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SG99859A1 - Heat sink for ball grid array packages - Google Patents

Heat sink for ball grid array packages

Info

Publication number
SG99859A1
SG99859A1 SG9906408A SG1999006408A SG99859A1 SG 99859 A1 SG99859 A1 SG 99859A1 SG 9906408 A SG9906408 A SG 9906408A SG 1999006408 A SG1999006408 A SG 1999006408A SG 99859 A1 SG99859 A1 SG 99859A1
Authority
SG
Singapore
Prior art keywords
heat sink
grid array
ball grid
array packages
packages
Prior art date
Application number
SG9906408A
Inventor
Briar John
Liew Steve
Original Assignee
St Assembly Test Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Assembly Test Services Ltd filed Critical St Assembly Test Services Ltd
Publication of SG99859A1 publication Critical patent/SG99859A1/en

Links

Classifications

    • H10W72/00—
SG9906408A 1999-05-07 1999-12-17 Heat sink for ball grid array packages SG99859A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30720799A 1999-05-07 1999-05-07

Publications (1)

Publication Number Publication Date
SG99859A1 true SG99859A1 (en) 2003-11-27

Family

ID=31715477

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9906408A SG99859A1 (en) 1999-05-07 1999-12-17 Heat sink for ball grid array packages

Country Status (1)

Country Link
SG (1) SG99859A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559306A (en) * 1994-05-17 1996-09-24 Olin Corporation Electronic package with improved electrical performance
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
US6104093A (en) * 1997-04-24 2000-08-15 International Business Machines Corporation Thermally enhanced and mechanically balanced flip chip package and method of forming

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559306A (en) * 1994-05-17 1996-09-24 Olin Corporation Electronic package with improved electrical performance
US6104093A (en) * 1997-04-24 2000-08-15 International Business Machines Corporation Thermally enhanced and mechanically balanced flip chip package and method of forming
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package

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