SG11201804241UA - Fluid cooling system and method for electronics equipment - Google Patents
Fluid cooling system and method for electronics equipmentInfo
- Publication number
- SG11201804241UA SG11201804241UA SG11201804241UA SG11201804241UA SG11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA
- Authority
- SG
- Singapore
- Prior art keywords
- fluid
- international
- heat exchanger
- conditioner
- exchanger
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title abstract 15
- 238000001816 cooling Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000002826 coolant Substances 0.000 abstract 2
- 230000008520 organization Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -' Organization International Bureau ires.. 00) (43) International Publication Date .... ..sr.) 8 June 2017 (08.06.2017) IN I PO I PCT (10) WO International 111111111111311111111111111111111111111111111111111111111111111111111111111111111111111111 2017/091862 Publication Al Number (51) International Patent Classification: (74) Agent: GOLJA HAINES & FRIEND; Suite 7, 23 G06F 1/20 (2006.01) HOSK 7/20 (2006.01) Richardson Street, South Perth, Perth, Western Australia G11B 33/14 (2006.01) F28D 1/047 (2006.01) 6151 (AU). (21) International Application Number: (81) Designated States (unless otherwise indicated, for every PCT/AU2016/051186 kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, (22) International Filing Date: BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, 1 December 2016 (01.12.2016) DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, (25) Filing Language: English HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, (26) Publication Language: English MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (30) Priority Data: OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, 2015904999 2 December 2015 (02.12.2015) AU SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, (71) Applicant: DOWNUNDER GEOSOLUTIONS PTY ZW. LTD [AU/AU]; Level 3, 76 Kings Park Road, West Perth, Western Australia 6005 (AU). (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (72) Inventors: MIDGLEY, Stuart David; 98 Rannoch Circle, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, Hamersley, Western Australia 6022 (AU). LOMMERS, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, Mark; 7 Kyle Court, Hamersley, Western Australia 6022 TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, (AU). DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, [Continued on next page] (54) Title: FLUID COOLING SYSTEM AND METHOD FOR ELECTRONICS EQUIPMENT : A fluid for in (57) conditioner (1) use a tank (110) containing (130), devices, immersed in fluid (F) in the computers or other electronic --g a z:L tank (110). The fluid conditioner (1) comprises a housing (10) having a heat located in chamber (38), an outlet (14), a exchanger (18) the chamber .1.: (38) of the housing (10), and one or more pumps (16) to pump fluid such so that the fluid passes into contact with the heat exchanger (18) in the chamber — (38). The heat exchanger (18) has an inlet (30) for cooling medium to enter \ / 1 L the heat exchanger (18) and an outlet (32) for cooling medium to exit the 54- ---r. , 3, 1 heat exchanger (18). In the upright, operational orientation of the fluid con - fl I $ ditioner (1), the (16) and the heat exchanger (18) are vertically spaced 0 pump 56 ------, 4-0 f I to the heat is located the mit- relative one another and exchanger (18) above t I r let (14) of the fluid conditioner (1). In use, fluid (F) is drawn into and 0 through the pumps (16) to be discharged from the pumps (16). The fluid (F) into the heat (18) to thereby the fluid (F), passes contact with exchanger cool , and the cooled fluid (F) exits the fluid conditioner (1) via the outlet (14) of , the fluid conditioner (1) and passes into the lower region of the tank (110) 16 for , circulation through the tank (110). 4(4, 5 I u 4if 1 IA,,i ts ti A-9, 46 \\ % i 7E3 ti - - N 1 I'l 11 t' l .4t 0 P N [ [ ‘o•if 1 C 30 IraIMIMI111111111 - GC 1 .2 g Cr\ — 14 0 o IN 11 0 ei O WO 2017/091862 Al MIDEDIMOM0101011101011110MOHOIEDIOMOVOIS LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, Published: SM, GW, TR), KM, OAPI (BF, BJ, ML, MR, NE, CF, SN, CG, CI, CM, TD, TG). GA, GN, GQ, with international search report (Art. 21(3))
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2015904999A AU2015904999A0 (en) | 2015-12-02 | Fluid Conditioner for Cooling Fluid in a Tank Holding Computers and/or Other Electronics Equipment, a Cooling System Incorporating such a Fluid Conditioner, and a Method of Cooling Fluid in a Tank Holding Computers and/or Other Electronics Equipment | |
PCT/AU2016/051186 WO2017091862A1 (en) | 2015-12-02 | 2016-12-01 | Fluid cooling system and method for electronics equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201804241UA true SG11201804241UA (en) | 2018-06-28 |
Family
ID=58795986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201804241UA SG11201804241UA (en) | 2015-12-02 | 2016-12-01 | Fluid cooling system and method for electronics equipment |
Country Status (15)
Country | Link |
---|---|
US (1) | US11026344B2 (en) |
EP (1) | EP3384364B1 (en) |
JP (1) | JP6659869B2 (en) |
CN (1) | CN108292152A (en) |
AU (1) | AU2016363679B2 (en) |
BR (1) | BR112018011022B1 (en) |
CA (1) | CA3006594C (en) |
DK (1) | DK3384364T3 (en) |
ES (1) | ES2910703T3 (en) |
HK (1) | HK1251057A1 (en) |
LT (1) | LT3384364T (en) |
MY (1) | MY193528A (en) |
RU (1) | RU2698777C1 (en) |
SG (1) | SG11201804241UA (en) |
WO (1) | WO2017091862A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US10020242B2 (en) | 2016-04-14 | 2018-07-10 | Hamilton Sundstrand Corporation | Immersion cooling arrangements for electronic devices |
RU2695089C2 (en) * | 2017-12-26 | 2019-07-19 | Общество с ограниченной ответственностью "Научно-Технический Центр ИннТех" | System for direct liquid cooling of electronic components |
US20190357378A1 (en) * | 2018-05-18 | 2019-11-21 | Tas Energy Inc. | Two-phase immersion cooling system and method with enhanced circulation of vapor flow through a condenser |
AT520915B1 (en) * | 2018-09-04 | 2019-07-15 | Claus Hinterecker | Device for cooling high-performance computers or circuits with temperature control |
JP7151503B2 (en) * | 2019-01-23 | 2022-10-12 | 富士通株式会社 | Cooling system and electronics |
US11592795B2 (en) * | 2019-02-08 | 2023-02-28 | Dell Products L.P. | System and method of managing liquids with information handling systems |
EP3941171B1 (en) * | 2019-03-13 | 2024-05-15 | Submer Technologies, S.L. | Cooling system for computer components |
TWI714037B (en) * | 2019-03-26 | 2020-12-21 | 緯創資通股份有限公司 | Air flow generating system for liquid tank, immersion cooling apparatus having the same, and method for operating the same |
US10765033B1 (en) * | 2019-05-23 | 2020-09-01 | Microsoft Technology Licensing, Llc | Immersion cooling enclosures with insulating liners |
CN112020265B (en) * | 2019-05-31 | 2022-06-28 | 华为技术有限公司 | Heat dissipation device and processor |
CN113721718B (en) * | 2020-05-26 | 2024-06-25 | 富联精密电子(天津)有限公司 | Heat abstractor and server |
US10966349B1 (en) * | 2020-07-27 | 2021-03-30 | Bitfury Ip B.V. | Two-phase immersion cooling apparatus with active vapor management |
WO2022058915A1 (en) * | 2020-09-18 | 2022-03-24 | 3M Innovative Properties Company | Sensors for contaminants |
US11412636B2 (en) * | 2021-01-12 | 2022-08-09 | Cooler Master Co., Ltd. | Single-phase immersion cooling system and method of the same |
EP4335261A1 (en) | 2021-05-06 | 2024-03-13 | Tyco Fire & Security GmbH | Electrical power distribution optimized liquid immersion cooling tank with variable flow for high density computer server equipment |
US11696423B2 (en) | 2021-05-06 | 2023-07-04 | Tyco Fire & Security Gmbh | Liquid immersion cooling tank with variable flow for high density computer server equipment |
CN114096133B (en) * | 2021-12-22 | 2024-10-29 | 北京字节跳动网络技术有限公司 | Immersed liquid cooling device and liquid cooling system |
TWI816465B (en) * | 2022-07-08 | 2023-09-21 | 緯穎科技服務股份有限公司 | Immersion cooling system |
WO2024059016A1 (en) * | 2022-09-14 | 2024-03-21 | Green Revolution Cooling, Inc. | System and method for supplying uniform flow of dielectric cooling fluid for data servers |
WO2024197189A1 (en) * | 2023-03-21 | 2024-09-26 | Slicip, Inc. | Flexible membrane container for thermal management of an electronic object |
FR3153492A1 (en) | 2023-09-22 | 2025-03-28 | Hyperion | Cooling system for at least one electronic device |
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JPS60229353A (en) * | 1984-04-27 | 1985-11-14 | Hitachi Ltd | heat transfer device |
KR900001393B1 (en) * | 1985-04-30 | 1990-03-09 | Fujitsu Ltd | Evaporation cooling module for semiconductor device |
JPH0727998B2 (en) * | 1986-10-20 | 1995-03-29 | 富士通株式会社 | Semiconductor device cooling method |
JPH04170097A (en) * | 1990-11-01 | 1992-06-17 | Koufu Nippon Denki Kk | Cooling mechanism |
US6955062B2 (en) * | 2002-03-11 | 2005-10-18 | Isothermal Systems Research, Inc. | Spray cooling system for transverse thin-film evaporative spray cooling |
RU2232952C1 (en) * | 2003-06-03 | 2004-07-20 | Алиева Елена Антоновна | Method of heating and cooling fluid medium |
US7591302B1 (en) * | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US20070227710A1 (en) * | 2006-04-03 | 2007-10-04 | Belady Christian L | Cooling system for electrical devices |
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US7485234B2 (en) * | 2006-06-08 | 2009-02-03 | Marine Desalination Systems, Llc | Hydrate-based desalination using compound permeable restraint panels and vaporization-based cooling |
US20080173427A1 (en) * | 2007-01-23 | 2008-07-24 | Richard Schumacher | Electronic component cooling |
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JP4903295B2 (en) * | 2008-04-21 | 2012-03-28 | ハードコア コンピューター、インク. | Case and rack system for liquid immersion cooling of arrayed electronic devices |
DK2321849T3 (en) * | 2008-08-11 | 2022-01-31 | Green Revolution Cooling Inc | HORIZONTAL COMPUTER SERVICE DIP SUBMITTED IN LIQUID AND SYSTEMS AND PROCEDURES FOR COOLING SUCH A SERVER STAND |
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CN201945206U (en) * | 2010-11-18 | 2011-08-24 | 深圳市信德昌机电设备工程有限公司 | One-to-two heat dispersion device and system |
US8955347B2 (en) * | 2011-07-21 | 2015-02-17 | International Business Machines Corporation | Air-side economizer facilitating liquid-based cooling of an electronics rack |
CN102625639B (en) * | 2012-03-21 | 2015-10-21 | 华为技术有限公司 | Electronic equipment and cooling system thereof and heat dissipating method |
US9335802B2 (en) * | 2013-02-01 | 2016-05-10 | Dell Products, L.P. | System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid |
WO2015175693A1 (en) * | 2014-05-13 | 2015-11-19 | Green Revolution Cooling, Inc. | System and method for air-cooling hard drives in liquid-cooled server rack |
US10011919B2 (en) * | 2015-05-29 | 2018-07-03 | Lam Research Corporation | Electrolyte delivery and generation equipment |
US10020242B2 (en) * | 2016-04-14 | 2018-07-10 | Hamilton Sundstrand Corporation | Immersion cooling arrangements for electronic devices |
-
2016
- 2016-12-01 SG SG11201804241UA patent/SG11201804241UA/en unknown
- 2016-12-01 ES ES16869414T patent/ES2910703T3/en active Active
- 2016-12-01 RU RU2018119573A patent/RU2698777C1/en active
- 2016-12-01 WO PCT/AU2016/051186 patent/WO2017091862A1/en active Application Filing
- 2016-12-01 CA CA3006594A patent/CA3006594C/en active Active
- 2016-12-01 DK DK16869414.9T patent/DK3384364T3/en active
- 2016-12-01 MY MYPI2018702093A patent/MY193528A/en unknown
- 2016-12-01 EP EP16869414.9A patent/EP3384364B1/en active Active
- 2016-12-01 JP JP2018548245A patent/JP6659869B2/en active Active
- 2016-12-01 BR BR112018011022-1A patent/BR112018011022B1/en active IP Right Grant
- 2016-12-01 CN CN201680069927.8A patent/CN108292152A/en active Pending
- 2016-12-01 AU AU2016363679A patent/AU2016363679B2/en active Active
- 2016-12-01 LT LTEPPCT/AU2016/051186T patent/LT3384364T/en unknown
-
2018
- 2018-05-22 US US15/986,635 patent/US11026344B2/en active Active
- 2018-08-14 HK HK18110410.1A patent/HK1251057A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU2016363679B2 (en) | 2020-03-12 |
EP3384364A4 (en) | 2019-08-21 |
CA3006594C (en) | 2023-10-10 |
LT3384364T (en) | 2022-05-10 |
RU2698777C1 (en) | 2019-08-29 |
EP3384364B1 (en) | 2022-03-30 |
BR112018011022B1 (en) | 2022-11-22 |
US20180279507A1 (en) | 2018-09-27 |
WO2017091862A1 (en) | 2017-06-08 |
US11026344B2 (en) | 2021-06-01 |
EP3384364A1 (en) | 2018-10-10 |
HK1251057A1 (en) | 2019-01-18 |
DK3384364T3 (en) | 2022-04-19 |
AU2016363679A1 (en) | 2018-06-07 |
CA3006594A1 (en) | 2017-06-08 |
JP6659869B2 (en) | 2020-03-04 |
ES2910703T3 (en) | 2022-05-13 |
JP2019500759A (en) | 2019-01-10 |
BR112018011022A2 (en) | 2018-11-21 |
MY193528A (en) | 2022-10-18 |
CN108292152A (en) | 2018-07-17 |
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