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SG167661A1 - Stacked die in die bga package - Google Patents

Stacked die in die bga package

Info

Publication number
SG167661A1
SG167661A1 SG200603130-6A SG2006031306A SG167661A1 SG 167661 A1 SG167661 A1 SG 167661A1 SG 2006031306 A SG2006031306 A SG 2006031306A SG 167661 A1 SG167661 A1 SG 167661A1
Authority
SG
Singapore
Prior art keywords
die
bga package
stacked
stacked die
devices
Prior art date
Application number
SG200603130-6A
Inventor
Hock Chuan Tan
Thiam Chye Lim
Victor Cher Khng Tan
Chee Peng Neo
Michael Kian Shing Tan
Beng Chye Chew
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200603130-6A priority Critical patent/SG167661A1/en
Publication of SG167661A1 publication Critical patent/SG167661A1/en

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Abstract

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
SG200603130-6A 2002-01-09 2002-01-09 Stacked die in die bga package SG167661A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200603130-6A SG167661A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200603130-6A SG167661A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Publications (1)

Publication Number Publication Date
SG167661A1 true SG167661A1 (en) 2011-01-28

Family

ID=43859909

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200603130-6A SG167661A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Country Status (1)

Country Link
SG (1) SG167661A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5986340A (en) * 1996-05-02 1999-11-16 National Semiconductor Corporation Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same
US6005778A (en) * 1995-06-15 1999-12-21 Honeywell Inc. Chip stacking and capacitor mounting arrangement including spacers
US6294839B1 (en) * 1999-08-30 2001-09-25 Micron Technology, Inc. Apparatus and methods of packaging and testing die
WO2003061006A2 (en) * 2002-01-09 2003-07-24 Micron Technology, Inc Stacked die in die bga package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6005778A (en) * 1995-06-15 1999-12-21 Honeywell Inc. Chip stacking and capacitor mounting arrangement including spacers
US5986340A (en) * 1996-05-02 1999-11-16 National Semiconductor Corporation Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same
US6294839B1 (en) * 1999-08-30 2001-09-25 Micron Technology, Inc. Apparatus and methods of packaging and testing die
WO2003061006A2 (en) * 2002-01-09 2003-07-24 Micron Technology, Inc Stacked die in die bga package

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