SG177233A1 - Thermosyphon for cooling electronic components - Google Patents
Thermosyphon for cooling electronic components Download PDFInfo
- Publication number
- SG177233A1 SG177233A1 SG2011040565A SG2011040565A SG177233A1 SG 177233 A1 SG177233 A1 SG 177233A1 SG 2011040565 A SG2011040565 A SG 2011040565A SG 2011040565 A SG2011040565 A SG 2011040565A SG 177233 A1 SG177233 A1 SG 177233A1
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- Singapore
- Prior art keywords
- thermosyphon
- evaporator section
- section
- condensate
- working fluid
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title description 10
- 238000009835 boiling Methods 0.000 claims description 49
- 239000012530 fluid Substances 0.000 claims description 30
- 239000011148 porous material Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- -1 for example Substances 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000006262 metallic foam Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of theevaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.[FIG. 1]
Description
La | | PCT/SG2010/000229 1%" ; oo kiso1s9r
THERMOSYPHON FOR COOLING ELECTRONIC COMPONENTS
Field of the Invention = The present invention relates to thermosyphons and more particularly to thermosyphons for cooling electronic components such as, for example, central processing units (CPUs), graphics processing units (GPUs) and concentrating solar cells.
Background of the Invention : : Thermal management is an important aspect in the design of electronic packaging. Proper thermal management of electronic devices ensures that operating temperatures remain within a reliable operating range. Operating at temperatures beyond the set boundary is undesirable as it leads to lower device performance, an increased probability of failure and a reduced lifespan.
With the introduction of multi-core processors and high-power electronics, component heat fluxes have risen to new higher levels and there is concern that current heat management technologies will not be able to cope with future heat load requirements. Thus, there is a need for a cooling device that is capable of dissipating waste heat generated by electronic components effectively.
Accordingly, in a first aspect, the present invention provides a thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the 1 ARE — : _ XGOO0ON*
Cs : | | PCT/SG2010/000229 thermosyphon. Advantageously, this allows operation of the thermosyphon at various physical orientations with minimal or no performance degradation. : - Preferably, the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through. Advantageously, this aids in returning the condensate to the evaporator section.
A boiling enhancement structure may be coupled to the evaporator section.
Advantageously, the boiling enhancement structure enhances nucleate boiling at the evaporator section and thereby increases the boiling heat transfer coefficient.
The boiling enhancement structure may include a plurality of pin fins.
Preferably, a separation between adjacent ones of the pin fins is less than a bubble characteristic length of a working fluid in the evaporator section. Advantageously, the bubble confinement effect enhances nucleate boiling of the working fluid and consequently increases heat transfer away from the heat source. in a preferred embodiment, the boiling enhancement structure is configured to draw the condensate back to the evaporator section. Advantageously, this enhances the heat transfer process.
Preferably, the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section. Advantageously, this reduces the heat transfer resistance.
In yet another preferred embodiment, a thermal interface material is coupled to the heat receiving portion of the evaporator section. Advantageously, this further reduces the heat transfer resistance. : ~ Preferably, a working fluid is provided in the evaporator section in an amount sufficient to submerge the boiling enhancement structure. Advantageously, this maximizes the boiling heat transfer. The working fluid is preferably in a saturated state. Co
. PCT/SG2010/000229
One of a plurality of grooves and a plurality of knurls may be formed on the inner surfaces of the condenser section for condensation enhancement. -In one embodiment, a port is provided for charging the evaporation section with a working fluid and for deaerating the thermosyphon. in a second aspect, the present invention provides a thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a boiling enhancement structure coupled to the evaporator section. The boiling enhancement structure includes a plurality of pin fins. Advantageously, the boiling enhancement structure enhances nucleate boiling at the evaporator section and increases both the boiling heat transfer coefficient and critical heat flux. :
Other aspects and advantages of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
FIG. 1 is an enlarged cross-sectional view of a thermosyphon in accordance ~ with one embodiment of the present invention; and oo
FIG. 2 is an enlarged perspective view of a boiling enhancement structure for the thermosyphon of FIG. 1. : Detailed Description of An Exemplary Embodiment . The detailed description set forth below in connection with the appended drawings is intended as a description of a presently preferred embodiment of the invention, and is not intended to represent the only form in which the present
: ‘ | PCT/SG2010/000229 invention. may be practiced. It is to be understood that the same or equivalent functions may be accomplished by different embodiments that are intended to be encompassed within the scope of the invention. | :
Referring now to FIG. 1, a thermosyphon 10 for cooling electronic components. such as, for example, central processing units (CPUs) and graphics processing units (GPUs) is shown. The thermosyphon 10 includes an evaporator section 12, a condenser section 14 coupled to the evaporator section 12, and a condensate guide 16 lining an inner portion of the evaporator section 12 and inner surfaces of the condenser section 14. A vapour core 18 is defined in the evaporator and condenser sections 12 and 14 by the condensate guide 16. A boiling enhancement structure 20 is coupled to the evaporator section 12. A working fluid 22 is provided in the evaporator section 12 in an amount sufficient to submerge the boiling enhancement structure 20. The boiling enhancement structure 20 is integrally formed with a heat receiving portion 24 of the evaporator section 12. A thermal interface material 26 is coupled to the heat receiving portion 24 of the evaporator section 12. A port 28 is provided for deaerating the thermosyphon 10 and for charging the evaporation section 12 with the working fluid 22. A plurality of fins 30 is coupled to the condenser section 14. ~The thermosyphon 10 is hermetically-sealed and is configured to receive heat from a heat source (not shown). The heat source may have a high heat flux and examples of the heat source include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs) and concentrating solar cells.
In the embodiment shown, the heat receiving portion 24 of the evaporator section 12 includes a base plate 32. The base plate 32 may be mounted or attached to the heat source. The base plate 32 is preferably fabricated from a thermally conductive material such as, for example, aluminium, copper, silver or graphite.
. . PCT/SG2010/000229 : The condenser section 14 is connected to and in fluid communication with the evaporator section 12. In the embodiment shown, the condenser section 14 includes a tube 34 and a top cover 36, the top cover 36 sealing one end of the tube 34. To ensure that the thermosyphon 10 is hermetically sealed, the tube 34 and the top cover 36 are bonded via a bonding process such as welding, soldering or diffusion. The tube 34 is preferably made of a thermally conductive material such . as, for example, aluminium, copper, silver or graphite. in the embodiment shown, the condenser section 14 is provided with an external means of heat exchange in the form of the cooling fins 30 extending from the tube 34 of the condenser section 14. The fins 30 are attached to the tube 34 with a degree of interference in order to have proper contact and thereby avoid the presence of gaps that could deteriorate the heat transfer performance of the fins 30.
The fins 30 are preferably made of a thermally conductive material such as, for example, copper or aluminium. Although the use of air-cooled fins is described in the present embodiment, it should be appreciated by those of ordinary skill in the art that the present invention is not limited by the cooling method employed to cool the condenser section 14. In alternative embodiments, the condenser section 14 may be cooled by other well known methods of cooling such as, for example, evaporative cooling, liquid cooling, spray cooling and impinging jet. | Further, for condensation enhancement, an inner surface of the tube 34 of the : condenser section 14 may be formed with a plurality of grooves or a knurled surface. oo Co
The condensate guide 16 is configured to return condensate to the evaporator section 12 regardless of an orientation of the thermosyphon 10. The condensate ~ 25 guide 16 is porous and the pores of the condensate guide 16 are sized to allow vapour to pass through and prevent condensate flow through. More particularly, the pores of the condensate guide 16 are designed small enough such that liquid is held by surface tension against liquid flow. The condensate guide 16 lines the boiling enhancement structure 20, the inner walls of the tube 34 and an inner surface of the
. : | PCT/SG2010/000229 ’ 1 top cover 36. Accordingly, when vapour condensation occurs in the condenser : section 14, the working fluid 22 in vapour form is allowed to pass through the condensate guide 16 but the condensate is prevented from returning to the vapour core 18, and the condensate guide 16 guides the flow of the condensate back to the evaporator section 12. Orientation independence of the thermosyphon 10 is thus achieved with the condensate guide 16. The condensate guide 16 may be made from a perforated sheet, a metallic wire mesh for structural integrity, or other porous medium. In one embodiment, the pores of the condensate guide 16 have a diameter of between about 0.1 millimetre (mm) and about 2 mm.
The vapour core 18 serves as a conduit for vapour generated from the evaporator section 12 to flow into the condenser section 14 and is therefore designed in a manner such that vapour flow is not constricted so as to prevent pressure build up in the evaporator section 12.
The boiling enhancement structure 20 is employed within the evaporator section 12 and forms a part of the internal surface of the evaporator section 12.
Referring now to FIG. 2, the boiling enhancement structure 20 of the thermosyphon 10 of FIG. 1 is shown. In the embodiment shown, the boiling enhancement structure 20 comprises a plurality of pin fins 38 integrally formed or mounted on an interior surface of the base plate 32. As can be seen from FIG. 2,a circular groove 40 is formed in the base plate 32 for receiving the tube 34 of the condenser section 14.
The boiling enhancement structure 20 improves the boiling heat transfer coefficient by increasing the number of nucleation sites and the heat transfer surface area. Additionally, the boiling enhancement structure 20 also improves the critical heat flux -by effectively minimizing the build-up of vapour film in the evaporator section 12 which causes dry out. : In a preferred embodiment, a separation between adjacent ones of the pin fins 38 is less than a bubble characteristic length of the working fluid 22 in the
. . : PCT/SG2010/000229 evaporator section 12. Advantageously, it has been shown through experimentation that the bubble confinement effect enhances nucleate boiling of the working fluid 22 and consequently increases heat transfer away from the heat source. The bubble characteristic length of the working fluid 22 may be computed with the following equation: : bubble characteristic length = 4-5) (1) g TP, where o represents surface tension, g represents gravitational acceleration, p, represents liquid density, and p represents vapour density. | : 4 .
The boiling enhancement structure 20 is configured to draw the condensate back to the evaporator section 12. More particularly, the boiling enhancement structure 20 serves as a thermally activated pumping unit that absorbs condensate from the condenser section 12.
The boiling enhancement structure 20 and the base plate 32 may be fabricated from a thermally conductive material such as, for example, aluminium, copper, silver or graphite. The pin fins 38 may be bonded to the base plate 32 via known bonding * methods such as, for example, soldering, brazing or diffusion. : In the embodiment shown, each of the pin fins 38 has a square profile. In one embodiment, each of the pin fins 38 has a height of between about 2 mm and about mm and a thickness of between about 0.5 mm and about 5 mm. However, it 20 should be understood that the pin fins 38 are not limited to these geometric : parameters as optimization of the geometric parameters such as fin profile, fin thickness and fin height is determined based on the thermal properties of the material from which the boiling enhancement structure 20 and the base plate 32 are : made and the boiling. heat transfer coefficient of the working fluid 22 for a specific geometry.
PCT/SG2010/000229
In alternative embodiments, the ‘boiling enhancement structure 20 may be "other forms of fins, grooves or an open-cell metal foam. - - The provision of the groove 40 in the base plate 32 helps to facilitate bonding of the evaporator section 12 to the condenser section 14. h 5 Referring again to FIG. 1, the working fluid 22 is preferably in a saturated state.
Advantageously, this ensures that the working fluid 22 undergoes phase change instantaneously at any temperature within the component operating range. ~ Examples of the working fluid 22 include, for example, water, a refrigerant or a dielectric fluid. In the embodiment shown, the boiling enhancement structure 20 is fully immersed in the working fluid 22. Advantageously, this maximizes the boiling heat transfer.
The thermal interface material 26 serves to reduce thermal interface resistance between the heat receiving portion 24 and the heat source.
The port 28 functions as an evacuation port that is sealed subsequent to liquid charging and deaeration. In the embodiment shown, the port 28 is provided in the form of a tube and is located on the top cover 36.
The operation of the thermosyphon 10 will now be described with reference to
FIG. 1.
In use, an electronic component generates heat. Heat from the electronic component is absorbed by the base plate 32 and spreads from the base plate 32 to the boiling enhancement structure 20 where nucleate boiling of the working fluid 22 : occurs and the working fluid 22 changes from a liquid to a vapour. Vapour bubbles : are formed on the heated surface of the boiling enhancement structure 20 creating a higher pressure region in the evaporator section 12. The higher pressure at the evaporator section 12 drives the vapour through the vapour core 18 to the condenser section 14 where pressure is lower.
PCT/SG2010/000229
As the walls of the condenser section 14 are at a lower temperature compared to the vapour, the vapour condenses into a liquid condensate on the walls of the condenser section 14 and releases latent heat of vaporization in the process. The heat released from the condensation process is rejected to an external medium via . 5 the fins 30 coupled to the condenser section 14.
The liquid condensate is enclosed by the walls of the condenser section 14 and the condensate guide 16 and is forced to flow between the walls of the condenser section 14 and the condensate guide 16 back to the evaporator section 12 by gravity and the capillary force provided by the boiling enhancement structure 20. :
As is evident from the foregoing discussion, the present invention provides an orientation-free, two-phase thermosyphon that effectively transfers heat from a heat dissipating component to a colder medium. Advantageously, through the provision of a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section, the thermosyphon of the present invention can be operated at various physical orientations with minimal or no performance degradation.
While the preferred embodiments of the invention have been illustrated and described, it will be clear that the invention is not limited to these embodiments only.
Numerous modifications, changes, variations, substitutions and equivalents will be apparent to those skilled in the art without departing from the scope of the invention as described in the claims.
Further, unless the context dearly requires otherwise, throughout the : description and the claims, the words "comprise", "comprising" and the like are to be construed in an inclusive as opposed to an exclusive or exhaustive sense; that is to say, in the sense of "including, but not limited to".
Claims (23)
1. A thermosyphon, comprising: | - ‘an evaporator section; . 5 a condenser section coupled to the evaporator section; and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section, the condensate guide defining a vapour core in the evaporator and condenser sections, wherein the condensate guide is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
2. The thermosyphon of claim 1, wherein the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through.
-
3. The thermosyphon of claim 1, further comprising a boiling enhancement structure coupled to the evaporator section.
4. The thermosyphon of claim 3, wherein the boiling enhancement structure comprises a plurality of pin fins.
5. The thermosyphon of claim 4, wherein a separation between adjacent ones of the pin fins is less than a bubble characteristic length of a working fluid in the evaporator section.
6. The thermosyphon of claim 3, wherein the boiling enhancement structure is configured to draw the condensate back to the evaporator section.
7. The thermosyphon of claim 3, wherein the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section.
PCT/SG2010/000229
8. The thermosyphon of claim 7, further comprising a thermal interface material coupled to the heat receiving portion of the evaporator section. :
‘9. The thermosyphon of claim 3, further comprising a working fluid in the evaporator section, wherein the working fluid is provided in an amount sufficient to submerge the boiling enhancement structure.
10. The thermosyphon of claim 9, wherein the working fluid is in a saturated + state.
11. The thermosyphon of claim 1, wherein one of a plurality of grooves and a plurality of knurls are formed on the inner surfaces of the condenser section.
12. The thermosyphon of claim 1, further comprising a port for charging the evaporation section with a working fluid and for deaerating the thermosyphon.
13. A thermosyphon, comprising: an evaporator section; i a condenser section coupled to the evaporator section; and a boiling enhancement structure coupled to the evaporator section, the boiling enhancement structure comprising a plurality of pin fins. :
14. The thermosyphon of claim 13, wherein a separation between adjacent ones of the pin fins is less than a bubble characteristic length of a working fluid in the evaporator section. oo
15. The thermosyphon of claim 13, wherein the boiling enhancement structure is configured to draw condensate back to the evaporator section.
16. The thermosyphon of claim 13, wherein the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section.
oo | | PCT/SG2010/000229
17. The thermosyphon of claim 16, further comprising a thermal interface material coupled to the heat receiving portion of the evaporator section.
18. The thermosyphon of claim 13, further comprising a working fluid in the evaporator section, wherein the working fluid is in a saturated state.
19. The thermosyphon of claim 18, wherein the working fluid is provided in an amount sufficient to submerge the boiling enhancement structure.
20. The thermosyphon of claim 13, wherein one of a plurality of grooves and a plurality of knurls are formed on an inner surface of the condenser section.
21. The thermosyphon of claim 13, further comprising a port for charging the evaporation section with a working fluid and for deaerating the thermosyphon.
22. The thermosyphon of claim 13, further comprising a condensate guide defining a vapour core in the evaporator and condenser sections, wherein the condensate guide is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
23, The thermosyphon of claim 22, wherein the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/SG2010/000229 WO2011159251A1 (en) | 2010-06-18 | 2010-06-18 | Thermosyphon for cooling electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG177233A1 true SG177233A1 (en) | 2012-02-28 |
Family
ID=45348444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011040565A SG177233A1 (en) | 2010-06-18 | 2010-06-18 | Thermosyphon for cooling electronic components |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120024500A1 (en) |
| SG (1) | SG177233A1 (en) |
| WO (1) | WO2011159251A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2503108A (en) * | 2013-06-10 | 2013-12-18 | Gert Pille | Cooling Photo-Voltaic Cells Using Thermosyphon Cooling Circuit |
| US10638648B2 (en) | 2016-04-28 | 2020-04-28 | Ge Energy Power Conversion Technology Ltd. | Cooling system with pressure regulation |
| US9894815B1 (en) | 2016-08-08 | 2018-02-13 | General Electric Company | Heat removal assembly for use with a power converter |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1481787A (en) * | 1974-10-10 | 1977-08-03 | Secretary Industry Brit | Two-phase thermosyphons |
| US5629840A (en) * | 1992-05-15 | 1997-05-13 | Digital Equipment Corporation | High powered die with bus bars |
| US6615912B2 (en) * | 2001-06-20 | 2003-09-09 | Thermal Corp. | Porous vapor valve for improved loop thermosiphon performance |
| US6704200B2 (en) * | 2002-02-12 | 2004-03-09 | Hewlett-Packard Development Company, L.P. | Loop thermosyphon using microchannel etched semiconductor die as evaporator |
| US6907918B2 (en) * | 2002-02-13 | 2005-06-21 | Thermal Corp. | Deformable end cap for heat pipe |
| US6714413B1 (en) * | 2002-10-15 | 2004-03-30 | Delphi Technologies, Inc. | Compact thermosiphon with enhanced condenser for electronics cooling |
| US6793009B1 (en) * | 2003-06-10 | 2004-09-21 | Thermal Corp. | CTE-matched heat pipe |
| US7013955B2 (en) * | 2003-07-28 | 2006-03-21 | Thermal Corp. | Flexible loop thermosyphon |
| JP2007533944A (en) * | 2004-03-31 | 2007-11-22 | ベリッツ コンピューター システムズ， インコーポレイテッド | Thermosyphon-based thin cooling system for computers and other electronic equipment |
| US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
| TWI307399B (en) * | 2005-09-09 | 2009-03-11 | Delta Electronics Inc | Heat dissipation module and heat pipe thereof |
-
2010
- 2010-06-18 SG SG2011040565A patent/SG177233A1/en unknown
- 2010-06-18 US US13/139,869 patent/US20120024500A1/en not_active Abandoned
- 2010-06-18 WO PCT/SG2010/000229 patent/WO2011159251A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011159251A1 (en) | 2011-12-22 |
| US20120024500A1 (en) | 2012-02-02 |
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