SU577706A1 - Device for tinning printed circuit boards - Google Patents

Device for tinning printed circuit boards

Info

Publication number: SU577706A1
Authority: SU; USSR - Soviet Union
Prior art keywords: printed circuit; circuit boards; tinning; tinning printed; boards
Prior art date: 1975-11-03

Application number

SU7502185422A

Other languages

Russian (ru)

Inventor

Дмитрий Федорович Данилов

Владимир Кириллович Митрохин

Original Assignee

Предприятие П/Я А-7555

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-11-03

Filing date

1975-11-03

Publication date

1977-10-25

1975-11-03 Application filed by Предприятие П/Я А-7555 filed Critical Предприятие П/Я А-7555

1975-11-03 Priority to SU7502185422A priority Critical patent/SU577706A1/en

1977-10-25 Application granted granted Critical

1977-10-25 Publication of SU577706A1 publication Critical patent/SU577706A1/en

Links

SU7502185422A 1975-11-03 1975-11-03 Device for tinning printed circuit boards SU577706A1 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
SU7502185422A SU577706A1 (en)	1975-11-03	1975-11-03	Device for tinning printed circuit boards

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
SU7502185422A SU577706A1 (en)	1975-11-03	1975-11-03	Device for tinning printed circuit boards

Publications (1)

Publication Number	Publication Date
SU577706A1 true SU577706A1 (en)	1977-10-25

Family

ID=20635978

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SU7502185422A SU577706A1 (en)	1975-11-03	1975-11-03	Device for tinning printed circuit boards

Country Status (1)

Country	Link
SU (1)	SU577706A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5169446A (en) *	1989-08-02	1992-12-08	Mhb Joint Venture	Method and apparatus for coating alkali or alkaline earth metals
DE4136804A1 (en) *	1991-11-08	1993-05-13	Ernst Hohnerlein	Soldering installation - has oxide formation prevented by a jacket around the pump shaft
US8651356B2 (en) *	2011-11-29	2014-02-18	Samsung Electro-Mechanics Co., Ltd.	Solder bump forming apparatus and soldering facility including the same

1975
- 1975-11-03 SU SU7502185422A patent/SU577706A1/en active

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5169446A (en) *	1989-08-02	1992-12-08	Mhb Joint Venture	Method and apparatus for coating alkali or alkaline earth metals
WO1992022382A1 (en) *	1991-06-18	1992-12-23	Valence Technology, Inc.	Method and apparatus for coating alkali or alkaline earth metals
DE4136804A1 (en) *	1991-11-08	1993-05-13	Ernst Hohnerlein	Soldering installation - has oxide formation prevented by a jacket around the pump shaft
DE4136804C2 (en) *	1991-11-08	2001-01-25	Seho Systemtechnik Gmbh	Soldering device
US8651356B2 (en) *	2011-11-29	2014-02-18	Samsung Electro-Mechanics Co., Ltd.	Solder bump forming apparatus and soldering facility including the same

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