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SG11201707864TA - Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications - Google Patents

Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications

Info

Publication number
SG11201707864TA
SG11201707864TA SG11201707864TA SG11201707864TA SG11201707864TA SG 11201707864T A SG11201707864T A SG 11201707864TA SG 11201707864T A SG11201707864T A SG 11201707864TA SG 11201707864T A SG11201707864T A SG 11201707864TA SG 11201707864T A SG11201707864T A SG 11201707864TA
Authority
SG
Singapore
Prior art keywords
vertical contact
high frequency
frequency applications
testing head
corresponding testing
Prior art date
Application number
SG11201707864TA
Inventor
Daniele Acconcia
Raffaele Vallauri
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201707864TA publication Critical patent/SG11201707864TA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06744Microprobes, i.e. having dimensions as IC details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06772High frequency probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201707864TA 2015-03-31 2016-03-10 Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications SG11201707864TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITUB20150340 2015-03-31
PCT/EP2016/055152 WO2016156003A1 (en) 2015-03-31 2016-03-10 Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications

Publications (1)

Publication Number Publication Date
SG11201707864TA true SG11201707864TA (en) 2017-10-30

Family

ID=53490171

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707864TA SG11201707864TA (en) 2015-03-31 2016-03-10 Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications

Country Status (10)

Country Link
US (1) US10386388B2 (en)
EP (1) EP3278120A1 (en)
JP (1) JP6728219B2 (en)
KR (1) KR102133484B1 (en)
CN (1) CN107430151B (en)
MY (1) MY186669A (en)
PH (1) PH12017501807A1 (en)
SG (1) SG11201707864TA (en)
TW (1) TWI687692B (en)
WO (1) WO2016156003A1 (en)

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DE102017209254B4 (en) * 2017-05-31 2025-03-06 Feinmetall Gmbh Contact head for an electrical test device, test device
DE102017209510A1 (en) * 2017-06-06 2018-12-06 Feinmetall Gmbh Contact Element System
KR101958351B1 (en) 2017-08-04 2019-03-15 리노공업주식회사 A test probe and test device using the same
KR101958353B1 (en) * 2017-08-04 2019-03-15 리노공업주식회사 A test device
KR101962644B1 (en) * 2017-08-23 2019-03-28 리노공업주식회사 A test probe and test device using the same
IT201700100522A1 (en) * 2017-09-07 2019-03-07 Technoprobe Spa Interface element for an electronic device test device and its manufacturing method
TWI783074B (en) * 2017-11-09 2022-11-11 義大利商探針科技公司 Contact probe for a testing head for testing high-frequency devices
IT201800002877A1 (en) 2018-02-20 2019-08-20 Technoprobe Spa Apparatus and method for the automated assembly of a measuring head
IT201900024889A1 (en) 2019-12-19 2021-06-19 Technoprobe Spa Contact probe for high frequency applications with improved current carrying capacity
IT201900024964A1 (en) * 2019-12-20 2021-06-20 Technoprobe Spa Measuring head for low pitch applications
TWI712802B (en) * 2020-01-21 2020-12-11 中華精測科技股份有限公司 Probe card device and neck-like probe thereof
JP6699812B1 (en) * 2020-02-12 2020-05-27 オムロン株式会社 Probe pin, inspection jig, inspection unit and inspection device
CN111929479A (en) * 2020-08-05 2020-11-13 苏州韬盛电子科技有限公司 Wafer test micro probe based on micro electro mechanical system
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
IT202000028364A1 (en) * 2020-11-25 2022-05-25 Technoprobe Spa CONTACT PROBE FOR MEASURING HEADS OF ELECTRONIC DEVICES
JP2022116470A (en) * 2021-01-29 2022-08-10 株式会社村田製作所 Probe device
KR102509528B1 (en) * 2021-02-05 2023-03-14 (주)포인트엔지니어링 The Electro-conductive Contact Pin
JP7470860B2 (en) 2021-03-16 2024-04-18 日本電子材料株式会社 Probe for probe card and method of manufacturing same
KR102549551B1 (en) * 2021-04-06 2023-06-29 (주)포인트엔지니어링 The electro-conductive contact pin and inspection apparatus having the same electro-conductive pin and manufacturing method thereof
KR102260983B1 (en) * 2021-04-16 2021-06-04 윌테크놀러지(주) Needle for vertical probe card with improved alignment efficiency
EP4350362A1 (en) * 2021-05-28 2024-04-10 Kabushiki Kaisha Nihon Micronics Probe
KR102321083B1 (en) * 2021-07-21 2021-11-03 (주)새한마이크로텍 Contact Probe
JP2023104519A (en) * 2022-01-18 2023-07-28 株式会社日本マイクロニクス probe
WO2023188165A1 (en) * 2022-03-30 2023-10-05 日本電子材料株式会社 Probe card
TWI805298B (en) * 2022-03-31 2023-06-11 中華精測科技股份有限公司 Vertical probe card having probes in multi-shape
TWI802354B (en) * 2022-03-31 2023-05-11 中華精測科技股份有限公司 Vertical probe head and fence-like probe thereof
TW202424495A (en) * 2022-08-15 2024-06-16 美商微製造股份有限公司 Multi-beam probes with decoupled structural and current carrying beams
WO2024062558A1 (en) * 2022-09-21 2024-03-28 日本電子材料株式会社 Probe for probe card
WO2024062560A1 (en) * 2022-09-21 2024-03-28 日本電子材料株式会社 Probe for probe cards
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CN119199206A (en) * 2023-06-27 2024-12-27 迪科特测试科技(苏州)有限公司 Probe card structure comprising probe groups with different lengths

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Also Published As

Publication number Publication date
KR102133484B1 (en) 2020-07-14
JP2018515752A (en) 2018-06-14
TW201640123A (en) 2016-11-16
TWI687692B (en) 2020-03-11
CN107430151A (en) 2017-12-01
US20180024166A1 (en) 2018-01-25
PH12017501807A1 (en) 2018-04-11
MY186669A (en) 2021-08-05
WO2016156003A1 (en) 2016-10-06
EP3278120A1 (en) 2018-02-07
CN107430151B (en) 2021-06-15
US10386388B2 (en) 2019-08-20
JP6728219B2 (en) 2020-07-22
KR20170132222A (en) 2017-12-01

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