SU767859A1

SU767859A1 - Method of sealing gas discharge devices

Info

Publication number: SU767859A1
Application number: SU782626397A
Authority: SU
Inventors: Алексей Николаевич Ивлюшкин; Любовь Николаевна Копытина; Юрий Николаевич Коротков; Юрий Кузьмич Куликов; Геннадий Николаевич Тюремнов
Original assignee: Предприятие П/Я В-8769
Priority date: 1978-06-12
Filing date: 1978-06-12
Publication date: 1980-09-30

Description

(54) СПОСОБ ГЕРМЕТИЗАЦИИ ГАЗОРАЗРЯДНЫХ ПРИБОРОВ(54) METHOD FOR SEALING GAS DISCHARGE DEVICES

Изобретение относитс к области газоразр дной техники, в частности к герметизации стеклоцемент ом газоразр дных приборов (ГРП), предназ- 5 наченных дл отображени информации. Техпроцесс герметизаций состоит из двух последовательных операций: нанесени пасты (шликера стеклоцемента ) и термообработки, при которой Ю происходит крист 1ллизаци стеклоцемента .The invention relates to the field of gas discharge technology, in particular, to sealing glass cement of gas discharge devices (HF) designed to display information. The sealing process consists of two successive operations: applying a paste (glass cement slip) and heat treatment, in which Yu occurs a crystal of glass cement.

Известен способ герметйзё(ции, когда герметизирующую пасту нанос т методом трафаретной печати fl . Указан-15 ный способ осуществим только дл нанесени тонких плоских герметизирующих швов ТОЛЩИНОЙ до 110 мкм, что в большинстве случаев недостаточно.The known method of sealing is (tions when sealing paste is applied by screen printing fl. This method is only feasible for applying thin flat sealing seams with a thickness of up to 110 microns, which is not sufficient in most cases.

Наиболее близким к данному техни- 20 ческому решению вл етс способ герметизации газоразр дных приборов путем выдавливани пасты на герметизируеNtje детали с последующей их термической обработкой 23 .25The closest to this technical solution is the method of sealing gas-discharge devices by squeezing the paste onto the Ntje sealing parts with their subsequent heat treatment 23 .25

В известном способе герметизеодии шликер стеклоцемента нанор т стекл нной пипеткой, либо выдавливанием из полиэтиленового шприца или тюбика. Указанный способ нанесени пасты не QIn the known method of sealing, a glass cement slurry is nanofitted with a glass pipette or extruded from a polyethylene syringe or tube. Said method of applying paste not Q

обеспечивает ртабильность давлени на выходе пипетки, шприца, в результате чего не удаетс получить равномерный и достаточно плотный слой пасты в иве. Как следствие, после герметизации получаетс большое число невакуумноплотн х спаев.ensures the stability of the pressure at the exit of the pipette, syringe, as a result of which it is not possible to obtain a uniform and sufficiently dense layer of paste in the willow. As a result, after sealing, a large number of non-vacuum dense junctions are obtained.

Целью из.обретени вл етс увеличение технологического клхода газоразр дных приборов.The purpose of the invention is to increase the process flow of gas discharge devices.

Поставленна цель достигаетс тем, что давление пасты на выходе устройства поддерживают посто нным, а величину его определ ют из соотношени :The goal is achieved by maintaining the pressure of the paste at the outlet of the device constant, and its value is determined from the relation:

3000 V В/ 7000,3000 V V / 7000,

где V - скорость нанесени пасты,мм с, Р - давление на выходе устройст .ва, ати,where V is the paste application rate, mm s, P is the outlet pressure of the device, ta, anti,

Claims

B — Paste Viscosity, p. The volume of the paste applied per unit length of the seam is determined by the output hole in the device and depends on the viscosity of the slip slip, which is determined by the ratio of the glass cement powder, and the binder of a certain viscosity. In this case, the greater the thickness of the paste layer to be applied, the more the viscosity should be taken. Knowing the speed of application of the shear, viscosity and, given a specific value of VB / P (from the indicated ratio), the pressure C is determined from which the slurry should be delivered to the place of application. The pressure that must be at the inlet of the device for applying a slip is chosen taking into account the pressure drop in the device and depends on its design. With a VB / P ratio of about 7000, the slurry layer does not have an even density that is insufficient for a sealed spa and the instruments after soldering are non-vacuum-dense. At. At a ratio of VB / P of less than 3000, the effect of splashing of the slip is observed, which also affects the uniformity of the seam density. Example. The application was carried out with the help of a device with the use of an output rectangular hole of 5 X 1.6 mm and a slip with a viscosity of 400 s. By asking Vb / P 6000 and knowing the value of P, which is equal to 0.27 at. Taking into account the losses in the device, the pressure at the inlet was created equal to 0.76 at. This made it possible to obtain a flat seam with a width of 5 ± 1 mm and a height of 1.6 ± 1 mm. After sealing according to the existing mode: T 460 ° C and tg, yf 60 min, the seam was obtained by vacuum sealing. EXAMPLE 2. The application was carried out using a device using an output triangular opening and a slip with a viscosity of 430 s. Asking for Vb / P 5000 and knowing the value of P, which is 0.175 atm. Taking into account the loss, the inlet pressure to the device was created equal to 0.75 ati. This made it possible to obtain an angle hermetic erosion-resistant seam with a radial thickness of 3 mm. Spa quality after sealing by mode. T and t 60 min. satisfactory. Thus, the use of the proposed method of applying paste will increase the technological output of the devices. Claims of the method of sealing gas-discharge devices by squeezing the paste onto the parts to be sealed with their subsequent heat treatment, differing from the fact that in order to increase the process output, the pressure of the paste at the outlet of the device is kept constant and its value / P 7000, lde V - paste speed, P - pressure paste at the device exit, ati; B - vyskopasty, p. . Sources of information taken into account in the examination of 1. X. Mer D. and Baggers J. Technologists of thick-walled hybrid integrated circuits. , World, M., 1975, p. 143.

2. Roeberi F., Handbook of vacuum engineering and technology, Moscow, Energie, 1972, p. 313 (prototype).