SU197803A1 - - Google Patents
Info
- Publication number
- SU197803A1 SU197803A1 SU1083760A SU1083760A SU197803A1 SU 197803 A1 SU197803 A1 SU 197803A1 SU 1083760 A SU1083760 A SU 1083760A SU 1083760 A SU1083760 A SU 1083760A SU 197803 A1 SU197803 A1 SU 197803A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- cooling
- gas
- carbon dioxide
- cooled
- carried out
- Prior art date
Links
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000001569 carbon dioxide Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 3
- 239000008246 gaseous mixture Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Description
СПОСОБ ОХЛАЖДЕНИЯ ФОРМИРУЮЩИХ COOLING METHOD FORMED
Известен способ охлаждени формирующих приспособлений водой.A known method of cooling the shaping devices with water.
Предложенный способ отличаетс от известного тем, что охлаждение производ т газообразными смес ми, имеюпдими отрицательную температуру, причем процесс охлаждени осуществл ют замкнутым циклом охлаждаемого газа.The proposed method differs from that known in that the cooling is carried out by gaseous mixtures having a negative temperature, the cooling process being carried out in a closed cycle of the gas to be cooled.
Это позвол ет снизить дефекты в сварных соединени х и тем самым повысить качество сварки, а также улучшить услови труда и повысить надежность эксплуатации оборудовани с точки зрени техники безопасности.This allows reducing defects in welded joints and thus improving the quality of welding, as well as improving working conditions and increasing reliability of equipment operation from the point of view of safety engineering.
Охлаждение по предлагаемому способу осуществл етс по схеме, представленной на чертеже .The cooling according to the proposed method is carried out according to the scheme shown in the drawing.
Из контейнера 1 твердую углекислоту подают Б газификатор 2, в котором она газифицируетс . Газификатор обогреваетс различными источниками тепла. Интенсивность газификации зависит от требуемого расхода газа. Из газификатора углекислый газ подают в холодильник 3, где он охлаждаетс до требуемой температуры (зависит от технологического процесса). Обычно эта температура должна быть в пределах от О до -40°С.From container 1 solid carbon dioxide is fed B to a gasifier 2, in which it is gasified. The gasifier is heated by various heat sources. The intensity of gasification depends on the required gas flow. From the gasifier, carbon dioxide is fed to refrigerator 3, where it is cooled to the required temperature (depending on the process). Typically, this temperature should be in the range from 0 to -40 ° C.
тель) 4, легко отключаемый от оби.1,ей системы . Из нагревател 4 газ подаетс непосредственно к распределительному устройству 5, из распределительного устройства - в мед,ные охлаждаемые приспособлени , иснользуемые при сварке (формирующие подкладки) либо плавке (кристаллизатор).tel) 4, easily disconnected from obi.1, to her system. From heater 4, gas is fed directly to switchgear 5, from switchgear to copper, cooling equipment used during welding (forming pads) or smelting (mold).
С целью экономии расхода газа последний из охлаждаемых приснособлений нодаетс вIn order to save gas consumption, the last of the cooled devices is mounted in
очиститель 6 дл удалени загр знений и иримесей . Очищенный таким образом углекисльгй газ направл етс в комплексный агрегат 7, состо щий из компрессора, холодильника и сборника. В комнлексном агрегате газообразла углекислота подвергаетс сжатию до 60- 70 агм и благодар охлаждению проточной водой переводитс в жидкое состо ние. Затем в результате нонижени давлени над жидкостью последн превращаетс в снегообразиу О массу. Снегообразную массу прессуют или же блоки (брикеты) твердой углекислоты образуютс непосредственно в специальных генераторах 8. После этого цикл повтор етс сначала.cleaner 6 for removing contaminants and primers. The carbon dioxide gas thus purified is directed to the complex unit 7, consisting of a compressor, a refrigerator and a collector. In a complex gas-gas aggregate, carbon dioxide is compressed to 60-70 agm and, due to cooling with running water, is converted into a liquid state. Then, as a result of the non-lowering of the pressure above the liquid, the latter turns into a snow mass of 0 mass. The snow mass is pressed or blocks (briquettes) of solid carbon dioxide are formed directly in special generators 8. After this, the cycle is repeated from the beginning.
25 ПРИСПОСОБЛЕНИЙ25 DEVICES
с целью повышени качества сварки и улучшени условий труда, охлаждение производ т газообразными смес ми, имеюшими отрицательную температуру, причем процесс охлаждени осуществл ют замкнутым циклом движени охлаждаемого газа.in order to improve the quality of welding and improve working conditions, cooling is produced by gaseous mixtures having a negative temperature, the cooling process being carried out in a closed loop movement of the cooled gas.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU197803A1 true SU197803A1 (en) |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4653582A (en) * | 1985-05-22 | 1987-03-31 | Treco Products, Inc. | Point indicating system for combat sports |
| US4844346A (en) * | 1988-04-21 | 1989-07-04 | Coffey Robert G | Grove sprayer |
| US4898080A (en) * | 1987-08-11 | 1990-02-06 | Lieberman Walter G | Fluid powered linear slide |
| US4949671A (en) * | 1985-10-24 | 1990-08-21 | Texas Instruments Incorporated | Processing apparatus and method |
| US5060497A (en) * | 1986-04-02 | 1991-10-29 | Nissan Motor Co., Ltd. | Method of forming asymmetrical articles by rolling |
| US5217761A (en) * | 1990-12-25 | 1993-06-08 | Chugai Ro Co., Ltd. | Sheet plasma CVD apparatus |
| US5391232A (en) * | 1985-12-26 | 1995-02-21 | Canon Kabushiki Kaisha | Device for forming a deposited film |
| US5772771A (en) * | 1995-12-13 | 1998-06-30 | Applied Materials, Inc. | Deposition chamber for improved deposition thickness uniformity |
| US6070551A (en) * | 1996-05-13 | 2000-06-06 | Applied Materials, Inc. | Deposition chamber and method for depositing low dielectric constant films |
| US6884296B2 (en) * | 2002-08-23 | 2005-04-26 | Micron Technology, Inc. | Reactors having gas distributors and methods for depositing materials onto micro-device workpieces |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4653582A (en) * | 1985-05-22 | 1987-03-31 | Treco Products, Inc. | Point indicating system for combat sports |
| US4949671A (en) * | 1985-10-24 | 1990-08-21 | Texas Instruments Incorporated | Processing apparatus and method |
| US5391232A (en) * | 1985-12-26 | 1995-02-21 | Canon Kabushiki Kaisha | Device for forming a deposited film |
| US5060497A (en) * | 1986-04-02 | 1991-10-29 | Nissan Motor Co., Ltd. | Method of forming asymmetrical articles by rolling |
| US4898080A (en) * | 1987-08-11 | 1990-02-06 | Lieberman Walter G | Fluid powered linear slide |
| US4844346A (en) * | 1988-04-21 | 1989-07-04 | Coffey Robert G | Grove sprayer |
| US5217761A (en) * | 1990-12-25 | 1993-06-08 | Chugai Ro Co., Ltd. | Sheet plasma CVD apparatus |
| US6015591A (en) * | 1995-12-13 | 2000-01-18 | Applied Materials, Inc. | Deposition method |
| US5772771A (en) * | 1995-12-13 | 1998-06-30 | Applied Materials, Inc. | Deposition chamber for improved deposition thickness uniformity |
| US6251187B1 (en) | 1995-12-13 | 2001-06-26 | Applied Materials, Inc. | Gas distribution in deposition chambers |
| US6070551A (en) * | 1996-05-13 | 2000-06-06 | Applied Materials, Inc. | Deposition chamber and method for depositing low dielectric constant films |
| US6416823B2 (en) | 1996-05-13 | 2002-07-09 | Applied Materials, Inc. | Deposition chamber and method for depositing low dielectric constant films |
| US6589610B2 (en) | 1996-05-13 | 2003-07-08 | Applied Materials, Inc. | Deposition chamber and method for depositing low dielectric constant films |
| US6833052B2 (en) | 1996-05-13 | 2004-12-21 | Applied Materials, Inc. | Deposition chamber and method for depositing low dielectric constant films |
| US7413627B2 (en) | 1996-05-13 | 2008-08-19 | Applied Materials, Inc. | Deposition chamber and method for depositing low dielectric constant films |
| US6884296B2 (en) * | 2002-08-23 | 2005-04-26 | Micron Technology, Inc. | Reactors having gas distributors and methods for depositing materials onto micro-device workpieces |
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