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SG11201906504SA - Tape for semiconductor processing - Google Patents

Tape for semiconductor processing

Info

Publication number
SG11201906504SA
SG11201906504SA SG11201906504SA SG11201906504SA SG 11201906504S A SG11201906504S A SG 11201906504SA SG 11201906504S A SG11201906504S A SG 11201906504SA SG 11201906504S A SG11201906504S A SG 11201906504SA
Authority
SG
Singapore
Prior art keywords
tape
semiconductor processing
temporary adhesive
values
measured
Prior art date
Application number
Inventor
Kosuke Hashimoto
Akira Sendai
Toru Sano
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of SG11201906504SA publication Critical patent/SG11201906504SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A tape for semiconductor processing that can be caused to shrink by heating sufficiently in a short time period and can retain a kerf width is provided. A tape for semiconductor processing 10 of the invention includes a temporary adhesive tape 15 having a substrate film 11; and a temporary adhesive layer 12 formed on at least one surface side of the substrate film 11, in which regarding the temporary adhesive tape 15, the sum of the integral value calculated from the sum total of the values of the thermal deformation rate in any of a first direction per 1°C between 40°C and 80°C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, and the integral value calculated from the sum total of the values of the thermal deformation rate in a second direction perpendicular to the first direction per 1°C between 40°C and 80°C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, is a negative value.
SG11201906504S 2018-03-28 2018-07-18 Tape for semiconductor processing SG11201906504SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018061061A JP6535117B1 (en) 2018-03-28 2018-03-28 Semiconductor processing tape
PCT/JP2018/026880 WO2019187184A1 (en) 2018-03-28 2018-07-18 Semiconductor processing tape

Publications (1)

Publication Number Publication Date
SG11201906504SA true SG11201906504SA (en) 2019-11-28

Family

ID=67023796

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906504S SG11201906504SA (en) 2018-03-28 2018-07-18 Tape for semiconductor processing

Country Status (8)

Country Link
JP (1) JP6535117B1 (en)
KR (1) KR102112789B1 (en)
CN (1) CN110546738B (en)
BR (1) BR112019019521B1 (en)
MY (1) MY187864A (en)
SG (1) SG11201906504SA (en)
TW (1) TWI685028B (en)
WO (1) WO2019187184A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7060547B2 (en) * 2019-05-29 2022-04-26 古河電気工業株式会社 Glass processing tape
JP7060548B2 (en) * 2019-05-29 2022-04-26 古河電気工業株式会社 Glass processing tape
KR102311521B1 (en) * 2019-11-07 2021-10-13 양진석 Apparatus of transferring a plurality of chips adn method of transferring a plurality of chips
WO2022077178A1 (en) * 2020-10-12 2022-04-21 华为技术有限公司 Chip packaging structure, electronic device and method for producing chip packaging structure
WO2023157195A1 (en) 2022-02-17 2023-08-24 株式会社レゾナック Dicing die-bonding film, and method for manufacturing semiconductor device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2521459B2 (en) * 1987-02-23 1996-08-07 日東電工株式会社 Method of manufacturing semiconductor chip
JP4757442B2 (en) * 1997-02-10 2011-08-24 リンテック株式会社 Chip body adhesive sheet
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2003342393A (en) * 2002-05-30 2003-12-03 Mitsubishi Polyester Film Copp Polyester soft film for dicing tape
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Method of dividing semiconductor wafer
JP4754278B2 (en) 2005-06-23 2011-08-24 リンテック株式会社 Chip body manufacturing method
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP2012174945A (en) * 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The Processing method of semiconductor wafer
JP5801584B2 (en) * 2011-03-29 2015-10-28 リンテック株式会社 Dicing tape and chip-shaped part manufacturing method
TWI553721B (en) * 2012-12-26 2016-10-11 日立化成股份有限公司 Expand method, and method for fabricating semiconductor device
JP6295135B2 (en) 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
TWI699420B (en) * 2015-03-24 2020-07-21 日商古河電氣工業股份有限公司 Tape for semiconductor processing
JP2017147293A (en) * 2016-02-16 2017-08-24 日立化成株式会社 Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape
JP2017174945A (en) * 2016-03-23 2017-09-28 京セラ株式会社 Multilayer electronic components

Also Published As

Publication number Publication date
TWI685028B (en) 2020-02-11
WO2019187184A1 (en) 2019-10-03
CN110546738A (en) 2019-12-06
BR112019019521A2 (en) 2020-04-22
BR112019019521B1 (en) 2021-03-16
KR102112789B1 (en) 2020-05-19
KR20190113746A (en) 2019-10-08
JP2019175958A (en) 2019-10-10
JP6535117B1 (en) 2019-06-26
TW201942964A (en) 2019-11-01
CN110546738B (en) 2020-12-29
MY187864A (en) 2021-10-26

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