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SG79258A1 - Forming solder bumps on semiconductor chips - Google Patents

Forming solder bumps on semiconductor chips

Info

Publication number
SG79258A1
SG79258A1 SG9902931A SG1999002931A SG79258A1 SG 79258 A1 SG79258 A1 SG 79258A1 SG 9902931 A SG9902931 A SG 9902931A SG 1999002931 A SG1999002931 A SG 1999002931A SG 79258 A1 SG79258 A1 SG 79258A1
Authority
SG
Singapore
Prior art keywords
semiconductor chips
solder bumps
forming solder
forming
bumps
Prior art date
Application number
SG9902931A
Inventor
Viswanadam Gautham
Original Assignee
Inst Of Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Of Microelectronics filed Critical Inst Of Microelectronics
Priority to SG9902931A priority Critical patent/SG79258A1/en
Publication of SG79258A1 publication Critical patent/SG79258A1/en

Links

SG9902931A 1999-06-05 1999-06-05 Forming solder bumps on semiconductor chips SG79258A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9902931A SG79258A1 (en) 1999-06-05 1999-06-05 Forming solder bumps on semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9902931A SG79258A1 (en) 1999-06-05 1999-06-05 Forming solder bumps on semiconductor chips

Publications (1)

Publication Number Publication Date
SG79258A1 true SG79258A1 (en) 2001-03-20

Family

ID=20430379

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9902931A SG79258A1 (en) 1999-06-05 1999-06-05 Forming solder bumps on semiconductor chips

Country Status (1)

Country Link
SG (1) SG79258A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279711A (en) * 1991-07-01 1994-01-18 International Business Machines Corporation Chip attach and sealing method
JPH07312399A (en) * 1994-05-18 1995-11-28 Hitachi Cable Ltd Ball grid array manufacturing method
US5607099A (en) * 1995-04-24 1997-03-04 Delco Electronics Corporation Solder bump transfer device for flip chip integrated circuit devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279711A (en) * 1991-07-01 1994-01-18 International Business Machines Corporation Chip attach and sealing method
JPH07312399A (en) * 1994-05-18 1995-11-28 Hitachi Cable Ltd Ball grid array manufacturing method
US5607099A (en) * 1995-04-24 1997-03-04 Delco Electronics Corporation Solder bump transfer device for flip chip integrated circuit devices

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