment element 1 1 0 0 to promote enhanced thermal energy capture, removal, and rejection, thereby maintaining the temperature of the power adjustment element 1 Accepted. Subsequently, the thermal energy captured by the thermal energy management element 丨 2 0 0 will be provided (via fluid flow) to the thermal energy rejection element 1410 of the thermal energy capture and rejection module i 4 00. … The heat capture and rejection module 1 4 0 0 is the use of thermal energy rejection element 1 & 1 (as shown by the heat sink with straight tail fins) and thermal energy capture element 42 4 rejection of thermal energy management element 1 2 〇 〇 Generated thermal energy. This thermal energy rejection element 1 4 1 〇 can utilize many different types of thermal energy rejection technology, including ... Designs with fluid flow paths on high surface area structures (such as fluid channels in straight fins), such as the Keen ny patent Description and introduction of the application. All of the thermal energy capture, removal, and rejection technologies described and introduced in the κeny patent application can also provide further research. The thermal energy capturing element 1420 has a micro-channel thermal energy exchanger 1430, which can promote the regionalized thermal energy capture, removal, and rejection of the thermal energy generated by the device 200 (with the thermal energy rejection element 1410). This micro-channel thermal energy exchanger 1 4 3 0 has a plurality of micro-channels 1 440 (with fluid in operation) to complete the effective thermal energy capture of the device. This micro-channel thermal energy exchanger 1 430 includes micro-channel 1 440 ′ and can be used with the micro-channel thermal energy exchanger 121〇 and the micro-channel 122〇

Page 44 200302960 V. Description of the invention (38) The same method and materials are used to make it. In addition, this micro-channel heat exchanger 1 430 can also respond to the heat removal requirement of a specific area of the device 2000, so that, for example, it is arranged at the interface of the heat capture element 1420. The density of the microchannel 1440 can increase in areas corresponding to expected or measured excess heat sources. In addition, the winding of the microchannel 44o can also be designed to reduce and / or minimize the temperature gradient at the inlet and outlet of the microchannel thermal energy exchanger 42o. The width, depth, and shape of the microchannel 1440 can also be designed and fabricated to improve the consistency of the device temperature in the device 2000. In fact, the shape and layout of the microchannel 1 440 can also be assisted by the thermal modeling tool described in the Kenny patent application. In addition, many different types of permutations, layouts, architectures, and design techniques for microchannel heat exchangers 1420 and microchannels 1440 are also explained and introduced in the Kenny patent application, which can also provide further reference . Similar to the previous description of the thermal energy management module 丨 200, the microchannels of the microchannel thermal energy exchanger 1420 can also be placed on the two interfaces of the thermal energy capture element 4200 at the same time to use the thermal energy generating device. Thermal energy is captured, removed, and / or rejected. In addition, it should be noted that the microchannel thermal energy exchanger 43 can also be constructed as an array of microchannel pillars. In this regard, a vertical channel array is interconnected vertically above one interface (or two interfaces) of the thermal energy capture element 142. This architecture can further enhance the capture, removal, and / or rejection of the thermal energy generated by the device 2000 and / or power adjustment and thermal energy management module 1000. Please continue to refer to FIG. 17A. In this embodiment, the cylinder 1230 is disposed between the thermal energy capturing and rejecting module 1440 and the thermal energy rejecting element 1410. This 茼 1 2 3 0 can be an electroosmotic ° cylinder device, such as the κ e η n y patent application.

Page 45 200302960 V. Description of Invention (39). In addition, the Dou Xi Ding Shou of the tube 1 2 3 0, which includes different types of architecture and design of Kenny patent application / electricity can also be connected to those architectures and designs that can provide further references / cases, and it should also be noted that , Is a green independent fluid cooling circuit V Sa :: can provide independent Cf1 by using a plurality of drums and / or capture ability. . . It is described in detail in the hot cases inside and at different positions, and it is also possible; this feature is also used in Ke_patent application "for further reference. Please refer to FIG. 17B. In a specific place, the mouth is set away from "2_", 3 will reject the thermal energy rejection element 141, and other components can be quite advantageous choices. This type of ^ can promote the system. The "limits the production of environmental towels, and provides sufficient power adjustment and thermal management in a small footprint." When the heat rejection element 1410 is disposed away from the ground, the pipe 1260 can provide the device 200 and the power adjustment element 121 to heat the fluid path of the fluid to the heat rejection element 1410. In this embodiment, the heat-rejecting element 远离 4ι, which is far away from the setting, can be placed in an area with sufficient volume (for placing straight-tailed arrays, which can have a fan), and will not interfere with the device 2 〇 Other system requirements for nearby weekly and peripheral systems (such as memory or data storage devices). On the matter, as described previously, in certain circumstances, the thermal rejection function may not be necessary. The power adjustment and thermal management module 1000 in Figs. 8 to 17B is used to introduce the power adjustment element placed on the surface of the thermal energy management element. In the embodiment shown in FIG. 8, the thermal energy management element 11 ′ is placed on the surface of the power adjustment element 12 2000. In this embodiment, the thermal energy management element 120 can capture and remove the thermal energy generated by the device 2000 more effectively because the microchannel is adjacent to the device 200.

200302960 V. Description of the invention (40) In addition, the thermal energy capture and removal of the circuit 112 of the power adjustment element 11 00 can also be relatively unchanged. In this way, the thermal energy management element 丨 200 can more effectively capture and remove the thermal energy generated by the device t00 and the power adjustment element 丨 丨 〇〇. Because in this embodiment, we can use the thermal energy capture and removal function of the thermal energy management element 1 1 00 without adding a thermal energy rejection element (for example, a heat sink, the figure Not shown). It should be > the idea is that, like the embodiment shown in FIG. 8, the micro channel 2 2 0 (shown in FIG. 18) can also be extended to the interface of the power adjustment element 1100. In addition, the micro communication structure 1 2 2 0 can also be formed at the same time on the thermal energy management module 丨 2 00 = the first and second matching interfaces. In this case, the microchannel thermal energy exchange 1 2 1 0 can even more effectively capture and remove the thermal energy of the device 2000 and the power adjustment element 1 100, in part because of the microchannel thermal energy exchanger 1210 and the device. The more intimate physical contact between the 200 and the power adjustment element 1100, in addition to thermal considerations, the circuit of the power adjustment element will still be in close proximity to this device, thereby providing all the power adjustment benefits previously described. The power adjustment and thermal energy management module shown in FIG. 18 can also be manufactured and implemented by using the same method of the power adjustment and thermal energy management module shown in FIG. 8. In addition, the power adjustment and thermal energy management module 1000 shown in FIG. 18 may also have all the specifics, additions, attributes, and implementations of the power adjustment and thermal energy management module 1 shown in FIGS. 8 to 17B. example. In this regard, the power adjustment and thermal management module 100 in FIG. 8 can have, for example, a controller, measurement or detection device 2 ο 〇 and / or power adjustment element 11 〇〇 operation Conditional parameter sensors (for example, temperature, pressure, and flow), and monitoring devices 2 0 0 and / or power adjustment elements 1 1 0 0 current sensors for current consumption page 47 200302960

In addition, the first tube, with a small foot to enter the mold 1 0 0 0, or the power adjustment is the same as the 11th example. The features of the example of all the figures in the figure 1 0 0 0 are the micro channel and the independent and thermal architecture of this power channel. cover. Figure 18 shows the power adjustment and heat (osmotic cartridges that provide the working fluid to these traces). In addition, Figure 18 specifies the area with a plurality of independent fine-tuning elements 11 0 0, the power adjustment of Figure 18, and the packaging of Figures 12A and 12B. In fact, the features and attributes of Figure 8 to 17B are as follows. Rate adjustment and thermal management modules and attributes will no longer be re-modeled. 1 0 0 0 can also be provided. That is, (including, for example, the rate adjustment and thermal energy management module in a space-constrained environment to allow the device 200 and / or thermal energy capture and removal. The management module 1 0 0 0 can also be implemented substantially in line with the first The implementation rate adjustment and thermal energy management modules in Figure 8 will be equally applied to the first for streamlining purposes. For these implementations, please refer to Figure 18, the power adjustment and thermal energy management module 100, and use the information in Figures 2 to 17B All the same technologies described above are used for signal winding on the device 2000. In addition, the power and location can also be wound on the circuit ° j2 and the device 200 using the same technology. For example, the embodiment of FIG. The winding technology described in FIG. 6, wherein the output power and location duct is a predetermined pad formed in the substrate using conventional manufacturing technology and wound to the power and location input of the corresponding device 200. In this kind of In the case, the output power and location pipe is directly wound to the power and location input of the device 2000. In another embodiment, the micro-channel structure of the power adjustment element and the energy management element is formed in In the same substrate ~ instead of being formed in the substrates 102a and 102b, as described previously and shown in Figures 8 and 18. Please refer to Figure 19A, M channel structure 1 2 2 0 and power adjustment Element 11 〇〇 series production

200302960 V. Description of the Invention (42): ί: 5 :. In this embodiment, because the thermal energy management element and the power adjustment element do not need to be interfaced with this consumption device and another one: Heliyang said, a printed circuit board), the cost of assembling by the cows can be reduced. In addition, because: ^: combined with the heat-generating circuit that consumes the surface of the device, the consumption wears two: 敎 = 2 is placed in the reverse phase. Compared to the embodiment of FIG. 9, it can also be used to capture and move In addition, the thermal energy capture and displacement of the circuit U2 is divided by: can = enough work = yuan: It does not matter, for example, the heat sink or fan's extra: the ability to remove, capture, and reject. π I ”, please continue to refer to FIG. 19A, in this embodiment, the structure of the micro-channel that can manage the measurement can also use the micro-channel production technology and (or 1 The other techniques described above can be made, and the basin can also be used as a step reference. Subsequently, the circuit 112 of the power adjustment element 1100 will be a metal oxide semi-transistor (c-teng) and a bipolar transistor: 1 Λ 2 to make. In this embodiment, this is made after it is formed. The welded solder joint (if; the chip 112 and the microchannel 1 220 is connected and made after making it.) It should be noted that there is a plural base (that is, : All features, attributes, alternatives, and implementation examples of the power adjustment and thermal management module 1000 are also fully applicable to the embodiment of FIG. 19A. In this regard, FIG. 19A The power adjustment and thermal energy management module 1000 can be exemplified by parameter sensors (for example, temperature, pressure, flow current sensors. In addition, the power adjustment and thermal energy management module 1 of FIG. 19A 〇〇

Page 49 200302960 V. Description of the invention (43) It is also possible to have a tube and a plurality of independent micro-channels, so as to achieve independent thermal energy capture and removal of the designated area of the device 200 and / or the power adjustment element 1 1 00. In addition, the power adjustment and thermal management module in Figure 18A can also be implemented as the packaging architecture in Figures 11, 12A, and 12B. In fact, the power adjustment and thermal energy management modules shown in Figures 8 to 18, as described earlier, all the features and attributes of ° will also be equally applicable to the power adjustment and thermal energy management modules in Figure 9A. group. Please continue to refer to Figure 19A. The power adjustment and thermal management module 1000 can use any of the winding technologies described previously to perform signal winding on the device 2000. In addition, the power and location can also be wound on the circuit 112 and the device 200 using the same technology (including the technology shown in Figure 6 and previously described). It should be noted that, in those cases where the power adjustment element 1 100 circuit 2 can be micro-channel processed without causing damage, the circuit 2 2 can also be fabricated before the fabrication of the micro-channel structure. In this way, these interfaces, power and ground perforations can be made before or after the microchannel structure is formed. The pads (if any) connected to these perforations can be made after the other components of the power adjustment and thermal management module 1 00 0 are completed. In the embodiment of FIG. 19A, the micro-channel structure of the power adjustment element 丨 i00 and the thermal energy management element 1200 is fabricated in a substrate. In another example, the entire microchannel structure (or part of this structure) can be fabricated on the back side of the device 200. Please refer to Figures 19B and 19C. The microchannel 1 220 of the microchannel structure can be completely manufactured in the device 2000 (Figure 19B), or partially manufactured in the device 200 and the power adjustment element " 00 (Figure 19c Figure). In addition, the discussions in Figure 19A can also be applied to Figures 19B and igc completely and equally.

Page 50 200302960

The power adjustment and thermal management module described in the figure. For simplicity, these discussions will not be repeated. Another feature of the present invention is to use this module and ^ / or the previously described elements (for example, power adjustment element 丨 丨 〇〇, thermal energy capture and rejection module 1 400, thermal energy rejection element 1410, and The thermal energy capture element 142) is used as a design block of the system, which has a regional power adjustment function and thermal energy capture, removal and / or rejection capabilities. For example, please refer to FIG. 20. In one embodiment, “the device 200 is placed on the printed circuit board 400, and the thermal energy capturing element 1420 is placed on the surface of the device 200, thereby promoting the device 200 The capture of thermal energy in the area. This power adjustment and thermal energy tube and management module is placed on the surface of thermal energy capture element 142. In this embodiment, setting the power adjustment element 1100 to the thermal energy capture element 1420 and the thermal energy management element 2200 is a quite advantageous option, which can enhance the capture of the thermal energy generated by the power adjustment element 1100. In addition, the thermal energy rejection element 1 41 0 (for example, a heat tank with a straight tail fin) can also be placed on the surface of the thermal energy management element 12 0 0 to obtain the thermal energy management element 12 00 and the thermal energy capture element 1420 ( The enhanced rejection function, which is mainly generated by the device 200, captures thermal energy (mainly generated by the power adjustment element 1100). In the embodiment shown in FIG. 20, the power adjusting element 1100 is immediately adjacent to the device 2000. The power and location connection on the power adjustment element 11 〇 can be completed using the previously described winding connection structure (please refer to, for example, Figures 4 and 7) ° Please follow Bin Bin to refer to Figure 20 'This σ The cartridge (not shown) may be an electro-osmotic plastic-like cartridge, which is disposed in the thermal energy management module 1 200 and / or the thermal energy capturing element 1420. In addition, this tube is not necessarily installed in a heat pipe

Page 51 200302960 V. Description of the invention (45) The management module 1 200 or the thermal energy capturing element 1420 can be a stand-alone device. As previously mentioned, this cartridge may also have a plurality of cartridge mechanisms, including: a mechanism having the architecture described in the patent application. FIG. 21 shows another example in which a module and / or component is not used as a design element. Referring to FIG. 21, in this embodiment, the power adjustment and energy management module 1 0 0 0 is placed in the device 200. Surface, and the thermal energy capturing element 1420 is placed on the power adjustment element 11 of the power conditioning and thermal management module i 00. The surface is furthermore, the thermal energy rejection element 1410 is placed on the surface of the thermal energy capturing element 1 420 to strengthen The thermal energy management element 1 200 (mainly generated by the device 200) and the thermal f capture element 1 420 (mainly generated by the power adjustment element 1 100) to reject heat. 7 In addition, these power adjustment and thermal energy management functions are also You can add (all parts) to other modules or components, or even add consumer devices. In terms of 'these functions can be combined with consumer devices to promote a tighter 20% rate system. Please refer to FIG. 22 shows that in the two aspects of the present invention, the power adjustment and thermal energy management module 1000 is placed in the attack device 200, and the capture device 1 420 can also be placed in the device 2. 〇Table since month official management element 1 20 The rejection ability of the thermal energy captured by 0 (generated by Changzhi 200 and the power adjustment element = ',,, ποο). In addition, the thermal energy rejection element i4i〇 and the proximity relationship of the wearer 200, the thermal energy rejection element 141〇 also It can directly capture the thermal energy generated by ^ ^ 42Q () ° "'In the case where & able to reject the element 1410 to provide the amount ^‚ capture and rejection is not necessary, the thermal energy rejection element 1 4 1 〇 can also be omitted. Page 52 200302960 V. Description of the invention (46) It should be noted that the power adjustment and thermal energy management module 1000 can also be placed on the back side of the device 200, or the power conditioning element jj 〇〇 and / or The thermal energy management element 2 (H) can also be placed on the front and back side of the device 2 QQ with k. In addition, the power adjustment element 1 100 can also be placed on the front side of the device 2 0, and the thermal energy management element 1 20 0 can also be placed on the back of the device 2000. Refer to FIG. 23 for reference. In another embodiment of the present invention, the system 2 0 0 has a power adjustment module 100 placed in the device 200 and has thermal energy. The capture and rejection group 1 40 0 can be placed on the surface of the device 200, whereby Provide thermal management of the device and the power two positive components 1 100. As in the embodiment shown in FIG. 22, the power adjustment module 100 in FIG. 23 can be placed on the back side of the device 200 or It is placed on the front side of the device 20 () j. In addition, the power adjustment module 100 can also be placed on the back side and the back side of the device 200. It should be noted that in all the embodiments shown in Figures 20 to 23 ^ Π pieces and modules, as well as consumption devices with power adjustment and / or thermal energy management functions / components, can also have corresponding components and modules shown in Figures 2 to 19 = various features, attributes, alternatives, and Benefits, as previously described. For simplicity, these features, attributes, and benefits will not be repeated.

In addition, in the case where the thermal energy rejection element 141 is not necessary to provide the thermal energy capture and rejection capability, the thermal energy rejection element 415 can also be omitted. W Another feature of the present invention is a system with a plurality of consumption devices, wherein each consumption device has a power adjustment and thermal energy management module, and is used to receive the power of the main power supply and the action of the fluid cartridge mechanism. expansive,. Please refer to FIG. 24. In this embodiment, the main power supply 3100 = is used to provide an initial power adjustment for an external power source (not shown). Main page 53 200302960 V. Description of the invention (47) The output of the power supply 3 1 0 0 is used to provide the power adjustment elements 1000a to 1000c of the power adjustment elements 1000a to 1000c respectively. These power adjustment elements 110a to 1100c are used to provide regional power adjustments of the consuming devices 200a to 200c, respectively. These power adjusting elements 110a to 110c can be any one of the embodiments shown in Figs. 8 to 19 and described previously. This main power supply 31 00 utilizes the power bus 3110 to provide the initial adjustment power to each power adjustment element 1 100a to 1100c. This power bus 3110 can be wound in parallel to each thermal energy management element 200a to 1200c. This main power supply 3 100 may have a separate element (similar to that shown in Fig. 1), or it may be a power adjustment module 1 100 (as shown in Fig. 2). In addition, the main power supply 3 1 0 may also have an additional power supply circuit 'which is placed in the vicinity of the devices 200a to 200c, respectively. These additional power supply circuits can be used to provide additional start-up power adjustments before power adjustment elements 1100a to iiooc are supplied. Please continue to refer to FIG. 24. The fluid cartridge mechanism 3 2 00 can provide working fluid to each of the power adjustment and thermal energy management modules 丨 0 〇 a to 100 〇 c thermal energy management elements 1200a to 1200c. These thermal energy management elements i200a to 1200c can capture and remove the thermal energy generated by the devices 200a to 200c and / or the power adjustment elements iiQa to 1100c. These thermal energy management elements 1200a to 1200 (: may be any of the embodiments described previously or shown in Figs. 8 to 19. In addition, the system 3 0 0 in Fig. 24 may also have zones The thermal energy rejection element (not shown) is placed on or near the surface of the devices 200a to 200c. In addition, the system 3000 can also or optionally have a global thermal rejection element (not shown)

Page 54 200302960 V. Description of the Invention (48)) is used to reject the thermal energy of one or more thermal energy management elements 1 20 0a to 1 2 0 0c. In addition, these heat rejection elements can also have all the features of the heat rejection elements and heat rejection modules shown in Figures 2 to 19 and previously described. This fluid pumping mechanism uses a fluid bus 3 2 10 to exchange working fluid and various thermal energy management elements 12 20 a to 12 0 c. That is, π means the barrel mechanism 3 2 0 is to provide cooling fluid to each thermal energy management element 1 200a to 1 200 0c by using the fluid bus 3 2 10; and the fluid bus 3210 is used to provide thermal energy management The path of the heated fluid from elements 1 2 0 0 a to 1 2 0 0 c gives the fluid cartridge mechanism 3 2 0 0. This fluid bus 3 2 1 0 can also be wound in parallel or in series to the respective thermal energy management elements 1 200a to 1 200c. It should be better than the previous ones. These include the previously used thermal energy 3 2 10, which can be solved, but the artist can also invent the example of a power design block. See also, because it is noted that the power adjustment Thermal energy management operations mentioned in Sections 2 to 7. Management technology types are no longer necessary. The various implementations of the Ming Dynasty will not violate the instincts of the present invention and apply for these modules and adjust the characteristics and models obtained by thermal means. The system that should fall on Figure 24 can be used to rectify the group 1 0 〇Exemplary embodiments <: Various methods shown in Figs. 20 and 21 can be used for functions. The 'fluid pump mechanism 3200' and the examples have been described above. Familiarize yourself with the scope and spirit of the invention. Various changes, adjustments, and scope of changes shall prevail, and other changes in the combination of components may manage the unique system if necessary. Groups and other combinations of elements are also within the scope of the invention. The method is implemented, including this. In response to the benefits of the fluid bussiness artist, he is familiar with this technique. Therefore, one could take the above into account. Can be provided in this regard, the use should be predictable

Page 55, 200302960 V. Description of the invention (49) '~ ^ _ — In addition, these: power adjustment and thermal energy management devices (including the pictures shown in Figures 22 and 23). ≪ harsh colors can also be combined in this module, Components or devices. Other work: falling within the scope of the present invention = ===: ^, micro-channel heat exchangers, micro-channels, sensors, and tube machines, different types of arrangements, layouts, architectures, Design and technology should also be used to provide further reference. In fact, the entire Kenny patent application should be used as a reference for this case.

Page 56 200302960 Schematic description ί A block diagram of the traditional means of adjustment and thermal capture / rejection of integrated circuit devices (for example, microprocessing). The power m) is a sectional view according to a feature of the present invention. 3, Figure 3 is a block diagram of an embodiment of the second group added to an integrated circuit application device. Figure 4 of the pullback rate shaping mode is added to an integrated circuit application device, and the root-cut rate adjustment and thermal capture / rejection module of another embodiment of the square-meter-square function are shown in Figure 5 according to the present invention. A characteristic block diagram 敕 ★ (including power and ground ducts) section. Knife-off power adjustment module Fig. 6 is a block diagram of a top view of this power according to a feature of the present invention. Figure 7 of the JE 'pull, and interface is a block diagram of the Λ work Λ adjustment * thermal energy management module added to an integrated circuit application device. According to the figures of the present invention-Figure 9 is a block diagram of a thermal energy management module added to an integrated circuit application device. The graph power adjustment and the m-th graph are top views of a feature and a microchannel architecture according to the present invention. "、 A &10; a 10B drawing of this & 7L piece is a cross-sectional view of a 埶 frame shown in Fig. 10A along the AA tangent line.", &Amp; inside, the 11th drawing of this microchannel is added To a dual line (dual _in — Ηη square (face — down) integrated circuit of the integrated circuit, which is equipped with a striker and facing downward, is a block diagram of another embodiment of the integrated circuit application device on page 57. Figures 12 ~ 12 are added to a dual-in-line package, ee ~ down) integrated circuit application device of another embodiment. ^^ ^ 2A ® ^ ^ ^ ^ Road application device Embodiment 2 ^: A block diagram of an example of a top-facing (faCe ~ d0Wn) integrated capacitor—two 1T ^. = 1 3 :: is a sectional view of another embodiment of this power adjustment according to the present invention. This is a cross-sectional view of another embodiment of the present invention, this power adjustment and thermal energy management module. Another 15th figure is a block diagram of the embodiment of the power adjustment of the twelfth figure, which is added to the application device of the thermal management mode circuit, and the twelfth figure. Figure 16 is a cross-sectional view according to an embodiment of the present invention. 、 The other one of the Sheep Shearing and Thermal Energy Management Module_ Figure 1 7A is added to an integrated circuit application-type thermal capture / rejection module. ^, Centered, and a separate module is added. Figure 17B is added to —Block diagram and section view of each case. An implementation of each type of thermal capture, centering with a separation The third line is according to the other aspect of the present invention: a diagram and a sectional view. Sectional view of the management module. Do, a power adjustment and thermal energy tube Figures 19A, 19B and 19C are added to the first, power, and power management and thermal energy management

Page 58 In the integrated circuit application device for power adjustment and thermal energy management, the diagram is a diagram according to the present invention. ,

Block diagram of one embodiment of the system _ Figure 21 is a block diagram of the closed loop power adjustment and thermal energy tube according to the present invention, another embodiment of the system. Figure 22 is a block diagram according to the present invention. Ito

Another embodiment of the system is closed-loop power adjustment and thermal energy management. Figures 23 and 3 are block diagrams according to the present invention. Figure 24 of another embodiment of the present power adjustment system is a block diagram of another and thermal energy management system (including solid features, a closed loop power adjustment; and thermal busbars) according to the present invention. Description of component symbols 1 Bypass capacitor 2 Straight tail fin 4 Thermal energy dispersing device 6 Device! 0J 3000 System 1 02, 102a, 102b Substrate I 06a--106p pads 08a, 111 a, n4a Power II 〇b Ground pad 11 4 b Grounding conduit and grounding conduit 11 8 b Output ground perforation 1 2 2 Connection welding pad 3 Voltage rectifier 5 Electrical connection 7 Printed winding base 1 0 0 Power adjustment module 104a--104h interface perforations 106x, 106y, 106z scheduled solder holes 108b ground perforation 11 2 circuits 116a, 116b '116c output power 118a output power perforation 1 2 0 conventional winding

200302960 Simple illustration 200'200a--200c device 400 circuit board 300'1000'1000a--1000c thermal energy management module 1100 power adjustment element 1260 pipeline 1200 '1200a--1200c thermal energy management element 1 280 controller 1 30 0 packaging 1210, 1 430 microchannel thermal energy exchanger 1220, 1220-1, 1220-2, 1440 microchannel 1230 cylinder 1 24 0 fluid inlet 1250 fluid outlet 1320 cover 1 2 70, 1 290 sensor 1410 thermal energy rejection element 1 40 0 thermal energy Capturing and rejecting module 1 42 0 Thermal energy capturing element 3 1 0 0 Main power supply 3 11 0 Power bus 3 2 0 0 Fluid pump mechanism 3 2 1 0 Fluid bus

Page 60

Claims (1)

200302960 6. Scope of patent application1. A system using the power, a main power of the system is a first work, a power rate adjustment module, a semiconductor substrate, a plurality of interfaces, and a through-hole interface; a first group of pads is connected to the circuit The power is set; the first half of the second work is plural to the media; it is placed between the supplied power and the power rate adjustment die conductor base interface through-hole interface; a first set of pads is connected to the circuit to be powered; 2 · If applied to such media, the power placed in the supply :: the entire circuit device to be applied to the first and second integrated circuit devices includes: should; the module 'fixed to the second system includes:, has a first interface And a second interface 'for providing electrical connection to the interface: the interface and the f' on the first interface, one of each of the first set of pad hole holes corresponding to the interface perforation; Among them, the thunder and T 4 systems also receive the main rate and provide adjustment power to the first integrated circuit assembly integrated circuit device. The entire module is fixed to the second integrated circuit assembly. Including: has a first interface and a second interface to provide electrical connection to the first interface and the first, placed on the first interface, one of each of the first group of pad pad holes corresponding to Interface perforation;: in the conductor substrate, where 'the circuit receives the master, and provides adjustment power to the first device, the integrated circuit is equipped with the system described in item 1 of the patent scope, wherein the first power 200302960 VI. Patent application scope-the circuit of the adjustment module 3. If the scope of the patent application is the first; the first / interface adjustment module further includes:, the system described above, wherein the first power is at least one power 惶And at least one power perforation of the second medium placed in the first power adjustment module, so as to provide electrical penetration and electrical connection to a part of the work. Connected to the first M plane of the 5th Hai and at least 4 of the circuit. If the patent scope of Shenyan Fan 1 is a system that is electrically connected to a power summarizing basin: In one, the power is perforated in the semiconductor substrate. And the second: the power perforation of the Haigong adjustment module and the electric power of the first power adjustment module are connected to the branch. At least one of the Tunling Power 5. The system described in item 丨 of the scope of patent application, wherein the adjustment module further includes: surface =-power welding pad, placed in the first power adjustment module of the first At least one power perforation of two media, wherein the power perforation two interface and the first power adjustment module are connected to at least-part of the first and tower; at least one output power conduit is coupled to the first-work * circuit To provide the power for adjusting the power to the first integrated circuit pull group. The system as described in item 5 of the scope of the patent application, wherein the conduit is connected to an input power pad, which is set to eight Turn out power '^ brother a power adjustment Page 62, 200302960 VI. On the first interface of the patent application group, the input power pad is corresponding to the first system. Among them, the first power 7. The system as described in item 丨 of the patent application scope. 'Where, the circuit of the first 3 adjustment module is placed on the first, and the first face of the power adjustment module. 8. The system as described in item 丨 of the scope of patent application, further comprising a current sensor placed in the semiconductor substrate of the first power adjustment module to provide a current representing the first integrated circuit device Consumption information. 9 · The system described in item 8 of the scope of patent application further includes a controller coupled to the current sensor to receive the information of the meter = the current consumption, wherein the controller adjusts the information accordingly The first integrated circuit device is 120 ° The system according to item 丨 of the scope of patent application, wherein the first power 5-week complete module and the first integrated circuit device are included in a circuit One of the sexes in the package. U • The system according to item 10 of the patent application scope, wherein the packaging has an optical interface. • The core circuit device described in the 11th patent application of the May patent scope is coupled to an optical interface. I! • The system described in item 10 of the scope of patent application f-circuits can be accessed optically. = · Lion type power adjustment and thermal energy management module, which is transferred to Chu integrated circuit device for use. The system includes and cooperates with P and the second-power adjustment and thermal energy management module. It is lightly connected to the first The product is cold, the first product, the first product, page 63, 200302960 U is used to provide electrical connection between the first interface and the second interface of M and plural interfaces; a circuit, an integrated circuit is equipped with a micro-channel structure, and has at least one channel placed in the semiconductor substrate to capture thermal energy, Among them, the 'microbody substrate' is used to adjust the structure of the first 'micropass channel structure to be allowed to flow through; a second work circuit device, an interface, and a bracket: a semiconductor substrate; A plurality of interface perforations for providing electrical connection between the first interface and the second interface; and a μ circuit placed in the semiconductor substrate to adjust the power to be applied to the first integrated circuit device; A microchannel structure having at least one microchannel placed in the semiconductor substrate to capture thermal energy, wherein the microchannel structure is structured to allow fluid to flow through; a fluid cartridge mechanism is coupled to the first And a second power adjustment and thermal energy rate adjustment and thermal energy management module, which are coupled to the second integrated body, the second power adjustment and thermal energy management module has a first two , And the second power adjustment based thermal management module pack Page 64 200302960 6. Patent application scope Management module, used to provide the fluid i and first and second power adjustment and thermal energy management modules. 15. The system described in item 14 of the scope of the patent application, where 'the'-the first power adjustment and thermal energy management module is more intensive.... A tube is placed in the fluid tube mechanism and provincial power aging and thermal energy management module. Set up between the microchannel structures. / 1 6 · The system described in item 5 of the patent application scope, wherein the first power adjustment and thermal energy management module is more inclusive. A current sensor is placed in the base of the contention conductor to provide an indication. A current consumption information; and a controller coupled to the current sensor to receive the information indicating the current consumption and adjust a fluid flow rate output by the cartridge accordingly. 17 · The system according to item 5 of the patent application scope, wherein the first power adjustment and thermal energy management module further includes: a temperature sensor placed in the first / power adjustment and thermal energy management module, For providing information indicating a temperature; and a controller coupled to the temperature sensor 'for receiving the information indicating the temperature and adjusting the first power adjustment and thermal energy management module in response to the information indicating the temperature The fluid flows in the microchannel structure. 1 8 · The system ′ described in item 17 of the scope of patent application, wherein the controller ′ adjusts the σ, that is, the fluid flow rate of a cylinder output in response to the information indicating the temperature. '1 9 · According to the system described in item 17 of the scope of the patent application, where' The temperature sensor and the controller are placed in the first power adjustment and thermal management module 200302960 6. Scope of patent application 5 semiconductor substrate. 20. The system described in item H of the scope of patent application, wherein the circuit of the Kf management module is placed on the second interface of the thermal management module. Li Yangzheng and 21. The system as described in Item 20 of the scope of patent application, the complex rate adjustment and thermal energy management module further includes: ???, the brother-work at least one power conduit, placed in the semiconductor substrate; And two pads, which are placed on the second interface surface, wherein the power welding surface and the current tr force rate conduit are used to provide electrical connection to the circuit of the second dielectric ratio adjustment and thermal energy management module At least one 2 car W system described in item 20 of the patent scope, wherein the -power adjustment and thermal energy management module further includes: a power output pad to t, placed on the first interface; and if = output power perforation, where the output power perforation is coupled to the circuit of the pad power adjustment and thermal energy management module and the output power welding 2 3 l φ 銮 π I 曱, please refer to item 22 of the patent scope The system, wherein the output power 24 corresponds to an input of the first integrated circuit device. • The system as described in item 14 of the patent scope of Shenyan, wherein the first power =: 2 and the circuit of the thermal management module are placed in the first power adjustment and management mode. Set the first interface. The system described in item 24 of the patent scope of Shenyan, wherein the μ-thickness and thermal management module further includes: 200302960 6. The scope of the patent application is that at least one power pad is placed on the second interface of the first power adjustment and heat, and Lv Liqi, and at least one power perforation, wherein the power pad is electrically connected to the function The perforation is used to provide an electrical connection between the second interface of the first power adjustment and thermal energy management module and at least a part of the circuit of the first power adjustment and thermal energy management module. ^ ... 2 6. The system according to item 25 of the scope of patent application, wherein the power perforation is electrically connected to a power conduit and placed in the semiconductor substrate of the first power adjustment and thermal management module, and The power conduit is electrically connected between the power pad and at least a part of a Xi circuit of the first power adjustment and thermal management module. , Μ 2 7 · The system described in item 26 of the scope of patent application, wherein the first power adjustment and thermal energy management module further includes at least one round of power outlet duct, which is lightly connected to the first power adjustment and thermal energy management module. The set of circuits is used to provide adjustment power to the first integrated circuit device i. 28. The system as described in item 27 of the scope of patent application, wherein the output power is connected to an input power gangue and placed on the first interface of the first power adjustment and thermal energy management module, The input power pad corresponds to the power input of the first integrated circuit device. '2 9 · The system according to item 14 of the scope of patent application, wherein the first power adjustment and thermal energy management module and the / integrated circuit device are included in a package having an electrical interface. 30. The system according to item 29 of the patent application scope, wherein the package has an optical interface. 200302960 — Scope of patent application 3 1 · As described in the application of spectrum directing ~ body circuit transmission: the system described in item 14 of the right garden, wherein the-product M & direct system has an optical interface. Set the ^ == to the system to install a # _..., moon dagger for the second integrated circuit, the system includes: capture: components, connected to the integrated circuit, to manage components, : Ί: generated by the road device: Among them, the first-thermal energy: the thermal energy generated by the integrated circuit device;-the body captures the first heat offense management element and is coupled to the second integrated electricity! Capture the second product The thermal energy generated by the body circuit device, of which, with the official 7L pieces, during operation, the heat energy generated by the second integrated circuit device with one of the liquid phase = 忐 is used to capture the y A fluid cartridge mechanism is coupled to the first and second thermal energy management elements for providing the fluid to the first and second thermal energy management elements. 70, 3: The system according to item 32 of the scope of patent application, including the flow bus, wherein the fluid bus is connected to the fluid cartridge mechanism to the first and second thermal energy management elements. Μ See these 34. The system described in item 33 of the scope of patent application, wherein the first and second thermal energy management elements are connected in parallel to the fluid cartridge mechanism 3 5 · As described in item 33 of the scope of patent application The system, in which the first one ## ,,, and the second thermal energy management element are connected in series to the fluid cartridge mechanism 36. The system according to item 33 of the scope of patent application, wherein the element capable of managing includes : A substrate, wherein the substrate is provided with one of the microchannels Page 68 200302960 VI. The scope of the patent application is a small part and is structured to allow one of the fluids to flow through; and a cartridge connected to the microchannel to produce the flow of the fluid in the microchannel. 37. The system according to item 36 of the scope of patent application, wherein the cartridge of the first thermal energy management element is an electroosmotic cartridge. 38. The system according to item 36 of the scope of patent application, wherein the cartridge of the first thermal energy management element is connected to the fluid cartridge mechanism. 39. The system according to item 38 of the scope of the patent application, wherein the fluid cylinder is a cylinder having an electroosmotic disk. 4 0 · The system described in item 32 of Shenyan's patent scope, including: A first power adjustment element is coupled to the first integrated circuit device. The first power adjustment element has a first interface and a second interface. The power adjustment element includes: a semiconductor substrate; A plurality of electrical interfaces between the interfaces are perforated to provide the first interface and the first connection; a first plurality of solder pads are placed on the first interface, each welding pad is connected to the first interface, and the interface perforations = number The perforation; and the corresponding interface -q are positive. The circuit has the power of at least a tuning circuit and an integrated circuit device placed in the semiconductor substrate, in which the whole device and at least one capacitor. 41. The system according to item 40 of the scope of application for a patent, wherein the rate-decreasing element and the first integrated circuit device are included in a force n electrical dielectric Page 69 200302960 VI. Scope of patent application In one of the packages. 4 2. The system as described in claim 41, wherein the packaging has an optical interface. 43. The system of claim 32, wherein the first integrated electrical device has an optical interface. Chapter 70