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SG161124A1 - Insulated metal substrate and method of forming the same - Google Patents

Insulated metal substrate and method of forming the same

Info

Publication number
SG161124A1
SG161124A1 SG200808021-0A SG2008080210A SG161124A1 SG 161124 A1 SG161124 A1 SG 161124A1 SG 2008080210 A SG2008080210 A SG 2008080210A SG 161124 A1 SG161124 A1 SG 161124A1
Authority
SG
Singapore
Prior art keywords
metal substrate
metal
forming
insulated metal
disposed
Prior art date
Application number
SG200808021-0A
Inventor
Kai Fook Francis Wee
Original Assignee
Opulent Electronics Internat P
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opulent Electronics Internat P filed Critical Opulent Electronics Internat P
Priority to SG200808021-0A priority Critical patent/SG161124A1/en
Priority to PCT/SG2009/000017 priority patent/WO2010050896A1/en
Publication of SG161124A1 publication Critical patent/SG161124A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

An insulated metal substrate (1) for use in metal clad printed circuit board, the insulated metal substrate (1) comprises a metal substrate (10), an electrically insulating layer (12) disposed on the metal substrate (10), and an electrically conducting layer (14) capable of interconnecting electronic power components (24) such as light emitting devices or light emitting diodes (LEDs), the electrically conducting layer (14) disposed on the electrically insulating layer (12). The metal substrate (10) comprises a base metal (10a) and a dissimilar overlaying metal(10b) disposed on the base metal (10a). Method of forming the insulated metal substrate (1) is also provided.
SG200808021-0A 2008-10-29 2008-10-29 Insulated metal substrate and method of forming the same SG161124A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200808021-0A SG161124A1 (en) 2008-10-29 2008-10-29 Insulated metal substrate and method of forming the same
PCT/SG2009/000017 WO2010050896A1 (en) 2008-10-29 2009-01-08 Insulated metal substrate and method of forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200808021-0A SG161124A1 (en) 2008-10-29 2008-10-29 Insulated metal substrate and method of forming the same

Publications (1)

Publication Number Publication Date
SG161124A1 true SG161124A1 (en) 2010-05-27

Family

ID=42129066

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200808021-0A SG161124A1 (en) 2008-10-29 2008-10-29 Insulated metal substrate and method of forming the same

Country Status (2)

Country Link
SG (1) SG161124A1 (en)
WO (1) WO2010050896A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2481754C1 (en) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Printed circuit board on metal substrate and method of its manufacturing
WO2015047974A2 (en) * 2013-09-24 2015-04-02 Cooper Technologies Company Systems and methods for improving service life of circuit boards
KR20150074421A (en) * 2013-12-24 2015-07-02 엘지이노텍 주식회사 printed circuit board AND LUMINOUS DEVICE
CN109413848B (en) * 2018-10-23 2020-04-21 胜宏科技（惠州）股份有限公司 Method for processing copper-aluminum combined metal substrate
CN110113880A (en) * 2018-12-29 2019-08-09 广东生益科技股份有限公司 Metal-based copper-clad laminate and preparation method thereof
CN110225676A (en) * 2019-04-23 2019-09-10 江苏迪飞达电子有限公司 A kind of production technology of multiple layer metal substrate
CN115151025A (en) * 2022-07-05 2022-10-04 诚亿电子（嘉兴）有限公司 High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6175084B1 (en) * 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
DE19900603A1 (en) * 1999-01-11 2000-07-13 Bosch Gmbh Robert Electronic semiconductor module
US6165596A (en) * 1999-10-14 2000-12-26 Lucent Technologies, Inc. Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components
TWI340010B (en) * 2006-08-04 2011-04-01 Everlight Electronics Co Ltd Circuit board with cooling functionality
WO2008128016A2 (en) * 2007-04-13 2008-10-23 World Properties Inc. Metal core circuit boards for light emitting diode applications and methods of manufacture thereof

Also Published As

Publication number Publication date
WO2010050896A1 (en) 2010-05-06

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