SU433186A1 - POLYMER COMPOSITION - Google Patents

Description

one

The invention relates to compositions of complex (syntactic) foams that can be used as spackling lightweight materials for the repair of hydraulic structures in shipbuilding, aviation, rocket production and other areas of technology.

A known polymer composition containing a low molecular weight epoxy resin, an approach h, a hardener and a diluent — phenylglycidyl ether or its mixture with a glycidyl ether of etriol in a ratio of 1: 0.5–1.5. If necessary, fillers and curing accelerators can be added to it.

The aim of the invention is the development of such putty compositions, which, after being applied to the surface, cure without heat from outside with increased speed and provide a durable and durable coating with low density, improved physical and mechanical characteristics.

This goal is achieved by the fact that the polymer composition contains a low molecular weight epoxy-resin resin, the active diluent is phenyl glycidyl ether (PHE) or a mixture of phenyl glycidyl ether and glycidyl ether of etriol, taken in a ratio of 1: 0.5-1.5 (ETF -10), as a hardener and at the same time a plasticizer of low molecular weight polyamide, hollow glass microspheres as a filler, a mixture of phenol and hexamethylene tetramine as a catalyst for hardening was additionally introduced. All the ingredients are taken in the next, it is a weight assumption, weight. including:

Epoxy resin

100 Active Diluent 16-40 Hardener

8-105 10-100

Filler Phenol 0.1-0.5

Hexamethylenetetramine 0.1-0.5 This composition forms on

surface

materials monolithic coatings have good adhesion to the base.

When preparing the composition, it is advisable to first modify the resin with an active diluent, and then mix the modified resin with the other ingredients of the composition.

As a result of the structure formation of the high polymer, which is part of the putty composition, and the influence on this process of the components of the putty coating does not require heat treatment, it hardens within 1 hour, and complete curing occurs within 3-5 days. The resulting putty compositions are resistant to the action of light, ozone, and oxygen, to the action of some organic solvents (gasoline, etc.), sulfuric, hydrochloric acids, and alkalis; they have good physical and mechanical characteristics and low water absorption. Example 1. Weight applied. h .: Hollow glass microspheres of mark O (true affinity 0.36 g / c) 61.2 Modified eioxide resin (per 100 wt. parts of resin ED-6 30 wt. h. PHE) 100 Hardener grade L-2014, 3 Phenol 0.25 Hexamethylene tetramine 0.22 Preparates are prepared using a medium (20-22 ° C) and cured without tenl supply from the outside for 5 days (sample 1). Example 2. Weight applied. h .: Hollow glass microspheres of mark O (true density 0.36 g / cm 3) 65 Modified epoxy resin (per 100 parts of weight. resins ED-6 30 parts by weight h. ETF-10) 100 Hardener of the grade L-2044 Phenol0 , 25 Hexamethylenetetramine 0.22 The composition is prepared at a temperature of 23 ° C and cured with a curing medium (21 days, 5 days (about the same conditions, E, sample 2). Example 3. Apply, by weight: Hollow glass microspheres grade O (true density 0.36 g / cm3) Modified epoxy resin (per 100 wt. parts resin ED-6 30 weight parts. PGE) Hardener brand L-1940 Phenol 0.25 Hexamethyletratra 0.22 Composition prepared at an ambient temperature (22-24 ° C) and cured under the same conditions for 5 days (overview 3). Example 4. Used, parts by weight: Hollow O glass microspheres (true density 0 , 36 g / cm 3) 65 Modified epoxy resin (per 100 parts by weight of resin ED-6 30 parts by weight of ETF-10) 100 Hardener brand L-1944 Phenol 0.25 Hexamethylether tetramine 0.22 The composition is prepared at the temperature of the opening medium ( 22-24 ° C) and cure the same conditions for 5 days (sample 4). Example 5. Weight applied. h .: Hollow glass microspheres of mark O (true density 0.309 g / cm 3) 23 Modified epoxy resin (per 100 parts of weight. resins ED-6 30 parts by weight h. ETF-10) 100 Hardener of the grade L-20104 Phenol 0.25 Hexamethylenetetramine 0.22 The composition is prepared at an ambient temperature (22-24 ° C) and is cured under the same conditions for 5 days (overview 5). The properties of the compositions resulted in a table.

Subject invention

Polymer composition containing low molecular weight epoxy-diodean resin, low molecular weight polyamide as a hardener, phenylglycidyl ether or its mixture with glycidyl ether of etriol at their ratio 1: 0.5-1.5 as an active diluent, glass microspheres as a filler and accelerator curing, characterized in that, in order to obtain a coating with a low density, enhanced physicomechanical characteristics and shorten the curing time, a mixture of phenol and hexane is used as an accelerator ametilentetramina and all the ingredients you composition taken in the following weight ratio, wt. hours: 5 Epoxy resin100 Active thinner 16-40 otverdteltel8-105 433186 6 Filler10-100 Phenol0,1-0,5 Hexamethylenetetramine 0,1-0,5