SU220013A1 - Solder for soldering copper and its alloys - Google Patents
Solder for soldering copper and its alloysInfo
- Publication number
- SU220013A1 SU220013A1 SU1146331A SU1146331A SU220013A1 SU 220013 A1 SU220013 A1 SU 220013A1 SU 1146331 A SU1146331 A SU 1146331A SU 1146331 A SU1146331 A SU 1146331A SU 220013 A1 SU220013 A1 SU 220013A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- alloys
- copper
- soldering copper
- soldering
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Известен припой дл пайки изделий из меди и ее сплавов следующего состава в серебро 10-30, медь 14-50, олово О-10. Дл улучшени свойств па ного соединени в состав припо введены дополнительно титан в количестве 0,1-0,57(, и бор 0,05-0,15%, а остальные компоненты вз ты в другом соотношении в %: олово 6-14, медь 25-35, серебро остальное. Введение малых добавок газопоглош,ающих элементов титана и бора улучшает смачивающую способность припо и уменьшает пористость па ных швов. Издели из меди и латуни, па ные предлагаемым припоем, имеют высокую прочность и при механических испытани х разрушаютс по основному материалу. Предмет изобретени Припой дл пайки меди н ее сплавов, содержащий олово, медь, серебро, отличающийс тем, что, с целью улучшени свойств па ного соединени , в его состав введены титан в количестве 0,1-0,5% и бор 0,05-0,15%, а остальные компоненты вз ты в следующем соотношении в %: олово 6-14, медь 25-35, серебро остальное.Known solder for soldering products from copper and its alloys of the following composition in silver 10-30, copper 14-50, tin O-10. To improve the properties of the solder compound, additionally titanium was added to the composition of the solder in an amount of 0.1-0.57 (and boron 0.05-0.15%, and the remaining components were taken in a different ratio in%: tin 6-14, copper 25-35, silver else. The introduction of small gas-plate additives, titanium and boron elements improves the wetting ability of the solder and reduces the porosity of the welds. The copper and brass products that are offered by the brazing material have high strength and The main material. The subject matter of the invention Solder for copper soldering and its alloys containing tin, copper, silver, characterized in that, in order to improve the properties of the solder compound, its composition includes titanium in an amount of 0.1-0.5% and boron 0.05-0.15%, and the rest The components are taken in the following ratio in%: tin 6-14, copper 25-35, silver the rest.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1146331A SU220013A1 (en) | 1967-04-05 | 1967-04-05 | Solder for soldering copper and its alloys |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1146331A SU220013A1 (en) | 1967-04-05 | 1967-04-05 | Solder for soldering copper and its alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
SU220013A1 true SU220013A1 (en) | 1968-06-14 |
Family
ID=39968319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU1146331A SU220013A1 (en) | 1967-04-05 | 1967-04-05 | Solder for soldering copper and its alloys |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU220013A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0135603A1 (en) * | 1983-09-26 | 1985-04-03 | GTE Products Corporation | Ductile low temperature brazing alloy |
-
1967
- 1967-04-05 SU SU1146331A patent/SU220013A1/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0135603A1 (en) * | 1983-09-26 | 1985-04-03 | GTE Products Corporation | Ductile low temperature brazing alloy |
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