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SG63840A1 - Apparatus and method for mounting semiconductor hips on a substrate - Google Patents

Apparatus and method for mounting semiconductor hips on a substrate

Info

Publication number
SG63840A1
SG63840A1 SG1998000833A SG1998000833A SG63840A1 SG 63840 A1 SG63840 A1 SG 63840A1 SG 1998000833 A SG1998000833 A SG 1998000833A SG 1998000833 A SG1998000833 A SG 1998000833A SG 63840 A1 SG63840 A1 SG 63840A1
Authority
SG
Singapore
Prior art keywords
location
hips
substrate
mounting semiconductor
chip
Prior art date
Application number
SG1998000833A
Inventor
Dieter Vischer
Original Assignee
Esec Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sa filed Critical Esec Sa
Publication of SG63840A1 publication Critical patent/SG63840A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Operations Research (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

The device is used for positioning semiconductor chips (10) on a printed circuit board (5), by picking up each chip from an initial location (A) and pivoting it sidewards to a second location (B), using a manipulator (1) with a chip gripper (2). A camera is provided at the first location for determining the position of the semiconductor chip, with a sensor or a second camera at the second location for determining the position of the printed circuit board, for controlling a position correction device (9) for the manipulator.
SG1998000833A 1997-04-30 1998-04-09 Apparatus and method for mounting semiconductor hips on a substrate SG63840A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01008/97A CH693229A5 (en) 1997-04-30 1997-04-30 Means and method for assembling vonHalbleiterchips on a substrate.

Publications (1)

Publication Number Publication Date
SG63840A1 true SG63840A1 (en) 1999-03-30

Family

ID=4200302

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998000833A SG63840A1 (en) 1997-04-30 1998-04-09 Apparatus and method for mounting semiconductor hips on a substrate

Country Status (6)

Country Link
EP (1) EP0877544A1 (en)
JP (1) JPH1167794A (en)
KR (1) KR19980081827A (en)
CH (1) CH693229A5 (en)
SG (1) SG63840A1 (en)
TW (1) TW440990B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19919924A1 (en) * 1999-04-30 2000-11-16 Siemens Ag Method for operating an automatic placement machine, automatic placement machine, replaceable component for an automatic placement machine and system comprising an automatic placement machine and a replaceable component
DE10042661B4 (en) * 1999-09-10 2006-04-13 Esec Trading S.A. Methods and apparatus for mounting semiconductor chips
CN1486583A (en) * 2001-02-14 2004-03-31 伊斯梅卡半导体控股公司 Method and device for treating components
DE20116653U1 (en) 2001-05-07 2002-01-03 Esec Trading S.A., Cham Automatic assembly machine for placing a semiconductor chip as a flip chip on a substrate
TWI231561B (en) 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
CH696103A5 (en) 2003-06-06 2006-12-15 Esec Trading Sa Semiconductor assembly equipment.
JP4353100B2 (en) 2005-01-21 2009-10-28 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
DE102006022637A1 (en) * 2006-05-12 2007-11-15 Mühlbauer Ag Method and device for approaching a predetermined position of a moving in a direction of travel carrier tape
FR2977756B1 (en) * 2011-07-06 2014-03-28 Jfp Microtechnic DEVICE FOR COLLECTING AND PLACING SMALL OBJECTS
FR3039743B1 (en) * 2015-07-29 2017-07-21 Jfp Microtechnic DEVICE FOR HANDLING SMALL OBJECTS
CN110678969B (en) * 2017-04-11 2024-05-14 米尔鲍尔有限两合公司 Component receiving device with optical sensor
CN109219269A (en) * 2017-07-07 2019-01-15 深圳市炫硕智造技术有限公司 High speed placement system
TWI734434B (en) * 2019-04-11 2021-07-21 日商新川股份有限公司 Joining device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2183820A (en) * 1985-11-09 1987-06-10 Dynapert Precima Ltd Electronic component placement
JP2803221B2 (en) * 1989-09-19 1998-09-24 松下電器産業株式会社 IC mounting apparatus and method
DE4127696A1 (en) * 1991-08-21 1993-02-25 Adalbert Fritsch Handling system for assembly of SMD devices onto printed circuit board - has suction pad gripper used to extract components from magazine under control of optical viewing system

Also Published As

Publication number Publication date
JPH1167794A (en) 1999-03-09
KR19980081827A (en) 1998-11-25
EP0877544A1 (en) 1998-11-11
TW440990B (en) 2001-06-16
CH693229A5 (en) 2003-04-30

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