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SU463174A1 - Electrolytic plate treater - Google Patents

Electrolytic plate treater

Info

Publication number
SU463174A1
SU463174A1 SU1908934A SU1908934A SU463174A1 SU 463174 A1 SU463174 A1 SU 463174A1 SU 1908934 A SU1908934 A SU 1908934A SU 1908934 A SU1908934 A SU 1908934A SU 463174 A1 SU463174 A1 SU 463174A1
Authority
SU
USSR - Soviet Union
Prior art keywords
plates
electrolytic plate
electrolyte
disk
treater
Prior art date
Application number
SU1908934A
Other languages
Russian (ru)
Inventor
Алексей Савельевич Булавин
Николай Иванович Тулянкин
Венедикт Петрович Калинин
Николай Иванович Желудов
Александр Иванович Коробов
Original Assignee
Предприятие П/Я Г-4521
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Г-4521 filed Critical Предприятие П/Я Г-4521
Priority to SU1908934A priority Critical patent/SU463174A1/en
Application granted granted Critical
Publication of SU463174A1 publication Critical patent/SU463174A1/en

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  • Electrolytic Production Of Metals (AREA)

Description

нен обод 10 с контактными кольцами 11, соединенными с источником питани .The rim 10 is not connected with slip rings 11 connected to a power source.

Устройство работает следующим образом.The device works as follows.

На вращающийс  от электропривода 3 несущий диск 2 любым известным способом, например капельным, подаетс  электролит. Поскольку несущий диск выполнен из несмачиваемого материала, электролит стекает в свободные объемы пазов 4, располага сь в них полусферой и покрыва  поверхность анодов 5 и катодов 6.An electrolyte is supplied to the carrier disk 2 rotating from the electric drive 3 by any known method, for example by dropping. Since the carrier disk is made of non-wetted material, the electrolyte flows into the free volumes of the slots 4, having a hemisphere in them and covering the surface of the anodes 5 and cathodes 6.

В гнездах установочной головки 9 фиксируютс  пластины 8 в положении, при котором их обрабатываема  поверхность лежит на поверхности диска 2 и касаетс  электролита. In the sockets of the installation head 9, the plates 8 are fixed in a position in which their workable surface lies on the surface of the disk 2 and touches the electrolyte.

За счет соприкосновени  поверхности пластин 8 с поверхностью диска 2 установочна  головка 9 вместе с зафиксированными в ее гнездах пластинами 8 вращаетс  вокруг своей оси.Due to the contact of the surface of the plates 8 with the surface of the disk 2, the installation head 9 together with the plates 8 fixed in its sockets rotates around its axis.

При перемещении пластин 8 и электродов 5 и 6, размещенных в диске 2, обеспечиваетс  поочередна  подача положптельного потенциала через электролит на каждый участок обрабатываемой поверхности пластины 8, расположенный в данный момент над анодом 5. Одновременно другой участок пластины 8,When moving the plates 8 and the electrodes 5 and 6, placed in the disk 2, alternate supply of positel potential through the electrolyte to each section of the treated surface of the plate 8 currently located above the anode 5 is provided.

расположенпый над катодом 6, подвергаетс  электролитической обработке.located above cathode 6, electrolytically treated.

Посто шюе и равномерное вращение дисг;а 2 вокруг своей осп обеспечивает равномерное переЛШщение пластпп 8 относительно поверхности электродов 5 и 6 и тем самым равномерную обработку их поверхности.Permanently and uniformly rotating the dysg; and 2 around its smallpox ensures a uniform overlap of the plastipp 8 with respect to the surface of the electrodes 5 and 6 and thus the uniform processing of their surface.

П р е л Л1 с т изобретени PR le L1 with t inventions

Устройство дл  электролитической обработки пластин, содержащее вращающиес  электроды и шарнирно закрепленные над ними ;1,ержатели пластин, обесасчивающие посто нную установку п.частин параллельно поверхности электродов, о т л и ч а ю щ е е с   тем, что, с целью расширени  диапазона применени  устройства за счет обеспечени  подачи положительного потенциала к обрабатываемым пластинам, опо содержит несущий диск из несмачпваемого электролитом диэлектрика с параллельными пазами, в которых ниже поверхности диска размещены электроды в виде чередующихс  пластин противоположной пол рности , а свободный объем пазов заполнен электролитом.A device for electrolytic processing of plates containing rotating electrodes and pivotally fixed above them; 1, the plates of plates holding the permanent installation of parts of the cells parallel to the surface of the electrodes, so as to extend the range use of the device by providing a positive potential to the treated plates, the support contains a carrier disk of a dielectric not wetted by electrolyte with parallel grooves in which electrodes are placed below the disk surface e interleaved plates of opposite polarity and free volume of the grooves is filled with electrolyte.

2 7 72 7 7

WW

SU1908934A 1973-03-09 1973-03-09 Electrolytic plate treater SU463174A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1908934A SU463174A1 (en) 1973-03-09 1973-03-09 Electrolytic plate treater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1908934A SU463174A1 (en) 1973-03-09 1973-03-09 Electrolytic plate treater

Publications (1)

Publication Number Publication Date
SU463174A1 true SU463174A1 (en) 1975-03-05

Family

ID=20549898

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1908934A SU463174A1 (en) 1973-03-09 1973-03-09 Electrolytic plate treater

Country Status (1)

Country Link
SU (1) SU463174A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6837984B2 (en) 1998-07-09 2005-01-04 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US7136173B2 (en) 1998-07-09 2006-11-14 Acm Research, Inc. Method and apparatus for end-point detection

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6837984B2 (en) 1998-07-09 2005-01-04 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US7136173B2 (en) 1998-07-09 2006-11-14 Acm Research, Inc. Method and apparatus for end-point detection

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