SU186264A1 - VACUUM DENSITY STAINLESS STEEL - Google Patents
VACUUM DENSITY STAINLESS STEELInfo
- Publication number
- SU186264A1 SU186264A1 SU940971A SU940971A SU186264A1 SU 186264 A1 SU186264 A1 SU 186264A1 SU 940971 A SU940971 A SU 940971A SU 940971 A SU940971 A SU 940971A SU 186264 A1 SU186264 A1 SU 186264A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- stainless steel
- vacuum density
- density stainless
- solder
- vacuum
- Prior art date
Links
Landscapes
- Ceramic Products (AREA)
Description
Дл пайки нержавеющей стали известен припой следующего состава (в %): медь 53- 54, никель 30, марганец 15, кремний 1-2.For brazing stainless steel, a solder of the following composition is known (in%): copper 53-54, nickel 30, manganese 15, silicon 1-2.
С целью повышени качества па ных соединений при многоступенчатой пайке изделий, в состав предлагаемого припо введены олово 5% и бор 0,1%; остальные компоненты вз ты в другом процентном соотношении: никель 0,45%; медь - остальное. Температура плавлени 1000-1050°С.In order to improve the quality of soldered joints when multi-stage soldering of products, tin 5% and boron 0.1% are introduced into the composition of the proposed solder; the other components are taken in a different percentage: nickel 0.45%; copper - the rest. Melting point 1000-1050 ° C.
Швы, па нные предлагаемым припоем, прочны, пластичны, не тер ют вакуумной плотности при последующих пайках припо ми с более низкой температурой плавлени и выдерживают более 30 теплосмен с температурой от 800 до 20°С без по влени течи.The seams paired by the proposed solder are durable, plastic, do not lose vacuum density during subsequent soldering with solder with a lower melting point and withstand more than 30 heat cycles with a temperature of 800 to 20 ° C without any leakage.
Припой обладает хорошей жидкотекучестью , обеспечивает требуемую смачиваемость па емых поверхностей и не разъедает основного металла, позвол тем самым спаивать конструкции из тонкой стали.Solder has good fluidity, provides the required wettability of the soldered surfaces and does not corrode the base metal, thereby allowing soldering of thin steel structures.
Предмет изобретени Subject invention
Припой дл вакуумноплотной пайки нержавеющей стали, содержащей , никель, отличающийс тем, что, с целью повышени качества па ных соединений при многоступенчатой пайке изделий, в его состав введены олово в количестве 5% и бор - 0,1%, а остальные компоненты вз ты в соотношении: никель 0,45%, медь - остальное.Solder for vacuum-tight brazing of stainless steel containing nickel, characterized in that, in order to improve the quality of the solder joints when multi-stage brazing of products, tin in an amount of 5% and boron are introduced into its composition, and the remaining components are taken in the ratio: nickel 0.45%, copper - the rest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU940971A SU186264A1 (en) | 1965-02-03 | 1965-02-03 | VACUUM DENSITY STAINLESS STEEL |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU940971A SU186264A1 (en) | 1965-02-03 | 1965-02-03 | VACUUM DENSITY STAINLESS STEEL |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU186264A1 true SU186264A1 (en) | 1966-09-12 |
Family
ID=39956147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU940971A SU186264A1 (en) | 1965-02-03 | 1965-02-03 | VACUUM DENSITY STAINLESS STEEL |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU186264A1 (en) |
-
1965
- 1965-02-03 SU SU940971A patent/SU186264A1/en active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CH618835GA3 (en) | ||
| SU186264A1 (en) | VACUUM DENSITY STAINLESS STEEL | |
| SU186265A1 (en) | ||
| SU450673A1 (en) | Solder for the soldering of knots of electrovacuum devices | |
| SU186262A1 (en) | STAINLESS STEEL SHOES | |
| US2335615A (en) | Solder for soldering foils of aluminum and aluminum alloys | |
| SU188275A1 (en) | JOINTS OF STEEL AND CARPET PARTS | |
| SU241950A1 (en) | N.V. Kurguzov, I.K. Sklre and A.I. Golubev | |
| SU179598A1 (en) | Solder for soldering stainless steel, copper and their combinations | |
| SU194528A1 (en) | Solder for soldering thermoelements | |
| SU239002A1 (en) | SHOULDERS OF ELECTRIC AND APPLIANCE KNOTS | |
| JPS5596662A (en) | Electronic component member | |
| SU500948A1 (en) | Flux for soldering and tinning | |
| GB619279A (en) | Improvements in and relating to soldering aluminium and alloys thereof | |
| SU118690A1 (en) | Heat resistant solder | |
| SU407691A1 (en) | About p and s aN of INVENTION 407691 | |
| SU194527A1 (en) | TITAIA PIKES | |
| SU207685A1 (en) | Solder for soldering metals and alloys | |
| SU437594A1 (en) | Solder for soldering elements of power semiconductor devices | |
| SU416200A1 (en) | ||
| SU589103A1 (en) | Solder for soldering copper alloys to steels | |
| SU206988A1 (en) | MOLYBDENA PIKES | |
| HOWES et al. | Mechanical properties of soldered joints in copper alloys | |
| SU134114A1 (en) | Solderless Flux Free Brazing | |
| SU134736A1 (en) | Switching method of semiconductor thermoelements |