[go: up one dir, main page]

SG171692A1 - Chemical mechanical polishing composition - Google Patents

Chemical mechanical polishing composition

Info

Publication number
SG171692A1
SG171692A1 SG201103505-2A SG2011035052A SG171692A1 SG 171692 A1 SG171692 A1 SG 171692A1 SG 2011035052 A SG2011035052 A SG 2011035052A SG 171692 A1 SG171692 A1 SG 171692A1
Authority
SG
Singapore
Prior art keywords
chemical mechanical
mechanical polishing
polishing composition
combinations
inhibitor composition
Prior art date
Application number
SG201103505-2A
Inventor
Song-Yuan Chang
ming-hui Lu
Ming-Che Ho
Original Assignee
Uwiz Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uwiz Technology Co Ltd filed Critical Uwiz Technology Co Ltd
Publication of SG171692A1 publication Critical patent/SG171692A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

An inhibitor composition according to the present invention at least comprises an imidazoline compound or a triazole compound or combinations thereof, and sarcosine and salt compounds thereof or combinations thereof. The inhibitor composition is applicable to chemical mechanical polishing so as to maintain a high removal rate of metal layers as well as suppress metal etching, thereby reducing polishing defects such as dishing, erosion and the like. Nil
SG201103505-2A 2008-04-24 2008-08-05 Chemical mechanical polishing composition SG171692A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097114974A TW200945429A (en) 2008-04-24 2008-04-24 Composition of chemical mechanical polishing

Publications (1)

Publication Number Publication Date
SG171692A1 true SG171692A1 (en) 2011-06-29

Family

ID=41392753

Family Applications (2)

Application Number Title Priority Date Filing Date
SG201103505-2A SG171692A1 (en) 2008-04-24 2008-08-05 Chemical mechanical polishing composition
SG200805785-3A SG156559A1 (en) 2008-04-24 2008-08-05 Chemical mechanical polishing composition

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200805785-3A SG156559A1 (en) 2008-04-24 2008-08-05 Chemical mechanical polishing composition

Country Status (3)

Country Link
JP (1) JP5567261B2 (en)
SG (2) SG171692A1 (en)
TW (1) TW200945429A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9528030B1 (en) * 2015-10-21 2016-12-27 Cabot Microelectronics Corporation Cobalt inhibitor combination for improved dishing
JP6901297B2 (en) 2017-03-22 2021-07-14 株式会社フジミインコーポレーテッド Polishing composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002348562A (en) * 2001-05-25 2002-12-04 Minebea Co Ltd Compound for coating sheet metal
JP2004153086A (en) * 2002-10-31 2004-05-27 Showa Denko Kk Metal abrasive compound, metal film grinding method and substrate manufacturing method
EP1682625A1 (en) * 2003-11-14 2006-07-26 Showa Denko K.K. Polishing composition and polishing method
JP2005340755A (en) * 2003-11-14 2005-12-08 Showa Denko Kk Abrasive compound and polishing method
JP2006179845A (en) * 2004-11-26 2006-07-06 Fuji Photo Film Co Ltd Polishing solution for metal, and polishing method
JP2007088379A (en) * 2005-09-26 2007-04-05 Fujifilm Corp Aqueous polishing slurry and chemical mechanical polishing method
JP2007189148A (en) * 2006-01-16 2007-07-26 Fujifilm Corp Chemical mechanical polishing method
TWI437083B (en) * 2006-07-28 2014-05-11 Showa Denko Kk Abrasive composition
JP2007221170A (en) * 2007-05-18 2007-08-30 Hitachi Chem Co Ltd Method of preparing polishing solution for metal
JP2009081300A (en) * 2007-09-26 2009-04-16 Fujifilm Corp Metal polishing composition, and polishing method using the same
JP2009094430A (en) * 2007-10-12 2009-04-30 Adeka Corp Polishing composition for cmp
JP2009123880A (en) * 2007-11-14 2009-06-04 Showa Denko Kk Polishing composition
US7955520B2 (en) * 2007-11-27 2011-06-07 Cabot Microelectronics Corporation Copper-passivating CMP compositions and methods
US9202709B2 (en) * 2008-03-19 2015-12-01 Fujifilm Corporation Polishing liquid for metal and polishing method using the same

Also Published As

Publication number Publication date
SG156559A1 (en) 2009-11-26
TW200945429A (en) 2009-11-01
TWI355026B (en) 2011-12-21
JP2009267325A (en) 2009-11-12
JP5567261B2 (en) 2014-08-06

Similar Documents

Publication Publication Date Title
MX370395B (en) Flat steel product, method for producing a flat steel product, and method for producing a component.
MY173068A (en) Stripping compositions having high wn/w etching selectivity
MX2009002220A (en) Disinfectant systems and methods.
MX2011010332A (en) Pyrimidine substituted purine compounds as kinase (s) inhibitors.
PH12013500365A1 (en) Anti-infective agents and uses thereof
TW200639166A (en) Amino-pyridines as inhibitors of β-secretase
JP2007116105A5 (en)
WO2011136597A3 (en) Copper and titanium composition for metal layer etching solution
MY161562A (en) Rinse liquid for lithography and pattern formation method using the same
SG179158A1 (en) Composition and method for polishing bulk silicon
TWI456013B (en) Polishing slurry composition
MY150778A (en) Fused heterocyclic compound
MY150651A (en) Polishing composition and polishing method
RU2015153430A (en) COMPOSITIONS OF CONVERSION COVERING BASED ON PERMANGANATE
TN2009000401A1 (en) New methods
MX2012013332A (en) Preparation of posaconazole intermediates.
MY158213A (en) Cutting fluid composition for wiresawing
MY182270A (en) Compositions for inhibiting corrosion
WO2012056390A3 (en) Solutions and methods for metal deposition
SG158816A1 (en) Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful thereof
MY165453A (en) Drill having a coating
MX2013011333A (en) Combinations of akt and mek inhibitor compounds, and methods of use.
TW200634138A (en) Low-dishing composition and method for chemical-mechanical planarization with branched-alkylphenol-substituted benzotriazole
WO2015044576A3 (en) Anti-corrosion formulations with storage stability
GB201105381D0 (en) Cubic boron nitride grit and tools comprising same