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SG11202109533QA - A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization - Google Patents

A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Info

Publication number
SG11202109533QA
SG11202109533QA SG11202109533QA SG11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA
Authority
SG
Singapore
Prior art keywords
metallization
activating
conductive
carbon
containing substrate
Prior art date
Application number
Inventor
Josef Gaida
Lutz Stamp
Lena Ivanova
Thomas Thomas
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG11202109533QA publication Critical patent/SG11202109533QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
SG11202109533Q 2019-04-04 2020-04-01 A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization SG11202109533QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP19167282 2019-04-04
PCT/EP2020/059313 WO2020201387A1 (en) 2019-04-04 2020-04-01 A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Publications (1)

Publication Number Publication Date
SG11202109533QA true SG11202109533QA (en) 2021-10-28

Family

ID=66092168

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202109533Q SG11202109533QA (en) 2019-04-04 2020-04-01 A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Country Status (12)

Country Link
US (1) US20220154343A1 (en)
EP (1) EP3947772A1 (en)
JP (1) JP7455859B2 (en)
KR (1) KR102783057B1 (en)
CN (1) CN113614283A (en)
BR (1) BR112021016763A2 (en)
CA (1) CA3135816A1 (en)
MX (1) MX2021012121A (en)
PH (1) PH12021552015A1 (en)
SG (1) SG11202109533QA (en)
TW (1) TWI764121B (en)
WO (1) WO2020201387A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3190848A1 (en) 2020-08-27 2022-03-03 Andre Beyer A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
WO2025051732A1 (en) 2023-09-07 2025-03-13 Atotech Deutschland GmbH & Co. KG A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278712A (en) * 1978-08-31 1981-07-14 Surface Technology, Inc. Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating
US4600699A (en) * 1983-02-14 1986-07-15 Enthone, Incorporated Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters
US4820547A (en) * 1987-04-24 1989-04-11 Surface Technology, Inc. Activators for colloidal catalysts in electroless plating processes
US5421989A (en) * 1993-08-31 1995-06-06 Atotech Deutschland Gmbh Process for the metallization of nonconductive substrates with elimination of electroless metallization
JP4069248B2 (en) 2002-12-09 2008-04-02 大阪市 Catalyst composition for electroless plating
KR20060128739A (en) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 Method for Direct Metallization of Non-Conductive Substrates
US20080245184A1 (en) 2006-06-15 2008-10-09 Woo Ram Lee Preparation method of metal nano particle using micro mixer
EP1876262A1 (en) 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Environmentally friendly electroless copper compositions
FR2958944B1 (en) * 2010-04-19 2014-11-28 Pegastech METHOD FOR COATING A SURFACE OF A SUBSTRATE OF NON-METALLIC MATERIAL WITH A METAL LAYER
WO2013050332A2 (en) 2011-10-05 2013-04-11 Atotech Deutschland Gmbh Formaldehyde-free electroless copper plating solution
JP6145681B2 (en) 2014-02-07 2017-06-14 石原ケミカル株式会社 Aqueous copper colloid catalyst solution for electroless copper plating and electroless copper plating method
JP2018523016A (en) * 2015-07-30 2018-08-16 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ Plating method for plastic surface
EP3181724A3 (en) 2015-12-14 2017-08-16 Rohm and Haas Electronic Materials LLC Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes
US10151035B2 (en) * 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
CN107460459A (en) 2017-06-29 2017-12-12 深圳安德万斯新材料科技有限公司 A kind of Nanometer Copper activating solution and preparation method thereof

Also Published As

Publication number Publication date
BR112021016763A2 (en) 2021-10-13
EP3947772A1 (en) 2022-02-09
CN113614283A (en) 2021-11-05
TW202041712A (en) 2020-11-16
MX2021012121A (en) 2021-11-03
KR20210143882A (en) 2021-11-29
CA3135816A1 (en) 2020-10-08
PH12021552015A1 (en) 2022-09-19
JP2022527973A (en) 2022-06-07
JP7455859B2 (en) 2024-03-26
WO2020201387A1 (en) 2020-10-08
KR102783057B1 (en) 2025-03-17
US20220154343A1 (en) 2022-05-19
TWI764121B (en) 2022-05-11

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