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SG144708A1 - Apparatus and method for fabricating folded ic packages - Google Patents

Apparatus and method for fabricating folded ic packages

Info

Publication number
SG144708A1
SG144708A1 SG200401545-9A SG2004015459A SG144708A1 SG 144708 A1 SG144708 A1 SG 144708A1 SG 2004015459 A SG2004015459 A SG 2004015459A SG 144708 A1 SG144708 A1 SG 144708A1
Authority
SG
Singapore
Prior art keywords
folded
packages
package
fabricating
planar
Prior art date
Application number
SG200401545-9A
Inventor
Chong Yong Boon
Tan Bock Yian
Original Assignee
Ever Technologies Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ever Technologies Pte Ltd filed Critical Ever Technologies Pte Ltd
Priority to SG200401545-9A priority Critical patent/SG144708A1/en
Publication of SG144708A1 publication Critical patent/SG144708A1/en

Links

Landscapes

  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

Apparatus And Method For Fabricating Folded IC packages An apparatus (1) for fabrication of folded IC packages, the apparatus comprising a holder (4) for receiving and fastening one or more planar IC packages, a folding element (46) for folding one portion of each planar IC package on top of another portion of said each the IC package, and a heater (42) for applying heat to the folded IC package to cure an adhesive element of the integrated package for fastening said folded portion of the IC package on top of the other portion of the IC package.
SG200401545-9A 2004-02-27 2004-02-27 Apparatus and method for fabricating folded ic packages SG144708A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200401545-9A SG144708A1 (en) 2004-02-27 2004-02-27 Apparatus and method for fabricating folded ic packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200401545-9A SG144708A1 (en) 2004-02-27 2004-02-27 Apparatus and method for fabricating folded ic packages

Publications (1)

Publication Number Publication Date
SG144708A1 true SG144708A1 (en) 2008-08-28

Family

ID=39710848

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200401545-9A SG144708A1 (en) 2004-02-27 2004-02-27 Apparatus and method for fabricating folded ic packages

Country Status (1)

Country Link
SG (1) SG144708A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559030A (en) * 1982-11-19 1985-12-17 O-M Limited Apparatus for folding jacket material
WO1993022139A1 (en) * 1992-05-05 1993-11-11 Cedal, S.R.L. Process for producing plastic laminates with metal laminae, especially for printed circuits
DE19927207A1 (en) * 1999-06-15 2000-12-28 Thyssenkrupp Ind Ag Process for joining sheet metal on the edge
JP2001143029A (en) * 1999-11-11 2001-05-25 Sony Corp Manufacturing method of ic card
US20010035572A1 (en) * 1999-05-05 2001-11-01 Isaak Harlan R. Stackable flex circuit chip package and method of making same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559030A (en) * 1982-11-19 1985-12-17 O-M Limited Apparatus for folding jacket material
WO1993022139A1 (en) * 1992-05-05 1993-11-11 Cedal, S.R.L. Process for producing plastic laminates with metal laminae, especially for printed circuits
US20010035572A1 (en) * 1999-05-05 2001-11-01 Isaak Harlan R. Stackable flex circuit chip package and method of making same
DE19927207A1 (en) * 1999-06-15 2000-12-28 Thyssenkrupp Ind Ag Process for joining sheet metal on the edge
JP2001143029A (en) * 1999-11-11 2001-05-25 Sony Corp Manufacturing method of ic card

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