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SG120948A1 - Stacked microfeature devices and associated methods - Google Patents

Stacked microfeature devices and associated methods

Info

Publication number
SG120948A1
SG120948A1 SG200305589A SG200305589A SG120948A1 SG 120948 A1 SG120948 A1 SG 120948A1 SG 200305589 A SG200305589 A SG 200305589A SG 200305589 A SG200305589 A SG 200305589A SG 120948 A1 SG120948 A1 SG 120948A1
Authority
SG
Singapore
Prior art keywords
associated methods
microfeature devices
stacked
stacked microfeature
devices
Prior art date
Application number
SG200305589A
Inventor
Mung Suan Heng
Kok Chua Tan
Vince Chan Seng Leong
Mark S Johnson
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200305589A priority Critical patent/SG120948A1/en
Publication of SG120948A1 publication Critical patent/SG120948A1/en

Links

SG200305589A 2003-09-05 2003-09-05 Stacked microfeature devices and associated methods SG120948A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200305589A SG120948A1 (en) 2003-09-05 2003-09-05 Stacked microfeature devices and associated methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200305589A SG120948A1 (en) 2003-09-05 2003-09-05 Stacked microfeature devices and associated methods

Publications (1)

Publication Number Publication Date
SG120948A1 true SG120948A1 (en) 2006-04-26

Family

ID=37111135

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200305589A SG120948A1 (en) 2003-09-05 2003-09-05 Stacked microfeature devices and associated methods

Country Status (1)

Country Link
SG (1) SG120948A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135066A1 (en) * 1998-05-04 2002-09-26 Corisis David J. Stackable ball grid array package
US20030057539A1 (en) * 2001-09-21 2003-03-27 Michel Koopmans Bumping technology in stacked die configurations
US20030111716A1 (en) * 2001-12-14 2003-06-19 Kazuaki Ano Wirebonded multichip module
US20030160311A1 (en) * 2002-02-28 2003-08-28 Aminuddin Ismail Stacked die semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135066A1 (en) * 1998-05-04 2002-09-26 Corisis David J. Stackable ball grid array package
US20030057539A1 (en) * 2001-09-21 2003-03-27 Michel Koopmans Bumping technology in stacked die configurations
US20030111716A1 (en) * 2001-12-14 2003-06-19 Kazuaki Ano Wirebonded multichip module
US20030160311A1 (en) * 2002-02-28 2003-08-28 Aminuddin Ismail Stacked die semiconductor device

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