SU1229982A1 - Cooler for power semiconductor device - Google Patents

Abstract

This invention relates to an electrical conversion technique. The purpose of the invention is to increase the cooling efficiency. Air is blown through intercostal channels 7. The heat transfer from the power-LWD device 3 and the ribs 4 is enhanced by the fact that the air flow is about 3-5 fug

Description

redistributed over the height of intercostal channel 7 due to the introduction of a corrugated insert 6 mounted on plate 5. Creation of turbulence

The invention relates to electrical conversion engineering, namely, to chillers for the forced air cooling of power semiconductor devices.

The purpose of the invention is to increase the cooling efficiency by creating turbulence in the air flow.

FIG. 1 shows the structure of the cooler, a general view; in fig. 2 shows section A-A in FIG. I; in fig. 3 — plate construction with corrugated inserts mounted thereon; in fig. 4 - plate with corrugated inserts in nzometrii, general view.

The cooler (Fig. 1) contains a housing I with a platform 2 for fastening the power strip of a niche device 3 and with flat ribs 4. The housing 1 and the ribs 4 are manufactured as a single unit in the form of a standard rolled aluminum alloy profile.

The ends of the flat ribs 4 of the professional BaiHbi are attached and a flat plate 5 is attached to them. On the plate 5 are fixed

. corrugated inserts 6, the square of which is oriented along the axis of the intercostal channel 7. Fastening the corrugated inserts 6 to the plate 5 is carried out by welding or soldering

The construction of the plate 5 is shown in FIG. 3. This plate has corrugated inserts 6, and their deep-

 bina h is inversely proportional to distance t

The cooler works as follows.

air flow reduces the thermal resistance of the cooler by 30-35%, resulting in a possible reduction of its mass. 4 il.

The heat released by the sypovyk by the semiconductor device 3 is transmitted through the platform 2 to the housing 1 and flat ribs 4. Air is blown through the intercostal channels 7. Heat is transferred through the surface of the flat ribs 4 to the air. Heat transfer is enhanced by the fact that air 1 stream is redistributed over the height of intercostal channel 7 due to the introduction of a corrugated insert 6 and the creation of air flow turbulization.

The technical and economic efficiency of the proposed cooler is that due to an increase in the intensity of heat transfer at the border of the cooler — the air flow, the heat resistance of the cooler is reduced by 30-35%, as a result of which its mass can be reduced.

Invention Formula

Chiller for power semiconductor device, comprising a housing with a platform for. a semiconductor device with flat ribs and corrugated inserts installed between them, the depth of corrugation which is inversely proportional to the distance from the base of the insert to its top, characterized by the fact that, in order to increase the cooling efficiency due to the turbulence of the air flow, it is equipped with a plate attached to The ends of the flat ribs and the corrugated inserts are mounted on the plate with their base.

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   . ;. Php,

. . Compiled by I. Krinsky

Editor G. Volkova Techred. L. Serdyukov Proofreader And Erdeyi

Order.2462 / 60 Circulation 765 Subscription

VNIIPI USSR State Committee

for inventions and discoveries.

113035, Moscow, Zh-35, .Raushska nab. 4/5

Production and printing company, Uzhgorod, st. Project, 4

Claims (1)

Claim Cooler for power semiconductor device ²⁵ , comprising a housing with a platform for pressing the semiconductor device, with flat fins and corrugated inserts installed between them, the corrugation depth 30 of which is inversely proportional to the distance from the base of the insert to its apex, The reason is that, in order to increase the cooling efficiency of 35 due to the creation of turbulence in the air flow, it is equipped with a plate attached to the ends of the flat ribs, and the corrugated inserts are mounted on the plate with base. Aa