SU979695A1 - Transfer siphon for low boiling point liquids - Google Patents

Description

(54) TRANSFERABLE SIPHON FOR LOW-FLUID LIQUIDS

one

The invention relates to a cryogenic technique, namely to designs of devices for the overflow of cryogenic liquids.

A pipeline is known for transferring liquid helium from one vessel to another, containing an overflow pipe with thermal insulation, located in the vacuumized pipeline 1.

A disadvantage of the known device is a significant heat gain to the overflow pipe, which causes an increased loss of liquid gels.

An overflow siphon for low-boiling liquids is also known, which contains an overflow pipe located inside the cooled screen with inlet, transitional and outlet sections, the last of which is connected via a thermal bridge to screen 2.

However, the known siphon is not very economical due to the large heat leakage to the liquid being poured and the need to use an additional refrigerant, liquid nitrogen.

The aim of the invention is to increase the efficiency of the siphon.

This goal is achieved by the fact that the screen in the zone of the transition section of the tube is equipped with an evacuated casing connected to the entrance section of the tube and a thermal bridge.

5The drawing shows a siphon with a Dewar vessel, a longitudinal section.

The overflow siphon for low-boiling liquids contains an overflow tube 2 located inside the cooled screen 1 with inlet, transition and outlet sections 3-5, the last of which is connected via thermal bridge 6 to screen 1, which in the zone of transitional section 4 is equipped with a vacuum-proof casing 7 connected with an inlet section 3 of the tube 2 and heat pipe bridge 6. The liquid is transferred from the Dewar vessel 8 to the vessel 9. In addition, the casing 7 is provided with a pipe 10 for pumping the internal cavity of the casing. Siphon works as follows. The low-temperature fluid through pipe 20 ke 2 is poured from vessel 8 into vessel 9, where partial evaporation of the liquid takes place and the cooling with waste vapor of thermal bridge 6. This leads to cooling of screen 1, which significantly reduces

Claims (1)

Claim An overflow siphon for low-boiling liquids containing an overflow pipe located inside the cooling screen with an inlet, a transition and an outlet, the last of which is connected through a thermal bridge to a screen, characterized in that, in order to increase its economy, the screen in the zone of the transition section of the tube is equipped with a vacuum a casing connected to the inlet portion of the tube and the thermal bridge.