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SG112807A1 - Packaged microelectronic die assemblies and methods of manufacture - Google Patents

Packaged microelectronic die assemblies and methods of manufacture

Info

Publication number
SG112807A1
SG112807A1 SG200105330A SG200105330A SG112807A1 SG 112807 A1 SG112807 A1 SG 112807A1 SG 200105330 A SG200105330 A SG 200105330A SG 200105330 A SG200105330 A SG 200105330A SG 112807 A1 SG112807 A1 SG 112807A1
Authority
SG
Singapore
Prior art keywords
manufacture
methods
microelectronic die
die assemblies
packaged microelectronic
Prior art date
Application number
SG200105330A
Inventor
Chee Moon Ow
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200105330A priority Critical patent/SG112807A1/en
Publication of SG112807A1 publication Critical patent/SG112807A1/en

Links

SG200105330A 2001-08-31 2001-08-31 Packaged microelectronic die assemblies and methods of manufacture SG112807A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200105330A SG112807A1 (en) 2001-08-31 2001-08-31 Packaged microelectronic die assemblies and methods of manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200105330A SG112807A1 (en) 2001-08-31 2001-08-31 Packaged microelectronic die assemblies and methods of manufacture

Publications (1)

Publication Number Publication Date
SG112807A1 true SG112807A1 (en) 2005-07-28

Family

ID=34882383

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200105330A SG112807A1 (en) 2001-08-31 2001-08-31 Packaged microelectronic die assemblies and methods of manufacture

Country Status (1)

Country Link
SG (1) SG112807A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5776797A (en) * 1995-12-22 1998-07-07 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6262895B1 (en) * 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5776797A (en) * 1995-12-22 1998-07-07 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6262895B1 (en) * 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier

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