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SG11201804241UA - Fluid cooling system and method for electronics equipment - Google Patents

Fluid cooling system and method for electronics equipment

Info

Publication number
SG11201804241UA
SG11201804241UA SG11201804241UA SG11201804241UA SG11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA SG 11201804241U A SG11201804241U A SG 11201804241UA
Authority
SG
Singapore
Prior art keywords
fluid
international
heat exchanger
conditioner
exchanger
Prior art date
Application number
SG11201804241UA
Inventor
Stuart David Midgley
Mark Lommers
Original Assignee
Downunder Geosolutions Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2015904999A external-priority patent/AU2015904999A0/en
Application filed by Downunder Geosolutions Pty Ltd filed Critical Downunder Geosolutions Pty Ltd
Publication of SG11201804241UA publication Critical patent/SG11201804241UA/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263Heat dissipaters releasing heat from coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -' Organization International Bureau ires.. 00) (43) International Publication Date .... ..sr.) 8 June 2017 (08.06.2017) IN I PO I PCT (10) WO International 111111111111311111111111111111111111111111111111111111111111111111111111111111111111111111 2017/091862 Publication Al Number (51) International Patent Classification: (74) Agent: GOLJA HAINES & FRIEND; Suite 7, 23 G06F 1/20 (2006.01) HOSK 7/20 (2006.01) Richardson Street, South Perth, Perth, Western Australia G11B 33/14 (2006.01) F28D 1/047 (2006.01) 6151 (AU). (21) International Application Number: (81) Designated States (unless otherwise indicated, for every PCT/AU2016/051186 kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, (22) International Filing Date: BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, 1 December 2016 (01.12.2016) DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, (25) Filing Language: English HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, (26) Publication Language: English MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (30) Priority Data: OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, 2015904999 2 December 2015 (02.12.2015) AU SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, (71) Applicant: DOWNUNDER GEOSOLUTIONS PTY ZW. LTD [AU/AU]; Level 3, 76 Kings Park Road, West Perth, Western Australia 6005 (AU). (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (72) Inventors: MIDGLEY, Stuart David; 98 Rannoch Circle, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, Hamersley, Western Australia 6022 (AU). LOMMERS, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, Mark; 7 Kyle Court, Hamersley, Western Australia 6022 TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, (AU). DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, [Continued on next page] (54) Title: FLUID COOLING SYSTEM AND METHOD FOR ELECTRONICS EQUIPMENT : A fluid for in (57) conditioner (1) use a tank (110) containing (130), devices, immersed in fluid (F) in the computers or other electronic --g a z:L tank (110). The fluid conditioner (1) comprises a housing (10) having a heat located in chamber (38), an outlet (14), a exchanger (18) the chamber .1.: (38) of the housing (10), and one or more pumps (16) to pump fluid such so that the fluid passes into contact with the heat exchanger (18) in the chamber — (38). The heat exchanger (18) has an inlet (30) for cooling medium to enter \ / 1 L the heat exchanger (18) and an outlet (32) for cooling medium to exit the 54- ---r. , 3, 1 heat exchanger (18). In the upright, operational orientation of the fluid con - fl I $ ditioner (1), the (16) and the heat exchanger (18) are vertically spaced 0 pump 56 ------, 4-0 f I to the heat is located the mit- relative one another and exchanger (18) above t I r let (14) of the fluid conditioner (1). In use, fluid (F) is drawn into and 0 through the pumps (16) to be discharged from the pumps (16). The fluid (F) into the heat (18) to thereby the fluid (F), passes contact with exchanger cool , and the cooled fluid (F) exits the fluid conditioner (1) via the outlet (14) of , the fluid conditioner (1) and passes into the lower region of the tank (110) 16 for , circulation through the tank (110). 4(4, 5 I u 4if 1 IA,,i ts ti A-9, 46 \\ % i 7E3 ti - - N 1 I'l 11 t' l .4t 0 P N [ [ ‘o•if 1 C 30 IraIMIMI111111111 - GC 1 .2 g Cr\ — 14 0 o IN 11 0 ei O WO 2017/091862 Al MIDEDIMOM0101011101011110MOHOIEDIOMOVOIS LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, Published: SM, GW, TR), KM, OAPI (BF, BJ, ML, MR, NE, CF, SN, CG, CI, CM, TD, TG). GA, GN, GQ, with international search report (Art. 21(3))
SG11201804241UA 2015-12-02 2016-12-01 Fluid cooling system and method for electronics equipment SG11201804241UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AU2015904999A AU2015904999A0 (en) 2015-12-02 Fluid Conditioner for Cooling Fluid in a Tank Holding Computers and/or Other Electronics Equipment, a Cooling System Incorporating such a Fluid Conditioner, and a Method of Cooling Fluid in a Tank Holding Computers and/or Other Electronics Equipment
PCT/AU2016/051186 WO2017091862A1 (en) 2015-12-02 2016-12-01 Fluid cooling system and method for electronics equipment

Publications (1)

Publication Number Publication Date
SG11201804241UA true SG11201804241UA (en) 2018-06-28

Family

ID=58795986

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201804241UA SG11201804241UA (en) 2015-12-02 2016-12-01 Fluid cooling system and method for electronics equipment

Country Status (15)

Country Link
US (1) US11026344B2 (en)
EP (1) EP3384364B1 (en)
JP (1) JP6659869B2 (en)
CN (1) CN108292152A (en)
AU (1) AU2016363679B2 (en)
BR (1) BR112018011022B1 (en)
CA (1) CA3006594C (en)
DK (1) DK3384364T3 (en)
ES (1) ES2910703T3 (en)
HK (1) HK1251057A1 (en)
LT (1) LT3384364T (en)
MY (1) MY193528A (en)
RU (1) RU2698777C1 (en)
SG (1) SG11201804241UA (en)
WO (1) WO2017091862A1 (en)

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US10020242B2 (en) 2016-04-14 2018-07-10 Hamilton Sundstrand Corporation Immersion cooling arrangements for electronic devices
RU2695089C2 (en) * 2017-12-26 2019-07-19 Общество с ограниченной ответственностью "Научно-Технический Центр ИннТех" System for direct liquid cooling of electronic components
US20190357378A1 (en) * 2018-05-18 2019-11-21 Tas Energy Inc. Two-phase immersion cooling system and method with enhanced circulation of vapor flow through a condenser
AT520915B1 (en) * 2018-09-04 2019-07-15 Claus Hinterecker Device for cooling high-performance computers or circuits with temperature control
JP7151503B2 (en) * 2019-01-23 2022-10-12 富士通株式会社 Cooling system and electronics
US11592795B2 (en) * 2019-02-08 2023-02-28 Dell Products L.P. System and method of managing liquids with information handling systems
EP3941171B1 (en) * 2019-03-13 2024-05-15 Submer Technologies, S.L. Cooling system for computer components
TWI714037B (en) * 2019-03-26 2020-12-21 緯創資通股份有限公司 Air flow generating system for liquid tank, immersion cooling apparatus having the same, and method for operating the same
US10765033B1 (en) * 2019-05-23 2020-09-01 Microsoft Technology Licensing, Llc Immersion cooling enclosures with insulating liners
CN112020265B (en) * 2019-05-31 2022-06-28 华为技术有限公司 Heat dissipation device and processor
CN113721718B (en) * 2020-05-26 2024-06-25 富联精密电子(天津)有限公司 Heat abstractor and server
US10966349B1 (en) * 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
WO2022058915A1 (en) * 2020-09-18 2022-03-24 3M Innovative Properties Company Sensors for contaminants
US11412636B2 (en) * 2021-01-12 2022-08-09 Cooler Master Co., Ltd. Single-phase immersion cooling system and method of the same
EP4335261A1 (en) 2021-05-06 2024-03-13 Tyco Fire & Security GmbH Electrical power distribution optimized liquid immersion cooling tank with variable flow for high density computer server equipment
US11696423B2 (en) 2021-05-06 2023-07-04 Tyco Fire & Security Gmbh Liquid immersion cooling tank with variable flow for high density computer server equipment
CN114096133B (en) * 2021-12-22 2024-10-29 北京字节跳动网络技术有限公司 Immersed liquid cooling device and liquid cooling system
TWI816465B (en) * 2022-07-08 2023-09-21 緯穎科技服務股份有限公司 Immersion cooling system
WO2024059016A1 (en) * 2022-09-14 2024-03-21 Green Revolution Cooling, Inc. System and method for supplying uniform flow of dielectric cooling fluid for data servers
WO2024197189A1 (en) * 2023-03-21 2024-09-26 Slicip, Inc. Flexible membrane container for thermal management of an electronic object
FR3153492A1 (en) 2023-09-22 2025-03-28 Hyperion Cooling system for at least one electronic device

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Also Published As

Publication number Publication date
AU2016363679B2 (en) 2020-03-12
EP3384364A4 (en) 2019-08-21
CA3006594C (en) 2023-10-10
LT3384364T (en) 2022-05-10
RU2698777C1 (en) 2019-08-29
EP3384364B1 (en) 2022-03-30
BR112018011022B1 (en) 2022-11-22
US20180279507A1 (en) 2018-09-27
WO2017091862A1 (en) 2017-06-08
US11026344B2 (en) 2021-06-01
EP3384364A1 (en) 2018-10-10
HK1251057A1 (en) 2019-01-18
DK3384364T3 (en) 2022-04-19
AU2016363679A1 (en) 2018-06-07
CA3006594A1 (en) 2017-06-08
JP6659869B2 (en) 2020-03-04
ES2910703T3 (en) 2022-05-13
JP2019500759A (en) 2019-01-10
BR112018011022A2 (en) 2018-11-21
MY193528A (en) 2022-10-18
CN108292152A (en) 2018-07-17

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