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SG130076A1 - Microfeature assemblies including interconnect structures and methods for forming such interconnect structures - Google Patents

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Info

Publication number
SG130076A1
SG130076A1 SG200505632-0A SG2005056320A SG130076A1 SG 130076 A1 SG130076 A1 SG 130076A1 SG 2005056320 A SG2005056320 A SG 2005056320A SG 130076 A1 SG130076 A1 SG 130076A1
Authority
SG
Singapore
Prior art keywords
interconnect structures
microfeature
methods
forming
assemblies including
Prior art date
Application number
SG200505632-0A
Inventor
Puah Kia Heng
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200505632-0A priority Critical patent/SG130076A1/en
Publication of SG130076A1 publication Critical patent/SG130076A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Wire Bonding (AREA)

Abstract

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures are disclosed herein. One particular embodiment of a microfeature assembly includes a microelectronic die having integrated circuitry, a plurality of terminals electrically coupled to the integrated circuitry, and conductive bumps on the individual terminals. The conductive bumps include first engagement features. The assembly also includes a microfeature workpiece haying a substrate and a plurality of pads on the substrate. The pads include non-planar second engagement features engaged with the first engagement features on corresponding conductive bumps.
SG200505632-0A 2005-09-02 2005-09-02 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures SG130076A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200505632-0A SG130076A1 (en) 2005-09-02 2005-09-02 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200505632-0A SG130076A1 (en) 2005-09-02 2005-09-02 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Publications (1)

Publication Number Publication Date
SG130076A1 true SG130076A1 (en) 2007-03-20

Family

ID=38787690

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200505632-0A SG130076A1 (en) 2005-09-02 2005-09-02 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Country Status (1)

Country Link
SG (1) SG130076A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5673846A (en) * 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
US20030216023A1 (en) * 1997-03-26 2003-11-20 Wark James M. Projected contact structures for engaging bumped semiconductor devices and methods of making the same
US20040159958A1 (en) * 2003-02-14 2004-08-19 Renesas Technology Corp. Semiconductor device and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5673846A (en) * 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
US20030216023A1 (en) * 1997-03-26 2003-11-20 Wark James M. Projected contact structures for engaging bumped semiconductor devices and methods of making the same
US20040159958A1 (en) * 2003-02-14 2004-08-19 Renesas Technology Corp. Semiconductor device and method of manufacturing the same

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